CN106572595A - Heat dissipation type high-power strong current printed circuit board and preparation method thereof - Google Patents
Heat dissipation type high-power strong current printed circuit board and preparation method thereof Download PDFInfo
- Publication number
- CN106572595A CN106572595A CN201610985825.2A CN201610985825A CN106572595A CN 106572595 A CN106572595 A CN 106572595A CN 201610985825 A CN201610985825 A CN 201610985825A CN 106572595 A CN106572595 A CN 106572595A
- Authority
- CN
- China
- Prior art keywords
- conductive layer
- wiring board
- parts
- basic unit
- intermediate layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0158—Polyalkene or polyolefin, e.g. polyethylene [PE], polypropylene [PP]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
The invention provides a heat dissipation type high-power strong current printed circuit board and a preparation method thereof. According to the flexible circuit board of a novel structure provided by the invention, a heat dissipation coating is additionally arranged on the surface of a conductive layer, a base layer is used in cooperation, and therefore, an excellent heat dissipation effect can be achieved with high-conductivity high-power strong current ensured, and the technical problem of the incapability of satisfying high heat resistance and high thermal conductivity in the prior art can be solved.
Description
Technical field
The invention belongs to PCB processing technique fields, and in particular to a kind of heat radiating type high power strong electric current printed wiring board and
Its preparation method.
Background technology
The application of high-power LED (light emitting diode) at present is increasingly popularized, and automobile lamp etc. adopts high-power
The application of optical diode is more and more, and the aluminum base layer of conventional rigid wiring board is very good at aspects such as radiatings, but due to dress
The concordance and Reliability comparotive matched somebody with somebody is poor, and assembly space is needed than larger, so being replaced using flexible circuit board original
The rigid wiring board of aluminium base have become the new direction of electronics, electrical equipment industry and wiring board industry development.Current LED lamps
It is single-sided flexible circuit board back side patch pressure sensitive adhesive plus metallic substrates generally to use structure（Aluminum or aluminum alloy）Mode carry out
Radiating, due to the bonded adhesives and basement membrane of current flexible circuit board（Polyimides）The coefficient of heat conduction than relatively low, 0.2～
0.3W/m.K, it is impossible to meet high thermal conductivity coefficient（Require to be more than 1W/m.K）Demand, some FPC product requirements are more than 150 DEG C
Environment long-term work, so the heat conductivity of the thermostability and structure to FPC itself is put forward higher requirement.
The content of the invention
In view of this, the present invention provides a kind of heat radiating type high power strong electric current printed wiring board and preparation method thereof, this
Bright to provide a kind of structure of flexible circuit board and newly design, the method for adding thermal dispersant coatings using conductive layer surface coordinates the present invention
The basic unit of design, while ensureing to meet high admittance high power strong electric current, reaches good radiating effect, solves prior art
In cannot meet the technical problem that thermostability and high-termal conductivity are required.
The technical scheme is that：A kind of heat radiating type high power strong electric current printed wiring board, the wiring board includes base
Layer, intermediate layer, conductive layer and via, the two sides of the basic unit has been covered each by intermediate layer, and the surface in the intermediate layer sets
There is conductive layer, the via runs through the conductive layer, intermediate layer and basic unit, and the conducting hole surface is provided with conductive layer.
The raw material of the basic unit is made up of following weight meter component, 57 parts of polyethylene, 23 parts of polystyrene, ethyl vinyl acetate second
Alkene copolymer（EVA）19 parts, 9 parts of activated Calcium carbonate, 2.3 parts of antiaging agent.By each component in the basic unit in the present invention
Synergistic function, so as to high intensity and high thermal conductivity.
The conductive layer for being arranged at interlayer surfaces is provided with thermal dispersant coatings, and the thermal dispersant coatings are by following weight meter component
Composition：0.2 part of 0.3 part of 4.5 parts of 9.2 parts of 0.87 part of 7.3 parts of 12.7 parts of SiO, ZnO, BeO, Zr, Hf, Fe, Cr, C
0.5 part, 0.25 part of N.By the synergistic function of each component in the basic unit in the present invention, so as to have high power strong is met
The high conductance and high thermal conductivity of electric current.
The conductive layer is closely knit tabular or pertusate netted.
The intermediate layer and conductive layer use metal material.The intermediate layer and conductive layer can be by prior arts
Any one material or the combination of two kinds of metal materials realize.
