CN205564810U - Inorganic encapsulation cut straightly formula purple light LED - Google Patents

Inorganic encapsulation cut straightly formula purple light LED Download PDF

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Publication number
CN205564810U
CN205564810U CN201620400041.4U CN201620400041U CN205564810U CN 205564810 U CN205564810 U CN 205564810U CN 201620400041 U CN201620400041 U CN 201620400041U CN 205564810 U CN205564810 U CN 205564810U
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CN
China
Prior art keywords
metal
purple light
ceramic
glass
light led
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201620400041.4U
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Chinese (zh)
Inventor
邱凡
莫福敏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zhejiang Danse Electronic Technology Co Ltd
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Zhejiang Danse Electronic Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zhejiang Danse Electronic Technology Co Ltd filed Critical Zhejiang Danse Electronic Technology Co Ltd
Priority to CN201620400041.4U priority Critical patent/CN205564810U/en
Application granted granted Critical
Publication of CN205564810U publication Critical patent/CN205564810U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched

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  • Led Device Packages (AREA)

Abstract

The utility model discloses an inorganic encapsulation cut straightly formula purple light LED, including a cermet base, the upper portion part of cermet base is metal parts, and the lower part part is ceramic part, metal parts's upper surface center is provided with recess interior sunken earlier on, be provided with one deck wafer fixing glue on the interior bottom of recess, the last purple light chip that is fixed with of wafer fixing glue, the lock has a glass metallic cap on the cermet base, the glass metallic cap further includes the tubular metal resonator of a both ends opening and inlays and locate glass lid on the tubular metal resonator in the port. The utility model discloses an organic material such as inorganic material such as glass, metal, pottery replacement epoxy, silica gel are as purple light LED encapsulating material, and it has promoted the sealed protection to purple light LED chip greatly to effectively enlarge the range of application of purple light LED under special environment, still improved purple light LED heat dispersion, promoted purple light LED's ageing resistance.

