CN104966118B - Radio frequency identification tag package structures and methods - Google Patents
Radio frequency identification tag package structures and methods Download PDFInfo
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- CN104966118B CN104966118B CN201510313801.8A CN201510313801A CN104966118B CN 104966118 B CN104966118 B CN 104966118B CN 201510313801 A CN201510313801 A CN 201510313801A CN 104966118 B CN104966118 B CN 104966118B
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- circular
- bulge loop
- electronic label
- circular bulge
- ring
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Abstract
The present invention provides a kind of radio frequency identification tag package structures and methods, and the structure includes：Hot-melt adhesive paste turns into the upper shell and lower house of seal casinghousing, and the electronic label chip being sealed in the seal casinghousing；The upper surface of the lower house is provided with internal the first circular bulge loop for placing the electronic label chip；The lower surface edge of the upper shell is provided with the second circular bulge loop；The height of the first circular bulge loop is more than the height of the electronic label chip；The internal diameter of the second circular bulge loop is more than the external diameter of the described first circular bulge loop.The present invention applies vibration and pressure by ultrasonic equipment to the second circular bulge loop of the first circular bulge loop and upper shell of lower house, it is tightly connected after making upper shell and lower house hot melt, electronic label chip is encapsulated in seal casinghousing, avoid in encapsulation process because location difficulty or injection HTHP cause damage to electronic label chip, there is simple in construction, easy to operate, raising product yield.
Description
Technical field
The present invention relates to chip encapsulation technology field, more particularly to a kind of radio frequency identification tag package structures and methods.
Background technology
Electronic tag (RFID) is a kind of more leading automatic identification technology in the world, and it is known automatically by radiofrequency signal
Other destination object simultaneously obtains related data, and identification work is widely used in merchandise control, identification, information without manual intervention
The fields such as tracking.
Globtop materials are used only to wrap up chip in general electronic tag, then form plastic-sealed body by curing molding,
Thereby protect inside chip and antenna.Damage easily is produced to chip and antenna during use, reduces product reliability and using elasticity.
The content of the invention
The brief overview on the present invention is given below, to provide the basic reason on certain aspects of the invention
Solution.It should be appreciated that this general introduction is not the exhaustive general introduction on the present invention.It is not intended to determine the key of the present invention
Or pith, nor is it intended to limit the scope of the present invention.Its purpose only provides some concepts in simplified form, with
This is as the preamble in greater detail discussed later.
The present invention provides a kind of radio frequency identification tag package structures and methods for improving product yield.
The present invention provides a kind of electronic label seal assembling structure, including hot-melt adhesive paste turns into the upper shell and lower casing of seal casinghousing
Body, and the electronic label chip being sealed in the seal casinghousing；
The upper surface of the lower house is provided with internal the first circular bulge loop for placing the electronic label chip；
The lower surface edge of the upper shell is provided with the second circular bulge loop；
The height of the first circular bulge loop is more than the height of the electronic label chip；The second circular bulge loop it is interior
Footpath is more than the external diameter of the described first circular bulge loop.
The present invention also provides a kind of radio frequency identification tag package method, including：
In the first circular bulge loop that electronic label chip is placed on set by lower house upper surface；
The upper shell that lower surface edge is provided with to the second circular bulge loop is covered on the lower house, passes through ultrasonic equipment
Vibration and pressure are applied to the described first circular bulge loop and the second circular bulge loop, after heating the upper shell and lower house
It is tightly connected；
Wherein, the height of the described first circular bulge loop is more than the height of the electronic label chip；Described second is circular convex
The internal diameter of ring is more than the external diameter of the described first circular bulge loop.
Radio frequency identification tag package structures and methods provided by the invention are convex to the first circle of lower house by ultrasonic equipment
Second circular bulge loop of ring and upper shell applies vibration and pressure, is tightly connected after making upper shell and lower house hot melt, by electronics
Label chip is encapsulated in seal casinghousing, and electronic label chip is fixed on to the upper surface of lower house by binding agent, so as to
Electronic label chip is limited in the first circular bulge loop in encapsulation process, avoided in encapsulation process to electronic label chip
Cause damage.In summary, radio frequency identification tag package structures and methods of the present invention are avoided in encapsulation process because of location difficulty or note
Modeling HTHP causes damage to electronic label chip, has the advantages that simple in construction, easy to operate, raising product yield.
Brief description of the drawings
Below with reference to the accompanying drawings illustrate embodiments of the invention, the above of the invention and its can be more readily understood that
Its objects, features and advantages.Part in accompanying drawing is intended merely to show the principle of the present invention.In the accompanying drawings, identical or similar
Technical characteristic or part will be represented using same or similar reference.
Fig. 1 is the electronic label seal assembling structure after the completion of being encapsulated in a kind of embodiment of electronic label seal assembling structure of the present invention
Schematic diagram.
Fig. 2 is the top view of lower house in a kind of embodiment of electronic label seal assembling structure of the present invention.
Fig. 3 is the side view of lower house in a kind of embodiment of electronic label seal assembling structure of the present invention.
Fig. 4 is the amplification of the second circular micro-projecting ring on lower house in a kind of embodiment of electronic label seal assembling structure of the present invention
Side view.
Fig. 5 is the upward view of upper shell in a kind of embodiment of electronic label seal assembling structure of the present invention.
Fig. 6 is the side view of upper shell in a kind of embodiment of electronic label seal assembling structure of the present invention.
Fig. 7 is the second circular micro-projecting ring and the second circle in a kind of preferred embodiment of electronic label seal assembling structure of the present invention
The corresponding schematic diagram of nick ring.
Fig. 8 is that to be placed on first circular convex for electronic label chip in a kind of embodiment of electronic label seal assembling structure of the present invention
Lower house structural representation when in ring.
Corresponding schematic diagrames of the Fig. 9 for upper shell in a kind of embodiment of electronic label seal assembling structure of the present invention with lower house.
Figure 10 is a kind of schematic flow sheet of embodiment of radio frequency identification tag package method of the present invention.
Description of reference numerals：
1 lower house
2 first circular bulge loops
3 first circular micro-projecting rings
4 second circular micro-projecting rings
5 upper shells
6 second circular bulge loops
7 second circular nick rings
8 electronic label chips
Embodiment
Illustrate embodiments of the invention with reference to the accompanying drawings.Retouched in the accompanying drawing of the present invention or a kind of embodiment
The element and feature that the element and feature stated can be shown in one or more other accompanying drawings or embodiment are combined.Should
Work as attention, for purposes of clarity, eliminated in accompanying drawing and explanation known to unrelated to the invention, those of ordinary skill in the art
Part and processing expression and description.
Fig. 1 is the electronic label seal assembling structure after the completion of being encapsulated in a kind of embodiment of electronic label seal assembling structure of the present invention
Schematic diagram.
As shown in figure 1, in the present embodiment, electronic label seal assembling structure of the present invention, which includes hot-melt adhesive paste, turns into capsul
The upper shell 5 and lower house 1 of body, and the electronic label chip 8 being sealed in the seal casinghousing.
The upper surface of lower house 1 is provided with internal the first circular bulge loop for placing electronic label chip 8.
The lower surface edge of upper shell 5 is provided with the second circular bulge loop.
The height of the first circular bulge loop is more than the height of electronic label chip 8.The internal diameter of the second circular bulge loop
More than the external diameter of the described first circular bulge loop.
Fig. 2 is the top view of lower house in a kind of embodiment of electronic label seal assembling structure of the present invention.Fig. 3 is present invention electricity
The side view of lower house in a kind of embodiment of subtab encapsulating structure.
As shown in Figures 2 and 3, it is preferable that the upper surface of the first circular bulge loop 2 is provided with the first circular micro-projecting ring 3, lower house
1 upper surface is provided with the second circular micro-projecting ring 4 of the corresponding second circular bulge loop.Fig. 4 is the amplification of the second circular micro-projecting ring 4
Side view.
Fig. 5 is the upward view of upper shell in a kind of embodiment of electronic label seal assembling structure of the present invention.Fig. 6 is present invention electricity
The side view of upper shell in a kind of embodiment of subtab encapsulating structure.
As shown in Figure 5 and Figure 6, the lower surface edge of upper shell 5 is provided with the second circular bulge loop 6.
Fig. 7 is the second circular micro-projecting ring and the second circle in a kind of preferred embodiment of electronic label seal assembling structure of the present invention
The corresponding schematic diagram of nick ring.
Preferably, the lower surface of upper shell 5 is provided with the first circular nick ring of the corresponding first circular micro-projecting ring 3, the
The lower surface of two circular bulge loops 6 is provided with the second circular nick ring 7 of corresponding second circular micro-projecting ring 4, as shown in Figure 7.
Preferably, the first circular micro-projecting ring 3, the second circular micro-projecting ring 4, the first circular nick ring and the second circular nick ring
7 longitudinal section is triangle, trapezoidal or rectangle.
Fig. 8 is that to be placed on first circular convex for electronic label chip in a kind of embodiment of electronic label seal assembling structure of the present invention
Lower house structural representation when in ring.
As shown in Figure 8, it is preferable that electronic label chip 8 is fixed on the upper surface of lower house 1 by binding agent.
Corresponding schematic diagrames of the Fig. 9 for upper shell in a kind of embodiment of electronic label seal assembling structure of the present invention with lower house.
As shown in figure 9, upper shell 5 is covered on lower house 1, the corresponding bottom surface of upper shell 5 of the first circular micro-projecting ring 3
First circular nick ring (being not shown), the second of the corresponding second circular lower surface of bulge loop 6 of the second circular micro-projecting ring 4 are circular
Nick ring 7 (is not shown), then applies vibration to the first circular 2 and second circular bulge loop 6 of bulge loop by ultrasonic equipment
And pressure, it is tightly connected after making upper shell 5 and the hot melt of lower house 1.
Figure 10 is a kind of schematic flow sheet of embodiment of radio frequency identification tag package method of the present invention.
As shown in Figure 10, in the present embodiment, radio frequency identification tag package method of the present invention includes：
S10：In the first circular bulge loop 2 that electronic label chip 8 is placed on set by the upper surface of lower house 1.
S30：The upper shell 5 that lower surface edge is provided with to the second circular bulge loop 6 is covered on lower house 1, passes through ultrasonic wave
Equipment applies vibration and pressure to the first circular 2 and second circular bulge loop 6 of bulge loop, is sealed after making upper shell 5 and the hot melt of lower house 1
Connection.
Wherein, the height of the first circular bulge loop 2 is more than the height of electronic label chip 8.The internal diameter of second circular bulge loop 6 is big
In the external diameter of the first circular bulge loop 2.
Preferably, the upper surface of the first circular bulge loop 2 is provided with the first circular micro-projecting ring 3, and the upper surface of lower house 1 is provided with pair
Answer the second circular micro-projecting ring 4 of the described second circular bulge loop.
Preferably, the lower surface of upper shell 5 is provided with the first circular nick ring of the corresponding first circular micro-projecting ring 3, the
The lower surface of two circular bulge loops 6 is provided with the second circular nick ring 7 of corresponding second circular micro-projecting ring 4.
Preferably, the first circular micro-projecting ring 3, the second circular micro-projecting ring 4, the first circular nick ring and the second circular nick ring
7 longitudinal section is triangle, trapezoidal or rectangle.
Preferably, electronic label chip 8 is fixed on the upper surface of lower house 1 by binding agent.
In summary, radio frequency identification tag package structures and methods provided by the invention by ultrasonic equipment to lower house
Second circular bulge loop of one circular bulge loop and upper shell applies vibration and pressure, makes the company of sealing after upper shell and lower house hot melt
Connect, electronic label chip is encapsulated in seal casinghousing, and electronic label chip is fixed on by the upper of lower house by binding agent
Surface, so as to which electronic label chip is limited in the first circular bulge loop in encapsulation process, avoid in encapsulation process to electricity
Subtab chip causes damage.Radio frequency identification tag package structures and methods of the present invention are avoided in encapsulation process because of location difficulty or note
Modeling HTHP causes damage to electronic label chip, has the advantages that simple in construction, easy to operate, raising product yield.
Finally it should be noted that：The above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations；Although
The present invention is described in detail with reference to the foregoing embodiments, it will be understood by those within the art that：It still may be used
To be modified to the technical scheme described in foregoing embodiments, or equivalent substitution is carried out to which part technical characteristic；
And these modification or replace, do not make appropriate technical solution essence depart from various embodiments of the present invention technical scheme spirit and
Scope.
Claims (10)
1. a kind of electronic label seal assembling structure, it is characterised in that turn into the upper shell and lower casing of seal casinghousing including hot-melt adhesive paste
Body, and the electronic label chip being sealed in the seal casinghousing；
The upper surface of the lower house is provided with internal the first circular bulge loop for placing the electronic label chip；
The lower surface edge of the upper shell is provided with the second circular bulge loop；
The height of the first circular bulge loop is more than the height of the electronic label chip；The internal diameter of the second circular bulge loop is big
In the external diameter of the described first circular bulge loop；
The first circular bulge loop and the second circular bulge loop are additionally operable under the vibration and pressure that ultrasonic equipment is applied
The upper shell and lower house is set to be tightly connected after heating.
2. electronic label seal assembling structure according to claim 1, it is characterised in that the upper surface of the first circular bulge loop
Provided with the first circular micro-projecting ring, the upper surface of the lower house is provided with the second circular dimpling of the corresponding second circular bulge loop
Ring.
3. electronic label seal assembling structure according to claim 2, it is characterised in that the lower surface of the upper shell be provided with pair
The first circular nick ring of the described first circular micro-projecting ring is answered, the lower surface of the second circular bulge loop is provided with corresponding described second
Second circular nick ring of circular micro-projecting ring.
