CN106531694B - Environment sensor - Google Patents

Environment sensor Download PDF

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Publication number
CN106531694B
CN106531694B CN201611110829.2A CN201611110829A CN106531694B CN 106531694 B CN106531694 B CN 106531694B CN 201611110829 A CN201611110829 A CN 201611110829A CN 106531694 B CN106531694 B CN 106531694B
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chip
reinforcing ring
environmental sensor
asic chip
adhesive
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CN201611110829.2A
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CN106531694A (en
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端木鲁玉
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Goertek Microelectronics Inc
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Goertek Inc
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3114—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48145—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16151—Cap comprising an aperture, e.g. for pressure control, encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Electromagnetism (AREA)
  • Pressure Sensors (AREA)
  • Micromachines (AREA)

Abstract

The invention discloses an environment sensor. The environment sensor comprises an ASIC chip, an MEMS chip and a PCB, wherein the ASIC chip is fixed on the PCB, a reinforcing ring is arranged between the ASIC chip and the MEMS chip, and the inner diameter of the reinforcing ring is smaller than the size of the MEMS chip supported by the reinforcing ring; the inner wall of the reinforcing ring and the ASIC chip form an accommodating cavity, adhesive sheet glue is filled in the accommodating cavity, and the MEMS chip and the ASIC chip are fixedly connected through the adhesive sheet glue. According to the invention, the reinforcing ring is arranged below the MEMS chip, so that the adhesive thickness can be better ensured, the effect of isolating external stress is improved, the chip can be supported, and the difficulty of subsequent processes such as routing and the like is reduced.