Description

A kind of direct insertion purple LED of inorganic encapsulated
Technical field
This utility model relates to LED production technical field, more specifically a kind of direct insertion purple of inorganic encapsulated Light LED.
Background technology
In prior art, the encapsulation of direct insertion purple LED uses the organic material pair such as epoxy resin, silica gel more Chip carries out sealing protection, and these inorganic material transparencys are fabulous, and packaging convenience can improve light extraction efficiency, And extensively apply in multi-field.
So meet use bad environments, as high temperature, chemicals volatilization burn into optic communication and need dust protection, The application such as easy to wear, the purple LED of organic material encapsulation then cannot meet requirement, and easily lose efficacy, Even dead lamp.
Utility model content
The purpose of this utility model is to overcome prior art disadvantages described above, it is provided that a kind of sealing protects, and has Effect expands purple LED range of application in particular circumstances, improves purple LED heat dispersion, aging resistance energy The direct insertion purple LED of inorganic encapsulated that power is strong.
In order to reach object above, this utility model is achieved through the following technical solutions: a kind of inorganic envelope Fill direct insertion purple LED, it is characterised in that include a ceramic metal base, described ceramic metal base upper Portion's parts are metal parts, and lower member is ceramic component, and the upper surface of described metal parts is provided centrally with One groove caved inward, the inner bottom part of described groove is provided with one layer of crystal-bonding adhesive, solid on described crystal-bonding adhesive Surely having a purple light chip, the height of described crystal-bonding adhesive is the 1/3~1/2 of described purple light chip height, described metal Running through in ceramic base and have a pair power pole, described power pole is respectively passed through a bonding gold wire and described purple by this Optical chip is connected, and described ceramic metal base fastens has a glass metal cap, described glass metal cap to enter One step includes the metal tube of a two ends port and is embedded at the glass cover in described metal tube upper port, described Glass cover is the convex lens sheet of a truncated cone-shaped.
As preferably, the metal parts lower end edge of described ceramic metal base and the gold of described glass metal cap Belong to pipe lower end edge and be provided with the flange stretched out to horizontal direction, the flange of described metal parts lower end edge and institute The flange stating metal tube lower end edge is stacked mutually, sets in the ceramic component upper surface of described ceramic metal base It is equipped with the caulking groove of the flange receiving the flange of described metal parts lower end edge and described metal tube lower end edge.
As preferably, metal tube in metal parts and described glass metal cap in described ceramic metal base Metal material is copper, and in described ceramic metal base, ceramic component is nano ceramics, described glass metal cap Middle glass cover is high borosilicate quartz glass.
Beneficial effect: this utility model by the inorganic material such as glass, metal, pottery replacement epoxy resin, The organic materials such as silica gel are as purple LED encapsulating material, and it is greatly improved the sealing to purple LED chip Protection, and effectively expand purple LED range of application in particular circumstances, also improve purple LED heat radiation Performance, improves the ageing resistance of purple LED.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model;
Fig. 2 is the schematic enlarged-scale view of part A in Fig. 1.
In figure: 1-ceramic component, 2-metal parts, 3-groove, 4-crystal-bonding adhesive, 5-purple light chip, 6-key B alloy wire, 7-power pole, 8-metal tube, 9-glass cover, 10-flange, 11-caulking groove.
Detailed description of the invention
Understand, below with reaching purpose and being readily apparent to make technological means of the present utility model, creation characteristic This utility model is expanded on further in conjunction with specific embodiments.
Embodiment: as depicted in figs. 1 and 2, a kind of direct insertion purple LED of inorganic encapsulated, including a metal pottery Porcelain base, the upper member of ceramic metal base is metal parts 2, and lower member is ceramic component 1, metal The upper surface of parts 2 is provided centrally with a groove 3 caved inward, and the inner bottom part of groove 3 is provided with one layer Crystal-bonding adhesive 4, crystal-bonding adhesive 4 is fixed with a purple light chip 5, and the height of crystal-bonding adhesive 4 is purple light chip 5 height 1/3~1/2, ceramic metal base runs through and has a pair power pole 7, this to power pole 7 respectively by a key B alloy wire 6 is connected with purple light chip 5, and ceramic metal base fastens a glass metal cap, glass gold Belong to cap farther include the metal tube 8 of a two ends port and be embedded at the glass cover in metal tube 8 upper port 9, glass cover 9 is the convex lens sheet of a truncated cone-shaped.
Metal parts 2 lower end edge of ceramic metal base and metal tube 8 lower end edge of glass metal cap are all provided with It is equipped with the flange 10 stretched out to horizontal direction, the flange of metal parts 2 lower end edge and metal tube 8 lower end edge Flange is stacked mutually, is provided with storage metal parts 2 in ceramic component 1 upper surface of ceramic metal base The flange of lower end edge and the caulking groove 11 of the flange 10 of metal tube 8 lower end edge.
In ceramic metal base, in metal parts 2 and glass metal cap, the metal material of metal tube 8 is copper, In ceramic metal base, ceramic component 1 is nano ceramics, and in glass metal cap, glass cover 9 is high borosilicate quartz Glass.
A kind of manufacture method of the direct insertion purple LED of inorganic encapsulated, step is as follows:
(1) crystal-bonding adhesive is placed in bonder carries out die bond operation, fix purple light chip, the height of crystal-bonding adhesive Degree is the 1/3~1/2 of purple light chip height;
(2) being put in baking box by the ceramic metal base fixing purple light chip and toast, baking is divided into two In the individual stage, first stage baking temperature is 100 DEG C, and the time is 60 minutes, makes the response inhabitation in crystal-bonding adhesive Agent is volatilized, and second stage baking temperature is 150 DEG C, and the time is 120 minutes, makes crystal-bonding adhesive solidify;
(3) the ceramic metal base after being solidified by crystal-bonding adhesive is placed on LED bonding equipment and carries out bonding wire operation, and one After power pole is run through ceramic metal base, respectively it is connected with purple light chip by a bonding gold wire and is formed back Road;
(4) by glass metal cap on ceramic metal base, and the pressure electricity in energy storage sealing welding technique for extra is utilized Welding resistance principle, it is achieved the flange of glass metal cap constitutes seamless welding with the flange of ceramic metal base, thus Realize LED component non-substantivity high-temperature heating quick inorganic material level Hermetic Package.
Use: this utility model replaces epoxy resin, silica gel by inorganic material such as glass, metal, potteries Deng organic material as purple LED encapsulating material, it is greatly improved the protection of the sealing to purple LED chip, And effectively expand purple LED range of application in particular circumstances, also improve purple LED heat dispersion, Improve the ageing resistance of purple LED.

