CN106699597A - 一种α‑氰基‑4‑羟基肉桂酸(CHCA)与硅基介孔材料共价偶联基质的合成方法 - Google Patents

一种α‑氰基‑4‑羟基肉桂酸(CHCA)与硅基介孔材料共价偶联基质的合成方法 Download PDF

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CN106699597A
CN106699597A CN201710116185.6A CN201710116185A CN106699597A CN 106699597 A CN106699597 A CN 106699597A CN 201710116185 A CN201710116185 A CN 201710116185A CN 106699597 A CN106699597 A CN 106699597A
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silicon
mesoporous material
chca
based mesoporous
aptes
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周焕英
高志贤
刘忠文
刘飞
刘芳
汤弘智
马雅琳
孙思明
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Institute of Hygiene and Environmental Medicine Academy of Military Medical Sciences of Chinese PLA
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    • C07ORGANIC CHEMISTRY
    • C07CACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C253/00Preparation of carboxylic acid nitriles
    • C07C253/30Preparation of carboxylic acid nitriles by reactions not involving the formation of cyano groups
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    • G01N27/62Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating the ionisation of gases, e.g. aerosols; by investigating electric discharges, e.g. emission of cathode
    • G01N27/64Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating the ionisation of gases, e.g. aerosols; by investigating electric discharges, e.g. emission of cathode using wave or particle radiation to ionise a gas, e.g. in an ionisation chamber

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Abstract

本发明的目的是针对常见基质CHCA在MALDI‑TOF MS小分子检测时背景干扰大的不足,提供一种CHCA与硅基介孔材料共价偶联的新基质,降低基质的背景干扰。反应采用活性酯法,硅基介孔材料表面首先修饰氨基,之后EDC活化CHCA羧基形成酰胺键,NHS取代EDC活化酯而形成NHS活化酯,再与硅基介孔材料表面的氨基结合,实现CHCA与硅基介孔材料的偶联。

Description

一种α-氰基-4-羟基肉桂酸(CHCA)与硅基介孔材料共价偶联 基质的合成方法
技术领域
本发明涉及一种新型基质辅助激光解吸电离(MALDI)基质的合成方法,具体涉及一种α-氰基-4-羟基肉桂酸(CHCA)与硅基介孔材料共价偶联基质的合成方法。
背景技术
基质辅助激光解吸电离飞行时间质谱(MALDI-TOF MS)是一种快速、高通量的软电离质谱技术,在蛋白质、多肽、寡核苷酸等物质的分析方面获得广泛应用。由于常用MALDI基质为小分子有机酸,因此在分析分子量小于500Da的小分子化合物时会引入大量的基质加合峰,干扰待测物信号。研究制备适于小分子(分子量<500Da)检测的基质对进一步拓宽MALDI-TOF MS应用范围具有重要意义。
发明内容
本发明针对常见基质CHCA在MALDI-TOF MS小分子检测时背景干扰大的不足,提供一种CHCA与硅基介孔材料共价偶联的新基质,降低了基质的背景干扰。
本发明的技术方案概述如下:硅基介孔材料表面首先修饰氨基,之后CHCA表面羧基被EDC,NHS活化,与修饰氨基的硅基介孔材料共价结合,形成新型基质。
(1)配制10~100mg/mL的介孔材料悬浊液,超声辅助分散,溶剂为无水乙醇;
(2)按照3-氨丙基三乙氧基硅烷(APTES):硅基介孔材料体积比0.5~3∶1的比例加入APTES,50~100℃水浴搅拌反应4~12小时;
(3)反应液2000r/min~10000r/min离心2~10min;依次用去离子水和无水乙醇洗涤3~5次;
(4)孔径为0.22μm以下的滤膜抽滤,滤膜截留的合成产物30~60℃真空干燥,制得硅基介孔材料@APTES;
(5)按照硅基介孔材料@APTES,CHCA,N-羟基丁二酰亚胺(NHS),1-乙基-(3-二甲基氨基丙基)碳酰二亚胺盐酸盐(EDC·HCl)质量比1∶1∶3~5∶12~20的比例混合,加入纯水使CHCA最终浓度为10~50mg/mL,避光条件下反应4h以上;
(6)纯水离心洗涤3次后,用乙腈洗涤,自然干燥备用。
附图说明
图1为α-氰基-4-羟基肉桂酸(CHCA)与硅基介孔材料共价偶联基质的合成路线示意图
具体实施方式
实施方案1
(1)称取0.5g SBA-15与50ml无水乙醇混合,超声混匀;
(2)加入100ml的APTES,在75℃水浴搅拌10h;
(3)3000r/min离心5min后,依次用纯水和无水乙醇洗3次后,0.22μm有机系滤膜抽滤;
(4)取抽滤后的合成产物50℃真空干燥,制得SBA-15@APTES;
(5)称取0.03gSBA-15@APTES、0.12gNHS、0.45gEDC、0.03gCHCA,加入1ml纯水混匀,避光条件下涡旋反应10h;
(6)产物3000r/min离心,纯水清洗3次,最后一次乙腈清洗,自然干燥。
实施方案2
(1)称取0.3g SBA-15与150ml无水乙醇混合,超声混匀;
(2)加入50ml的APTES,在60℃水浴搅拌5h;
(3)5000r/min离心5min后,依次用纯水和无水乙醇洗3次,0.22μm有机系滤膜抽滤;
(4)取抽滤后的合成产物40℃真空干燥,制得SBA-15@APTES;
(5)称取0.02gSBA-15@APTES、0.10gNHS、0.40gEDC、0.02gCHCA,加入1ml纯水混匀,避光条件下涡旋反应4h;
(6)产物5000r/min离心,纯水清洗3次,最后一次乙腈清洗,自然干燥。

Claims (2)

1.一种α-氰基-4-羟基肉桂酸(CHCA)与硅基介孔材料共价偶联基质的合成方法,其特征在于包括以下合成步骤:
(1)配制10~100mg/mL的介孔材料悬浊液,超声辅助分散,溶剂为无水乙醇;
(2)按照3-氨丙基三乙氧基硅烷(APTES)∶硅基介孔材料体积比0.5~3∶1的比例加入APTES,50~100℃水浴搅拌反应4~12小时;
(3)反应液2000r/min~10000r/min离心2~10min;依次用去离子水和无水乙醇洗涤3~5次;
(4)孔径为0.22μm以下的滤膜抽滤,滤膜截留的合成产物30~60℃真空干燥,制得硅基介孔材料@APTES;
(5)按照硅基介孔材料@APTES,CHCA,N-羟基丁二酰亚胺(NHS),1-乙基-(3-二甲基氨基丙基)碳酰二亚胺盐酸盐(EDC·HCl)质量比1∶1∶3~5∶12~20的比例混合,加入纯水使CHCA最终浓度为10~50mg/mL,避光条件下反应4h以上;
(6)纯水离心洗涤3次后,用乙腈洗涤,自然干燥备用。
2.根据权利要求1所述的合成方法,如上所述的介孔硅材料为SBA-15或其它含有硅羟基的介孔材料。
CN201710116185.6A 2017-02-21 2017-02-21 一种α‑氰基‑4‑羟基肉桂酸(CHCA)与硅基介孔材料共价偶联基质的合成方法 Pending CN106699597A (zh)

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