CN106714473A - Finger bifurcation multilayer FPC product processing process - Google Patents
Finger bifurcation multilayer FPC product processing process Download PDFInfo
- Publication number
- CN106714473A CN106714473A CN201611213338.0A CN201611213338A CN106714473A CN 106714473 A CN106714473 A CN 106714473A CN 201611213338 A CN201611213338 A CN 201611213338A CN 106714473 A CN106714473 A CN 106714473A
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- CN
- China
- Prior art keywords
- layers
- copper
- layer
- hole
- product processing
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4635—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating flexible circuit boards using additional insulating adhesive materials between the boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/096—Vertically aligned vias, holes or stacked vias
Abstract
Provided is a finger bifurcation multilayer FPC product processing process, which comprises the following steps: 1) processing of inner-layer plates; 2) plate laminating: laminating the two inner-layer plates to the two sides of a bonding sheet to form a substrate; 3) hole drilling: drilling a hole in a metal layer of the substrate to form a through hole, the through hole running through the whole substrate up and down; 4) applying of high-temperature-resistant glue: applying high-temperature-resistant glue on outer hole openings of guide holes to seal the outer hole openings of the guide holes; 5) copper plating: plating a connection cooper layer on hole walls of the through hole, the connection cooper layer connecting copper layers at the two sides of a PI layer; 6) preparation of an outer-layer circuit pattern: forming the outer-layer circuit pattern on the copper layer of a pattern processing region; 7) laminating an outer-layer cover film; and 8) removing the high-temperature-resistant glue. The invention provides a new golden finger making method; the method finishes finger bifurcation multilayer FPC product processing, and effectively solves the problem of burr and liquid medicine permeating; and the method breaks routine designs, is high in practicality and has high popularization significance.
Description
Technical field
The present invention relates to a kind of processing technology of golden finger, and in particular to a kind of finger position bifurcated multi-layer FPC Product processing work
Skill.
Background technology
Be arranged in rows many rectangular metal contact pieces near the position of edges of boards on printed circuit board (PCB), metal contact piece be
One layer of nickel gold is electroplated on the copper face of printed circuit board (PCB) to be formed.These metal contact pieces are a part for printed circuit board (PCB), golden finger gold
Finger is made up of numerous golden yellow conductive contact blades, because of its surface gold-plating and conductive contact blade arrangement such as finger-shaped, so being referred to as
" golden finger ".In application process, all of signal is transmitted by golden finger.
However, for finger position bifurcated multi-layer FPC product, due in technique compared with conventional multilayer FPC preparation methods
There is larger difference, cannot be made using traditional processing mode, the manufacture craft of finger position bifurcated multi-layer FPC product becomes row
Blank in the industry, the development to technology forms a kind of obstruction.
The content of the invention
Based on this, it is necessary to for deficiency of the prior art, there is provided a kind of finger position bifurcated multi-layer FPC Product processing work
Skill.
A kind of finger position bifurcated multi-layer FPC product processing technique, comprises the following steps：(1), inner plating processing, it is described interior
Laminate includes PI layers, is pressed together on the layers of copper of PI layers of both sides and is pressed on the cover layer of layers of copper lateral surface, wherein, a layers of copper appearance
Face is provided with circumscribed area and the showing methods region of external outside line, and the cover layer is pressed together on showing methods region and external
In layers of copper beyond region, the inner plating is provided with guide hole；(2) two inner platings are pressed on bonding sheet two by, pressing plate simultaneously
Side, forms substrate, the layers of copper with showing methods region 110 towards outside, after completing pressing plate, in the showing methods area on layers of copper surface
Layer of metal layer is molded on domain；(3), drill, drilled on the metal level of substrate, be allowed to form a through hole, the through hole is upper and lower
Through whole substrate, after completing drilling, metal level is removed；(4) high-temperature plastic, is pasted, resistance to height is pasted on guide hole aperture in the outer part
Warm glue, sealing guide hole aperture in the outer part；(5), copper facing, plates connection layers of copper, the connection layers of copper connection on the hole wall of through hole
The PI layers of layers of copper of both sides；(6), outer-layer circuit graphic making, is molded outer-layer circuit figure in the layers of copper in showing methods region；
(7) outer layer cover layer, is pressed, the showing methods region of the layers of copper on the outside of PI layers covers epiphragma, cover layer is coated on outer layer copper
Region on layer beyond circumscribed area；(8) high-temperature plastic, is removed.
Further, the layers of copper of the PI layers of both sides is provided with circumscribed area, in step (1), the circumscribed area warp
PAD surface treatments are crossed, Gold plated Layer is formed.
Further, the hole wall of guide hole is provided with layers of copper, and the layers of copper of the PI layers of both sides is by the layers of copper on guide hole hole wall
Carry out electrical communication.
