CN106623587A - 一种集成式框架类芯片产品切断测试装置 - Google Patents
一种集成式框架类芯片产品切断测试装置 Download PDFInfo
- Publication number
- CN106623587A CN106623587A CN201611224882.5A CN201611224882A CN106623587A CN 106623587 A CN106623587 A CN 106623587A CN 201611224882 A CN201611224882 A CN 201611224882A CN 106623587 A CN106623587 A CN 106623587A
- Authority
- CN
- China
- Prior art keywords
- screw thread
- cylinder
- plate
- bottom plate
- cut
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000012360 testing method Methods 0.000 title claims abstract description 112
- 238000005520 cutting process Methods 0.000 title claims abstract description 32
- 230000007246 mechanism Effects 0.000 claims abstract description 128
- 239000000463 material Substances 0.000 claims abstract description 49
- 238000009413 insulation Methods 0.000 claims description 23
- 238000009826 distribution Methods 0.000 claims description 17
- 229910000831 Steel Inorganic materials 0.000 claims description 12
- 239000010959 steel Substances 0.000 claims description 12
- 239000004744 fabric Substances 0.000 claims description 2
- 210000001320 hippocampus Anatomy 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 238000003780 insertion Methods 0.000 description 4
- 230000037431 insertion Effects 0.000 description 4
- 238000003825 pressing Methods 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D28/00—Shaping by press-cutting; Perforating
- B21D28/02—Punching blanks or articles with or without obtaining scrap; Notching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
- B21C51/00—Measuring, gauging, indicating, counting, or marking devices specially adapted for use in the production or manipulation of material in accordance with subclasses B21B - B21F
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D45/00—Ejecting or stripping-off devices arranged in machines or tools dealt with in this subclass
- B21D45/02—Ejecting devices
- B21D45/04—Ejecting devices interrelated with motion of tool
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)
Abstract
Description
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201611224882.5A CN106623587B (zh) | 2016-12-27 | 2016-12-27 | 一种集成式框架类芯片产品切断测试装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201611224882.5A CN106623587B (zh) | 2016-12-27 | 2016-12-27 | 一种集成式框架类芯片产品切断测试装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN106623587A true CN106623587A (zh) | 2017-05-10 |
CN106623587B CN106623587B (zh) | 2019-08-02 |
Family
ID=58832897
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201611224882.5A Active CN106623587B (zh) | 2016-12-27 | 2016-12-27 | 一种集成式框架类芯片产品切断测试装置 |
Country Status (1)
Country | Link |
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CN (1) | CN106623587B (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106976704A (zh) * | 2017-05-15 | 2017-07-25 | 苏州锦浩翔自动化有限公司 | 一种直立翻转装置 |
CN109541439A (zh) * | 2018-12-10 | 2019-03-29 | 通富微电子股份有限公司 | 一种芯片测试进料方向的调整方法、检测装置、调整系统 |
CN110355286A (zh) * | 2019-08-19 | 2019-10-22 | 东莞晋原电子有限公司 | 一种自动加装旋铆pin脚的设备 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3818195A (en) * | 1972-09-08 | 1974-06-18 | Diecomp Inc | Method and apparatus for controlling placement of split die cavities |