A kind of preparation method of above-mentioned heat radiating type high power strong electric current printed wiring board, comprises the following steps：
S1. basic unit is taken, using surfactant solution and water substrate surface is respectively washed, remove spot, the dust of substrate surface,
And make basic unit smooth；
S2. by the way of magnetron sputtering, in substrate surface intermediate layer is added；
S3. by way of plating, in interlayer surfaces conductive layer is added；
S4. by way of laser boring, the conducting for sequentially passing through conductive layer, intermediate layer, basic unit, intermediate layer, conductive layer is got
Hole；
S5. conductive layer is added by way of magnetron sputtering in the conducting hole surface.
The present invention adopts said structure design so that the wiring board heat resistance of this new structure and heat conductivility are obtained
Increase substantially, the cooling requirements of high-power LED wiring board can be fully met, extend the service life of product.
Specific embodiment
Technical scheme is clearly and completely described below in conjunction with the embodiment of the present invention, it is clear that retouched
The embodiment stated is only a part of embodiment of the invention, rather than the embodiment of whole.
A kind of heat radiating type high power strong electric current printed wiring board, the wiring board include basic unit, intermediate layer, conductive layer and
Via, the two sides of the basic unit has been covered each by intermediate layer, and the surface in the intermediate layer is provided with conductive layer, and the via is passed through
The conductive layer, intermediate layer and basic unit are worn, the conducting hole surface is provided with conductive layer.
The raw material of the basic unit is made up of following weight meter component, 57 parts of polyethylene, 23 parts of polystyrene, ethyl vinyl acetate second
Alkene copolymer（EVA）19 parts, 9 parts of activated Calcium carbonate, 2.3 parts of antiaging agent.
The conductive layer for being arranged at interlayer surfaces is provided with thermal dispersant coatings, and the thermal dispersant coatings are by following weight meter component
Composition：0.2 part of 0.3 part of 4.5 parts of 9.2 parts of 0.87 part of 7.3 parts of 12.7 parts of SiO, ZnO, BeO, Zr, Hf, Fe, Cr, C
0.5 part, 0.25 part of N.
The conductive layer is closely knit tabular or pertusate netted.
The intermediate layer and conductive layer use metal material.
A kind of preparation method of above-mentioned heat radiating type high power strong electric current printed wiring board, comprises the following steps：
S1. basic unit is taken, using surfactant solution and water substrate surface is respectively washed, remove spot, the dust of substrate surface,
And make basic unit smooth；
S2. by the way of magnetron sputtering, in substrate surface intermediate layer is added；
S3. by way of plating, in interlayer surfaces conductive layer is added；
S4. by way of laser boring, the conducting for sequentially passing through conductive layer, intermediate layer, basic unit, intermediate layer, conductive layer is got
Hole；
S5. conductive layer is added by way of magnetron sputtering in the conducting hole surface.
The present invention adopts said structure design so that the wiring board heat resistance of this new structure and heat conductivility are obtained
Increase substantially, the cooling requirements of high-power LED wiring board can be fully met, extend the service life of product.
It is obvious to a person skilled in the art that the invention is not restricted to the details of above-mentioned one exemplary embodiment, Er Qie
In the case of spirit or essential attributes without departing substantially from the present invention, the present invention can be in other specific forms realized.Therefore, no matter
From the point of view of which point, embodiment all should be regarded as exemplary, and be nonrestrictive, the scope of the present invention is by appended power
Profit is required rather than described above is limited, it is intended that all in the implication and scope of the equivalency of claim by falling
Change is included in the present invention.
Moreover, it will be appreciated that although this specification is been described by according to embodiment, not each embodiment is only wrapped
Containing an independent technical scheme, this narrating mode of description is only that for clarity those skilled in the art should
Using description as an entirety, the technical scheme in each embodiment can also Jing it is appropriately combined, form those skilled in the art
Understandable other embodiment.The ins and outs not described in detail in the present invention, can pass through arbitrary in this area
Prior art is realized.Particularly, all technical characterstics not described in detail can be realized by any prior art in the present invention.
Claims (6)
1. a kind of heat radiating type high power strong electric current printed wiring board, it is characterised in that the wiring board includes basic unit, intermediate layer,
Conductive layer and via, the two sides of the basic unit has been covered each by intermediate layer, and the surface in the intermediate layer is provided with conductive layer, institute
Via is stated through the conductive layer, intermediate layer and basic unit, the conducting hole surface is provided with conductive layer.