Description

Environment sensor
Technical Field
The invention relates to the technical field of chip packaging, in particular to an environment sensor.
Background
As shown in fig. 1, in a housing 1 ', an ASIC (application specific Integrated Circuit) chip 4' is fixed on a PCB 5 'by a bonding adhesive 3', an MEMS (Micro-Electro-Mechanical System) chip 2 'is fixed on the ASIC chip 4' by the bonding adhesive 3 ', and conductive wires 6' are disposed between the MEMS chip 2 'and the ASIC chip 4' and between the ASIC chip 4 'and the PCB 5'.
In the product packaging process, in order to isolate the stress of the PCB, a piece-sticking adhesive (or adhesive paper) between chips needs to be set to a larger thickness; however, the thickness of the die attach adhesive is difficult to control within a desired thickness range due to the weight of the chip, and when the thickness of the adhesive layer is large, the adhesive layer rebounds to cause great difficulty in subsequent processes such as wire bonding and the like, thereby causing low yield and the like.
Disclosure of Invention
In view of the above description, the present invention provides an environmental sensor to solve the problem that it is difficult to isolate the stress of the PCB by increasing the thickness of the adhesive sheet during the packaging process of the product.
In order to achieve the purpose, the technical scheme of the invention is realized as follows:
in one aspect, the present invention provides an environmental sensor comprising: the integrated circuit comprises an ASIC chip, an MEMS chip and a PCB, wherein the ASIC chip is fixed on the PCB, a reinforcing ring is arranged between the ASIC chip and the MEMS chip, an accommodating cavity is formed by the inner wall of the reinforcing ring and the ASIC chip, and the inner diameter of the reinforcing ring is smaller than that of the MEMS chip supported by the reinforcing ring; and the accommodating cavity is filled with bonding sheet glue, and the MEMS chip is fixedly connected with the ASIC chip through the bonding sheet glue.
Preferably, the reinforcing ring is in a solid state below a first temperature value, is in a liquid state or a vapor state above a second temperature value higher than the first temperature value, and the second temperature value is less than the glass transition temperature Tg value of the piece bonding glue.
Preferably, the adhesive sheet glue is solid below Tg value, and the Tg value is above 350 ℃.
Preferably, the reinforcing ring is made of a hot melt adhesive stick EVT material, the value range of the first temperature value is 0-50 ℃, and the value range of the second temperature value is 100-280 ℃.
Preferably, the shape of the stiffener ring matches the MEMS chip.
Preferably, the outer diameter dimension of the reinforcing ring is smaller than the dimension of the ASIC chip.
Preferably, the thickness of the adhesive sheet glue is larger than that of the reinforcing ring.
Preferably, the reinforcing ring and the ASIC chip are fixed together by adhesion.
Preferably, the environment sensor further comprises a packaging shell, and the packaging shell and the PCB form a cavity for accommodating the ASIC chip and the MEMS chip.
On the other hand, the invention provides an environment sensor, which is formed by removing part or all of the reinforcing ring of the environment sensor, correspondingly, the height of the side wall of the accommodating cavity becomes low or disappears, and the bonding sheet adhesive for bonding the MEMS chip and the ASIC chip is partially or completely exposed without the support of the reinforcing ring.
The embodiment of the invention has the beneficial effects that:
1. according to the environment sensor, the reinforcing ring is additionally arranged between the MEMS chip and the ASIC chip, the reinforcing ring and the ASIC chip are utilized to form the containing cavity, the adhesive sheet glue is limited by the containing cavity, the thickness of the adhesive sheet glue between the MEMS chip and the ASIC chip is increased, the stress of a PCB is isolated, and the supporting of the reinforcing ring is adopted, so that the resilience of the adhesive sheet glue is reduced, and the difficulty of subsequent processes such as routing and the like is reduced.
2. According to the environment sensor, the reinforcing ring of the environment sensor is removed, so that the bonding piece adhesive bonding the MEMS chip and the ASIC chip is partially or completely exposed without supporting of the reinforcing ring, the reinforcing ring can be prevented from restricting the effective adhesive thickness of the bonding piece adhesive, the buffering effect of the bonding piece adhesive is fully exerted, the stress from a PCB is effectively isolated, and the product performance is improved.
Drawings
FIG. 1 is a schematic diagram of a package structure of a sensor in the prior art;
fig. 2 is a schematic structural diagram of an environmental sensor according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of an environmental sensor according to a second embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
Since the ASIC chip and the MEMS chip in the sensor are easily affected by external stress, especially the MEMS chip is sensitive to stress from the PCB, the stress of the PCB on the MEMS chip is usually reduced by increasing the thickness of the bottom adhesive tape of the MEMS. However, the thickness of the die attach adhesive is difficult to control within a desired thickness range due to the weight of the chip, and when the thickness of the adhesive layer is large, the adhesive layer rebounds to cause great difficulty in subsequent processes such as wire bonding and the like, thereby causing low yield and the like.
Based on the above situation, the overall design scheme of the invention is as follows: a reinforcing ring is added between the MEMS chip and the ASIC chip, and the reinforcing ring is utilized to form a fence for limiting the free flow of the bonding sheet adhesive, so that the thickness of the bonding sheet adhesive at the bottom of the MEMS is increased; in the subsequent procedures such as routing, the resilience of the adhesive sheet is reduced by means of the support of the reinforcing ring, and the processing difficulty is reduced; before the final product is formed, the reinforcing ring is ablated, the limitation on the bonding sheet glue is removed, the bonding sheet glue can fully play a buffering role, the stress from the PCB is reduced, and the product performance is improved.
Example one
Fig. 2 is a schematic structural diagram of an environmental sensor according to an embodiment of the present invention, as shown in fig. 2, the environmental sensor includes an ASIC chip 3, an MEMS chip 4, and a PCB 2, the ASIC chip 3 is fixed on the PCB 2, a reinforcing ring 6 is further disposed between the ASIC chip 3 and the MEMS chip 4, an inner wall of the reinforcing ring 6 and the ASIC chip 3 form a receiving cavity, and an inner diameter of the reinforcing ring 6 is smaller than a size of the MEMS chip 4 supported by the reinforcing ring; and the accommodating cavity is filled with bonding glue 7, and the MEMS chip 4 is fixedly connected with the ASIC chip 3 through the bonding glue 7.
This embodiment increases the reinforcing ring through the periphery that plays fixed action's bonding die glue between MEMS chip and ASIC chip, utilizes reinforcing ring and ASIC chip to form and accepts the chamber, through should accepting the chamber restriction, support bonding die glue, and then increases the thickness of bonding die glue between MEMS chip and the ASIC chip, the influence of isolated PCB board stress, the degree of difficulty that reduces follow-up processes such as routing.
Because this embodiment need utilize the reinforcing ring to prescribe a limit, support the bonding die glue of accomodating the intracavity, consequently require that the reinforcing ring under the normal atmospheric temperature should be stable, and because the reinforcing ring can restrict the weakening effect of bonding die glue to external stress, consequently require intermediate product after the follow-up processing such as routing, the reinforcing ring can be got rid of, nevertheless does not influence the solidification state of the bonding die glue of accomodating the intracavity.
