CN106531694A - Environmental sensor - Google Patents
Environmental sensor Download PDFInfo
- Publication number
- CN106531694A CN106531694A CN201611110829.2A CN201611110829A CN106531694A CN 106531694 A CN106531694 A CN 106531694A CN 201611110829 A CN201611110829 A CN 201611110829A CN 106531694 A CN106531694 A CN 106531694A
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- Prior art keywords
- chip
- environmental sensor
- fixing collar
- asic chip
- bonding die
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- 230000007613 environmental effect Effects 0.000 title claims abstract description 42
- 239000003292 glue Substances 0.000 claims description 62
- 239000000463 material Substances 0.000 claims description 9
- 239000012943 hotmelt Substances 0.000 claims description 5
- 230000008034 disappearance Effects 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims description 3
- 230000009477 glass transition Effects 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 14
- 230000003014 reinforcing effect Effects 0.000 abstract description 7
- 230000000694 effects Effects 0.000 abstract description 6
- 239000000853 adhesive Substances 0.000 abstract description 4
- 230000001070 adhesive effect Effects 0.000 abstract description 4
- 239000000047 product Substances 0.000 description 7
- 238000005538 encapsulation Methods 0.000 description 4
- 238000007711 solidification Methods 0.000 description 4
- 230000008023 solidification Effects 0.000 description 4
- 238000005286 illumination Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 241000208340 Araliaceae Species 0.000 description 1
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 1
- 235000003140 Panax quinquefolius Nutrition 0.000 description 1
- 238000010009 beating Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 235000008434 ginseng Nutrition 0.000 description 1
- 239000013067 intermediate product Substances 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
- H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
- H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3114—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48145—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16151—Cap comprising an aperture, e.g. for pressure control, encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Abstract
The invention discloses an environmental sensor. The environmental sensor includes an ASIC chip, an MEMS chip and a PCB, the ASIC chip is fixed on the PCB, a reinforcing ring is arranged between the ASIC chip and MEMS chip, and the internal diameter dimension of the reinforcing ring is smaller than the size of the MEMS chip; and the inner wall of the reinforcing ring and the ASIC chip form an accommodating cavity, a die bonding adhesive is filled in the accommodating cavity, and the MEMS chip and the ASIC chip are fixedly connected through the die bonding adhesive. According to the environmental sensor provided by the invention, through arrangement of the reinforcing ring under the MEMS chip, adhesive thickness is well guaranteed, an effect of isolating outside stress is improved, the chip can also be supported, and the difficulty of subsequent processes such as wire bonding is lowered.
Description
Technical field
The present invention relates to chip encapsulation technology field, more particularly to a kind of environmental sensor.
Background technology
Sensor-packaging structure of the prior art as shown in figure 1, in shell 1 ', ASIC (Application
Specific Integrated Circuit, special IC) chip 4 ' is fixed on pcb board 5 ' by bonding die glue 3 ',
MEMS (Micro-Electro-Mechanical System, MEMS) chip 2 ' is fixed on ASIC by bonding die glue 3 '
On chip 4 ', wire 6 ' between MEMS chip 2 ' and asic chip 4 ', between asic chip 4 ' and pcb board 5 ', is provided with.
In product encapsulation process, it is the stress for isolating pcb board, needs to arrange the bonding die glue (or gummed paper) between chip
Larger thickness；But it is limited to chip weight, it is difficult to by the THICKNESS CONTROL of bonding die glue in required thickness range, and glue-line is thick
When spending big, because of the resilience of glue-line, to subsequent handling, the such as technique such as routing causes great difficulty, causes the low phenomenon of yield rate.
The content of the invention
In view of foregoing description, the invention provides a kind of environmental sensor, to solve to be difficult to pass through in product encapsulation process
Increase bonding die glue thickness to completely cut off the problem of pcb board stress.