The beneficial effect of finger of the present invention position bifurcated multi-layer FPC product processing technique is：The present invention provides a kind of new
Method for manufacturing gold finger, completes finger position bifurcated multi-layer FPC Product processing, in manufacturing process, is covered using high temperature resistant yellow glue
The outer openings of guide hole, effectively solve the problems, such as that guide hole is intake, in addition, a metal level is molded before drilling, effectively to through hole
The burr of opening is shifted, it is ensured that the layers of copper of via openings is smooth, improves the quality of product, and the present invention breaks the normal procedure design,
It is practical, with stronger dissemination.
Brief description of the drawings
Fig. 1 is the corresponding product in step (1)~(3) of finger of the present invention position bifurcated multi-layer FPC product processing technique
Profile.
Fig. 2 is the corresponding product in step (4)~(6) of finger of the present invention position bifurcated multi-layer FPC product processing technique
Profile.
Fig. 3 is the corresponding product in step (7)~(8) of finger of the present invention position bifurcated multi-layer FPC product processing technique
Profile.
Specific embodiment
In order to make the purpose , technical scheme and advantage of the present invention be clearer, it is right below in conjunction with drawings and Examples
The present invention is further elaborated.It should be appreciated that specific embodiment described herein is only used to explain the present invention, not
For limiting the present invention.
As shown in Figure 1 to Figure 3, the present invention provides a kind of finger position bifurcated multi-layer FPC product processing technique, for making gold
Finger position bifurcated multi-layer FPC product, finger position bifurcated multi-layer FPC product processing technique is comprised the following steps：
(1), inner plating 100 is processed, the inner plating 100 include PI layers 10, be pressed together on the PI layers of layers of copper of 10 both sides 20 and
Be pressed on the cover layer 30 of the lateral surface of layers of copper 20, wherein, the outer surface of a layers of copper 20 be provided with external outside line circumscribed area and
Showing methods region 110, another layers of copper 20 is provided with circumscribed area, the cover layer 30 be pressed together on showing methods region 110 and
In layers of copper 20 beyond circumscribed area, the circumscribed area is surface-treated (tin plating or gold-plated treatment) by PAD, forms Gold plated Layer
40, the one end of the inner plating 100 is provided with guide hole 50, and the hole wall of guide hole 50 is provided with layers of copper, and the layers of copper of PI layers of 10 both sides is led to
The layers of copper 20 crossed on the hole wall of guide hole 50 carries out electrical communication；
(2) two inner platings 100 are pressed on the both sides of bonding sheet 60 by, pressing plate simultaneously, form substrate, band showing methods region
110 layers of copper after completing pressing plate, is molded one layer similar to tin layers towards outside on the showing methods region 110 on layers of copper surface
Metal level (not shown)；
(3), drill, drilled on the metal level of substrate, be allowed to form a through hole 70, the through hole is about 70 through whole
Substrate, after completing drilling, removes metal level, during drilling, because metal level is located at outermost, effectively by the formed burr that drills
It is transferred on metal level, it is ensured that the layers of copper of the bore portions of through hole 70 is smooth, without burr；
(4) high-temperature plastic 80, is pasted, high-temperature plastic 80 is pasted on the aperture in the outer part of guide hole 50, sealing guide hole 50 is in the outer part
Aperture, in preventing postorder process, aperture of the liquid medicine from guide hole 50 in the outer part enters, and damages product；
(5), copper facing, plates connection layers of copper on the hole wall of through hole 70, and the connection layers of copper connects the PI layers of layers of copper of 10 both sides；
(6), outer-layer circuit graphic making, is molded outer-layer circuit figure 90 in the layers of copper in showing methods region 110；
(7), pressure outer layer cover layer 30, epiphragma 30 is covered in the showing methods region 110 of PI layers 10 layers of copper in outside, makes to cover
Epiphragma 30 is coated in external copper layer the region beyond circumscribed area；
(8) high-temperature plastic 80, is removed.
The beneficial effect of finger of the present invention position bifurcated multi-layer FPC product processing technique is：The present invention provides a kind of new
Method for manufacturing gold finger, completes finger position bifurcated multi-layer FPC Product processing, in manufacturing process, is covered using high temperature resistant yellow glue
The outer openings of guide hole 50, effectively solve the problems, such as that guide hole 50 is intake, in addition, a metal level is molded before drilling, it is effectively right
The burr of the opening of through hole 70 is shifted, it is ensured that the layers of copper of the opening of through hole 70 is smooth, improves the quality of product, and the present invention breaks often
Rule design, it is practical, with stronger dissemination.