Based on the above consideration, in an implementation scheme of this embodiment, the reinforcing ring is in a solid state below a first temperature value, and is in a liquid state or a vapor state above a second temperature value higher than the first temperature value, and the second temperature value is smaller than a Tg value of the die attach adhesive. The adhesive sheet can be cured under the environment of normal temperature, illumination, water vapor and the like, and is solid below the Tg value after being cured.
For example, the reinforcing ring may be made of an EVT material, and the first temperature value ranges from 0 to 50 ℃, the second temperature value corresponds to 100-280 ℃, and the Tg value of the adhesive sheet glue 7 corresponds to a value above 350 ℃; namely, the reinforcing ring made of the hot melt adhesive rod EVT can keep a stable solid state at normal temperature, and can melt and flow at a higher temperature (above 100 ℃), but does not influence the curing state of the adhesive sheet glue 7.
It should be noted that, in practical applications, the reinforcing ring made of other materials may be selected, as long as the reinforcing ring is stable at normal temperature, and can limit the flow of the adhesive sheet glue, so that the adhesive sheet glue can be cured at normal temperature, under illumination, under water vapor, and the like, and the liquefaction temperature or vaporization temperature of the reinforcing ring is much lower than the Tg value of the adhesive sheet glue.
It should be noted that the above-mentioned embodiment exemplarily shows that the reinforcing ring can be removed by heat treatment, and obviously, in practical applications, the reinforcing ring made of other materials can also be selected to be removed by corrosion, shearing, and other treatment processes.
The environmental sensor of this embodiment through the reinforcing ring who selects suitable material not only can guarantee to glue thick, reduce the follow-up procedure (like the routing) degree of difficulty betterly, and the reinforcing ring is through melting and flow under the high temperature condition, can also guarantee the qualified gluey thickness of final state product for the MEMS chip only relies on the bonding die to keep apart the stress that comes from the PCB board.
As with reference to fig. 2, fig. 2 exemplarily shows that the reinforcing ring 6 has a circular ring shape. It is obvious that the reinforcing ring 6 may have other shapes in practical application. Preferably, the shape of the reinforcing ring matches with the MEMS chip, that is, when the MEMS chip is square, the outer shape of the reinforcing ring is also square, and when the MEMS chip is circular, the outer shape of the reinforcing ring is also circular.
Preferably, the reinforcing ring 6 has an outer diameter dimension smaller than that of the ASIC chip 3 to effectively support the MEMS chip. As shown in fig. 2, the reinforcing ring 6 is completely disposed on the ASIC chip 3, and a certain space is reserved at the edge of the reinforcing ring to facilitate subsequent processes such as wire bonding on the ASIC chip. In addition, in order to ensure that the thickness of the bonding sheet glue can meet the stress requirement, the thickness of the bonding sheet glue 7 is preferably larger than that of the reinforcing ring 6.
In this embodiment, the fixing manner of the reinforcing ring 6 and the ASIC chip 3 and the fixing manner of the ASIC chip 3 and the PCB 2 are not limited, for example, the reinforcing ring 6 may be fixed on the ASIC chip 3 by adhesion, and the ASIC chip 3 may also be fixed on the PCB 2 by adhesive.
Referring to fig. 2, the environmental sensor in this embodiment further includes a package housing 1, the package housing 1 and the PCB 2 form a cavity for accommodating the ASIC chip 3 and the MEMS chip 4, and the ASIC chip 3 and the MEMS chip 4 in the cavity and the ASIC chip 3 and the PCB 2 are connected by a wire 5.
The environmental sensor of the present example was prepared by the following method:
1. selecting a PCB, an MEMS chip and an ASIC chip with proper models, and pasting the ASIC chip on the PCB;
2. adhering a reinforcing ring on the ASIC chip to form an accommodating cavity together with the ASIC chip;
3. filling a bonding sheet adhesive in the accommodating cavity, and fixing the MEMS chip on the ASIC through the bonding sheet adhesive;
4. curing the sheet adhesive in the environment of proper temperature, illumination, water vapor and the like;
5. after the adhesive sheet glue is cured, performing subsequent processing procedures such as routing connection and the like on the MEMS chip, the ASIC chip and the PCB;
6. and forming a cavity for accommodating the ASIC chip and the MEMS chip by using the packaging shell and the PCB plate to finish the packaging processing of the sensor.
Thus, the preparation of the environmental sensor of the present embodiment is completed through steps 1 to 6.
The environmental sensor in this embodiment can detect outside temperature, humidity, luminance or parameters such as sound intensity, and environmental sensor mainly uses in consumer electronics product field, for example cell-phone, notebook computer, wearable equipment, intelligent house etc..
Example two
Based on the fact that the reinforcing ring of the environmental sensor in the first embodiment may restrict the adhesive sheet glue, and thus part of the adhesive sheet glue cannot sufficiently exert the buffering effect, the embodiment provides the environmental sensor which is formed by reprocessing the environmental sensor in the first embodiment.
Fig. 3 is a schematic structural diagram of the environmental sensor provided in this embodiment, as shown in fig. 3, the environmental sensor is formed by removing part or all of the reinforcing ring of the environmental sensor in the first embodiment, accordingly, the height of the sidewall of the accommodating cavity becomes low or disappears, and the adhesive sheet adhesive for bonding the MEMS chip and the ASIC chip is exposed without supporting the reinforcing ring partially or entirely.
In this embodiment, the removing method of the reinforcing ring is not limited, and in practical applications, a reasonable method, such as high temperature treatment, shearing treatment, corrosion treatment, etc., may be selected according to the material characteristics of the reinforcing ring.
For example, when the reinforcing ring is made of a hot melt adhesive rod EVT material, the reinforcing ring can be melted at a high temperature, at the moment, the height of the side wall of the accommodating cavity becomes lower or disappears, and accordingly, the bonding sheet adhesive for bonding the MEMS chip and the ASIC chip is partially or completely exposed without the support of the reinforcing ring; referring to fig. 3, the reinforcing ring 6 is melted and then cured to form a film layer coating the ASIC chip 3, the height of the side wall of the accommodating cavity becomes low, and the die attach adhesive 7 bonding the MEMS chip 3 and the ASIC chip 4 is partially exposed without the support of the reinforcing ring, so that the restriction on the die attach adhesive is removed, the die attach adhesive fully exerts a buffering effect, the stress from the PCB is reduced, and the product performance is improved.
For the convenience of clearly describing the technical solutions of the embodiments of the present invention, in the embodiments of the present invention, the words "first", "second", and the like are used to distinguish the same items or similar items with basically the same functions and actions, and those skilled in the art can understand that the words "first", "second", and the like do not limit the quantity and execution order.
While the foregoing is directed to embodiments of the present invention, other modifications and variations of the present invention may be devised by those skilled in the art in light of the above teachings. It should be understood by those skilled in the art that the foregoing detailed description is for the purpose of better explaining the present invention, and the scope of the present invention should be determined by the scope of the appended claims.