4. electronic label seal assembling structure according to claim 3, it is characterised in that the first circular micro-projecting ring, second
The longitudinal section of circular micro-projecting ring, the first circular nick ring and the second circular nick ring is triangle, trapezoidal or rectangle.
5. electronic label seal assembling structure according to claim 1, it is characterised in that the electronic label chip passes through bonding
Agent is fixed on the upper surface of the lower house.
A kind of 6. radio frequency identification tag package method, it is characterised in that including：
In the first circular bulge loop that electronic label chip is placed on set by lower house upper surface；
The upper shell that lower surface edge is provided with to the second circular bulge loop is covered on the lower house, by ultrasonic equipment to institute
State the first circular bulge loop and the second circular bulge loop applies vibration and pressure, the upper shell and lower house is sealed after heating
Connection；
Wherein, the height of the described first circular bulge loop is more than the height of the electronic label chip；The second circular bulge loop
Internal diameter is more than the external diameter of the described first circular bulge loop.
7. radio frequency identification tag package method according to claim 6, it is characterised in that the upper surface of the first circular bulge loop
Provided with the first circular micro-projecting ring, the upper surface of the lower house is provided with the second circular dimpling of the corresponding second circular bulge loop
Ring.
8. radio frequency identification tag package method according to claim 7, it is characterised in that the lower surface of the upper shell be provided with pair
The first circular nick ring of the described first circular micro-projecting ring is answered, the lower surface of the second circular bulge loop is provided with corresponding described second
Second circular nick ring of circular micro-projecting ring.
9. radio frequency identification tag package method according to claim 8, it is characterised in that the first circular micro-projecting ring, second
The longitudinal section of circular micro-projecting ring, the first circular nick ring and the second circular nick ring is triangle, trapezoidal or rectangle.
10. radio frequency identification tag package method according to claim 6, it is characterised in that the electronic label chip passes through viscous
Knot agent is fixed on the upper surface of the lower house.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510313801.8A CN104966118B (en) | 2015-06-09 | 2015-06-09 | Radio frequency identification tag package structures and methods |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510313801.8A CN104966118B (en) | 2015-06-09 | 2015-06-09 | Radio frequency identification tag package structures and methods |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104966118A CN104966118A (en) | 2015-10-07 |
| CN104966118B true CN104966118B (en) | 2018-03-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510313801.8A Active CN104966118B (en) | 2015-06-09 | 2015-06-09 | Radio frequency identification tag package structures and methods |
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| Country | Link |
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| CN (1) | CN104966118B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7449962B2 (en) | 2019-12-27 | 2024-03-14 | 京セラ株式会社 | contactless communication medium |
| CN112248675B (en) * | 2020-10-12 | 2021-06-22 | 深圳市亿源印刷有限公司 | Label manufacturing process and printing equipment thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1828641A (en) * | 2005-02-28 | 2006-09-06 | Krd株式会社 | IC tags |
| CN201540587U (en) * | 2009-05-11 | 2010-08-04 | 深圳市远望谷信息技术股份有限公司 | Metal anti-dismantling electronic tag of UHF band license plate |
| CN203084754U (en) * | 2013-03-20 | 2013-07-24 | 宁波立芯射频股份有限公司 | Water-proof electronic tag |
| CN204680046U (en) * | 2015-06-09 | 2015-09-30 | 南通富士通微电子股份有限公司 | Electronic label seal assembling structure |
-
2015
- 2015-06-09 CN CN201510313801.8A patent/CN104966118B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1828641A (en) * | 2005-02-28 | 2006-09-06 | Krd株式会社 | IC tags |
| CN201540587U (en) * | 2009-05-11 | 2010-08-04 | 深圳市远望谷信息技术股份有限公司 | Metal anti-dismantling electronic tag of UHF band license plate |
| CN203084754U (en) * | 2013-03-20 | 2013-07-24 | 宁波立芯射频股份有限公司 | Water-proof electronic tag |
| CN204680046U (en) * | 2015-06-09 | 2015-09-30 | 南通富士通微电子股份有限公司 | Electronic label seal assembling structure |
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| Publication number | Publication date |
|---|---|
| CN104966118A (en) | 2015-10-07 |
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| CB02 | Change of applicant information |
Address after: 226006 Jiangsu Province, Nantong City Chongchuan District Chongchuan Road No. 288 Applicant after: Tongfu Microelectronics Co., Ltd. Address before: 226006 Jiangsu Province, Nantong City Chongchuan District Chongchuan Road No. 288 Applicant before: Fujitsu Microelectronics Co., Ltd., Nantong |
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