CN206038045U - Temperature and humidity sensor's packaging structure - Google Patents
Temperature and humidity sensor's packaging structure Download PDFInfo
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- CN206038045U CN206038045U CN201620885087.XU CN201620885087U CN206038045U CN 206038045 U CN206038045 U CN 206038045U CN 201620885087 U CN201620885087 U CN 201620885087U CN 206038045 U CN206038045 U CN 206038045U
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- humidity sensor
- temperature humidity
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- substrate
- temperature
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Abstract
The utility model discloses a temperature and humidity sensor's packaging structure, including base plate, temperature and humidity sensor and packaging part, be equipped with the through -hole on the base plate, temperature and humidity sensor's one side is equipped with the sensing hole, and the one side setting that temperature and humidity sensor was equipped with the sensing hole is in on the base plate, the sensing hole with the through -hole correspond to set up, temperature and humidity sensor's another side with base plate electrically connected, the packaging part covers the base plate and is equipped with temperature and humidity sensor's one side and covers temperature and humidity sensor. The utility model provides a pair of temperature and humidity sensor's packaging structure, convenient operation not only, the packaging efficiency is high moreover, can carry out batch production.
Description
Technical field
This utility model is related to technical field of semiconductor encapsulation, more particularly to a kind of encapsulating structure of Temperature Humidity Sensor.
Background technology
Temperature Humidity Sensor refers to the equipment of the signal of telecommunication that Temperature Quantity and humidity amount can be converted into easy measured process
Or device.Due to needing and external environment condition directly contact when Temperature Humidity Sensor sensing temperature and humidity, can be only achieved sensing mesh
, therefore, when Temperature Humidity Sensor of the prior art is encapsulated, usually reserve peristome to expose sensor in encapsulation region
Detection hole.During encapsulation, peristome is specially reserved, not only inconvenient operation, and inefficiency during batch encapsulation.
Utility model content
Technical problem to be solved in the utility model is：There is provided the high humiture of a kind of easy to operate and packaging efficiency to pass
The encapsulating structure of sensor.
In order to solve above-mentioned technical problem, the technical solution adopted in the utility model is：
A kind of encapsulating structure of Temperature Humidity Sensor, including substrate, Temperature Humidity Sensor and packaging part, sets on the substrate
The one side for having through hole, the Temperature Humidity Sensor is provided with sensing hole, and Temperature Humidity Sensor is provided with the one side in sensing hole and is arranged on institute
State on substrate, the sensing hole is correspondingly arranged with the through hole, and the another side of Temperature Humidity Sensor is electrically connected with the substrate, institute
State packaging part and cover one side and the covering Temperature Humidity Sensor that substrate is provided with Temperature Humidity Sensor.
Further, the diameter with diameter greater than the sensing hole of the through hole.
Further, a diameter of 0.5-0.6mm of the through hole, a diameter of 0.2-0.3mm in the sensing hole.
Further, the center of the through hole is arranged with the central coaxial in the sensing hole.
Further, also including electric-conductor, the one side that the Temperature Humidity Sensor is electrically connected with substrate is provided with solder joint, described
One end of electric-conductor is arranged on the solder joint and is electrically connected with solder joint, the other end of electric-conductor arrange on the substrate and with
Substrate is electrically connected.
Further, also including glue-line, the glue-line covers the Temperature Humidity Sensor and is provided with the one side of solder joint and covers
Electric-conductor.
Further, the material of the packaging part is epoxy resin.
The beneficial effects of the utility model are：The one side that Temperature Humidity Sensor is provided with sensing hole is arranged on substrate,
It is electrically connected by the another side of Temperature Humidity Sensor and substrate, sensing hole is correspondingly arranged with the through hole on substrate, by logical
Hole exposes sensing hole, carries out the detection of temperature and humidity in order to Temperature Humidity Sensor；During encapsulation, directly packaging part is coated
It is on Temperature Humidity Sensor and substrate, without the need for specially reserving opening, not only easy to operate, and packaging efficiency is high, can
Produced in batches.
Description of the drawings
Top views of the Fig. 1 for the Temperature Humidity Sensor of the encapsulating structure of the Temperature Humidity Sensor of this utility model embodiment；
Upward views of the Fig. 2 for the Temperature Humidity Sensor of the encapsulating structure of the Temperature Humidity Sensor of this utility model embodiment；
Profiles of the Fig. 3 for the encapsulating structure of the Temperature Humidity Sensor of this utility model embodiment.
Label declaration：
1st, substrate；11st, through hole；2nd, Temperature Humidity Sensor；21st, sense hole；22nd, solder joint；3rd, packaging part；4th, electric-conductor；5、
Glue-line.
Specific embodiment
By describing technology contents of the present utility model in detail, realizing purpose and effect, below in conjunction with embodiment and match somebody with somebody
Close accompanying drawing to be explained in detail.
