CN109326543A - Chip packaging device - Google Patents
Chip packaging device Download PDFInfo
- Publication number
- CN109326543A CN109326543A CN201811349029.5A CN201811349029A CN109326543A CN 109326543 A CN109326543 A CN 109326543A CN 201811349029 A CN201811349029 A CN 201811349029A CN 109326543 A CN109326543 A CN 109326543A
- Authority
- CN
- China
- Prior art keywords
- chip
- packaging device
- tray
- card base
- chip packaging
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Abstract
The present invention relates to a kind of chip packaging devices, including transport establishment, grasping mechanism, package platforms and glue applying mechanism, wherein；Multiple trays for chip placement are equidistantly arranged in the transport establishment, the package platforms upper end offers the card slot for placing card base；The glue applying mechanism is suitable for dropping to glue in the mounting groove on card base；The grasping mechanism is suitable for picking up the chip on tray and being placed in the mounting groove on card base, grasping mechanism is adsorbed chip by negative pressure, glue applying mechanism carries out dispensing to the mounting groove of Ka Jinei simultaneously, by grasping mechanism in card base mounting groove chip being placed in package platforms, complete encapsulation operation.
Description
Technical field
The present invention relates to a kind of chip packaging devices.
Background technique
Smart card is encapsulated by chip and card base, thus master operation also surrounds chip and the processing of card base carries out, and one
As, chip passes through Nian Jie encapsulation with card base.
Traditional Intelligent card package needs pointedly to make corresponding mold, and the card base pasted with chip will be needed to put
It sets in mold, and injects glue in the mounting groove of card base, then chip is placed in the mounting groove of card base and completes encapsulation, this
Kind method causes production efficiency very low, wasting manpower and material resources, while also increasing the manufacturing cost of smart card.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of chip packaging device, envelope when solving chip and the encapsulation of card base
Fill inconvenient problem.
The technical solution adopted by the present invention to solve the technical problems is: providing a kind of chip packaging device, including transport
Mechanism, grasping mechanism, package platforms and glue applying mechanism, wherein；
Multiple trays for chip placement are equidistantly arranged in the transport establishment；
The package platforms upper end offers the card slot for placing card base；
The glue applying mechanism is suitable for dropping to glue in the mounting groove on card base；
The grasping mechanism is suitable for picking up the chip on tray and being placed in the mounting groove on card base.
Further, the grasping mechanism includes rotary body and multiple suction tubes；
The rotary body lower end fixed setting, the rotary body upper end rotation are provided with multiple struts, and the suction tube is mounted on branch
On bar；
The suction nozzle of the suction tube is arranged towards the upper surface of the chip, for removing the chip on the tray.
Further, the transport establishment includes bracket, driving motor, drive roll, driven roller and conveyer belt；
The drive roll and driven roller are rotatably arranged on the left and right ends of bracket respectively, the output shaft of the driving motor with
Drive roll is fixedly connected, and drive roll is driven to rotate；
The conveyer belt is set on drive roll and driven roller, and the tray is fixedly mounted on the conveyor belt.
Further, the glue applying mechanism includes rotating turret and Glue dripping head, the rotating turret fixed setting, the dispensing
Head is rotatably arranged on the upper end of rotating turret；
The Glue dripping head has sharp plastic emitting portion, the bottom surface Relative vertical setting in the sharp plastic emitting portion and card slot.
Further, the depth of the card slot is less than the thickness of the card base, the size of the tray and the card base phase
Together, the height of upper surface is same when the height of upper surface is placed on tray with chip when and the chip is placed in card slot
On horizontal plane.
Further, the strut is equipped with telescopic cylinder, and the push rod of the telescopic cylinder is fixedly connected on the upper of suction tube
End, so that suction tube be driven to move up and down；
The lower end of the suction tube offers the locating slot for matching with tray, and the suction nozzle is arranged in locating slot.
Further, the bracket for chip placement is offered on the tray, the suction nozzle is arranged towards bracket.
Further, the transport establishment is two, and the package platforms are two.
Further, the strut on the rotary body is four.
The beneficial effects of the present invention are: grasping mechanism is adsorbed chip by negative pressure, while glue applying mechanism is to Ka Jinei
Mounting groove carry out dispensing, by grasping mechanism in the card base mounting groove being placed on chip in package platforms, complete seal
Dress operation.
Detailed description of the invention
The following further describes the present invention with reference to the drawings.
Fig. 1 is the top view of chip packaging device of the present invention；
Fig. 2 is the main view of chip packaging device of the present invention；
Fig. 3 is the schematic diagram of chip packaging device glue applying mechanism of the present invention；
Fig. 4 is the schematic diagram of chip packaging device transport establishment of the present invention；
Wherein；1, transport establishment, 11, tray, 12, bracket, 13, drive roll, 14, driven roller, 15, conveyer belt, 2, crawl
Mechanism, 21, rotary body, 22, suction tube, 3, package platforms, 4, glue applying mechanism, 41, rotating turret, 42, Glue dripping head, 5, chip, 6, card
Base, 7, telescopic cylinder.
