CN105280802A - White light LED module group having multiple hot flow channels and preparation method thereof - Google Patents
White light LED module group having multiple hot flow channels and preparation method thereof Download PDFInfo
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- CN105280802A CN105280802A CN201510602713.XA CN201510602713A CN105280802A CN 105280802 A CN105280802 A CN 105280802A CN 201510602713 A CN201510602713 A CN 201510602713A CN 105280802 A CN105280802 A CN 105280802A
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- 238000002360 preparation method Methods 0.000 title claims description 9
- 239000000758 substrate Substances 0.000 claims abstract description 47
- 239000012530 fluid Substances 0.000 claims abstract description 33
- 238000006243 chemical reaction Methods 0.000 claims abstract description 10
- 239000003292 glue Substances 0.000 claims description 11
- 238000002347 injection Methods 0.000 claims description 10
- 239000007924 injection Substances 0.000 claims description 10
- 239000011159 matrix material Substances 0.000 claims description 10
- 238000007789 sealing Methods 0.000 claims description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- 230000010412 perfusion Effects 0.000 claims description 6
- 239000000741 silica gel Substances 0.000 claims description 6
- 229910002027 silica gel Inorganic materials 0.000 claims description 6
- 238000007711 solidification Methods 0.000 claims description 6
- 230000008023 solidification Effects 0.000 claims description 6
- 239000002131 composite material Substances 0.000 claims description 4
- 230000005284 excitation Effects 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 239000003086 colorant Substances 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims description 3
- 230000004044 response Effects 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 abstract description 5
- 230000005540 biological transmission Effects 0.000 abstract 5
- 239000013078 crystal Substances 0.000 abstract 5
- 230000005855 radiation Effects 0.000 abstract 1
- 238000001723 curing Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 5
- 238000005286 illumination Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 2
- 239000013529 heat transfer fluid Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052755 nonmetal Inorganic materials 0.000 description 2
- 230000008859 change Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000000295 emission spectrum Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000011415 microwave curing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 238000005424 photoluminescence Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000007306 turnover Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The invention provides a white light LEDG module group having multiple hot flow channels. The white light LEDG module group includes a crystal fixation substrate, spacing setting members, a wavelength conversion cover plate, an external light transmission cover and a fluid medium. The crystal fixation substrate is formed by line substrates on which LED array chips are fixed. The spacing setting members are fixed at the periphery of an LED array chip zone on the crystal fixation substrate, and the height of the spacing setting members are greater than that of the LED array chips. The wavelength conversion cover plate is fixed and connected on the spacing setting members. The external light transmission cover is fixed on the crystal fixation substrate at the periphery of the spacing setting members, and an enclosing cavity is formed between the external light transmission cover and the crystal fixation substrate. The fluid medium fills the enclosing cavity, so that a sensible heat thermal convection is formed between the LED array chips, the wavelength conversion cover plate, and the external light transmission cover. The heat radiation of the external light transmission cover is used for heat dissipation, and the thermal dissipation capability of the light source module group is effectively improved.
Description
Technical field
The present invention relates to a kind of white light LEDs module, particularly a kind of white light LEDs module possessing many heat passages and preparation method thereof.
Background technology
As new generation of green illumination, LED illumination has possessed energy-saving and cost-reducing notable feature, all obtains support energetically and popularization at home and abroad.Under current industrialization technology level, chip LED adds fluorescent material and remains the main flow means quantizing to make white light LEDs.In this white light implementation, owing to being limited to external quantum efficiency, optical efficiency and fluorophor phototranstormation efficiency are got in encapsulation, and its electro-optical efficiency is general still lower than 60%, while meaning electro-optic conversion, must generate along with a large amount of heat.Especially for the illumination occasion of high light flux demand, the heat management for light source module is related to reliability and the continuous firing ability of LED illumination lamp.
Chip LED is added to the light source module of fluorescent material, importance that is integrated or array chip heat management is self-evident, its concern chip emission spectrum long-time stability and mix the light quality of white light processed; Meanwhile, fluorophor, when carrying out fluorescence conversion or wavelength convert, owing to there is energy conversion loss, unavoidably also faces the heat management problems of association heat.The heat management problems of aforementioned two aspects, along with the lifting of wattage or lumen number when LED illumination lamp manufactures, seems important all the more and very important.
Summary of the invention
The technical problem to be solved in the present invention, is to provide a kind of white light LEDs module possessing many heat passages and preparation method thereof.
