CN106796919B - 具有选择性和边缘金属化的罩盖 - Google Patents
具有选择性和边缘金属化的罩盖 Download PDFInfo
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Abstract
本发明公开了一种与半导体封装一起使用的罩盖。首先,将聚酰胺掩模施加于盖板的一个表面。其次,使所述表面的暴露区域以及所述盖板的侧面金属化。然后可移除所述聚酰胺掩模。这减小了所述金属化层的撤回和收缩,同时降低了制造成本和工艺时间。
Description
相关申请的交叉引用
本专利申请要求2014年10月1日提交的序列号为62/058,351的美国临时专利申请的优先权,该临时专利申请全文以引用方式并入本文。
背景技术
本公开涉及用于电子封装的气密密封的罩盖。更具体地讲,本文描述了用于制备此类具有减少的缺陷的罩盖的工艺,以及由此形成的罩盖和包括此类罩盖的电子封装。
气密密封的电子封装可通过将罩盖设置到电子元件上方来制备,所述电子元件安装在绝缘封装基座的腔体内。然后通过使用密封剂将罩盖的周边区域和封装基座接合在一起,以气密地密封腔体。密封剂通常为用于焊接的软焊料。软焊料具有相对较低的熔融温度,因此可在低温下进行密封。
当罩盖由非金属材料制成时,必须使罩盖金属化以在周边密封区域上形成金属层,以允许通过焊接粘合罩盖。这增加了罩盖的制造成本。
一些问题可能因罩盖上的金属化层而产生。首先,用于使周边区域金属化的掩模可偏移(即未正确对齐),从而使围绕罩盖周边的金属化部分形成不同宽度,并且有可能减弱目前比预期更薄的部分上的气密密封。第二,金属化层可从盖的边缘撤回,从而形成间隙并且同样可能减弱气密密封。渗气也可能由于金属化层中的有机成分而出现。这些可导致渗漏故障、分层、不良粘合等。此外,问题可因焊料而产生,诸如焊料空隙、脱湿、溅出物和PIND失效(当过量焊料在腔体中形成颗粒时)。
希望提供最大程度地减小这些问题的方法。
发明内容
本公开涉及制备用于电子封装的气密密封的罩盖的方法。罩盖由板形成。将聚酰胺掩模施加于板的表面,从而限定被掩模覆盖的中心区域和不被掩模覆盖的周边区域。使板的周边区域和侧壁金属化以形成密封环,并且移除聚酰胺掩模。根据需要,密封环可由附加的金属子层形成。然后例如通过平头焊接将焊料预成型件附接到密封环。
本文公开了多种制备罩盖的方法,包括:将聚酰胺掩模施加于板的第一表面的中心区域并且限定第一表面上的周边区域,其中板具有第一表面、第二表面以及将第一表面和第二表面接合在一起的侧壁;通过使板的周边区域和侧壁金属化来形成密封环;以及移除聚酰胺掩模以获得罩盖。
板可由铍-铜、钼、青铜、玻璃、铁-镍-钴合金或选自氧化铝(Al2O3)、氧化铍(BeO)、氮化铝(AlN)、氧化锆增韧氧化铝(ZTA)、SiC和Si3N4构成的组中的陶瓷制成。板可具有约0.5毫米至约1毫米的厚度。在一些特定实施例中,板由非磁性材料形成。
金属化的周边区域可为板的第一表面的表面积的约20%至约35%。
在一些实施例中,密封环由选自银、钯、铂、镍、金以及它们的合金构成的组中的金属形成。有时,密封环可由一组子层形成。在其他实施例中,密封环可由非磁性金属形成。
周边区域上的密封环可具有约0.5mm至约1mm的宽度。周边区域上的密封环可具有约1微米(μm)至约40μm的厚度。
板可具有盘或矩形棱镜的形状。侧壁可具有多个面。
该方法还可以包括将焊料预成型件平头焊接到周边区域上的密封环。焊料预成型件可具有约200℃至约350℃的熔融温度。焊料预成型件可由金-锡合金、铅基合金或无铅合金形成。
本文还公开了罩盖,其包括:板,该板包括第一表面、第二表面以及将第一表面和第二表面接合在一起的侧壁;板的第一表面的周边区域和侧壁上的密封环;以及连接至周边区域上的密封环的焊料预成型件。
板可由铍-铜、钼、青铜、玻璃、铁-镍-钴合金或选自氧化铝(Al2O3)、氧化铍(BeO)、氮化铝(AlN)、氧化锆增韧氧化铝(ZTA)、SiC和Si3N4构成的组中的陶瓷制成。
密封环可由选自银、钯、铂、镍、金以及它们的合金构成的组中的金属形成。有时,密封环由一组子层形成。焊料预成型件也可由金-锡合金、铅基合金或无铅合金形成。
本公开的这些和其他非限制性特征在下文中更具体地公开。
附图说明
以下是附图说明,其提供的目的是示出本文所公开的示例性实施例并且不是为了限制本公开。
图1为常规的电子封装的侧面剖视图。
图2为常规的电子封装的分解透视图。
图3为具有板的“理想的”罩盖的透视图,所述板上具有金属化密封环。
图4为其中密封环不合意地偏移的罩盖的透视图。
图5为其中密封环不合意地从板的边缘撤回的罩盖的透视图。
图6为将制成罩盖的板的透视图。
图7为具有覆盖板的中心区域的聚酰胺掩模板的透视图。
图8A为金属化后的板的透视图。
图8B为金属化板的顶视图。
图8C为金属化板的侧视图。.
