CN209626212U - A kind of WLP device - Google Patents
A kind of WLP device Download PDFInfo
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- CN209626212U CN209626212U CN201920616523.7U CN201920616523U CN209626212U CN 209626212 U CN209626212 U CN 209626212U CN 201920616523 U CN201920616523 U CN 201920616523U CN 209626212 U CN209626212 U CN 209626212U
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- pinboard
- wlp
- wlp device
- device body
- protection shell
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Abstract
The utility model discloses a kind of WLP devices, including pinboard, are packaged the WLP device body of acquisition, and protection shell to chip using WLP encapsulation technology；Wherein, chip fitting is fixed on pinboard, and array of metal balls is distributed with away from the surface of chip in pinboard, the metal ball electrical connection on the pin and pinboard that the pin of chip passes through pinboard；Protection shell is fixedly connected with pinboard, and the cavity for accommodating chip is formed between protection shell and pinboard.WLP device provided by the utility model carries out secondary development to WLP device convenient for user, and can play a very good protection to WLP device, avoids generating damage during Product transport.
Description
Technical field
The utility model relates to WLP encapsulation technology fields, more particularly to a kind of WLP device.
Background technique
Wafer-level packaging (WLP) is a kind of new packaging form, and wafer-level packaging is the window by chip die and attached cavity
Mouth wafer is bonded on the basis of precisely aligning, and number of windows and position and chip on FPA wafer are complete on window wafer
Corresponding, when bonding, requires each chips to align accurately with corresponding window, formation vacuum cavity.Wafer is cut after the completion of bonding
Test, output chip.Wafer-level packaging has the characteristics that encapsulating structure is simple, small in size, at low cost, vacuum life is long, MEMS
Industry packing forms, which have begun to wafer-level packaging, to be changed.Production capacity can be substantially improved after wafer-level packaging batch production, reduce
Device cost.
WLP part device is received by the market because of its compact, reliable performance.But it is high to environmental requirement based on WLP device,
Influence during Product transport vulnerable to ambient vibration or temperature and humidity, so that the performance of WLP device declines.And user makes
When with WLP device, it is also necessary to carry out secondary development to WLP device, therefore reduce external environment to WLP component influences, and reduce
The difficulty of user's secondary development is current problem to be solved.
Utility model content
The purpose of the utility model is to provide a kind of WLP devices, and it is dry to the generation of WLP device performance to solve external environment
It disturbs, and the problem of user's secondary development difficulty.
In order to solve the above technical problems, the utility model provides a kind of WLP device, including pinboard, skill is encapsulated based on WLP
Art is packaged the WLP device body of acquisition, and protection shell to chip；
Wherein, the WLP device body fitting is fixed on the pinboard, and the pinboard deviates from the WLP device
Array of metal balls is distributed in the surface of ontology, and the pin of the WLP device body passes through the pin of the pinboard and described turn
Metal ball electrical connection on fishplate bar；
The protection shell is fixedly connected with the pinboard, and is formed between the protection shell and the pinboard
Accommodate the cavity of the WLP device body.
Wherein, the WLP device body is infrared detector；
The position that the protection shell corresponds to the WLP device body window is equipped with through-hole, passes through institute for the window
It states through-hole and receives optical signal.
Wherein, the pinboard is pcb board or pottery backboard.
Wherein, fitting is provided with heat conduction copper sheet or TEC device between the WLP device body and the pinboard.
Wherein, it is snapped connection between the protection shell and the pinboard.
Wherein, the surface of the protection shell is additionally provided with antistatic film layer.
WLP device body and pinboard are packaged connection, in pinboard by WLP device provided by the utility model
There are a large amount of array of metal balls at the back side, can be used for the Function Extension of WLP device, be the device of WLP device and other function
Part is electrically connected, and then cooperating provides possibility, convenient for the secondary development of user.In addition, also being connected on pinboard
There is protection shell, so that the components such as chip and its pin are fully located at pinboard and protection shell is formed by among cavity,
WLP device is avoided by the interference of external environment, influences its performance.
Therefore, WLP device provided by the utility model carries out secondary development to WLP device convenient for user, and can be right
WLP device plays a very good protection, and avoids generating damage during Product transport.
Detailed description of the invention
For the clearer technical solution for illustrating the utility model embodiment or the prior art, below will to embodiment or
Attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is only
Some embodiments of the utility model, for those of ordinary skill in the art, without creative efforts,
It is also possible to obtain other drawings based on these drawings.
Fig. 1 is the structural schematic diagram of WLP device body provided by the embodiment of the utility model；
Fig. 2 is the structural schematic diagram of WLP device provided by the embodiment of the utility model；
Fig. 3 is the bottom substance schematic diagram of WLP device provided by the embodiment of the utility model.
Specific embodiment
In order to make those skilled in the art better understand the scheme of the utility model, with reference to the accompanying drawing and specific implementation
The utility model is described in further detail for mode.Obviously, described embodiment is only the utility model a part
Embodiment, instead of all the embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art are not doing
Every other embodiment obtained under the premise of creative work out, fall within the protection scope of the utility model.
