CN105712283B - A kind of LCC encapsulation stress release structure - Google Patents
A kind of LCC encapsulation stress release structure Download PDFInfo
- Publication number
- CN105712283B CN105712283B CN201410720844.3A CN201410720844A CN105712283B CN 105712283 B CN105712283 B CN 105712283B CN 201410720844 A CN201410720844 A CN 201410720844A CN 105712283 B CN105712283 B CN 105712283B
- Authority
- CN
- China
- Prior art keywords
- lcc
- anchor point
- strain relief
- tie
- point
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Micromachines (AREA)
Abstract
The invention belongs to encapsulation fields, and in particular to a kind of LCC encapsulation stress release structure.A kind of LCC encapsulation stress release structure includes the strain relief with chip form fit, anchor point and supporting point is arranged on strain relief, is connected by tie-beam between anchor point and supporting point.The present invention effect be：1) under the premise of not changing original LCC case materials, increasing process costs, the thermal stress caused by material thermal expansion coefficient mismatches can effectively be reduced by strain relief.2) under the premise of not significantly increasing volume, it can be effectively isolated by the strain relief positioned at LCC enclosure interiors and the input of the mechanics such as extraneous vibration of decaying, impact, reduction mechanical stress protect chip, the mechanical environment adaptability of lifting system.
Description
Technical field
The invention belongs to encapsulation fields, and in particular to a kind of LCC encapsulation stress release structure.
Background technology
LCC encapsulation is the common packing forms of MEMS, as shown in Figure 1, excellent with batch micro operations, at low cost etc.
Point can be that MEMS sensing elements (chip) provide high vacuum high stable closed environment, while being conducive to the small-sized collection of realization system
Cheng Hua；It is now widely used in the encapsulation such as MEMS gyro, mems accelerometer.
In existing LCC encapsulation, usually by golden tin solder by MEMS chip and LCC shell Direct Bondings, as shown in Fig. 2,
There are the following problems for this packaged type.
1) LCC case materials usually select Al2O3Ceramics, coefficient of thermal expansion are 6~7ppm/ DEG C, and MEMS chip is usually
Silicon materials, coefficient of thermal expansion are 2~3ppm/ DEG C.MEMS package need to generally adapt to larger range of temperature, as room temperature~
+ 300 DEG C, larger coefficient of thermal expansion mismatch easily generates stress between LCC shells and chip, and then deteriorates the entirety of system
Performance.
2) for MEMS chip characteristic size usually in micron dimension, part also uses cantilever design, relatively fragile, directly will
LCC shells are easily introduced the interference of the mechanics such as extraneous vibration, impact with chip welding, on the one hand propose larger choose to MEMS chip intensity
On the other hand war easily leads to material creep and sluggishness, and then reduces the mechanical environment adaptability of system.
Select the relatively small AlN ceramic of coefficient of thermal expansion that can reduce encapsulation to a certain extent as LCC case materials
Stress, but its price is up to Al2O37~10 times of ceramics, considerably increase cost.
Invention content
The purpose of the present invention is in view of the drawbacks of the prior art, provide a kind of LCC encapsulation stress release structure.
The invention is realized in this way：A kind of LCC encapsulation stress release structure, includes being released with the stress of chip form fit
Structure is put, anchor point and supporting point are set on strain relief, connected by tie-beam between anchor point and supporting point.
A kind of LCC encapsulation stress as described above discharges structure, wherein the anchor point is centrally disposed, and supporting point is set
It sets in surrounding.
A kind of LCC encapsulation stress as described above discharges structure, wherein the anchor point is arranged in strain relief
The shape of the heart, anchor point is rectangular or round, and anchor point is connected by way of bonding or gluing with LCC shells, centered on anchor point,
4 or more tie-beams are arranged in radioactivity, and the supporting point with tie-beam quantity Matching is arranged in strain relief outermost,
Supporting point is connect with anchor point by tie-beam.
A kind of LCC encapsulation stress as described above discharges structure, wherein setting is anchored boss below anchor point.
A kind of LCC encapsulation stress as described above discharges structure, wherein the anchor point is arranged in surrounding, and supporting point is set
It sets at center.
A kind of LCC encapsulation stress as described above discharges structure, wherein the anchor point is arranged in strain relief four
The shape in week, anchor point is rectangular or round, and anchor point is connected by way of bonding or gluing with LCC shells, is fixed point with anchor point
Centered on strain relief geometric center, 4 or more tie-beams are arranged in radioactivity, at strain relief center
It is arranged and is connect by tie-beam with anchor point with the supporting point of tie-beam quantity Matching, supporting point.
A kind of LCC encapsulation stress as described above discharges structure, wherein setting is anchored boss below anchor point.
A kind of LCC encapsulation stress as described above discharges structure, wherein the material of strain relief be 7740 glass or
4J44 iron cobalt nickel alloys.
