CN204550044U - The encapsulating structure of the module containing sensor unit - Google Patents
The encapsulating structure of the module containing sensor unit Download PDFInfo
- Publication number
- CN204550044U CN204550044U CN201520231841.3U CN201520231841U CN204550044U CN 204550044 U CN204550044 U CN 204550044U CN 201520231841 U CN201520231841 U CN 201520231841U CN 204550044 U CN204550044 U CN 204550044U
- Authority
- CN
- China
- Prior art keywords
- sensor unit
- chip
- module group
- group substrates
- sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 claims abstract description 45
- 238000004806 packaging method and process Methods 0.000 claims abstract description 8
- 238000002347 injection Methods 0.000 claims description 4
- 239000007924 injection Substances 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 12
- 238000003466 welding Methods 0.000 abstract description 11
- 239000000178 monomer Substances 0.000 description 10
- 238000005538 encapsulation Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Pressure Sensors (AREA)
Abstract
The utility model discloses a kind of encapsulating structure of the module containing sensor unit, comprising: module group substrates, the chip of sensor unit, packaging part; The chip of described sensor unit is set directly on described module group substrates, and described packaging part and described module group substrates surround in described sensor unit is encapsulated in by encapsulating structure.The utility model can avoid SMT welding process on the impact of sensor performance as far as possible.
Description
Technical field
The utility model relates to a kind of encapsulating structure of the module containing sensor unit.
Background technology
Shown in figure 1, module containing sensor unit comprises module group substrates 1, packaged sensor monomer 100 and other unit 7, sensor monomer 100 comprises the encapsulating structure that shell 2 and monomer substrate 5 surround, the chip of sensor is provided with, the asic chip 5 comprising MEMS sensor chip 3 and be electrically connected by lead-in wire 4 with described MEMS sensor chip 3 in encapsulating structure inside.Current is generally be affixed on module group substrates by packaged sensor monomer and other unit by SMT welding for this module containing sensor unit, forms final module application product.Likely have a strong impact on the chip generation of sensor monomer inside the SMT welding process of sensor monomer and other unit in this technical scheme, such as, backflow phenomenon in SMT welding process can cause sensor function to reduce or drift.
Utility model content
The purpose of this utility model is to provide the new encapsulation scheme of the module containing sensor unit, to avoid above-mentioned SMT welding process on the impact of sensor.
The utility model provides a kind of encapsulating structure of the module containing sensor unit, comprising: module group substrates, the chip of sensor unit, packaging part; The chip of described sensor unit is set directly on described module group substrates, and described packaging part and described module group substrates surround in described sensor unit is encapsulated in by encapsulating structure.
Further, other unit be mounted on described module group substrates is also comprised.
Preferably, the chip of described sensor unit, or to be welded on described module group substrates by conductive adhesive on described module group substrates.
Preferably, described packaging part is shell or mould-injection.
Preferably, described shell is metal shell or substrate package.
Wherein, the chip of the described sensor unit asic chip that comprises MEMS sensor chip and connect with described MEMS sensor chip electrical.
The utility model has following beneficial effect:
1) chip of sensor unit is directly processed on module group substrates, instead of the chip of sensor unit first encapsulated form sensor monomer and then be welded on module group substrates by SMT, avoid sensor monomer SMT welding process to the impact of sensor performance.
2) first other unit of module is mounted on module group substrates, and then the chip of sensor unit is directly processed on module group substrates, avoid other cell S MT welding process to the impact of sensor performance.
3) simplifying manufacturing process and the structure of module product, because this reducing the cost of module product, also reducing the height of sensor unit simultaneously.
By referring to the detailed description of accompanying drawing to exemplary embodiment of the present utility model, further feature of the present utility model and advantage thereof will become clear.
Accompanying drawing explanation
In the description combined and the accompanying drawing forming a part for description shows embodiment of the present utility model, and illustrate that one is used from and explains principle of the present utility model together with it.
Fig. 1 is the encapsulating structure of the module containing sensor unit in prior art.