The design of this utility model most critical is：The one side that Temperature Humidity Sensor is provided with sensing hole is arranged on into substrate
On, sensing hole is correspondingly arranged with the through hole on substrate, it is during encapsulation, not only easy to operate, and also packaging efficiency is high.
Fig. 1 to Fig. 3 is referred to, a kind of encapsulating structure of Temperature Humidity Sensor, including substrate 1, Temperature Humidity Sensor 2 and envelope
Piece installing 3, the substrate 1 are provided with through hole 11, and the one side of the Temperature Humidity Sensor 2 is provided with sensing hole 21, Temperature Humidity Sensor 2
The one side for being provided with sensing hole 21 is arranged on the substrate 1, and the sensing hole 21 is correspondingly arranged with the through hole 11, and humiture is passed
The another side of sensor 2 is electrically connected with the substrate 1, the packaging part 3 cover substrate 1 be provided with Temperature Humidity Sensor 2 one side and
Cover the Temperature Humidity Sensor 2.
Knowable to foregoing description, the beneficial effects of the utility model are：Temperature Humidity Sensor is provided with into the one of sensing hole
Face is arranged on substrate, is electrically connected by the another side of Temperature Humidity Sensor and substrate, senses hole and the through hole on substrate
Be correspondingly arranged, expose sensing hole by through hole, the detection of temperature and humidity is carried out in order to Temperature Humidity Sensor；During encapsulation,
Directly packaging part is coated on Temperature Humidity Sensor and substrate, it is without the need for specially reserving opening, not only easy to operate, and
And packaging efficiency is high, can be produced in batches.
Further, the diameter with diameter greater than the sensing hole 21 of the through hole 11.
Seen from the above description, the diameter with diameter greater than sensing hole of through hole, can be such that sensing hole is fully contacted with outside, carry
The sensing sensitivity of high Temperature Humidity Sensor.
Further, a diameter of 0.5-0.6mm of the through hole 11, a diameter of 0.2-0.3mm in the sensing hole 21.
Seen from the above description, during the big 0.3mm of diameter in the diameter of through hole and sensing hole or so, temperature and humidity sensing can both have been made
Utensil has higher sensitivity, can be prevented because the diameter of through hole is excessive again, and cause debris to enter.
Further, the center of the through hole 11 is arranged with the central coaxial in the sensing hole 21.
Seen from the above description, the center of through hole is arranged with the central coaxial in sensing hole, can prevent from sensing hole skew rear portion
Point hole blocked by through hole and affect the sensitivity of Temperature Humidity Sensor.
Further, also including electric-conductor 4, the one side that the Temperature Humidity Sensor 2 is electrically connected with substrate 1 is provided with solder joint
22, one end of the electric-conductor 4 is arranged on the solder joint 22 and is electrically connected with solder joint 22, and the other end of electric-conductor 4 is arranged on
Electrically connect on the substrate 1 and with substrate 1.
Seen from the above description, Temperature Humidity Sensor is electrically connected by electric-conductor with substrate, and electric-conductor can be metal
Lead.
Further, also including glue-line 5, the glue-line 5 covers the Temperature Humidity Sensor 2 and is provided with the one side of solder joint 22 simultaneously
Cover electric-conductor 4.
Seen from the above description, glue-line is set on Temperature Humidity Sensor and electric-conductor, circuit can be fixed and be protected
Shield, prevents electric-conductor from loosely dropping with Temperature Humidity Sensor and substrate connection, affects the performance of Temperature Humidity Sensor.
Further, the material of the packaging part 3 is epoxy resin.
Seen from the above description, fixation is packaged by epoxy resin, Temperature Humidity Sensor can be played a protective role.
Fig. 1 to Fig. 3 is refer to, embodiment of the present utility model is：
A kind of encapsulating structure of Temperature Humidity Sensor, including substrate 1, Temperature Humidity Sensor 2, packaging part 3,4 and of electric-conductor
Glue-line 5, the substrate 1 are provided with through hole 11, and through hole 11 can be formed by way of machine drilling or laser boring.The temperature
The one side of humidity sensor 2 is provided with sensing hole 21, and Temperature Humidity Sensor 2 is provided with the one side laminating in sensing hole 21 and is arranged on substrate 1
On.The diameter with diameter greater than sensing hole 21 of through hole 11, senses a diameter of 0.2mm, a diameter of 0.5mm of through hole 11 in hole 21,
Sensing hole 21 is correspondingly arranged with through hole 11, and the central coaxial at the center and through hole 11 for sensing hole 21 is arranged.Temperature Humidity Sensor 2
One side be provided with solder joint 22, one end of electric-conductor 4 is arranged on solder joint 22 and is electrically connected with solder joint 22, the other end of electric-conductor 4
Arrange on substrate 1 and electrically connect with substrate 1, electric-conductor 4 is metal lead wire.Glue-line 5 covers Temperature Humidity Sensor 2 and is provided with solder joint
22 one side simultaneously covers electric-conductor 4, and glue-line 5 is used for fixing and protecting the connection of Temperature Humidity Sensor 2 and substrate 1.Encapsulation
Part 3 covers substrate 1 and is provided with the one side of Temperature Humidity Sensor 2 and covers Temperature Humidity Sensor 2, by Temperature Humidity Sensor 2 and substrate 1
On other electronic components be all packaged.The material of packaging part 3 is epoxy resin.