To reach above-mentioned purpose, the technical scheme is that what is be achieved in that：
On the one hand, the invention provides a kind of environmental sensor, including：Asic chip, MEMS chip and pcb board, ASIC
Chip is fixed on pcb board, and fixing collar, the inwall and asic chip of fixing collar are additionally provided between asic chip and MEMS chip
Host cavity, and the internal diameter size of fixing collar are formed less than the size of the MEMS chip of its support；Filling bonding die glue in host cavity,
MEMS chip is fixedly connected by bonding die glue with asic chip.
Preferably, fixing collar is in solid-state below the first temperature value, more than the second temperature value higher than the first temperature value
It is in a liquid state or steam state, and second temperature value is less than the glass transition temperature Tg value of bonding die glue.
Preferably, bonding die glue is in solid-state below Tg values, and Tg values are more than 350 DEG C.
Preferably, fixing collar is hot melt rubber stick EVT materials, and the span of the first temperature value is 0-50 DEG C, second temperature
The span of value is 100-280 DEG C.
Preferably, the shape of fixing collar is matched with MEMS chip.
Preferably, size of the outside dimension of fixing collar less than asic chip.
Preferably, thickness of the thickness of bonding die glue more than fixing collar.
Preferably, fixing collar and asic chip are by together with being adhesively fixed.
Preferably, environmental sensor also includes encapsulating housing, and encapsulating housing is formed with pcb board and houses asic chip, MEMS
The chamber of chip.
On the other hand, the invention provides a kind of environmental sensor, removes its fixing collar by above-mentioned environmental sensor
Form, accordingly, the Sidewall Height step-down of host cavity or disappearance after partly or entirely, bond MEMS chip and asic chip it is viscous
Piece glue is presented the exposed shape that part supports without fixing collar or all supports without fixing collar.
The beneficial effect of the embodiment of the present invention is：
1st, environmental sensor of the invention, by increasing fixing collar between MEMS chip and asic chip, using reinforcing
Circle and asic chip form host cavity, limit bonding die glue by the host cavity, increase bonding die between MEMS chip and asic chip
The thickness of glue, completely cuts off pcb board stress, and the support by fixing collar, reduces the resilience dynamics of bonding die glue, after reducing routing etc.
The difficulty of continuous technique.
2nd, environmental sensor of the invention, the part or all of shape of the fixing collar by removing above-mentioned environmental sensor
Into making bonding die glue presentation part between bonding MEMS chip and asic chip support without fixing collar or all prop up without fixing collar
The exposed shape of support, can avoid the effective glue of fixing collar restriction bonding die glue thick, it is ensured that the buffering effect of bonding die glue is not fully exerted, and enters
And effectively completely cut off the stress from pcb board, improved properties of product.
Description of the drawings
Fig. 1 is the encapsulating structure schematic diagram of sensor in prior art；
Fig. 2 is the structural representation of the environmental sensor that the embodiment of the present invention one is provided；
Fig. 3 is the structural representation of the environmental sensor that the embodiment of the present invention two is provided.
Specific embodiment
To make the object, technical solutions and advantages of the present invention clearer, below in conjunction with accompanying drawing to embodiment party of the present invention
Formula is described in further detail.
As the asic chip in sensor, MEMS chip are easily affected by extraneous stress, especially MEMS chip is to coming
Stress from pcb board is more sensitive, reduces the PCB that MEMS chip is subject to generally by increasing the thickness of MEMS bottoms bonding die glue
Plate stress.But it is limited to chip weight, it is difficult to which by the THICKNESS CONTROL of bonding die glue in required thickness range, and bondline thickness is big
When, because of the resilience of glue-line, to subsequent handling, the such as technique such as routing causes great difficulty, causes the low phenomenon of yield rate.
Based on above-mentioned situation, the General layout Plan of the present invention is：Increase between MEMS chip and asic chip and reinforce
Circle, is formed the fence for limiting that bonding die glue is flowed freely, and then increases the thickness of MEMS bottoms bonding die glue using fixing collar；Follow-up work
During sequence such as routing, by the support of fixing collar, the resilience dynamics of bonding die glue is reduced, reduce difficulty of processing；Final products are molded
Before, fixing collar is melted, the restriction to bonding die glue is removed, is made bonding die glue give full play to cushioning effect, is reduced answering from pcb board
Power, improving product performance.