White light LEDs module of the present invention is achieved in that a kind of white light LEDs module possessing many heat passages, comprises die bond substrate, spacing keeper, wavelength convert cover plate, outer diffuser and fluid media (medium); Described die bond substrate is made up of the circuit base plate being fixed with LED array chip; The LED array chip district that described spacing keeper is fixed on die bond substrate is peripheral, and is highly greater than the height of LED array chip; Described wavelength convert cover plate is fixedly connected on described spacing keeper; Outer diffuser is fixed on the die bond substrate of spacing keeper periphery, and and form closed cavity between die bond substrate; Described fluid media (medium) is filled in this closed cavity, to form sensible heat thermal convection between LED array chip, wavelength convert cover plate and outer diffuser.
Wherein, as preferably scheme of the present invention, the present invention may further be:
Described spacing keeper is a plurality of square small convex pillars, or is a plurality of arc projections, and discontinuous be evenly distributed on periphery, LED array chip district one circumferentially.
Described spacing keeper is highly heat-conductive material, and is highly not less than 0.4mm.
Described wavelength convert cover plate has simulated response character to the monochromatic excitation light within the scope of 200-600nm.
Described wavelength convert cover plate is body phase uniform monolayers component, or is the composite multi-layer component of laminated.
Described wavelength convert cover plate is single primary colours component of single matrix, or is the multiple bases component of single matrix.
Described wavelength convert cover plate is plane or non-planar configuration.
Described fluid media (medium) is water white transparency, and its refractive index is at 1.3-1.8, and viscosity is at 50-1000mm
2/ s.
The preparation method of the present invention's above-mentioned white light LEDs module is achieved in that a kind of preparation method possessing the white light LEDs module of many heat passages, specifically comprises the steps:
Step (1), making die bond substrate: by LED chip in mode that is annular or linear array, be fixed on circuit base plate by die bond technique, form LED array chip.
Step (2), fixing spacing keeper: by welding or bonding way, spacing keeper is fixed on the periphery in LED array chip district on die bond substrate.
Step (3), fixed wave length conversion cover plate: adopt glue bond mode, adhesive glue is applied in advance at spacing locator surface, after precuring, the wavelength convert cover plate pressing of surface through clean is fixed, keep pressure state to carry out successive depths solidification.
Step (4), fixing outer diffuser: the periphery outer diffuser being fixed on die bond ceiling substrate position keeper.
Step (5), perfusion of fluid medium sealing: after wavelength convert cover plate, the solidification thoroughly of outer diffuser, by die bond substrate overturning, from the fluid injection through hole perfusion of fluid medium that die bond substrate bottom surface leaves, fluid media (medium) filling interface is not just to have and fluid injection openings is as the criterion, afterwards with the fluid injection through hole of inserting non-topping up slightly larger than the silica gel hose of through hole or silica gel sieve, and be coated with sealing glue solidifying sealing.
Wherein, for the present invention, in described step (3) be cured as hot curing time, the temperature of described precuring is 70-100 DEG C, and pre-cure time is 10-40min; Described successive depths curing temperature is 120-160 DEG C, and curing time is 1-4 hour.
Tool of the present invention has the following advantages: the present invention is by forming closed cavity between die bond substrate and outer diffuser, and fill heat transfer fluid medium to form sensible heat thermal convection between integrated chip group, wavelength convert cover plate and outer diffuser, the heat-radiation heat-dissipating of the outer diffuser of further utilization, form the heat dissipation channel of hot-fluid thus in the heat sink direction of die bond substrate and chip light-emitting path direction simultaneously, what add light source module leads heat dissipation channel, and the thermal conductance effectively improving light source module is fallen apart ability.
Accompanying drawing explanation
The present invention is further illustrated in conjunction with the embodiments with reference to the accompanying drawings.
Fig. 1 is the plan structure schematic diagram of white light LEDs module of the present invention.
Fig. 2 is the axial sectional structure schematic diagram of white light LEDs module of the present invention.
Fig. 3 is the plan structure schematic diagram of die bond substrate of the present invention.
Fig. 4 a to Fig. 4 d is the plan structure schematic diagram that the present invention fixes 4 kinds of embodiments after spacing keeper on die bond substrate.
Fig. 5 is the plan structure schematic diagram of the present invention's fixed wave length conversion cover plate on spacing keeper.
Embodiment
The white light LEDs module possessing many heat passages of the present invention, comprises die bond substrate 1, spacing keeper 2, wavelength convert cover plate 3, outer diffuser 4 and fluid media (medium) 5.