In sum, a kind of encapsulating structure of Temperature Humidity Sensor that this utility model is provided, not only easy to operate, and
Packaging efficiency is high, can be produced in batches.
Embodiment of the present utility model is the foregoing is only, the scope of the claims of the present utility model is not thereby limited, it is every
The equivalents made using this utility model description and accompanying drawing content, or directly or indirectly it is used in the technology neck of correlation
Domain, is included in scope of patent protection of the present utility model in the same manner.
Claims (7)
1. a kind of encapsulating structure of Temperature Humidity Sensor, it is characterised in that including substrate, Temperature Humidity Sensor and packaging part, institute
State substrate and be provided with through hole, the one side of the Temperature Humidity Sensor is provided with sensing hole, and Temperature Humidity Sensor is provided with the one of sensing hole
Face is arranged on the substrate, and the sensing hole is correspondingly arranged with the through hole, the another side of Temperature Humidity Sensor and the base
Plate is electrically connected, and the packaging part covers substrate and is provided with the one side of Temperature Humidity Sensor and covers the Temperature Humidity Sensor.
2. the encapsulating structure of Temperature Humidity Sensor according to claim 1, it is characterised in that the through hole with diameter greater than
The diameter in the sensing hole.
3. the encapsulating structure of Temperature Humidity Sensor according to claim 2, it is characterised in that the through hole it is a diameter of
0.5-0.6mm, a diameter of 0.2-0.3mm in the sensing hole.
4. the encapsulating structure of Temperature Humidity Sensor according to claim 1, it is characterised in that the center of the through hole and institute
The central coaxial for stating sensing hole is arranged.
5. the encapsulating structure of Temperature Humidity Sensor according to claim 1, it is characterised in that also including electric-conductor, described
The one side that Temperature Humidity Sensor is electrically connected with substrate is provided with solder joint, one end of the electric-conductor be arranged on the solder joint and with weldering
Point electrical connection, the other end of electric-conductor are arranged on the substrate and are electrically connected with substrate.
6. the encapsulating structure of Temperature Humidity Sensor according to claim 5, it is characterised in that also including glue-line, the glue
Layer covers the Temperature Humidity Sensor and is provided with the one side of solder joint and covers electric-conductor.
7. the encapsulating structure of Temperature Humidity Sensor according to claim 1, it is characterised in that the material of the packaging part is
Epoxy resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620885087.XU CN206038045U (en) | 2016-08-15 | 2016-08-15 | Temperature and humidity sensor's packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620885087.XU CN206038045U (en) | 2016-08-15 | 2016-08-15 | Temperature and humidity sensor's packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206038045U true CN206038045U (en) | 2017-03-22 |
Family
ID=58306297
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620885087.XU Active CN206038045U (en) | 2016-08-15 | 2016-08-15 | Temperature and humidity sensor's packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206038045U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107159507A (en) * | 2017-05-27 | 2017-09-15 | 广州华凌制冷设备有限公司 | Senser element protective layer coats frock and technique, senser element and air conditioner |
-
2016
- 2016-08-15 CN CN201620885087.XU patent/CN206038045U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107159507A (en) * | 2017-05-27 | 2017-09-15 | 广州华凌制冷设备有限公司 | Senser element protective layer coats frock and technique, senser element and air conditioner |
| CN107159507B (en) * | 2017-05-27 | 2020-08-14 | 广州华凌制冷设备有限公司 | Sensor device protective layer coating tool and process, sensor device and air conditioner |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP02 | Change in the address of a patent holder |
Address after: 518055 floor 1-3 and floor 4, building 8, zone 2, Zhongguan honghualing Industrial South Zone, No. 1213, Liuxian Avenue, Pingshan community, Taoyuan Street, Nanshan District, Shenzhen, Guangdong Patentee after: BIWIN STORAGE TECHNOLOGY Co.,Ltd. Address before: 518055 1st floor, 2nd floor, 4th floor, 5th floor, No.4 factory building, tongfuyu industrial city, Taoyuan Street, Nanshan District, Shenzhen City, Guangdong Province Patentee before: BIWIN STORAGE TECHNOLOGY Co.,Ltd. |
|
| CP02 | Change in the address of a patent holder |