Fig. 2 is the manufacture process schematic diagram that the utility model contains the encapsulating structure of the module of sensor unit.
Fig. 3 is the structural representation that the utility model contains the first embodiment of the encapsulating structure of the module of sensor unit.
Fig. 4 is the structural representation that the utility model contains the second embodiment of the encapsulating structure of the module of sensor unit.
Fig. 5 is the structural representation that the utility model contains the 3rd embodiment of the encapsulating structure of the module of sensor unit.
Detailed description of the invention
Various exemplary embodiment of the present utility model is described in detail now with reference to accompanying drawing.It should be noted that: unless specifically stated otherwise, otherwise positioned opposite, the numerical expression of the parts of setting forth in these embodiments and step and numerical value do not limit scope of the present utility model.
Illustrative to the description only actually of at least one exemplary embodiment below, never as any restriction to the utility model and application or use.
May not discuss in detail for the known technology of person of ordinary skill in the relevant, method and apparatus, but in the appropriate case, technology, method and apparatus should be regarded as a part for description.
In all examples with discussing shown here, any occurrence should be construed as merely exemplary, instead of as restriction.Therefore, other example of exemplary embodiment can have different values.
It should be noted that: represent similar terms in similar label and letter accompanying drawing below, therefore, once be defined in an a certain Xiang Yi accompanying drawing, then do not need to be further discussed it in accompanying drawing subsequently.
Shown in figure 2, provide the manufacture process that the utility model contains the encapsulating structure of the module of sensor unit, comprise the following steps: S1, the chip that module group substrates, sensor unit are provided and other unit; S2, first other unit is mounted on module group substrates; S3, the chip of sensor unit directly to be processed on module group substrates and encapsulate again.
In step s3, can with conducting resinl by the die bonding of sensor unit on module group substrates, or by the chips welding of sensor unit on module group substrates.
In step s3, can utilize shell and part module group substrates surround encapsulation cavity with by the chip package of sensor unit interior, or with the chip of mould-injection covering sensor unit to realize encapsulating.
Wherein, shell can be metal shell or substrate package.
Wherein, the chip of the sensor unit asic chip that comprises MEMS sensor chip and connect with MEMS sensor chip electrical.
Reference Figure 3 shows that the first embodiment of the encapsulating structure of the module containing sensor unit, comprises module group substrates 1, sensor unit, and other unit 7.MEMS sensor chip 3 and the asic chip 5 of sensor unit are set directly on module group substrates 1, and the substrate package that utilizes substrate to surround 21 and module group substrates 1 surround and encapsulate in MEMS sensor chip 3 and asic chip 5 be encapsulated in by cavity.MEMS sensor chip 3 and asic chip 5 are electrically connected by lead-in wire 4, and asic chip 5 is electrically connected with the circuit on module group substrates 1 by another lead-in wire.
With reference to the second embodiment of encapsulating structure that Figure 4 shows that the module containing sensor unit, and the difference of the first embodiment is, is to cover MEMS sensor chip 3 and asic chip 5 completely from top to form the encapsulation to both by mould-injection 22.
Reference Figure 5 shows that the 3rd embodiment of the encapsulating structure of the module containing sensor unit, be with the difference of the first embodiment, comprise two sensor units, first sensor unit comprises MEMS sensor chip 31 and asic chip 51, and both are electrically connected by lead-in wire 41; Second sensor unit comprises MEMS sensor chip 32 and asic chip 52, and both are electrically connected by lead-in wire 42.Metal shell 23 and module group substrates 1 surround encapsulation cavity, in MEMS sensor chip 31, asic chip 51, MEMS sensor chip 32 and asic chip 52 being all encapsulated in.
In above three embodiments, following manner can be adopted to be fixed on module group substrates 1 by the chip of sensor unit: with conducting resinl by the die bonding of described sensor unit on described module group substrates, or by the chips welding of described sensor unit on described module group substrates.