JPH05268023A (ja) * | 1992-02-24 | 1993-10-15 | Nec Corp | 出力回路 |
CN2873347Y (zh) * | 2005-08-12 | 2007-02-28 | 珠海格力电器股份有限公司 | 一种毛细管的冲压成型设备 |
CN201214122Y (zh) * | 2008-05-23 | 2009-04-01 | 重庆璐驰机械制造有限公司 | 自动钢材棒料送料机 |
CN102709253A (zh) * | 2012-05-14 | 2012-10-03 | 奈电软性科技电子(珠海)有限公司 | 一种集成电路板制作工艺 |
CN202910151U (zh) * | 2012-10-12 | 2013-05-01 | 刘天镐 | 金属耳机壳自动冲孔装置 |
JP2013252590A (ja) * | 2012-06-07 | 2013-12-19 | Hal Electronics Co Ltd | 積層コア製造用の積層材製造装置並びに積層コア製造用の積層材製造方法 |
CN206445068U (zh) * | 2016-12-27 | 2017-08-29 | 安徽钜芯半导体科技有限公司 | 一种集成式框架类芯片产品切断测试装置 |
-
2016
- 2016-12-27 CN CN201611224882.5A patent/CN106623587B/zh active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3818195A (en) * | 1972-09-08 | 1974-06-18 | Diecomp Inc | Method and apparatus for controlling placement of split die cavities |
JPH05268023A (ja) * | 1992-02-24 | 1993-10-15 | Nec Corp | 出力回路 |
CN2873347Y (zh) * | 2005-08-12 | 2007-02-28 | 珠海格力电器股份有限公司 | 一种毛细管的冲压成型设备 |
CN201214122Y (zh) * | 2008-05-23 | 2009-04-01 | 重庆璐驰机械制造有限公司 | 自动钢材棒料送料机 |
CN102709253A (zh) * | 2012-05-14 | 2012-10-03 | 奈电软性科技电子(珠海)有限公司 | 一种集成电路板制作工艺 |
JP2013252590A (ja) * | 2012-06-07 | 2013-12-19 | Hal Electronics Co Ltd | 積層コア製造用の積層材製造装置並びに積層コア製造用の積層材製造方法 |
CN202910151U (zh) * | 2012-10-12 | 2013-05-01 | 刘天镐 | 金属耳机壳自动冲孔装置 |
CN206445068U (zh) * | 2016-12-27 | 2017-08-29 | 安徽钜芯半导体科技有限公司 | 一种集成式框架类芯片产品切断测试装置 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106976704A (zh) * | 2017-05-15 | 2017-07-25 | 苏州锦浩翔自动化有限公司 | 一种直立翻转装置 |
CN106976704B (zh) * | 2017-05-15 | 2022-10-25 | 苏州锦浩翔自动化有限公司 | 一种直立翻转装置 |
CN109541439A (zh) * | 2018-12-10 | 2019-03-29 | 通富微电子股份有限公司 | 一种芯片测试进料方向的调整方法、检测装置、调整系统 |
CN110355286A (zh) * | 2019-08-19 | 2019-10-22 | 东莞晋原电子有限公司 | 一种自动加装旋铆pin脚的设备 |
CN110355286B (zh) * | 2019-08-19 | 2024-04-26 | 东莞晋原电子有限公司 | 一种自动加装旋铆pin脚的设备 |
Also Published As
Publication number | Publication date |
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CN106623587B (zh) | 2019-08-02 |
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SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Integrated type frame class chip product cutting and testing device Effective date of registration: 20200724 Granted publication date: 20190802 Pledgee: China Postal Savings Bank Limited by Share Ltd. Chizhou branch Pledgor: ANHUI JUXIN SEMICONDUCTOR TECHNOLOGY Co.,Ltd. Registration number: Y2020980004360 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20211011 Granted publication date: 20190802 Pledgee: China Postal Savings Bank Limited by Share Ltd. Chizhou branch Pledgor: ANHUI JUXIN SEMICONDUCTOR TECHNOLOGY Co.,Ltd. Registration number: Y2020980004360 |
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CP03 | Change of name, title or address | ||
CP03 | Change of name, title or address |
Address after: 247000 No. 2 Shuanglong Road, Chizhou Economic and Technological Development Zone, Chizhou City, Anhui Province Patentee after: Anhui Juxin Semiconductor Technology Co.,Ltd. Country or region after: China Address before: 247000 No. 2 Shuanglong Road, Chizhou Economic and Technological Development Zone, Chizhou City, Anhui Province Patentee before: ANHUI JUXIN SEMICONDUCTOR TECHNOLOGY Co.,Ltd. Country or region before: China |