CN106653622A - Packaging technology and packaging structure of ceramic chip - Google Patents
Packaging technology and packaging structure of ceramic chip Download PDFInfo
- Publication number
- CN106653622A CN106653622A CN201611137889.3A CN201611137889A CN106653622A CN 106653622 A CN106653622 A CN 106653622A CN 201611137889 A CN201611137889 A CN 201611137889A CN 106653622 A CN106653622 A CN 106653622A
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- Prior art keywords
- ceramic
- chip
- ceramic monolith
- cover plate
- monolith
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/291—Oxides or nitrides or carbides, e.g. ceramics, glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3114—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Abstract
The invention provides a packaging technology of a ceramic chip. The packaging technology comprises the following steps of (I) dispensing and film-forming, before chip assembly, coating the edge of one side, which needs to be packaged with a cover plate, of a ceramic carrier with a liquid-like dual-curable sealant through a glue dispenser, and curing and setting the dual-curable sealant through UV light irradiation to form a structural film on the ceramic carrier; (2) chip assembly, namely carrying out chip assembly on the ceramic carrier; and (3) cured sealing, after chip assembly is completed, bonding the cover plate matched with the ceramic carrier in size and the ceramic carrier through heating the structural film and then carrying out cured sealing. The packaging structure of the ceramic chip has the practical advantages of high bonding strength, good surface wettability, high air-tightness and the like, the roll-to-roll automatic dispensing process can be achieved and the production efficiency is obviously improved.
Description
Technical field
The present invention relates to ceramic chip package technical field, is the packaging technology and its encapsulating structure of a kind of ceramic chip.
Background technology
Ceramic material be with naturally occurring or synthetic compound through shaping and high-temperature firing into foreign peoples's Inorganic Non-metallic Materials,
In heat and mechanical properties, there are high temperature resistant, heat-insulated, high rigidity, abrasion performance；There are insulating properties, pressure in terms of electrical property
Electrically, the advantages of semiconductive, magnetic；There is the function such as catalysis, corrosion-resistant, absorption in terms of chemistry.
Ceramic package is a kind of new packaging method grown up after Metal Packaging, is also gas as metal
Close property, wherein ceramic package（Carrier）It is by multi-layer ceramics microwave treatment, Jing porcelain powder, curtain coating, blanking, punching, printing, layer
The flow process such as pressure, fervent, sintering, nickel plating, soldering, gold-plated is obtained.Ceramic package have good air-tightness, stable chemical performance, can be many
The advantages of layer wiring, high thermal conductivity, high insulation resistance, thermal coefficient of expansion and close chip, have been used for Ceramic Balls coral array package
(CBGA), ceramic grid array package（CPGA）, dual-inline package（CDIP), ceramic four sides pin flat package
（CQFP）, ceramic small outline encapsulation（CSOP）, ceramic leaded chip carrier（CLCC）, ceramic leadless chip carrier
（LCCC）, multi-chip module（MCM）Etc. all kinds of packaging technologies.
As high-power ceramic packaged light source is progressively to emerging applications such as automobile headlamp, mobile phone flashlight, ultraviolet LED lamps
Field is permeated, and how to reduce the paces that manufacturing cost determines its market penetration.And manufacturing process is complicated, low production efficiency and valency
Lattice costliness is the inferior position of ceramic package.Traditional ceramic chip air-tightness sealing cap technique is needed after chip assembling, in sealing-in
Ceramic monolith edge surface uniform application structural adhesive, then with cover plate for sealing and solidifies so as to reaching sealing effectiveness.This side
The drawbacks of method, essentially consists in, and usual ceramic chip package technique is first by chipset loaded on ceramic monolith, the dispensing envelope after
In dress technical process, megohmite insulant is coated on the join domain between ceramic chip and lead for easy appearance, is caused on fraction defective
Rise.Further, since the fragility of ceramic monolith itself, ceramic chip is in multiple transport process by external loading, vibration and friction
Impact can cause the fragmentation of ceramic material.