Described die bond substrate 1 is made up of the circuit base plate 12 being fixed with LED array chip 11.The excitation wavelength of described LED array chip 11, in 200-600nm scope, can be formal dress, vertical and inverted structure.Described circuit base plate 12 can metal species substrate, also can be non-metal kind substrate; Can be laminate-type substrate, may also be non-laminated substrate; Described die bond substrate 1 bottom surface also has fluid injection through hole 122.
The LED array chip district that described spacing keeper 2 is fixed on die bond substrate 1 is peripheral, and is highly greater than the height of LED array chip 11; And be highly not less than 0.4mm.Described spacing keeper 2 is highly heat-conductive material, can be metal species or non-metal kind.
The structure of described spacing keeper 2 can be various ways, and as shown in fig. 4 a, described spacing keeper 2 is a plurality of square small convex pillars; For another example, shown in Fig. 4 b to Fig. 4 d, be a plurality of arc projection, and discontinuous be evenly distributed on periphery, LED array chip district (in figure, A is the boundary line in LED array chip district) one circumferentially, wherein, in each embodiment, the number of arc projection is different, and arc length is also different, if Fig. 4 b is 8 arc projections, arc length is shorter, and Fig. 4 c is 4 arc projections, and arc length is medium, Fig. 4 d is 2 arc projections, and arc length is longer.
Described wavelength convert cover plate 3 is fixedly connected on described spacing keeper 2; Monochromatic excitation light within the scope of described wavelength convert cover plate 3 couples of 200-600nm has simulated response character, namely possesses photoluminescence property.Described wavelength convert cover plate 3 can be body phase uniform monolayers component, as solid state fluorescence body, or is the composite multi-layer component of laminated, as coating class fluorescence composite bed.
Described wavelength convert cover plate 3 can be single primary colours component of single matrix, during as being blue light for exciting light, this wavelength convert cover plate 3 can be the yellow fluorophor of single matrix, or as exciting light be ultraviolet or black light time, this wavelength convert cover plate 3 can be the unitary fluorophor of single matrix; Described wavelength convert cover plate 3 also can be the multiple bases component of single matrix, during as being blue light for exciting light, this wavelength convert cover plate can be red, the green binary fluorophor of single matrix, or as exciting light be ultraviolet or black light time, this wavelength convert cover plate 3 can be binary or the ternary fluorophor of single matrix; Described wavelength convert cover plate 3 is plane or non-planar configuration.
Described outer diffuser 4 is fixed on the die bond substrate 1 of spacing keeper periphery, and and form closed cavity between die bond substrate 1; Described fluid media (medium) 5 is filled in this closed cavity, to form sensible heat thermal convection between LED array chip 11, wavelength convert cover plate 3 and outer diffuser 4.
Described fluid media (medium) 5 is colourless transparent liquid, and its refractive index is at 1.3-1.8, and viscosity is at 50-1000mm
2/ s.
The preparation method of the above-mentioned white light LEDs module of the present invention specifically comprises the steps:
Step (1), making die bond substrate 1: as shown in Figure 3, by LED chip in mode that is annular or linear array, be fixed on circuit base plate 12 by die bond technique, form LED array chip 11.
Step (2), fixing spacing keeper 2: as shown in the arbitrary figure of Fig. 4 a to Fig. 4 d, by welding or bonding way, spacing keeper 2 is fixed on the periphery in LED array chip district on die bond substrate 1, namely outside the A of boundary line.
Step (3), fixed wave length conversion cover plate 3: as shown in Figure 5, adopt glue bond mode, apply adhesive glue in advance, after precuring on spacing keeper 2 surface, wavelength convert cover plate 3 pressing of surface through clean is fixed, keeps pressure state to carry out successive depths solidification.
Wherein, solidification is in advance looked from successive depths curing process and is used glue kind different and different, can carry out hot curing, photocuring or microwave curing etc.If hot curing, then the temperature of described precuring is 70-100 DEG C, and pre-cure time is 10-40min; Described successive depths curing temperature is 120-160 DEG C, and curing time is 1-4 hour.
Step (4), fixing outer diffuser 4: as shown in Figure 1, by glue bond mode or alternate manner, outer diffuser 4 is fixed on the periphery of die bond substrate 1 upper limit keeper 2.
Step (5), perfusion of fluid medium 5 sealing: as shown in Figure 1, solidify thoroughly until wavelength convert cover plate 3, outer diffuser 4, by die bond substrate 1 turn-over, the fluid injection through hole 122 perfusion of fluid medium 5 left from die bond substrate 1 bottom surface, fluid media (medium) fills 5 filling interfaces (i.e. fluid boundary) just not have and fluid injection openings 122 is as the criterion, afterwards with the fluid injection through hole 122 of inserting non-topping up slightly larger than the silica gel hose of through hole or silica gel plug, and be coated with sealing glue solidifying and seal and get final product.