图9A为具有焊料预成型件的金属化板的分解图。
图9B为其中密封环不合意地偏移的罩盖的透视图的顶视图。
图10为本公开的方法的工艺流程图。
具体实施方式
通过参考附图,可以更全面地理解本文所公开的部件、工艺和装置。基于展示本公开的便利性和容易性,这些图仅仅是示意性表示,并且因此不旨在指示其设备或部件的相对尺寸和维度,和/或限定或限制示例性实施例的范围。
虽然为清楚起见以下说明书中使用了特定术语,但这些术语旨在仅仅指所选择用于图中示例的实施例的特定结构,并且不旨在限定或限制本公开的范围。在下面的图和以下说明书中,应当理解,类似的数字代号是指具有类似功能的部件。
单数形式的“一”、“一个”和“该”包括多个指代物,除非上下文另外明确地规定。
如本说明书和权利要求中所用,术语“包括”可以包括实施例“由…组成”和“基本上由…组成”。如本文所用,术语“包括”、“包含”、“具有”、“有”、“能够”、“含有”以及它们的变型旨在为开放式的过渡短语、术语或需要存在所述组分/步骤和允许存在其他组分/步骤的词汇。然而,此类描述应理解为还描述了“由所枚举的组分/步骤组成”和“基本上由所枚举的组分/步骤组成”的组合物或方法,这允许仅存在指定组分/步骤以及可能从其导致的任何掺杂物,并且排除了其他组分/步骤。
本申请的说明书和权利要求中的数值应理解为包括当简化为具有有效数字的相同数时相同的数值,以及与指定值的差值小于本申请中所述的用于确定值的常规类型的测定技术的实验误差的数值。
本文所公开的所有范围包括所引用的端值并且可独立地组合(例如,“从2至10”的范围包括端值2和10以及所有中间值)。
由一个或多个术语诸如“约”和“基本上”修饰的值可不限于指定的精确值。修饰语“约”还应被视为公开了由两个端值的绝对值限定的范围。例如,表达“从约2至约4”还公开了范围“从2至4”。
首先,图1和图2示出了气密密封的电子封装。图1为封装的剖视图,并且图2为示出封装的多个方面的分解透视图。
电子封装100由绝缘基座110、焊料预成型件120和盖130形成。基座被成形为包括其中安装了电子部件(例如半导体)的腔体112。此处未示出基座可能包括的多条引线和通路。基座的周边包括凸壁114。焊料预成型件在受热时熔化并将盖熔合到基座的凸壁。
图3为用于气密密封电子封装的罩盖300的透视图。罩盖包括板310和用于允许焊接罩盖的金属化密封环320。图3示出了金属化密封环的理想化应用。此处,围绕板的周边的密封环的宽度322是恒定的。应当注意,密封环仅存在于板的第一表面上,并且不覆盖板的侧壁312。
在图4中,示出了不合意地偏移的密封环。如此处所见,顶部右侧上的密封环的宽度324大于所需的宽度,并且底部左侧上的密封环的宽度326小于所需的宽度。
在图5中,示出了金属化密封环的撤回。此处,金属化密封环的部分326不再与板的边缘325接续。
本公开提供了制备减少这些事件发生的罩盖的方法。简而言之,使用聚酰胺掩模覆盖板的表面的中心区域。然后通过使板的表面的周边区域和侧壁金属化以形成一个连续层,来形成密封环。这提高了产量、密封强度,并且还为终端用户提供了视觉保证。然后将焊料预成型件平头焊接到密封环。
首先,图6为将形成罩盖的板的透视图。板600为固体。板的外部由第一表面610和与第一表面相对的第二表面(不可见)形成。侧壁620将第一表面和第二表面接合在一起。如此处所示,板为三维矩形棱镜。第一表面和第二表面大致平行于彼此,或换句话讲具有恒定的厚度605。侧壁620具有四个面621、622、623、624。然而,预期板可具有任何形状。例如,板也可以是盘,其中第一表面和第二表面为圆形,并且侧壁仅具有一个面。