Embodiment one
Fig. 2 is the structural representation of the environmental sensor that the embodiment of the present invention one is provided, as shown in Fig. 2 the environmentally sensitive
Device includes asic chip 3, MEMS chip 4 and pcb board 2, and asic chip 3 is fixed on pcb board 2, asic chip 3 and MEMS chip
Fixing collar 6 is additionally provided between 4, inwall and the asic chip 3 of fixing collar 6 form host cavity, and the internal diameter size of fixing collar 6 is little
In the size of its MEMS chip 4 for supporting；Filling bonding die glue 7 in host cavity, MEMS chip 4 passes through bonding die glue 7 with asic chip 3
It is fixedly connected.
The present embodiment increases reinforcing by the periphery of the bonding die glue of fixation is played between MEMS chip and asic chip
Circle, forms host cavity using fixing collar and asic chip, is limited by the host cavity, supports bonding die glue, and then increases MEMS cores
The thickness of bonding die glue between piece and asic chip, completely cuts off the impact of pcb board stress, reducing the difficulty of the subsequent technique such as routing.
Due to current embodiment require that limited using fixing collar, the bonding die glue supported in host cavity, therefore it is required that under normal temperature
Fixing collar should stablize, and as fixing collar can restrict the decrease effect of bonding die glue stress to external world, therefore it is required that intermediate products
After the process of the subsequent techniques such as routing, fixing collar can be removed, but not affect the solidification shape of the bonding die glue in host cavity
State.
Based on above-mentioned consideration, in an implementation of the present embodiment, fixing collar is in solid-state below the first temperature value,
It is in a liquid state or steam state more than the second temperature value higher than the first temperature value, and second temperature value turns less than the vitrifying of bonding die glue
Temperature Tg values.Bonding die glue can be solidified in environment such as normal temperature, illumination, steam, in solid-state below Tg values after solidification.
It is exemplary, fixing collar can be hot melt rubber stick EVT materials, its first temperature value span be 0-50 DEG C, second
Temperature value is corresponded to as 100-280 DEG C, and the Tg values of bonding die glue 7 correspond to more than 350 DEG C of numerical value；That is hot melt rubber stick EVT materials
The fixing collar of matter can keep stable solid-state at normal temperatures, in higher temperature (more than 100 DEG C) melt, flowing, but not shadow
Ring the solid state of bonding die glue 7.
It should be noted that in actual applications, the fixing collar of other materials is also may be selected, as long as fixing collar is at normal temperatures
It is stable, the flowing of bonding die glue can be limited, so that bonding die glue completes solidification, and fixing collar under the environment such as normal temperature, illumination, steam
Condensing temperature or vapourizing temperature much smaller than bonding die glue Tg values.
It should be noted that above-mentioned implementation is illustrated, fixing collar can be removed by being heat-treated, it is clear that
In practical application, it is also possible to select the fixing collar of other materials, to be removed by handling process such as burn into shearings.
The environmental sensor of the present embodiment, by select the fixing collar of suitable material to be not only able to preferably to ensure glue it is thick,
Subsequent handling (such as routing) difficulty, and fixing collar are reduced under the high temperature conditions by melting and flowing, moreover it is possible to ensure that final state is produced
The qualified glue of product is thick so that MEMS chip only relies on stress of the bonding die glue isolation from pcb board.
Fig. 2 is referred to such as, what Fig. 2 illustrated fixing collar 6 is shaped as annular.Obvious fixing collar in actual applications
6 can also be other shapes.Preferably, the shape of fixing collar is matched with MEMS chip, i.e., when MEMS chip is square, reinforce
The outer shape of circle is also square, and when MEMS chip is circular, the outer shape of fixing collar is also annular, and the present embodiment is not
The shape of fixing collar is limited, for ease of processing, the side's of being preferably designed to annular.