Tool of the present invention has the following advantages: the present invention is by forming closed cavity between die bond substrate and outer diffuser, and filling heat transfer fluid medium to form sensible heat thermal convection between integrated chip group, wavelength convert cover plate and outer diffuser, the heat-radiation heat-dissipating of the outer diffuser of further utilization, form the heat dissipation channel of hot-fluid thus in the heat sink direction of die bond substrate and chip light-emitting path direction simultaneously, what add light source module leads heat dissipation channel, and the thermal conductance effectively improving light source module is fallen apart ability.
Although the foregoing describe the specific embodiment of the present invention; but be familiar with those skilled in the art to be to be understood that; specific embodiment described by us is illustrative; instead of for the restriction to scope of the present invention; those of ordinary skill in the art, in the modification of the equivalence done according to spirit of the present invention and change, should be encompassed in scope that claim of the present invention protects.
Claims (10)
1. possess a white light LEDs module for many heat passages, it is characterized in that: comprise die bond substrate, spacing keeper, wavelength convert cover plate, outer diffuser and fluid media (medium); Described die bond substrate is made up of the circuit base plate being fixed with LED array chip; The LED array chip district that described spacing keeper is fixed on die bond substrate is peripheral, and is highly greater than the height of LED array chip; Described wavelength convert cover plate is fixedly connected on described spacing keeper; Outer diffuser is fixed on the die bond substrate of spacing keeper periphery, and and form closed cavity between die bond substrate; Described fluid media (medium) is filled in this closed cavity, to form sensible heat thermal convection between LED array chip, wavelength convert cover plate and outer diffuser.
2. the white light LEDs module possessing many heat passages according to claim 1, it is characterized in that: described spacing keeper is a plurality of square small convex pillars, or be a plurality of arc projections, and discontinuous be evenly distributed on periphery, LED array chip district one circumferentially.
3. the white light LEDs module possessing many heat passages according to claim 1 and 2, is characterized in that: described spacing keeper is highly heat-conductive material, and is highly not less than 0.4mm.
4. kind according to claim 1 possesses the white light LEDs module of many heat passages, it is characterized in that: described wavelength convert cover plate has simulated response character to the monochromatic excitation light within the scope of 200-600nm.
5. kind according to claim 1 possesses the white light LEDs module of many heat passages, it is characterized in that: described wavelength convert cover plate is body phase uniform monolayers component, or is the composite multi-layer component of laminated.
6. kind according to claim 1 possesses the white light LEDs module of many heat passages, it is characterized in that: described wavelength convert cover plate is single primary colours component of single matrix, or is the multiple bases component of single matrix.
7. kind according to claim 1 possesses the white light LEDs module of many heat passages, it is characterized in that: described wavelength convert cover plate is plane or non-planar configuration.
8. kind according to claim 1 possesses the white light LEDs module of many heat passages, it is characterized in that: described fluid media (medium) is water white transparency, and its refractive index is at 1.3-1.8, and viscosity is at 50-1000mm
2/ s.
9. the preparation method possessing the white light LEDs module of many heat passages as described in any one of claim 1 to 8, is characterized in that: specifically comprise the steps:
Step (1), making die bond substrate: by LED chip in mode that is annular or linear array, be fixed on circuit base plate by die bond technique, form LED array chip;
Step (2), fixing spacing keeper: by welding or bonding way, spacing keeper is fixed on the periphery in LED array chip district on die bond substrate;
Step (3), fixed wave length conversion cover plate: adopt glue bond mode, adhesive glue is applied in advance at spacing locator surface, after precuring, the wavelength convert cover plate pressing of surface through clean is fixed, keep pressure state to carry out successive depths solidification;
Step (4), fixing outer diffuser: the periphery outer diffuser being fixed on die bond ceiling substrate position keeper;
Step (5), perfusion of fluid medium sealing: after wavelength convert cover plate, the solidification thoroughly of outer diffuser, by die bond substrate overturning, from the fluid injection through hole perfusion of fluid medium that die bond substrate bottom surface leaves, fluid media (medium) filling interface is not just to have and fluid injection openings is as the criterion, afterwards with the fluid injection through hole of inserting non-topping up slightly larger than the silica gel hose of through hole or silica gel plug, and be coated with sealing glue solidifying sealing.