板600由非金属材料制成。示例性非金属材料包括铍-铜、钼、青铜、玻璃、铁-镍-钴合金(例如KOVARTM)、铁-镍二元合金(例如合金42)或选自氧化铝(Al2O3)、氧化铍(BeO)、氮化铝(AlN)、氧化锆增韧氧化铝(ZTA)、SiC和Si3N4构成的组中的陶瓷。板具有约0.5毫米(mm)至约1毫米的厚度605(在第一表面和第二表面之间测定)。在特定实施例中,板由非磁性材料制成。这在电信号/噪声可妨碍封装中的电子部件的某些应用中,例如在医学成像应用中可以是有用的。
其次,如图7所示,将聚酰胺掩模630施加于板的第一表面的中心区域612。因此第一表面分成被掩模覆盖的中心区域612和不被掩模覆盖的周边区域614。聚酰胺掩模通常被预先制备成指定形状,然后设置到第一表面的中心区域上。应当注意,这是温度敏感和化学敏感的工艺,因此选择正确的材料和组合物是至关重要的。
其次,如图8A所示,板为金属化的。金属化可导致金属沉积到聚酰胺掩模上。金属化在第一表面的周边区域614上形成金属层,同样在侧壁620上形成金属层。这两个金属层的组合在本文中称为密封环640。金属可为银、钯、铂、镍、金或它们的合金。在特定实施例中,密封环由非磁性金属形成。金属化可通过溅射沉积、电镀、热喷雾、化学气相沉积(CVD)或任何其他合适的方式完成。
另一个方法是使用薄膜工艺形成“种子”层,然后通过电解或化学镀工艺将种子层镀覆到较厚的金属层上。种子层不应包含任何有机成分。
在现有的连续制造工艺中,单个金属掩模将被重复使用到多个不同板上。因此,沉积到金属掩模上的金属可能被携带到板之间,或者掩模本身的金属可沉积到后续板之上。预期在本公开中,每个板接纳其自身的聚酰胺掩模,并且聚酰胺掩模不会在不同板之间重复使用。
在一些期望的实施例中,密封环可由一组子层形成。在此类实施例中,可以存在两个子层或三个子层。在特定实施例中,可首先设置镍子层,然后可将金子层设置在镍子层上方。镍子层充当腐蚀屏障,而金子层提供易于焊接的表面。每个子层可具有0.001mm至0.01mm(即,1μm至10μm)的厚度/深度。密封环可具有0.001mm至0.04mm(即,1μm至40μm)的厚度/深度。
图8B为金属化板的平面(顶视)图。图8C为金属化板的侧视图。参见图8B,周边金属化区域标有附图标号614,并且以透明纹理指示。中心区域标有附图标号612,并且以斜线指示。周边区域为板的第一表面的表面积的约20%至约35%。中心区域为板的第一表面的表面积的约65%至约80%。周边区域的宽度标有附图标号615,并且为约0.5mm至约1.5mm。如图8C中所见,金属密封环还存在于板的侧壁620上。板的厚度也以附图标号605指示。
其次,如图9A和图9B所示,焊料预成型件650连接至密封环640。更具体地讲,将焊料预成型件设置在第一表面的周边区域614上方的密封环的部分上。通常将焊料预成型件平头焊接到密封环。图9A为第一表面的分解图,而图9B为第一表面的平面(顶视)图。在这两个图中,移除了聚酰胺掩模,并且第一表面610可见。焊料预成型件为环形的。焊料预成型件的宽度655可等于或小于周边区域的宽度615。焊料预成型件的宽度为约0.3mm至约0.6mm。焊料预成型件有利地具有约200℃至约350℃的熔融温度。焊料预成型件可由金-锡合金(例如80Au-20Sn)、铅基合金或无铅合金制成。可根据应用要求调节焊料体积,而不需要修改金属化区域。焊料预成型件应当非常均匀,以减小过量或不充分焊料连接和空隙的风险。
未示出将聚酰胺掩模630从板的中心区域移除。在形成密封环的金属化之后将聚酰胺掩模从板移除。然而,可根据需要在连接焊料预成型件之前或之后移除聚酰胺掩模。因此最终罩盖的第一表面的中心区域未被金属化;相反第一表面在中心区域中可见。