Preferably, size of 6 outside dimension of fixing collar less than asic chip 3, with effective support MEMS chip.Such as with reference to figure
2, fixing collar 6 is disposed entirely within asic chip 3, and its edge is also reserved with certain space, in order to carry out beating in asic chip
The subsequent handlings such as line.Stress demand can be met to ensure the thickness of bonding die glue in addition, the thickness of preferred bonding die glue 7 is more than reinforcing
The thickness of circle 6.
The present embodiment does not limit the fixed form of fixing collar 6 and asic chip 3, asic chip 3 and pcb board 2, exemplary
Ground, fixing collar 6 can be fixed on by way of bonding on asic chip 3, and asic chip 3 can also be by way of bonding die glue
On fixed pcb board 2.
With reference to Fig. 2, the environmental sensor in the present embodiment also includes encapsulating housing 1, and encapsulating housing 1 is formed with pcb board 2 and received
Hold asic chip 3, the chamber of MEMS chip 4, between the asic chip 3 and MEMS chip 4 of within the chamber, asic chip 3 and pcb board
Connected by wire 5 between 2.
The environmental sensor of the present embodiment prepares to be formed by following methods：
1st, pcb board, MEMS chip and the asic chip of suitable types are selected, asic chip is pasted onto on pcb board；
2nd, the strengthening with external bonding circle on asic chip, makes fixing collar form host cavity with asic chip；
3rd, bonding die glue is filled in host cavity, MEMS chip is fixed on ASIC by the bonding die glue；
4th, the solidification bonding die glue in the environment such as suitable temperature, illumination, steam；
5th, after the completion of bonding die adhesive curing, the subsequent treatment work such as routing connection is carried out to MEMS chip, asic chip and pcb board
Sequence；
6th, the chamber for housing asic chip, MEMS chip is formed using encapsulating housing and pcb board, the encapsulation of sensor is completed
Process.
By upper, the preparation of the environmental sensor of the present embodiment is completed by step 1～6.
Environmental sensor in the present embodiment can detect the ginseng such as temperature, humidity, brightness or intensity of sound of outside
Number, environmental sensor are mainly used in consumer electronics sector, such as mobile phone, notebook computer, wearable device, intelligent family
Occupy etc..
Embodiment two
As the fixing collar of environmental sensor in embodiment one may restrict bonding die glue, make the part bonding die glue cannot be abundant
Cushioning effect is played, based on the situation, a kind of environmental sensor is present embodiments provided, the environmental sensor is by embodiment one
Environmental sensor reprocess to be formed.
The structural representation of the environmental sensor that Fig. 3 is provided for the present embodiment, as shown in figure 3, the environmental sensor is by reality
The part or all of formation that the environmental sensor in example one removes its fixing collar is applied, accordingly, the Sidewall Height step-down of host cavity
Or disappear, the bonding die glue presentation of bond MEMS chip and asic chip is partly supported or is all supported without fixing collar without fixing collar
Exposed shape.
The present embodiment does not limit the removing method of fixing collar, in actual applications, can be according to the material behavior of fixing collar
Select reasonable manner, such as high-temperature process, shear treatment, corrosion treatmentCorrosion Science etc..
Exemplarily, when fixing collar is hot melt rubber stick EVT materials, can now be housed by high-temperature fusion fixing collar
The Sidewall Height step-down in chamber or disappearance, accordingly, the bonding die glue of bonding MEMS chip and asic chip is presented part without fixing collar
The exposed shape for supporting or all supporting without fixing collar；With reference to Fig. 3, the melting resolidification of fixing collar 6 forms cladding asic chip 3
Film layer, the Sidewall Height step-down of host cavity, the presentation of bonding die glue 7 of bond MEMS chip 3 and asic chip 4 are partly propped up without fixing collar
The exposed shape of support, thus eliminates the restriction to bonding die glue, makes bonding die glue give full play to cushioning effect, reduce from pcb board
Stress, improve properties of product.