As depicted in figs. 1 and 2, Fig. 1 is the structure of the chip provided by the embodiment of the utility model obtained based on WLP technology
Schematic diagram；Fig. 2 is the structural schematic diagram of WLP device provided by the embodiment of the utility model, which may include:
Pinboard 2 is packaged the WLP device body 1 of acquisition, and protection shell based on WLP encapsulation technology to chip；
Specifically, which can use pcb board or pottery backboard, can also use the pinboard of other materials,
To being not specifically limited in this utility model.
Wherein, the fitting of WLP device body 1 is fixed on pinboard 2, and pinboard 2 is away from the surface of WLP device body 1 point
It is furnished with array of metal balls, the metal ball electrical connection on the pin and pinboard 2 that the pin of WLP device body 1 passes through pinboard 2；
Specifically, it can be electrically connected by metal lead wire between the pin of the pin with pinboard 2 of WLP device body 1, and
Between the pin and metal ball of pinboard 2 be also electrical connection, therefore the pin of WLP device body 1 can and array of metal balls
It is electrically connected.
Protection shell 3 is fixedly connected with pinboard 2, is formed between protection shell 3 and pinboard 2 and is accommodated WLP device sheet
The cavity of body 1.
It specifically, is to be fastened on pinboard 3 as shown in Fig. 2, the protection shell 3 in Fig. 2 is when being assembled on pinboard 2
And be fixedly connected with pinboard marginal position, and then form cavity between pinboard 3, so that the pin of WLP device body 1,
The easily damaged component such as the pin and metal lead wire of pinboard 2 is respectively positioned on cavity inside, avoids the interference by external environment.
Wafer-level packaging (WLP) be using wafer as encapsulation process object, and unconventional encapsulation system with one chip be plus
Work object.All packaging and testing movements are completed on wafer before carrying out chip cutting, therefore nearly all manufacturing process is equal
It is completed in fab, and excludes the conventional process of encapsulation factory.After wafer comes out from foundries, just directly in full wafer chip
Upper carry out encapsulation procedure, when finally cutting down, first is that many packaged IC finished products, all pass through very much on time and cost
Ji.WLP device body 1 in the application, the device obtained after being as packaged using WLP encapsulation technology to chip.
It is small-sized to meet current various chips in nanoscale for 1 size of WLP device body obtained using WLP encapsulation technology
The requirement of change encapsulates chip by the encapsulation technology, largely improves the integrated level of chip, and structure is smaller, layout
It is more compact.But nonetheless, the IC finished product of formation, there is also various deficiencies.Backend user is also required to carry out two when in use
Secondary exploitation, and certain customers and ability and condition that secondary development is not present.And the chip of IC finished product is during transportation,
It can be influenced to a certain extent by external environment.Therefore, the core with certain function obtained using WLP encapsulation technology
Piece, either encapsulated moulding still transport use process in, it is all higher to environmental requirement.Such as cross chip dampness or collision all
Chip easy to damage influences its normal work.
The structure of WLP device in the application is that WLP device body 1 is secondary using the progress of BGA package technology is similar to
The structure obtained is encapsulated, WLP device body is encapsulated on pinboard 2, WLP device body 1 is can be obtained and pinboard 2 is mutual
The structure being fitted and connected, and array of metal balls, while the pin and pinboard of WLP device body 1 is distributed in the back side of pinboard 2
2 pin electrical connection.BGA package have compact, signal decaying less, high excellent of the anti-interference and noiseproof feature of chip
Gesture.The utility model expansion interface uses the packing forms of BGA, to give full play to the performance advantage of WLP device.When WLP device
When part ontology 1 needs to come into operation, other functional chips and the WLP device body 1 need to only be carried out by array of metal balls
Electrical connection, can will be used cooperatively, so that WLP device is secondary between other functional chips and the WLP device body 1
It develops more simple and convenient.
In addition, setting can form the protective shell for accommodating the cavity of WLP device body 1 with pinboard 2 also on pinboard 2
Body 3, the components such as WLP device body 1 and its pin can be located at cavity inside, so that WLP device body 1 is used in transport
When, protection shell 3 such as can completely cut off to a certain extent outside moisture and collide at the shadow generated to 1 performance of WLP device body
It rings.
Optionally, in the another specific embodiment of the utility model, can also include:
WLP device body 1 is infrared detector；
It protects the position of the window of the corresponding WLP device body 1 of shell 3 to be equipped with through-hole 4, is received for window by through-hole 4
Optical signal.
Infrared detector is one of WLP device, needs to receive optical signal from the window's position and converts the optical signal
It for electric signal and exports, it is therefore desirable to which in protection 3 corresponding position of shell, through-hole 4 is set.
If the WLP device body 1 is the chip device for not needing to receive optical signal, then protection shell 3 can and be transferred
Closed cavity is formed between plate 2, to play the role of preferably protecting WLP device body 1.