图10为汇总上述步骤的工艺流程图。当罩盖的板由陶瓷形成时,从较大的陶瓷面板(1010)分离陶瓷板。制备聚酰胺(1020)。还制造焊料预成型件(1030)。然后使用聚酰胺掩模掩盖陶瓷板(1040),并且金属化(1050)。此处将在第一金属化层上任选地添加子层示为电镀(1060)。其次,将焊料预成型件平头焊接到基板以获得罩盖(1070)。
在本文所述的方法中产生了许多优点。具体地讲,消除了密封环的收缩。减小了金属化工艺中的渗气,这延长了罩盖的储存寿命,另外改善了密封完整性。任何类型的焊料可附接到密封环。焊料优化同样减小了PIND失效。加工准备时间也得以改善。
本公开已参照示例性实施例得以描述。明显地,其他人在阅读和理解前述具体实施方式时将想到变型和更改。预期本公开应理解为包括所有此类变型和更改,只要它们在所附权利要求或其等同物的范围内。
Claims (18)
1.一种制备罩盖的方法,包括:
将聚合物型掩模施加于板的第一表面,从而将所述板的所述第一表面分成由所述聚合物型掩模覆盖的中心区域和没有被所述聚合物型掩模覆盖的周边区域,其中所述板还具有第二表面以及将所述第一表面和第二表面接合在一起的侧壁;
通过使所述板的所述第一表面的所述周边区域和所述侧壁金属化来形成密封环,其中所述密封环由两个子层或三个子层形成,其中所述子层中的第一子层为镍,并且所述子层中的第二子层为金,所述第二子层设置在所述第一子层上方;以及
移除所述聚合物型掩模以获得所述罩盖,其中所述第一表面的所述中心区域没有被金属化。
2.根据权利要求1所述的方法,其中所述板由铍-铜、钼、青铜、玻璃、铁-镍-钴合金或选自氧化铝(Al2O3)、氧化铍(BeO)、氮化铝(AlN)、氧化锆增韧氧化铝(ZTA)、SiC和Si3N4的陶瓷制成。
3.根据权利要求1所述的方法,其中所述板具有0.5毫米至1毫米的厚度。
4.根据权利要求1所述的方法,其中所述板由非磁性材料形成。
5.根据权利要求1所述的方法,其中所述周边区域为所述板的所述第一表面的表面积的20%至35%。
6.根据权利要求1所述的方法,其中所述密封环由选自银、钯、铂、镍、金以及它们的合金的金属形成。
7.根据权利要求1所述的方法,其中所述密封环由非磁性金属形成。
8.根据权利要求1所述的方法,其中所述周边区域上的所述密封环具有0.5mm至1mm的宽度。
9.根据权利要求1所述的方法,其中所述周边区域上的所述密封环具有1微米(μm)至40μm的厚度。
10.根据权利要求1所述的方法,其中所述板为盘或矩形棱镜的形状。
11.根据权利要求1所述的方法,其中所述侧壁具有多个面。
12.根据权利要求1所述的方法,还包括将焊料预成型件平头焊接到所述周边区域上的所述密封环。
13.根据权利要求12所述的方法,其中所述焊料预成型件具有200℃至350℃的熔融温度。
14.根据权利要求12所述的方法,其中所述焊料预成型件由金-锡合金、铅基合金或无铅合金形成。
15.根据权利要求1所述的方法,其中所述掩模为聚酰胺。
16.通过权利要求1所述的方法制造的罩盖。
17.一种罩盖,包括:
板,所述板包括第一表面、第二表面以及将所述第一表面和第二表面接合在一起的侧壁;
密封环,所述密封环在所述第一表面的周边区域连续施加并沿着所述板的整个所述侧壁延伸,其中所述密封环由镍子层和设置在所述镍子层上方的金子层形成,并且其中所述板的所述第一表面的中心区域是暴露的;以及
环形焊料预成型件,所述焊料预成型件连接至所述周边区域上的所述密封环,其中所述焊料预成型件不延伸到所述板的所述侧壁。
18.根据权利要求17所述的罩盖,其中所述板由铍-铜、钼、青铜、玻璃、铁-镍-钴合金或选自氧化铝(Al2O3)、氧化铍(BeO)、氮化铝(AlN)、氧化锆增韧氧化铝(ZTA)、SiC和Si3N4的陶瓷制成。
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