Claims (9)

1. An environmental sensor, comprising: the MEMS chip fixing device comprises an ASIC chip, an MEMS chip and a PCB board, wherein the ASIC chip is fixed on the PCB board; the accommodating cavity is filled with bonding sheet glue, and the MEMS chip is fixedly connected with the ASIC chip through the bonding sheet glue;
the reinforcing ring is in a solid state below a first temperature value, is in a liquid state or a vapor state above a second temperature value higher than the first temperature value, and the second temperature value is smaller than the glass transition temperature Tg value of the adhesive sheet glue.
2. The environmental sensor of claim 1, wherein the adhesive sheet glue is in a solid state below the Tg value, which is above 350 ℃.
3. The environmental sensor according to claim 2, wherein the reinforcing ring is made of an EVT material, the first temperature value ranges from 0 ℃ to 50 ℃, and the second temperature value ranges from 100 ℃ to 280 ℃.
4. The environmental sensor of claim 1, wherein the stiffener ring is shaped to match the MEMS chip.
5. The environmental sensor of claim 1, wherein the stiffener ring has an outer diameter dimension that is smaller than a dimension of the ASIC chip.
6. The environmental sensor of claim 1, wherein the thickness of the patch adhesive is greater than the thickness of the reinforcing ring.
7. The environmental sensor of claim 1, wherein the stiffener ring and the ASIC chip are secured together by adhesive bonding.
8. The environmental sensor according to any one of claims 1 to 7, further comprising a package housing, the package housing and the PCB plate forming a chamber for housing the ASIC chip, MEMS chip.
9. An environmental sensor, wherein the environmental sensor of any one of claims 1 to 8 is formed by removing part or all of its reinforcing ring, accordingly, the height of the sidewall of the receiving cavity becomes low or disappears, and the adhesive sheet adhesive for bonding the MEMS chip and the ASIC chip is partially or completely exposed without the supporting of the reinforcing ring.
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CN107359173B (en) * 2017-06-12 2023-01-03 格科微电子（上海）有限公司 Assembling method of image sensor module
CN108622847A (en) * 2018-05-03 2018-10-09 河北美泰电子科技有限公司 The encapsulating method and structure of MEMS sensor

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CN205472637U (en) * 2016-04-07 2016-08-17 中国电子科技集团公司第十三研究所 Micro -electro -mechanical system package substrate
CN206379343U (en) * 2016-12-06 2017-08-04 歌尔股份有限公司 A kind of environmental sensor

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CN204732405U (en) * 2014-06-12 2015-10-28 意法半导体(格勒诺布尔2)公司 The heap superimposition electronic installation of integrated circuit (IC) chip

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CN205472637U (en) * 2016-04-07 2016-08-17 中国电子科技集团公司第十三研究所 Micro -electro -mechanical system package substrate
CN206379343U (en) * 2016-12-06 2017-08-04 歌尔股份有限公司 A kind of environmental sensor

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