The present invention effect be：1) under the premise of not changing original LCC case materials, increasing process costs, by answering
Power release structure can effectively reduce the thermal stress caused by material thermal expansion coefficient mismatches.2) volume is not being significantly increased
Under the premise of, it can be effectively isolated by the strain relief positioned at LCC enclosure interiors and the mechanics such as extraneous vibration of decaying, impact
Input reduces mechanical stress, protection chip, the mechanical environment adaptability of lifting system.
Description of the drawings
Fig. 1 is MEMS LCC encapsulation schematic diagrams；
Fig. 2 is a kind of existing LCC encapsulation sectional view；
Fig. 3 is a kind of corresponding strain relief of the present invention；
Fig. 4 is the corresponding encapsulation combination diagram of strain relief shown in Fig. 3；
Fig. 5 is the corresponding another strain relief of the present invention；
Fig. 6 is the corresponding encapsulation combination diagram of strain relief shown in Fig. 5.
In figure：1.LCC shells, 2. chips, 3. solders, 4. strain reliefs, 41. anchor points, 42. tie-beams, 43. sides
Frame, 44. bonding regions, 411. anchor boss, 5. strain reliefs, 51. tie-beams, 52. frames, 53. anchor points, 531. anchors are convex
Platform.
Specific implementation mode
Embodiment 1
As shown in figure 3, a kind of LCC encapsulation stress release structure is distributed in symmetrical, mainly by anchor point 41, tie-beam 42,
Frame 43 and bonding region 44 etc. form.Anchor point 41 is located at center, generally rectangular or round, and its underpart is to be anchored boss 411, can
It is connected with LCC shells by way of bonding or gluing.Tie-beam 42 is uniformly distributed anchor point surrounding is radial, generally at least
It is 4.Frame 43 is connected with the other end of tie-beam 42, is distributed in outside, and frame 43 constitutes cantilever style with tie-beam 42 and combines
Girder construction can be equivalent to spring, can be effectively isolated stress.Bonding region 44 is evenly distributed on the vertex of frame, generally just
Shape or circle, upper part can be connected with chip bottom by way of bonding or gluing, be played a supportive role.
The global shape of strain relief 4 can correspondingly be adjusted according to chip shape, generally rectangular or round, optional
Take the material close with chip body material thermal expansion coefficient, such as 7740 glass or 4J44 iron cobalt nickel alloys.
The combination diagram of LCC shells 1, chip 2 and strain relief 4 is as shown in Figure 4.
The characteristics of strain relief 4 is that center is anchored, surrounding supports.
Embodiment 2
Another mutation of the present invention is as shown in Figure 5.
Strain relief 5 is distributed in symmetrical, is mainly made of tie-beam 51, frame 52, anchor point 53 etc..Tie-beam 51
It is uniformly distributed around center is radial, generally at least 4, upper part can be by way of bonding or gluing and chip bottom
It is connected, plays a supportive role.Frame 52 is connected with tie-beam 51, is distributed in outside, and frame 52 constitutes cantilever style group with tie-beam 51
Girder construction is closed, spring can be equivalent to, stress can be effectively isolated.Anchor point 53 is evenly distributed on the vertex of frame, generally just
Shape or circle, its underpart are to be anchored boss 531, can be connected with LCC shells by way of bonding or gluing.
The by the way of surrounding anchor, central supported of strain relief 5
The global shape of strain relief 5 can correspondingly be adjusted according to chip shape, generally rectangular or round, optional
Take the material close with chip body material thermal expansion coefficient, such as 7740 glass or 4J44 iron cobalt nickel alloys.
The combination diagram of LCC shells 1, chip 2 and strain relief 5 is as shown in Figure 6.
Claims (3)
- Include the strain relief with chip form fit 1. a kind of LCC encapsulation stress discharges structure, it is characterised in that：It answers Power discharges setting anchor point and supporting point in structure, is connected by tie-beam between anchor point and supporting point；The anchor point is centrally disposed, and supporting point is arranged in surrounding；The anchor point setting is at strain relief center, and the shape of anchor point is rectangular or round, and anchor point passes through bonding or glue Glutinous mode is connected with LCC shells, and centered on anchor point, 4 or more tie-beams are arranged in radioactivity, in strain relief The supporting point with tie-beam quantity Matching is arranged in outermost, and supporting point is connect with anchor point by tie-beam.
- 2. a kind of LCC encapsulation stress as described in claim 1 discharges structure, it is characterised in that：Setting is anchored convex below anchor point Platform.