2. heat radiating type high power strong electric current printed wiring board according to claim 1, it is characterised in that the original of the basic unit
Material is made up of following weight meter component, 57 parts of polyethylene, 23 parts of polystyrene, ethylene-vinyl acetate copolymer（EVA） 19
Part, 9 parts of activated Calcium carbonate, 2.3 parts of antiaging agent.
3. the heat radiating type high power strong electric current printed wiring board according to claim 1 or 2, it is characterised in that described to set
The conductive layer for being placed in interlayer surfaces is provided with thermal dispersant coatings, and the thermal dispersant coatings are made up of following weight meter component：SiO 12.7
Part, 7.3 parts of ZnO, 0.87 part of BeO, 9.2 parts of Zr, 4.5 parts of Hf, 0.3 part of Fe, 0.2 part of Cr, 0.5 part of C, 0.25 part of N.
4. the heat radiating type high power strong electric current printed wiring board according to claim 1, it is characterised in that the conductive layer
For closely knit tabular or pertusate netted.
5. the heat radiating type high power strong electric current printed wiring board according to claim 1, it is characterised in that the intermediate layer
Metal material is used with conductive layer.
6. a kind of preparation method of the heat radiating type high power strong electric current printed wiring board as described in claim 1-5, its feature exists
In comprising the following steps：
S1. basic unit is taken, using surfactant solution and water substrate surface is respectively washed, remove spot, the dust of substrate surface,
And make basic unit smooth；
S2. by the way of magnetron sputtering, in substrate surface intermediate layer is added；
S3. by way of plating, in interlayer surfaces conductive layer is added；
S4. by way of laser boring, the conducting for sequentially passing through conductive layer, intermediate layer, basic unit, intermediate layer, conductive layer is got
Hole；
S5. conductive layer is added by way of magnetron sputtering in the conducting hole surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610985825.2A CN106572595A (en) | 2016-11-09 | 2016-11-09 | Heat dissipation type high-power strong current printed circuit board and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610985825.2A CN106572595A (en) | 2016-11-09 | 2016-11-09 | Heat dissipation type high-power strong current printed circuit board and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106572595A true CN106572595A (en) | 2017-04-19 |
Family
ID=58540760
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610985825.2A Pending CN106572595A (en) | 2016-11-09 | 2016-11-09 | Heat dissipation type high-power strong current printed circuit board and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106572595A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102209429A (en) * | 2010-10-29 | 2011-10-05 | 博罗县精汇电子科技有限公司 | Heat radiation type flexible circuit board |
| CN105304593A (en) * | 2015-11-18 | 2016-02-03 | 上海大学 | Efficient radiating substrate for photoelectric device |
| CN205124123U (en) * | 2015-11-30 | 2016-03-30 | 惠州市博宇科技有限公司 | Copper -clad plate of high heat conduction copper of high proof voltage base |
| US20160226042A1 (en) * | 2015-02-04 | 2016-08-04 | Outlast Technologies, LLC | Systems, structures and materials for electrochemical device thermal management |
-
2016
- 2016-11-09 CN CN201610985825.2A patent/CN106572595A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102209429A (en) * | 2010-10-29 | 2011-10-05 | 博罗县精汇电子科技有限公司 | Heat radiation type flexible circuit board |
| US20160226042A1 (en) * | 2015-02-04 | 2016-08-04 | Outlast Technologies, LLC | Systems, structures and materials for electrochemical device thermal management |
| CN105304593A (en) * | 2015-11-18 | 2016-02-03 | 上海大学 | Efficient radiating substrate for photoelectric device |
| CN205124123U (en) * | 2015-11-30 | 2016-03-30 | 惠州市博宇科技有限公司 | Copper -clad plate of high heat conduction copper of high proof voltage base |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: 516000 No. 9, Longshan Eighth Road, Daya Bay West District, Huizhou City, Guangdong Province Applicant after: Guangdong Kexiang Electronic Technology Co., Ltd. Address before: 516000 No. 9, Longshan Eighth Road, Daya Bay West District, Huizhou City, Guangdong Province Applicant before: Guangdong Kexiang Electronic Technology Co., Ltd. |
|
| CB02 | Change of applicant information | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170419 |
|
| RJ01 | Rejection of invention patent application after publication |