The upper only presently preferred embodiments of the present invention, is not intended to limit the invention, all in spirit of the invention
With any modification, equivalent and the improvement made within principle etc., should be included within the scope of the present invention.
Claims (3)
1. a kind of finger position bifurcated multi-layer FPC product processing technique, it is characterised in that comprise the following steps：
(1), inner plating processing, the inner plating includes PI layers, is pressed together on the layers of copper of PI layers of both sides and is pressed on layers of copper lateral surface
Cover layer, wherein, a layers of copper outer surface is provided with circumscribed area and the showing methods region of external outside line, the cover layer
It is pressed together in the layers of copper beyond showing methods region and circumscribed area, the inner plating is provided with guide hole；
(2) two inner platings are pressed on bonding sheet both sides by, pressing plate simultaneously, form substrate, the layers of copper direction with showing methods region
Outside, after completing pressing plate, is molded layer of metal layer on the showing methods region on layers of copper surface；
(3), drill, drilled on the metal level of substrate, be allowed to form a through hole, the through hole runs through whole substrate up and down, complete
Into after drilling, metal level is removed；
(4) high-temperature plastic, is pasted, high-temperature plastic, sealing guide hole aperture in the outer part is pasted on guide hole aperture in the outer part；
(5), copper facing, plates connection layers of copper on the hole wall of through hole, and the connection layers of copper connects the PI layers of layers of copper of both sides；
(6), outer-layer circuit graphic making, is molded outer-layer circuit figure in the layers of copper in showing methods region；
(7) outer layer cover layer, is pressed, the showing methods region of the layers of copper on the outside of PI layers covers epiphragma, cover layer is coated outside
Region in layer layers of copper beyond circumscribed area；
(8) high-temperature plastic, is removed.
2. finger according to claim 1 position bifurcated multi-layer FPC product processing technique, it is characterised in that：Described PI layers two
The layers of copper of side is provided with circumscribed area, and in step (1), the circumscribed area is surface-treated by PAD, forms Gold plated Layer.
3. finger according to claim 1 position bifurcated multi-layer FPC product processing technique, it is characterised in that：The guide hole
Hole wall is provided with layers of copper, and the layers of copper of the PI layers of both sides carries out electrical communication by the layers of copper on guide hole hole wall.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611213338.0A CN106714473A (en) | 2016-12-23 | 2016-12-23 | Finger bifurcation multilayer FPC product processing process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611213338.0A CN106714473A (en) | 2016-12-23 | 2016-12-23 | Finger bifurcation multilayer FPC product processing process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106714473A true CN106714473A (en) | 2017-05-24 |
Family
ID=58903209
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611213338.0A Pending CN106714473A (en) | 2016-12-23 | 2016-12-23 | Finger bifurcation multilayer FPC product processing process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106714473A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101500376A (en) * | 2009-03-16 | 2009-08-05 | 深圳市深南电路有限公司 | Method for producing high multilayered blind hole multilayer board by double head pressing insertion pin |
| CN101662888A (en) * | 2009-09-28 | 2010-03-03 | 深南电路有限公司 | Preparation method for PCB plate with step trough |
| CN102970828A (en) * | 2012-11-30 | 2013-03-13 | 成都航天通信设备有限责任公司 | Method for manufacturing rigidity-flexibility combined printing circuit board |
| CN103002676A (en) * | 2012-10-23 | 2013-03-27 | 大连东恒科技发展有限公司 | Machining process of metal holes |
| CN104981108A (en) * | 2014-04-14 | 2015-10-14 | 深南电路有限公司 | Processing method of suspension-structure gold finger, and circuit board |
-
2016
- 2016-12-23 CN CN201611213338.0A patent/CN106714473A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101500376A (en) * | 2009-03-16 | 2009-08-05 | 深圳市深南电路有限公司 | Method for producing high multilayered blind hole multilayer board by double head pressing insertion pin |
| CN101662888A (en) * | 2009-09-28 | 2010-03-03 | 深南电路有限公司 | Preparation method for PCB plate with step trough |
| CN103002676A (en) * | 2012-10-23 | 2013-03-27 | 大连东恒科技发展有限公司 | Machining process of metal holes |
| CN102970828A (en) * | 2012-11-30 | 2013-03-13 | 成都航天通信设备有限责任公司 | Method for manufacturing rigidity-flexibility combined printing circuit board |
| CN104981108A (en) * | 2014-04-14 | 2015-10-14 | 深南电路有限公司 | Processing method of suspension-structure gold finger, and circuit board |
Non-Patent Citations (1)
| Title |
|---|
| 李光兰: "《电子工艺与设备》", 31 March 2008, 天津大学出版社 * |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170524 |
|
| RJ01 | Rejection of invention patent application after publication |