- 3. a kind of LCC encapsulation stress as described in any one of claim 1~2 claim discharges structure, feature exists In：The material of strain relief is 7740 glass or 4J44 iron cobalt nickel alloys.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410720844.3A CN105712283B (en) | 2014-12-02 | 2014-12-02 | A kind of LCC encapsulation stress release structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410720844.3A CN105712283B (en) | 2014-12-02 | 2014-12-02 | A kind of LCC encapsulation stress release structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105712283A CN105712283A (en) | 2016-06-29 |
| CN105712283B true CN105712283B (en) | 2018-07-31 |
Family
ID=56146306
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410720844.3A Active CN105712283B (en) | 2014-12-02 | 2014-12-02 | A kind of LCC encapsulation stress release structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105712283B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108358160B (en) * | 2018-04-18 | 2023-08-01 | 中国兵器工业集团第二一四研究所苏州研发中心 | Hoisting type MEMS device packaging structure capable of releasing stress |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1678513A (en) * | 2002-09-04 | 2005-10-05 | 模拟设备公司 | Microchip with thermal stress relief means |
| KR20070111608A (en) * | 2006-05-18 | 2007-11-22 | 삼성전기주식회사 | Mems package and manufacturing method thereof |
| CN101920926A (en) * | 2010-09-30 | 2010-12-22 | 无锡中微高科电子有限公司 | Unmatched seal stress release structure |
| CN102040186A (en) * | 2010-11-09 | 2011-05-04 | 北京自动化控制设备研究所 | High vacuum ceramic LCC packaging method |
| CN202886664U (en) * | 2012-11-19 | 2013-04-17 | 青岛海信宽带多媒体技术有限公司 | Optical module adopting LCC (Leadless Chip Carrier) packaging structure |
| CN203238029U (en) * | 2013-04-22 | 2013-10-16 | 安徽北方芯动联科微系统技术有限公司 | MEMS element provided with structure reducing packaging stress |
| CN103500737A (en) * | 2013-10-24 | 2014-01-08 | 中国兵器工业集团第二一四研究所苏州研发中心 | Overload-resistant integral LCC (Leadless Chip Carrier) package based on LTCC (Low Temperature Co-Fired Ceramic) substrate |
-
2014
- 2014-12-02 CN CN201410720844.3A patent/CN105712283B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1678513A (en) * | 2002-09-04 | 2005-10-05 | 模拟设备公司 | Microchip with thermal stress relief means |
| KR20070111608A (en) * | 2006-05-18 | 2007-11-22 | 삼성전기주식회사 | Mems package and manufacturing method thereof |
| CN101920926A (en) * | 2010-09-30 | 2010-12-22 | 无锡中微高科电子有限公司 | Unmatched seal stress release structure |
| CN102040186A (en) * | 2010-11-09 | 2011-05-04 | 北京自动化控制设备研究所 | High vacuum ceramic LCC packaging method |
| CN202886664U (en) * | 2012-11-19 | 2013-04-17 | 青岛海信宽带多媒体技术有限公司 | Optical module adopting LCC (Leadless Chip Carrier) packaging structure |
| CN203238029U (en) * | 2013-04-22 | 2013-10-16 | 安徽北方芯动联科微系统技术有限公司 | MEMS element provided with structure reducing packaging stress |
| CN103500737A (en) * | 2013-10-24 | 2014-01-08 | 中国兵器工业集团第二一四研究所苏州研发中心 | Overload-resistant integral LCC (Leadless Chip Carrier) package based on LTCC (Low Temperature Co-Fired Ceramic) substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105712283A (en) | 2016-06-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TW200703531A (en) | Methods for packaging an image sensor and a packaged image sensor | |
| CN201598171U (en) | Stress isolated MEMS inertial sensor packaging structure | |
| CN202836865U (en) | Leadless package structure for silicon pressure sensors | |
| CN106744644A (en) | A kind of MEMS sensor low stress encapsulating package and package system | |
| CN102730617B (en) | Packaging structure of integrated magnetic and accelerometer and packaging method thereof | |
| TW200729444A (en) | Semiconductor package structure and fabrication method thereof | |
| CN106783814A (en) | A kind of film bulk acoustic wave device bare chip module package structure and method for packing | |
| CN105712283B (en) | A kind of LCC encapsulation stress release structure | |
| CN108358160B (en) | Hoisting type MEMS device packaging structure capable of releasing stress | |
| CN102259827A (en) | Method for encapsulating MEMS (micro electro mechanical system) high-range acceleration sensor | |
| CN204714514U (en) | Three-dimensional stacked MEMS package structure | |
| TW200725827A (en) | Structure and process of chip package | |
| CN102730618A (en) | Encapsulating structure and encapsulating method for integrating acceleration sensor and magnetic sensor | |
| CN108807286A (en) | sensor LGA package structure | |
| CN101150889B (en) | Encapsulation structure and its method for computer electric microphone | |
| CN206163483U (en) | Many chip module packaging structure including film bulk acoustic wave device unpacked chip | |
| CN208200366U (en) | The MEMS device encapsulating structure of the releasable stress of lift-on/lift-off type | |
| US8686547B1 (en) | Stack die structure for stress reduction and facilitation of electromagnetic shielding | |
| CN104880573B (en) | MEMS sensing chips | |
| CN206908859U (en) | Packaging system, microphone and the electronic equipment of MEMS microphone | |
| CN211570109U (en) | MEMS gyroscope and electronic device based on thermal expansion flow | |
| TW200725851A (en) | Packing structure and method forming the same | |
| CN208271883U (en) | Multichip stacking encapsulation structure | |
| CN113387319B (en) | MEMS chip packaging structure based on multi-through hole silicon substrate and preparation method thereof | |
| CN213416273U (en) | Stress isolation packaging structure of MEMS device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |