CN106536605B - 预浸料和纤维强化复合材料 - Google Patents
预浸料和纤维强化复合材料 Download PDFInfo
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- CN106536605B CN106536605B CN201580041533.7A CN201580041533A CN106536605B CN 106536605 B CN106536605 B CN 106536605B CN 201580041533 A CN201580041533 A CN 201580041533A CN 106536605 B CN106536605 B CN 106536605B
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| JP6854591B2 (ja) * | 2016-04-12 | 2021-04-07 | 帝人株式会社 | プリプレグ、強化繊維、繊維強化複合材料、およびプリプレグの製造方法 |
| BR112018071036A2 (pt) * | 2016-04-13 | 2019-02-12 | Teijin Limited | material compósito reforçado com fibra de pré-impregnado e fibras de reforço de superfície modificada |
| US11589472B2 (en) * | 2016-06-23 | 2023-02-21 | Toray Industries, Inc. | Case having inner space within cover for electronic device |
| CN109637722B (zh) * | 2018-11-06 | 2020-11-03 | 深圳烯湾科技有限公司 | 碳纳米管纤维导线 |
| US12134238B2 (en) | 2018-12-21 | 2024-11-05 | 3M Innovative Properties Company | Fiber-reinforced composite layup |
| US20220097345A1 (en) * | 2018-12-27 | 2022-03-31 | Nippon Steel Chemical & Material Co., Ltd. | Metal-fiber reinforced plastic composite material |
| CN111978577A (zh) * | 2020-07-31 | 2020-11-24 | 中航复材(北京)科技有限公司 | 一种双极板用连续导电纤维毡预浸料及制备方法 |
| CN112521743A (zh) * | 2020-11-12 | 2021-03-19 | 国网山西省电力公司电力科学研究院 | 工频电场探头电磁屏蔽层复合材料 |
| KR102709776B1 (ko) * | 2021-12-24 | 2024-09-26 | 재단법인 한국섬유기계융합연구원 | 유전물질의 유도발열을 활용한 고분자 복합재의 성형방법 |
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| CN103396576A (zh) * | 2006-08-07 | 2013-11-20 | 东丽株式会社 | 预浸料坯和碳纤维强化复合材料 |
| WO2014017339A1 (ja) * | 2012-07-25 | 2014-01-30 | 東レ株式会社 | プリプレグおよび炭素繊維強化複合材料 |
| WO2014050896A1 (ja) * | 2012-09-26 | 2014-04-03 | 東邦テナックス株式会社 | プリプレグ及びその製造方法 |
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| GB0622060D0 (en) * | 2006-11-06 | 2006-12-13 | Hexcel Composites Ltd | Improved composite materials |
| US20080145647A1 (en) * | 2006-12-13 | 2008-06-19 | Rahul Ganguli | Metal impregnated composites and methods of making |
| JP2009062473A (ja) | 2007-09-07 | 2009-03-26 | Toray Ind Inc | プリプレグおよび炭素繊維強化複合材料 |
| GB0805640D0 (en) | 2008-03-28 | 2008-04-30 | Hexcel Composites Ltd | Improved composite materials |
| US8044499B2 (en) | 2008-06-10 | 2011-10-25 | Semiconductor Energy Laboratory Co., Ltd. | Wiring substrate, manufacturing method thereof, semiconductor device, and manufacturing method thereof |
| JP5473413B2 (ja) | 2008-06-20 | 2014-04-16 | 株式会社半導体エネルギー研究所 | 配線基板の作製方法、アンテナの作製方法及び半導体装置の作製方法 |
| GB0817591D0 (en) | 2008-09-26 | 2008-11-05 | Hexcel Composites Ltd | Improvements in composite materials |
| JP5887963B2 (ja) * | 2012-01-31 | 2016-03-16 | 東レ株式会社 | プリプレグおよび炭素繊維強化複合材料 |
| GB201206885D0 (en) | 2012-04-19 | 2012-06-06 | Cytec Tech Corp | Composite materials |
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| CN103396576A (zh) * | 2006-08-07 | 2013-11-20 | 东丽株式会社 | 预浸料坯和碳纤维强化复合材料 |
| WO2014017339A1 (ja) * | 2012-07-25 | 2014-01-30 | 東レ株式会社 | プリプレグおよび炭素繊維強化複合材料 |
| WO2014050896A1 (ja) * | 2012-09-26 | 2014-04-03 | 東邦テナックス株式会社 | プリプレグ及びその製造方法 |
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| BR112017001488B1 (pt) | 2021-10-19 |
| ES2700599T3 (es) | 2019-02-18 |
| BR112017001488A2 (pt) | 2017-12-05 |
| JP2016183328A (ja) | 2016-10-20 |
| US20180208729A1 (en) | 2018-07-26 |
| CN106536605A (zh) | 2017-03-22 |
| WO2016017553A1 (ja) | 2016-02-04 |
| US10544274B2 (en) | 2020-01-28 |
| CA2953910A1 (en) | 2016-02-04 |
| JP6713792B2 (ja) | 2020-06-24 |
| JPWO2016017553A1 (ja) | 2017-04-27 |
| EP3176205B1 (en) | 2018-10-31 |
| EP3176205A1 (en) | 2017-06-07 |
| EP3176205A4 (en) | 2017-06-28 |
| JP5898391B1 (ja) | 2016-04-06 |
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