CN106660191B - 自动装卸装置 - Google Patents

自动装卸装置 Download PDF

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Publication number
CN106660191B
CN106660191B CN201580028464.6A CN201580028464A CN106660191B CN 106660191 B CN106660191 B CN 106660191B CN 201580028464 A CN201580028464 A CN 201580028464A CN 106660191 B CN106660191 B CN 106660191B
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CN
China
Prior art keywords
workpiece
carrier
movable part
hole
suction nozzle
Prior art date
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Application number
CN201580028464.6A
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English (en)
Chinese (zh)
Other versions
CN106660191A (zh
Inventor
安田太
安田太一
榎本辰男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Handotai Co Ltd
Original Assignee
Shin Etsu Handotai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Publication of CN106660191A publication Critical patent/CN106660191A/zh
Application granted granted Critical
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/28—Work carriers for double side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B25J9/041—Cylindrical coordinate type
    • B25J9/042—Cylindrical coordinate type comprising an articulated arm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/10—Programme-controlled manipulators characterised by positioning means for manipulator elements
    • B25J9/102—Gears specially adapted therefor, e.g. reduction gears
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Manipulator (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
CN201580028464.6A 2014-06-16 2015-05-13 自动装卸装置 Active CN106660191B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014-123518 2014-06-16
JP2014123518A JP6183301B2 (ja) 2014-06-16 2014-06-16 自動ハンドリング装置
PCT/JP2015/002425 WO2015194092A1 (ja) 2014-06-16 2015-05-13 自動ハンドリング装置

Publications (2)

Publication Number Publication Date
CN106660191A CN106660191A (zh) 2017-05-10
CN106660191B true CN106660191B (zh) 2018-06-29

Family

ID=54935108

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201580028464.6A Active CN106660191B (zh) 2014-06-16 2015-05-13 自动装卸装置

Country Status (8)

Country Link
US (1) US9931730B2 (enExample)
JP (1) JP6183301B2 (enExample)
KR (1) KR102150406B1 (enExample)
CN (1) CN106660191B (enExample)
DE (1) DE112015002397T5 (enExample)
SG (1) SG11201610298XA (enExample)
TW (1) TWI594841B (enExample)
WO (1) WO2015194092A1 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6922467B2 (ja) * 2016-07-08 2021-08-18 Ａｇｃ株式会社 被処理部材の位置決め装置、処理装置、位置決め方法およびガラス板の製造方法
CN108561532A (zh) * 2018-04-28 2018-09-21 湖南宇晶机器股份有限公司 分体局部升降式齿圈结构
CN108515450B (zh) * 2018-06-08 2023-08-01 新乡日升数控轴承装备股份有限公司 用于研磨机上料的工装及研磨机的上料方法
JP7162551B2 (ja) * 2019-02-18 2022-10-28 株式会社ディスコ 加工装置
CN111136573B (zh) * 2019-11-27 2021-12-03 常州市瑞得通讯科技有限公司 一种高稳定、低损耗陶瓷滤波器制备流水线
KR102262418B1 (ko) * 2020-03-05 2021-06-08 주식회사 클레버 이차전지 셀의 폴딩 공정용 이차전지 셀 이송 장치
CN112103211B (zh) * 2020-08-21 2024-03-12 大连佳峰自动化股份有限公司 多头芯片拾取绑定机构
CN113427383A (zh) * 2021-07-27 2021-09-24 成都市瑞研光科技有限公司 一种智能抛光机
CN114834898A (zh) * 2022-03-28 2022-08-02 中环领先半导体材料有限公司 磨片下料自动取片装置
CN114800109A (zh) * 2022-06-27 2022-07-29 苏州博宏源机械制造有限公司 双面抛光机及其抛光方法
CN116000958B (zh) * 2022-12-28 2024-07-19 力鼎智能装备(青岛)集团有限公司 一种手腕设备及夹取方法
CN118875967B (zh) * 2024-09-23 2024-12-13 北京特思迪半导体设备有限公司 一种游星轮外圈滚道装置以及外圈驱动系统

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5174067A (en) * 1990-10-19 1992-12-29 Shin-Etsu Handotai Co., Ltd. Automatic wafer lapping apparatus
US6113490A (en) * 1997-12-16 2000-09-05 Hakomori; Shunji Work unloading method and surface polishing apparatus with work unloading mechanism
CN101176976A (zh) * 2006-11-06 2008-05-14 中村留精密工业株式会社 基板加工机的工件装卸器
CN101372087A (zh) * 2007-08-21 2009-02-25 株式会社春近精密 工件搬送装置
JP2013215813A (ja) * 2012-04-05 2013-10-24 Koyo Mach Ind Co Ltd 両頭平面研削におけるワーク搬入出方法及び両頭平面研削盤

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5944186B2 (ja) * 1982-06-11 1984-10-27 スピ−ドフアム株式会社 平面研削装置
JPS61241060A (ja) * 1985-04-17 1986-10-27 Supiide Fuamu Kk 平面自動研磨装置
JPS6368359A (ja) 1986-09-10 1988-03-28 Otani Reiji ラツピングマシンのキヤリヤ単位ワ−ク同時装填及キヤリヤスライド心出し位置決め方法
JP2000042913A (ja) * 1998-07-22 2000-02-15 Fujikoshi Mach Corp 両面研磨装置のワーク給排システム
JP4492155B2 (ja) * 2004-02-27 2010-06-30 信越半導体株式会社 半導体ウエーハ用キャリアの保持孔検出装置及び検出方法並びに半導体ウエーハの研磨方法
JP4621261B2 (ja) * 2008-02-01 2011-01-26 株式会社住友金属ファインテック 両面研摩装置
JP5493633B2 (ja) * 2009-09-18 2014-05-14 株式会社Ｓｕｍｃｏ 研磨方法及びその装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5174067A (en) * 1990-10-19 1992-12-29 Shin-Etsu Handotai Co., Ltd. Automatic wafer lapping apparatus
US6113490A (en) * 1997-12-16 2000-09-05 Hakomori; Shunji Work unloading method and surface polishing apparatus with work unloading mechanism
CN101176976A (zh) * 2006-11-06 2008-05-14 中村留精密工业株式会社 基板加工机的工件装卸器
CN101372087A (zh) * 2007-08-21 2009-02-25 株式会社春近精密 工件搬送装置
JP2013215813A (ja) * 2012-04-05 2013-10-24 Koyo Mach Ind Co Ltd 両頭平面研削におけるワーク搬入出方法及び両頭平面研削盤

Also Published As

Publication number Publication date
DE112015002397T5 (de) 2017-02-23
US9931730B2 (en) 2018-04-03
TW201600232A (zh) 2016-01-01
CN106660191A (zh) 2017-05-10
TWI594841B (zh) 2017-08-11
KR20170018833A (ko) 2017-02-20
KR102150406B1 (ko) 2020-09-01
WO2015194092A1 (ja) 2015-12-23
JP2016002612A (ja) 2016-01-12
JP6183301B2 (ja) 2017-08-23
US20170190019A1 (en) 2017-07-06
SG11201610298XA (en) 2017-01-27

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