Optionally, in the another specific embodiment of the utility model, can also include:
Fitting is provided with heat-conducting piece 5, in particular heat conduction copper sheet or TEC device between WLP device body 1 and pinboard 2.
It, may be to the work of WLP device body 1 if higher based on 1 temperature of WLP device body that WLP technology obtains
Performance generates irreversible damage.But WLP device body 1, in practical work process, especially infrared detector is receiving
When optical signal, heat is inevitably generated, so that 1 temperature of WLP device body increases.And the surface of WLP device body 1 is
It is bonded the setting installation of pinboard 2, is unfavorable for radiating, heat-conducting piece 5 is set between pinboard 2 and chip, is conducive to accelerate WLP
Heat transmitting between device body 1 and pinboard 2, accelerates the radiating rate of WLP device body 1, ensures WLP device body 1
Working performance.
Optionally, in the another specific embodiment of the utility model, can also include:
It is snapped connection between protection shell 3 and pinboard 2.
Because all relatively small based on 1 size of WLP device body that WLP technology obtains, if protection shell 3 and pinboard
Connection structure between 2 is excessively complicated, then can increase difficulty for assembling between the two, will protect shell 3 by buckle structure
It is attached between pinboard 2, simplifies the assembling difficulty between protection shell 3 and pinboard 2.
As shown in Figures 2 and 3, it is each provided with a protrusion in four corner positions of protection shell 3, accordingly, switching
It is provided with corresponding bayonet on plate 2, the protrusion on shell 3 will be protected to squeeze into bayonet, so that protrusion is caught in buckle
Guarantee the protrusion of protection shell 2 and the close connection of bayonet.
Certainly, the buckle structure in Fig. 2 and Fig. 3 is only one of the present embodiment specifically implementation, this is practical
It to the specific structure of buckle structure and is not construed as limiting in novel, as long as guaranteeing to be fixedly connected i.e. between protection shell 3 and pinboard 2
It can.
Optionally, in the another specific embodiment of the utility model, can also include:
The surface of protection shell 3 is additionally provided with antistatic film layer.
Because electrostatic can seriously break the circuit structure of ring WLP device body 1, and destroy the performance of WLP device body 1,
And in the transport of mould group and assembling process, electrostatic is generated, inevitably in order to avoid performance of the electrostatic to chip generates shadow
It rings, antistatic film layer can be set on protection 1 surface of shell, conductive film layer can be set, specifically convenient for electrostatic disappears
It removes, electrostatic is avoided to have an impact chip performance.
Each embodiment in this specification is described in a progressive manner, the highlights of each of the examples are with it is other
The difference of embodiment, same or similar part may refer to each other between each embodiment.For being filled disclosed in embodiment
For setting, since it is corresponded to the methods disclosed in the examples, so being described relatively simple, related place is referring to method part
Explanation.
Claims (6)
1. a kind of WLP device, which is characterized in that including pinboard, be packaged acquisition to chip using WLP encapsulation technology
WLP device body, and protection shell；
Wherein, the WLP device body fitting is fixed on the pinboard, and the pinboard deviates from the WLP device body
Surface be distributed with array of metal balls, the pin of the WLP device body passes through the pin and the pinboard of the pinboard
On metal ball electrical connection；
The protection shell is fixedly connected with the pinboard, and is formed and accommodated between the protection shell and the pinboard
The cavity of the WLP device body.
2. WLP device as described in claim 1, which is characterized in that the WLP device body is infrared detector；
The position that the protection shell corresponds to the WLP device body window is equipped with through-hole, passes through for the window described logical
Hole receives optical signal.
3. WLP device as claimed in claim 2, which is characterized in that the pinboard is pcb board or pottery backboard.
4. WLP device as described in any one of claims 1 to 3, which is characterized in that the WLP device body and the switching
Fitting is provided with heat conduction copper sheet or TEC device between plate.
5. WLP device as claimed in claim 4, which is characterized in that the company of buckle between the protection shell and the pinboard
It connects.
6. WLP device as claimed in claim 4, which is characterized in that the surface of the protection shell is additionally provided with electrostatic prevention film
Layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920616523.7U CN209626212U (en) | 2019-04-30 | 2019-04-30 | A kind of WLP device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920616523.7U CN209626212U (en) | 2019-04-30 | 2019-04-30 | A kind of WLP device |
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| Publication Number | Publication Date |
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| CN209626212U true CN209626212U (en) | 2019-11-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920616523.7U Active CN209626212U (en) | 2019-04-30 | 2019-04-30 | A kind of WLP device |
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| Country | Link |
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| CN (1) | CN209626212U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109979909A (en) * | 2019-04-30 | 2019-07-05 | 烟台艾睿光电科技有限公司 | A kind of WLP device |
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2019
- 2019-04-30 CN CN201920616523.7U patent/CN209626212U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109979909A (en) * | 2019-04-30 | 2019-07-05 | 烟台艾睿光电科技有限公司 | A kind of WLP device |
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