10. possess the preparation method of the white light LEDs module of many heat passages as claimed in claim 9, it is characterized in that: in described step (3) be cured as hot curing time, the temperature of described precuring is 70-100 DEG C, and pre-cure time is 10-40min; Described successive depths curing temperature is 120-160 DEG C, and curing time is 1-4 hour.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510602713.XA CN105280802A (en) | 2015-09-21 | 2015-09-21 | White light LED module group having multiple hot flow channels and preparation method thereof |
| PCT/CN2016/085370 WO2017049963A1 (en) | 2015-09-21 | 2016-06-08 | White-light led module having multiple heat flow channels and fabrication method therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510602713.XA CN105280802A (en) | 2015-09-21 | 2015-09-21 | White light LED module group having multiple hot flow channels and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105280802A true CN105280802A (en) | 2016-01-27 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510602713.XA Pending CN105280802A (en) | 2015-09-21 | 2015-09-21 | White light LED module group having multiple hot flow channels and preparation method thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN105280802A (en) |
| WO (1) | WO2017049963A1 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017049963A1 (en) * | 2015-09-21 | 2017-03-30 | 福建中科芯源光电科技有限公司 | White-light led module having multiple heat flow channels and fabrication method therefor |
| CN107359154A (en) * | 2017-08-10 | 2017-11-17 | 中国科学院福建物质结构研究所 | A kind of remote fluorescence LED component and preparation method and application |
| CN107369743A (en) * | 2017-08-10 | 2017-11-21 | 中国科学院福建物质结构研究所 | A kind of remote fluorescence LED component and preparation method and application |
| CN110021587A (en) * | 2017-12-01 | 2019-07-16 | 斯坦雷电气株式会社 | Light emitting device |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113013154B (en) * | 2021-02-10 | 2023-08-18 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | Integrated packaging tube shell of flat phased array antenna transceiver component |
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| US20080080189A1 (en) * | 2006-09-29 | 2008-04-03 | Pei-Choa Wang | LED Illumination Apparatus |
| CN101858492A (en) * | 2009-04-09 | 2010-10-13 | 大连路明发光科技股份有限公司 | LED illumination device and application thereof in lamp |
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| CN104505456A (en) * | 2014-12-16 | 2015-04-08 | 福建中科芯源光电科技有限公司 | High-power white-light LED (Light-emitting Diode) excellent in heat radiation and manufacturing method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105280802A (en) * | 2015-09-21 | 2016-01-27 | 福建中科芯源光电科技有限公司 | White light LED module group having multiple hot flow channels and preparation method thereof |
-
2015
- 2015-09-21 CN CN201510602713.XA patent/CN105280802A/en active Pending
-
2016
- 2016-06-08 WO PCT/CN2016/085370 patent/WO2017049963A1/en active Application Filing
Patent Citations (4)
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| US20080080189A1 (en) * | 2006-09-29 | 2008-04-03 | Pei-Choa Wang | LED Illumination Apparatus |
| CN101858492A (en) * | 2009-04-09 | 2010-10-13 | 大连路明发光科技股份有限公司 | LED illumination device and application thereof in lamp |
| CN103672529A (en) * | 2013-12-31 | 2014-03-26 | 贵阳杰能科技有限公司 | Hyperbolic cooling tower type LED (Light Emitting Diode) lamp |
| CN104505456A (en) * | 2014-12-16 | 2015-04-08 | 福建中科芯源光电科技有限公司 | High-power white-light LED (Light-emitting Diode) excellent in heat radiation and manufacturing method thereof |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017049963A1 (en) * | 2015-09-21 | 2017-03-30 | 福建中科芯源光电科技有限公司 | White-light led module having multiple heat flow channels and fabrication method therefor |
| CN107359154A (en) * | 2017-08-10 | 2017-11-17 | 中国科学院福建物质结构研究所 | A kind of remote fluorescence LED component and preparation method and application |
| CN107369743A (en) * | 2017-08-10 | 2017-11-21 | 中国科学院福建物质结构研究所 | A kind of remote fluorescence LED component and preparation method and application |
| CN107359154B (en) * | 2017-08-10 | 2023-09-08 | 中国科学院福建物质结构研究所 | Remote fluorescent LED device and preparation method and application thereof |
| CN107369743B (en) * | 2017-08-10 | 2023-09-08 | 中国科学院福建物质结构研究所 | Remote fluorescent LED device and preparation method and application thereof |
| CN110021587A (en) * | 2017-12-01 | 2019-07-16 | 斯坦雷电气株式会社 | Light emitting device |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2017049963A1 (en) | 2017-03-30 |
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