Claims (3)

1. the direct insertion purple LED of inorganic encapsulated, it is characterised in that include a ceramic metal base, institute The upper member stating ceramic metal base is metal parts, and lower member is ceramic component, described metal parts Upper surface be provided centrally with a groove caved inward, the inner bottom part of described groove is provided with one layer of die bond Glue, described crystal-bonding adhesive is fixed with a purple light chip, and the height of described crystal-bonding adhesive is described purple light chip height 1/3~1/2, described ceramic metal base runs through and has a pair power pole, this to described power pole respectively by one Root bonding gold wire is connected with described purple light chip, and described ceramic metal base fastens a glass metal cap, Described glass metal cap farther includes the metal tube of a two ends port and is embedded at described metal tube upper port In glass cover, described glass cover is the convex lens sheet of a truncated cone-shaped.
The direct insertion purple LED of inorganic encapsulated the most according to claim 1, it is characterised in that described gold Belong to the metal tube lower end edge of the metal parts lower end edge of ceramic base and described glass metal cap be provided with to The flange of the flange that horizontal direction is stretched out, the flange of described metal parts lower end edge and described metal tube lower end edge It is stacked mutually, the ceramic component upper surface of described ceramic metal base is provided with the described metal parts of storage The flange of lower end edge and the caulking groove of the flange of described metal tube lower end edge.
The direct insertion purple LED of inorganic encapsulated the most according to claim 1 and 2, it is characterised in that institute State the metal material of metal tube in metal parts in ceramic metal base and described glass metal cap and be copper, In described ceramic metal base, ceramic component is nano ceramics, and in described glass metal cap, glass cover is high borosilicate Quartz glass.
CN201620400041.4U 2016-04-30 2016-04-30 Inorganic encapsulation cut straightly formula purple light LED Expired - Fee Related CN205564810U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201620400041.4U CN205564810U (en) 2016-04-30 2016-04-30 Inorganic encapsulation cut straightly formula purple light LED

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201620400041.4U CN205564810U (en) 2016-04-30 2016-04-30 Inorganic encapsulation cut straightly formula purple light LED

Publications (1)

Publication Number Publication Date
CN205564810U true CN205564810U (en) 2016-09-07

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105870308A (en) * 2016-04-30 2016-08-17 浙江单色电子科技有限公司 Inorganic encapsulation direct-plug type violet LED and manufacturing method thereof
CN108305927A (en) * 2018-03-16 2018-07-20 江苏鸿利国泽光电科技有限公司 A kind of direct insertion deep ultraviolet LED of inorganic encapsulated

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105870308A (en) * 2016-04-30 2016-08-17 浙江单色电子科技有限公司 Inorganic encapsulation direct-plug type violet LED and manufacturing method thereof
CN105870308B (en) * 2016-04-30 2019-11-05 浙江单色电子科技有限公司 A kind of direct insertion purple LED of inorganic encapsulated and its manufacturing method
CN108305927A (en) * 2018-03-16 2018-07-20 江苏鸿利国泽光电科技有限公司 A kind of direct insertion deep ultraviolet LED of inorganic encapsulated

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C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20160907

Termination date: 20180430

CF01 Termination of patent right due to non-payment of annual fee