Specific embodiment
Presently in connection with attached drawing, the present invention is further illustrated.These attached drawings are simplified schematic diagram only with signal side
Formula illustrates basic structure of the invention, therefore it only shows the composition relevant to the invention.
As shown in Figures 1 to 4；A kind of chip packaging device is provided, including transport establishment 1, grasping mechanism 2, package platforms 3 with
And glue applying mechanism 4, wherein；The transport establishment 1 is two, and the package platforms 3 are two, the strut on the rotary body 21
It is four.
Multiple trays 11 for chip placement 5 are equidistantly arranged in the transport establishment 1；3 upper end of package platforms
Offer the card slot for placing card base 6；The glue applying mechanism 4 is suitable for dropping to glue in the mounting groove on card base 6；It is described
Grasping mechanism 2 is suitable for picking up the chip 5 on tray 11 and being placed in the mounting groove on card base 6.
The grasping mechanism 2 includes rotary body 21 and multiple suction tubes 22；21 lower end of the rotary body fixed setting, the rotation
It turns the rotation of 21 upper ends and is provided with multiple struts, the suction tube 22 is mounted on strut；The suction nozzle of the suction tube 22 is described in
The upper surface of chip 5 is arranged, for removing the chip 5 on the tray 11.
The transport establishment 1 includes bracket 12, driving motor, drive roll 13, driven roller 14 and conveyer belt 15；Institute
State drive roll 13 and driven roller 14 be rotatably arranged on the left and right ends of bracket 12 respectively, the output shaft of the driving motor with
Drive roll 13 is fixedly connected, and drive roll 13 is driven to rotate；The conveyer belt 15 is set in drive roll 13 and driven rolling
On cylinder 14, the tray 11 is fixedly mounted on conveyer belt 15.
The glue applying mechanism 4 includes rotating turret 41 and Glue dripping head 42, and the rotating turret 41 is fixedly installed, the Glue dripping head
42 are rotatably arranged on the upper end of rotating turret 41；The Glue dripping head 42 has sharp plastic emitting portion, the sharp plastic emitting portion and card slot
The setting of bottom surface Relative vertical.
The depth of the card slot is less than the thickness of the card base 6, and the size of the tray 11 is identical as the card base 6, and
The height of upper surface is same when the height of upper surface is placed on tray 11 with chip 5 when the chip 5 is placed in card slot
On horizontal plane.
The strut is equipped with telescopic cylinder 7, and the push rod of the telescopic cylinder 7 is fixedly connected on the upper end of suction tube 22, from
And suction tube 22 is driven to move up and down；The lower end of the suction tube 22 offers the locating slot for matching with tray 11, the suction
Mouth is arranged in locating slot.
The bracket for chip placement 5 is offered on the tray 11, the suction nozzle is arranged towards bracket.
In actual operation, chip 5 is placed in the bracket on tray 11, the Glue dripping head 42 on rotating turret 41 turns to
The top of 3 card slot of package platforms, Glue dripping head 42 drop to glue in the mounting groove of the card base 6 in card slot, after dispensing after
Remove Glue dripping head 42；
Then rotary body 21 rotates, and the suction tube 22 on strut is driven to turn to 11 top of tray, and the movement of telescopic cylinder 7, which drives, inhales
Cylinder 22 moves downward, and is located at tray 11 in the locating slot of 22 lower end of suction tube, and suction nozzle is adsorbed chip 5 by negative pressure, and with
Suction tube 22 move upwards and leave tray 11；
When another suction tube 22 on 21 strut of rotary body moves downward simultaneously, suction nozzle closes negative pressure, and the chip 5 adsorbed falls
To the mounting groove of card base 6, encapsulation work is completed.
Taking the above-mentioned ideal embodiment according to the present invention as inspiration, through the above description, relevant staff is complete
Various changes and amendments can be carried out without departing from the scope of the technological thought of the present invention' entirely.The technology of this invention
Property range is not limited to the contents of the specification, it is necessary to which the technical scope thereof is determined according to the scope of the claim.
Claims (9)
1. a kind of chip packaging device, which is characterized in that including transport establishment (1), grasping mechanism (2), package platforms (3) and
Glue applying mechanism (4), wherein；
Multiple trays (11) for chip placement (5) are equidistantly arranged on the transport establishment (1)；
Package platforms (3) upper end offers the card slot for placing card base (6)；
The glue applying mechanism (4) is suitable for dropping to glue in the mounting groove on card base (6)；
The grasping mechanism (2) is suitable for picking up the chip (5) on tray (11) and being placed in the mounting groove on card base (6).
2. chip packaging device according to claim 1, which is characterized in that the grasping mechanism (2) includes rotary body
(21) with multiple suction tubes (22)；
Rotary body (21) the lower end fixed setting, rotary body (21) the upper end rotation are provided with multiple struts, the suction tube
(22) it is mounted on strut；
The suction nozzle of the suction tube (22) is arranged towards the upper surface of the chip (5), for removing on the tray (11)
Chip (5).