The content of the invention
The technical problem to be solved is：(1) how to avoid traditional liquid glue that pottery is polluted in cover plate for sealing processing procedure
Join domain between porcelain core piece and lead；(2) how micro- pore impact that liquid glue occurs in dispensing and solidification process is reduced
The air-tightness of ceramic chip；(3) how to make ceramic chip package technological operation convenient, artificial and cost of transportation is greatly reduced.
The present invention solves the technical scheme of above technical problem：
A kind of packaging technology of ceramic chip, comprises the following steps：
(i) dispensing film forming：Before chip is assembled, liquid double solidification fluid sealants are applied by point gum machine imposes on ceramic monolith
Need the outer rim with the side of cover plate encapsulation, by UV light irradiations make double solidification sealing glue solidifyings shape to be formed structural film adhesive in
On ceramic monolith；
(ii) chip assembling：Chipset dress is carried out on ceramic monolith；
(iii) solidification sealing：After chip is completed, will be matched with the ceramic monolith size by heating the structural film adhesive
Cover plate carry out with the ceramic monolith it is bonding, then solidification sealing.
The double solidification fluid sealants being related in the present invention are Patent No. 201610924542.7, and patent name is " a kind of
Double solidifications leaded light glue disclosed in double solidifications leaded light glue for display backlight module and preparation method thereof ".
So, the first dispensing film forming that the present invention is adopted, then carries out chip assembling, then cover plate solidification sealing, makes ceramic core
Piece air-tightness sealing cap technological operation is convenient, and artificial and cost of transportation is greatly reduced；Overcome because liquid glue is in dispensing again simultaneously
And micro- pore that solidification occurs when operating together affects the bubble-tight technical problem of ceramic chip.As can be seen here, the present invention breaks through
The Traditional Thinking of glue dispensing and packaging again after the assembling of prior art chips, the first dispensing film forming of science, then chip assembling, then it is solid
Change sealing, structural film adhesive is made by need to only heating the structural film adhesive for having cured sizing during solidification sealing with cover plate and ceramic monolith
There is good bonding force, both avoided traditional liquid adhesive and polluted between ceramic chip and lead in cover plate for sealing processing procedure
Connection, reduces the air-tightness of the micro- pore impact ceramic chip occurred in dispensing and solidification process because of liquid glue, again can be with
Make ceramic chip package technological operation convenient, artificial and cost of transportation is greatly reduced, kill two birds with one stone.
The invention further relates to a kind of ceramic chip package structure, including cover plate and ceramic monolith, ceramic monolith is loaded in load
Take, carry be equally spaced the in its longitudinal direction hole for bearing ceramic monolith and the positioning for being indexed positioning
Hole, location hole is located at the edge of carrier band, and hole is located at the below or above of location hole, and matches with ceramic monolith size；Ceramics
Carrier scribbles double solidification fluid sealants and forms structure glue by UV light irradiations solidifying and setting with the outer rim of the side of cover plate encapsulation
Film, ceramic monolith is with cover plate by the solidification sealing of heating arrangement glued membrane.
The invention further relates to a kind of point gum machine of the packaging technology for ceramic chip, including by the first controller control bit
Move with the horizontal shifting platform in direction, by second controller and control the Glue dripping head of gel quantity, by Glue dripping head applying glue in ceramics load
Horizontal direction tree lace is formed on external edge, UVLED spot lights is disposed at tree lace mobile route rear, for irradiating the top of tree lace
Face, the intensity of UVLED spot lights is controlled by the 3rd controller.
The technical scheme that further limits of the invention is：
The packaging technology of aforesaid ceramic chip, step (iii) in, heating-up temperature be 110-150 DEG C, minute hardening time 20-50.