For the ease of clearly describing the technical scheme of the embodiment of the present invention, in inventive embodiment, employ " first ",
The identical entry essentially identical to function and effect such as " second " printed words or similar item make a distinction, and those skilled in the art can manage
The printed words such as solution " first ", " second " are not defined to quantity and execution order.
The above, specific embodiment only of the invention, under the above-mentioned teaching of the present invention, those skilled in the art
Other improvement or deformation can be carried out on the basis of above-described embodiment.It will be understood by those skilled in the art that above-mentioned tool
The purpose of the present invention is simply preferably explained in body description, and protection scope of the present invention should be defined by scope of the claims.
Claims (10)
1. a kind of environmental sensor, including：Asic chip, MEMS chip and pcb board, the asic chip are fixed on the PCB
On plate, it is characterised in that fixing collar, the inwall of the fixing collar are additionally provided between the asic chip and the MEMS chip
Host cavity, and the internal diameter size of the fixing collar are formed less than the size of the MEMS chip of its support with asic chip；Institute
Filling bonding die glue in host cavity is stated, the MEMS chip is fixedly connected by the bonding die glue with the asic chip.
2. environmental sensor according to claim 1, it is characterised in that the fixing collar is below the first temperature value in solid
State, is in a liquid state or steam state more than the second temperature value higher than the first temperature value, and the second temperature value is less than the bonding die
The glass transition temperature Tg value of glue.
3. environmental sensor according to claim 2, it is characterised in that the bonding die glue is below the Tg values in solid
State, the Tg values are more than 350 DEG C.
4. environmental sensor according to claim 3, it is characterised in that the fixing collar is hot melt rubber stick EVT materials, institute
The span for stating the first temperature value is 0-50 DEG C, and the span of the second temperature value is 100-280 DEG C.
5. environmental sensor according to claim 1, it is characterised in that the shape of the fixing collar and the MEMS chip
Matching.
6. environmental sensor according to claim 1, it is characterised in that the outside dimension of the fixing collar is less than described
The size of asic chip.
7. environmental sensor according to claim 1, it is characterised in that the thickness of the bonding die glue is more than the fixing collar
Thickness.
8. environmental sensor according to claim 1, it is characterised in that the fixing collar is with the asic chip by viscous
Connect and be fixed together.
9. the environmental sensor according to any one of claim 1-8, it is characterised in that the environmental sensor also includes envelope
Dress housing, the encapsulating housing form the chamber for housing the asic chip, MEMS chip with the pcb board.
10. a kind of environmental sensor, it is characterised in that the environmental sensor by described in any one of claim 1-9 removes which and adds
The part or all of rear of Gu Quan forms, accordingly, the Sidewall Height step-down of the host cavity or disappearance, and bond the MEMS chip
The exposed shape that part supports without fixing collar or all supports without fixing collar is presented with the bonding die glue of the asic chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611110829.2A CN106531694B (en) | 2016-12-06 | 2016-12-06 | Environment sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611110829.2A CN106531694B (en) | 2016-12-06 | 2016-12-06 | Environment sensor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106531694A true CN106531694A (en) | 2017-03-22 |
| CN106531694B CN106531694B (en) | 2020-04-21 |
Family
ID=58342540
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611110829.2A Active CN106531694B (en) | 2016-12-06 | 2016-12-06 | Environment sensor |
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| Country | Link |
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| CN (1) | CN106531694B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107359173A (en) * | 2017-06-12 | 2017-11-17 | 格科微电子（上海）有限公司 | The assembly method of imaging sensor module |
| CN108622847A (en) * | 2018-05-03 | 2018-10-09 | 河北美泰电子科技有限公司 | The encapsulating method and structure of MEMS sensor |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US20130193530A1 (en) * | 2010-02-09 | 2013-08-01 | Robert Bosch Gmbh | Semiconductor Component and Corresponding Production Method |
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