3. chip packaging device according to claim 1, which is characterized in that the transport establishment (1) include bracket (12),
Driving motor, drive roll (13), driven roller (14) and conveyer belt (15)；
The drive roll (13) and driven roller (14) are rotatably arranged on the left and right ends of bracket (12), the driving electricity respectively
The output shaft of machine is fixedly connected with drive roll (13), and drive roll (13) is driven to rotate；
The conveyer belt (15) is set on drive roll (13) and driven roller (14), and the tray (11) is fixedly mounted on defeated
It send on band (15).
4. chip packaging device according to claim 1, which is characterized in that the glue applying mechanism (4) includes rotating turret
(41) and Glue dripping head (42), rotating turret (41) fixed setting, the Glue dripping head (42) are rotatably arranged on rotating turret (41)
Upper end；
The Glue dripping head (42) has sharp plastic emitting portion, the bottom surface Relative vertical setting in the sharp plastic emitting portion and card slot.
5. chip packaging device according to claim 3, which is characterized in that the depth of the card slot is less than the card base
(6) size of thickness, the tray (11) is identical as card base (6), and upper end when the chip (5) is placed in card slot
The height in face and chip (5) are placed on the height of upper surface when on tray (11) in same level.
6. chip packaging device according to claim 5, which is characterized in that the strut is equipped with telescopic cylinder (7), institute
The push rod for stating telescopic cylinder (7) is fixedly connected on the upper end of suction tube (22), so that suction tube (22) be driven to move up and down；
The lower end of the suction tube (22) offers the locating slot for matching with tray (11), and the suction nozzle is arranged in locating slot
It is interior.
7. chip packaging device according to claim 6, which is characterized in that offer on the tray (11) for placing
The bracket of chip (5), the suction nozzle are arranged towards bracket.
8. chip packaging device according to claim 1, which is characterized in that the transport establishment (1) is two, the envelope
Assembling platform (3) is two.
9. chip packaging device according to claim 1, which is characterized in that the strut on the rotary body (21) is four
It is a.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811349029.5A CN109326543A (en) | 2018-11-13 | 2018-11-13 | Chip packaging device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811349029.5A CN109326543A (en) | 2018-11-13 | 2018-11-13 | Chip packaging device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109326543A true CN109326543A (en) | 2019-02-12 |
Family
ID=65259636
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811349029.5A Pending CN109326543A (en) | 2018-11-13 | 2018-11-13 | Chip packaging device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109326543A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115121446A (en) * | 2022-08-30 | 2022-09-30 | 科华控股股份有限公司 | Sealing gasket glue dispensing and adhering device for suction casting shell type and method thereof |
| CN116072589A (en) * | 2023-03-07 | 2023-05-05 | 苏州易缆微光电技术有限公司 | Integrated optical module packaging equipment |
| CN116487291A (en) * | 2023-03-17 | 2023-07-25 | 徐州市沂芯微电子有限公司 | Chip packaging method and device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102891089A (en) * | 2012-10-11 | 2013-01-23 | 北京大拙至诚科技发展有限公司 | Encapsulating method of intelligent card |
| CN103325926A (en) * | 2013-06-19 | 2013-09-25 | 华中科技大学 | LED packaging structure used in on-board chip and fluorescent powder coating method thereof |
| CN106653622A (en) * | 2016-12-12 | 2017-05-10 | 南京诺邦新材料有限公司 | Packaging technology and packaging structure of ceramic chip |
| CN206401272U (en) * | 2016-12-12 | 2017-08-11 | 合肥矽迈微电子科技有限公司 | Chip attachment equipment |
-
2018
- 2018-11-13 CN CN201811349029.5A patent/CN109326543A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102891089A (en) * | 2012-10-11 | 2013-01-23 | 北京大拙至诚科技发展有限公司 | Encapsulating method of intelligent card |
| CN103325926A (en) * | 2013-06-19 | 2013-09-25 | 华中科技大学 | LED packaging structure used in on-board chip and fluorescent powder coating method thereof |
| CN106653622A (en) * | 2016-12-12 | 2017-05-10 | 南京诺邦新材料有限公司 | Packaging technology and packaging structure of ceramic chip |
| CN206401272U (en) * | 2016-12-12 | 2017-08-11 | 合肥矽迈微电子科技有限公司 | Chip attachment equipment |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115121446A (en) * | 2022-08-30 | 2022-09-30 | 科华控股股份有限公司 | Sealing gasket glue dispensing and adhering device for suction casting shell type and method thereof |
| CN116072589A (en) * | 2023-03-07 | 2023-05-05 | 苏州易缆微光电技术有限公司 | Integrated optical module packaging equipment |
| CN116487291A (en) * | 2023-03-17 | 2023-07-25 | 徐州市沂芯微电子有限公司 | Chip packaging method and device |
| CN116487291B (en) * | 2023-03-17 | 2024-03-26 | 徐州市沂芯微电子有限公司 | Chip packaging method and device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190212 |
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| RJ01 | Rejection of invention patent application after publication |