Another technical problem to be solved by this invention is how to realize the encapsulation automatic continuous production of ceramic chip
And to overcome the problem of ceramic chip easy fragmentation in transport process；In order to solve this technical problem, in above-mentioned steps
(i) in, ceramic monolith is loaded on carrier band, carries the hole being equally spaced in its longitudinal direction for bearing ceramic monolith
(pocket) and the location hole for being indexed positioning, location hole be located at carrier band edge, hole be located at location hole lower section or
Top, and match with ceramic monolith size.So, the present invention is by the way that ceramic monolith is loaded on carrier band, and sets on carrier band
There are hole and location hole, be used for loading ceramic monolith using the carrier band with location hole, being accurately positioned by location hole can be real
Existing volume to volume automation dispensing processing procedure, so whole dispensing, UV curing process can be completed all by automation process；Meanwhile,
Carrier band loads ceramic monolith by hole, can overcome due to the fragility of ceramic monolith itself, and ceramic chip is repeatedly defeated
Suffered external loading during fortune, the impact of vibration and friction and cause the possibility of ceramic material fragmentation.
The packaging technology of aforesaid ceramic chip, wherein it is hollow micro- to be added with monodisperse silica in double solidification fluid sealants
Ball, addition is the 0.1-2% of double solidification fluid sealant weight, and the monodisperse silica hollow microsphere particle diameter is 20-150
um.So, monodisperse silica hollow microsphere is added in double solidification fluid sealants, it can be ensured that double solidification sealing glue solidifying sizings
Forming structural film adhesive will not subside and keep the uniformity of thickness.
The liquid that the packaging technology of aforesaid ceramic chip, wherein structural film adhesive pass through 25 DEG C of viscosity 10000-100000cps
The UV of body shape adds and formed after heat dual curing fluid sealant UV-light cured, and thickness is 100-500um.
Aforesaid ceramic chip package structure, its cover plate is ceramics, metal, or glass material, and its wall thickness is 0.5-
5mm。
Aforesaid ceramic chip package structure, wherein ceramic monolith are alundum (Al2O3) material, are shaped as square, rectangular
Body or cylinder, its thickness is 0.5-5mm.
The invention has the beneficial effects as follows：
The packaging technology of the ceramic chip of the present invention organically combines UV solid glues and the epoxy construction gluing agent that is heating and curing to form double
Solidification fluid sealant, using gluing process, by Liquid Structure glue fine ceramics carrier edge is evenly applied to, and be this ensure that to pottery
The wellability of porcelain rough surface, turn avoid traditional liquid epoxy construction gluing agent and pollutes ceramic chip in cover plate for sealing processing procedure
The possibility of the join domain between lead.Meanwhile, beneficial to sealing air-tightness is ensured, product yield is carried smooth film surface
Rise.
The first dispensing film forming that the present invention is adopted, chip assembling, then cover plate for sealing, grasp ceramic chip air-tightness sealing cap technique
Make convenient, artificial and cost of transportation is greatly reduced, while and reducing because liquid glue occurs in dispensing and solidification process
Micro- pore affects the air-tightness of ceramic chip.
What the present invention was adopted replaces traditional liquid epoxy structural adhesive with epoxy construction glued membrane, while importing single dispersing
Silicon dioxide hollow microsphere, it can be ensured that solidified glue film will not subside and thickness uniformity.So can avoid because of glue amount
The uneven phenomenon for excessive glue occur.So that ceramic monolith outward appearance is totally pollution-free, it is not necessary to follow-up cleaning procedure, it is ensured that whole
Body reliability of structure and durability.
The present invention is used for loading ceramic monolith using the carrier band with location hole, realizes that volume to volume automates gluing process,
Whole dispensing UV curing process can be completed all by automation process, and operating efficiency is greatly improved, further reduce manually into
This etc..Meanwhile, carrier band packaging can be overcome due to the fragility of ceramic monolith itself, and ceramic chip is suffered in multiple transport process
External loading, vibration and friction impact and cause the possibility of ceramic material fragmentation.
Description of the drawings
Fig. 1 is ceramic chip package flow process schematic diagram of the present invention.
Fig. 2 is the structure top view of present invention carrier band.
Fig. 3 is the ceramic chip package microstructure schematic diagram of the present invention.
Fig. 4 is ceramic chip package traditional structure schematic diagram.
Specific embodiment
Embodiment 1
The present embodiment is a kind of packaging technology of ceramic chip, as shown in figure 1, comprising the following steps：
(i) dispensing film forming：Before chip is assembled, liquid double solidification fluid sealants are applied by point gum machine imposes on ceramic monolith
Need the outer rim with the side of cover plate encapsulation, by UV light irradiations make double solidification sealing glue solidifyings shape to be formed structural film adhesive in
On ceramic monolith；Point gum machine is included by the horizontal shifting platform 4 in the command displacement of the first controller 8 and direction, by second controller 2
The Glue dripping head 3 of control gel quantity, horizontal shifting platform 4 is by the command displacement of the first controller 8 and direction；The gel quantity of Glue dripping head 3
Controlled by second controller 2；Horizontal direction tree lace 6 is formed in ceramic monolith outer rim 7 by the applying glue of Glue dripping head 3, is moved in tree lace
Dynamic path rear placement UVLED spot lights 1, for irradiating the top surface of tree lace 6, the intensity of UVLED spot lights 1 is by the 3rd controller
9 controls；
(ii) chip assembling：Chipset dress is carried out on ceramic monolith；
(iii) solidification sealing：After chip is completed, will be matched with the ceramic monolith size by heating the structural film adhesive
Cover plate carry out with the ceramic monolith it is bonding, then solidification sealing.
The double solidification fluid sealants being related in the present invention are Patent No. 201610924542.7, and patent name is " a kind of
Double solidifications leaded light glue disclosed in double solidifications leaded light glue for display backlight module and preparation method thereof ".
The present embodiment is loaded in ceramic monolith on carrier band 5, and 5 structure top views of carrier band are as shown in Fig. 2 on its length direction
Be equally spaced the hole (pocket) 11 for bearing ceramic monolith and the location hole 10 for being indexed positioning, location hole 10
It is designed at carrying 5 edge, the top edge or lower limb of carrier band 5 is may be located at, not affect its overall mechanical strength, while just
In orientating principle as.It is evenly spaced on carrier band 5 with the rectangular hole 11 of the strict matching size of cuboid ceramic monolith 7.Carrier band
Select based on embossed carrier tape, can be Merlon（PC）, polystyrene（PS）, acrylonitrile-butadiene-styrene (ABS) copolymerization tree
Fat（ABS）Material, the forming method of continous way is selected, because the method dimensional stability is more preferably, product size precision is higher,
Be conducive to the precise control in automatically dropping glue path.The present invention is using with location hole 10（Index hole）Carrier band 5 be used for load pottery
Ceramic carrier 7, the thickness of ceramic monolith 7 is about 0.5 to 2mm, by location hole 10（Index hole）Be accurately positioned, realize volume to volume
Automation dispensing processing procedure, so whole dispensing, UV curing process can be completed all by automation process, meanwhile, carrier band 5 is packed
Can overcome due to the fragility of of ceramic monolith 7 itself, and ceramic chip suffered external loading, vibration in multiple transport process
And friction impact and cause the possibility of ceramic material fragmentation.Carrier band with index hole is used for loading ceramic monolith, with oneself
Dynamic control spot gluing equipment is combined, and realizes that volume to volume automates gluing process.
Ceramic chip package structure different from the ceramic chip in traditional handicraft as shown in figure 3, including ceramic monolith 7, seal
Dress technique, in the present invention before IC chip 15 is assembled, first imposes on ceramic monolith by structural film adhesive 6 by gluing process of the present invention
7 outer rims so as to form the structural film adhesive of one layer of uniform thickness, carry out again afterwards IC chip 15 and assemble, and subsequently carry out cover plate 13 close
Envelope processing procedure.
The fluid sealant for being wherein used for ceramic chip assembly encapsulating structure is the double solidification fluid sealants of UV+ heating dual cure systems,
Double solidification fluid sealants are 10000-100000cps at 25 DEG C in uncured front range of viscosities.Double solidification fluid sealants add single
Dispersed silicon dioxide hollow microsphere, weight ratio is 0.6%, and monodisperse silica hollow microsphere particle diameter is 20-150 um.It is double solid
Under w light just fixed forms structural film adhesive 6 on ceramic monolith 7 to change fluid sealant, and thickness is 100-500um.Treat 15 groups of chip
After the completion of dress, seal and solidify with cover plate 13, adopt temperature for 110-150 DEG C, minute hardening time 20-50.Cover plate materials can
To be ceramics, metal, or glass material, its wall thickness is 0.5-5mm.Ceramic monolith is square, cuboid, cylinder isotactic
Then shape, ceramic carrier material can be alundum (Al2O3), aluminium nitride, carborundum, beryllium oxide, diamond, or glass-ceramic etc..
Preferably, the ceramic monolith is alundum (Al2O3) material, and thickness is 0.5-2mm.
Comparative example：Ceramic chip package structure in traditional handicraft is as shown in figure 4, its sealing of cover plate 13 is to complete IC cores
After piece 15 is assembled with the welding of the lead of welding pin 12, chip bonding, the ceramics of chip will be equipped with by applicating liquid epoxy glue 14
Carrier 7 is sealed with cover plate 13.Because liquid glue is subject in the curing process the stress of cover plate 13 and external pressure, its thickness it is uncontrollable
Property causes excessive glue to cause more serious bad order rate.
The ceramic chip package structural manufacturing process of the present embodiment is by UV solid glues and the organic knot of epoxy construction gluing agent that is heating and curing
Close and form double solidification fluid sealants, using gluing process, Liquid Structure glue is evenly applied to into fine ceramics carrier edge, so protect
The wellability to ceramic rough surfaces is demonstrate,proved, traditional liquid epoxy construction gluing agent has been turn avoid and is polluted in cover plate for sealing processing procedure
The possibility of the join domain between ceramic chip and lead.Meanwhile, smooth film surface is produced beneficial to sealing air-tightness is ensured
Product Yield lmproved.
The first dispensing film forming that the present embodiment is adopted, chip assembling, then cover plate for sealing, make ceramic chip air-tightness sealing cap technique
Simple operation, is greatly reduced artificial and cost of transportation, while and reducing because liquid glue occurs in dispensing and solidification process
Micro- pore affect ceramic chip air-tightness.
What the present embodiment was adopted replaces traditional liquid epoxy structural adhesive with structural film adhesive, while importing single dispersing two
Silica hollow microsphere, it can be ensured that solidified glue film will not subside and thickness uniformity.So can avoid because of glue amount not
Uniformly there is the phenomenon of excessive glue.So that ceramic monolith outward appearance is totally pollution-free, it is not necessary to follow-up cleaning procedure, it is ensured that overall
Reliability of structure and durability.
In addition to the implementation, the present invention can also have other embodiment.All employing equivalents or equivalent transformation shape
Into technical scheme, all fall within the protection domain of application claims.
Claims (10)
1. a kind of packaging technology of ceramic chip, it is characterised in that：Comprise the following steps：
(i) dispensing film forming：Before chip is assembled, liquid double solidification fluid sealants are applied by point gum machine imposes on ceramic monolith
The outer rim with the side of cover plate encapsulation is needed, makes double solidification sealing glue solidifyings shape for forming structure glue by UV light irradiations
Film is on the ceramic monolith；
(ii) chip assembling：Chipset dress is carried out on the ceramic monolith；
(iii) solidification sealing：After chip is completed, will be matched with the ceramic monolith size by heating the structural film adhesive
Cover plate and the ceramic monolith carry out bonding and solidification sealing.
2. the packaging technology of ceramic chip as claimed in claim 1, it is characterised in that：The step (iii) in, heating-up temperature is
110-150 DEG C, minute hardening time 20-50.
3. the packaging technology of ceramic chip as claimed in claim 1, it is characterised in that：The step (i) in, by the ceramics
Carrier load on carrier band, it is described carrier band be equally spaced in its longitudinal direction the hole for bearing ceramic monolith and be used for into
The location hole of line index positioning, the location hole is located at the edge of the carrier band, and the hole is located at the lower section of the location hole
Or top, and match with ceramic monolith size.
4. the packaging technology of the ceramic chip as described in claim 1 or 2 or 3, it is characterised in that：In double solidification fluid sealants
It is added with monodisperse silica hollow microsphere, addition is the 0.1-2% of double solidification fluid sealant weight, the single dispersing
Silicon dioxide hollow microsphere particle diameter is 20-150um.
5. the packaging technology of the ceramic chip as described in claim 1 or 2 or 3, it is characterised in that：The structural film adhesive（6）It is logical
The liquid UV for crossing 25 DEG C of viscosity 10000-100000cps adds and formed after heat dual curing fluid sealant UV-light cured, and thickness is
100-500um。
6. the packaging technology of the ceramic chip as described in claim 1 or 2 or 3, it is characterised in that：The step (i) in, pass through
Point gum machine applies double solidification fluid sealants when imposing on ceramic monolith outer rim, and at gluing mobile route rear UVLED spot lights are disposed, and applies
For irradiating the top surfaces of the tree lace formed after double solidification fluid sealants spread while glue.
7. a kind of ceramic chip package structure, including cover plate and ceramic monolith, it is characterised in that：The ceramic monolith is loaded in load
Take, the carrier band is equally spaced in its longitudinal direction hole for bearing ceramic monolith and for being indexed positioning
Location hole, the location hole be located at the carrier band edge, the hole be located at the location hole below or above, and with pottery
Ceramic carrier size is matched；The ceramic monolith scribbles double solidification fluid sealants and by UV light with the outer rim of the side of cover plate encapsulation
Irradiation solidifying and setting forms structural film adhesive, and the ceramic monolith is with cover plate by the heating structural film adhesive solidification sealing.
8. ceramic chip package structure as claimed in claim 7, it is characterised in that：The cover plate is ceramics, metal, or glass
Glass material, its wall thickness is 0.5-5mm.
9. ceramic chip package structure as claimed in claim 7, it is characterised in that：The ceramic monolith is alundum (Al2O3) material
Matter, is shaped as square, cuboid or cylinder, and its thickness is 0.5-5mm.
10. a kind of point gum machine for the packaging technology of ceramic chip described in claim 1 or 2 or 3, including by the first controller
The horizontal shifting platform in command displacement and direction, by second controller control gel quantity Glue dripping head, by Glue dripping head applying glue in
Horizontal direction tree lace is formed in ceramic monolith outer rim, it is characterised in that：UVLED point light is disposed at the tree lace mobile route rear
Source, for irradiating the top surface of tree lace, the intensity of the UVLED spot lights is controlled by the 3rd controller.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611137889.3A CN106653622A (en) | 2016-12-12 | 2016-12-12 | Packaging technology and packaging structure of ceramic chip |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611137889.3A CN106653622A (en) | 2016-12-12 | 2016-12-12 | Packaging technology and packaging structure of ceramic chip |
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| CN106653622A true CN106653622A (en) | 2017-05-10 |
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ID=58824185
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| CN201611137889.3A Pending CN106653622A (en) | 2016-12-12 | 2016-12-12 | Packaging technology and packaging structure of ceramic chip |
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| CN108160414A (en) * | 2018-01-20 | 2018-06-15 | 梵利特智能科技（苏州）有限公司 | A kind of card rubber-coated mechanism |
| CN109326543A (en) * | 2018-11-13 | 2019-02-12 | 江苏澳芯微电子有限公司 | Chip packaging device |
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| CN111684584A (en) * | 2018-02-01 | 2020-09-18 | 康宁股份有限公司 | Singulated substrates for roll-form electronic packaging and other applications |
| CN112280663A (en) * | 2020-10-29 | 2021-01-29 | 王晓冬 | Droplet single-layer tiled nucleic acid detection chip packaging part and chip packaging method |
| CN115458416A (en) * | 2022-07-21 | 2022-12-09 | 河北博威集成电路有限公司 | Automatic operation method for sealing cap of metal ceramic packaged power device |
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| CN108160414A (en) * | 2018-01-20 | 2018-06-15 | 梵利特智能科技（苏州）有限公司 | A kind of card rubber-coated mechanism |
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| CN111684584A (en) * | 2018-02-01 | 2020-09-18 | 康宁股份有限公司 | Singulated substrates for roll-form electronic packaging and other applications |
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