The utility model has following beneficial effect:
1) chip of sensor unit is directly processed on module group substrates, instead of the chip of sensor unit first encapsulated form sensor monomer and then be welded on module group substrates by SMT, avoid sensor monomer SMT welding process to the impact of sensor performance.
2) first other unit of module is mounted on module group substrates, and then the chip of sensor unit is directly processed on module group substrates, avoid other cell S MT welding process to the impact of sensor performance.
3) simplifying manufacturing process and the structure of module product, because this reducing the cost of module product, also reducing the height of sensor unit simultaneously.
Although be described in detail specific embodiments more of the present utility model by example, it should be appreciated by those skilled in the art, above example is only to be described, instead of in order to limit scope of the present utility model.It should be appreciated by those skilled in the art, when not departing from scope and spirit of the present utility model, above embodiment can be modified.Scope of the present utility model is limited by claims.
Claims (6)
1. an encapsulating structure for the module containing sensor unit, is characterized in that, comprising:
Module group substrates, the chip of sensor unit, packaging part;
The chip of described sensor unit is set directly on described module group substrates, and described packaging part and described module group substrates surround in described sensor unit is encapsulated in by encapsulating structure.
2. structure according to claim 1, is characterized in that, also comprises other unit be mounted on described module group substrates.
3. structure according to claim 1, is characterized in that, the chip of described sensor unit, or to be welded on described module group substrates by conductive adhesive on described module group substrates.
4. structure according to claim 1, is characterized in that, described packaging part is shell or mould-injection.
5. structure according to claim 4, is characterized in that, described shell is metal shell or substrate package.
6. the structure according to any one of claim 1-5, is characterized in that, the asic chip that the chip of described sensor unit comprises MEMS sensor chip and connects with described MEMS sensor chip electrical.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520231841.3U CN204550044U (en) | 2015-04-16 | 2015-04-16 | The encapsulating structure of the module containing sensor unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520231841.3U CN204550044U (en) | 2015-04-16 | 2015-04-16 | The encapsulating structure of the module containing sensor unit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204550044U true CN204550044U (en) | 2015-08-12 |
Family
ID=53825180
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520231841.3U Active CN204550044U (en) | 2015-04-16 | 2015-04-16 | The encapsulating structure of the module containing sensor unit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204550044U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104743508A (en) * | 2015-04-16 | 2015-07-01 | 歌尔声学股份有限公司 | Packaging method and packaging structure for module comprising sensor unit |
-
2015
- 2015-04-16 CN CN201520231841.3U patent/CN204550044U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104743508A (en) * | 2015-04-16 | 2015-07-01 | 歌尔声学股份有限公司 | Packaging method and packaging structure for module comprising sensor unit |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN204464255U (en) | The encapsulating structure of integrated sensor | |
| CN202979520U (en) | Seal cover and electronic device | |
| CN204550044U (en) | The encapsulating structure of the module containing sensor unit | |
| CN203845811U (en) | Multifunctional sensor | |
| CN104009026A (en) | Package structure and package method of tire pressure sensor circuit | |
| CN103606539A (en) | Frame-based flat package adopting opening-optimization technology and manufacturing process thereof | |
| CN104743508A (en) | Packaging method and packaging structure for module comprising sensor unit | |
| CN202712172U (en) | Multi-chip dual-base island SOP package structure | |
| CN204516738U (en) | The encapsulating structure of integrated sensor | |
| CN204518074U (en) | A kind of product module containing microphone | |
| CN204464270U (en) | Semiconductor package body | |
| CN102738009A (en) | Manufacturing process of flat packaging piece of AAQFN framework product based on brushing | |
| CN204948350U (en) | There is the MEMS device of flexible conducting structure | |
| CN103855066A (en) | Image induction chip packaging method for protecting chip | |
| CN102332413A (en) | Surface mounted technology (SMT) tin paste connecting process | |
| CN103337504A (en) | A packaging method for an image sensor | |
| CN104779224A (en) | QFN (Quad Fiat Nolead) packaging structure of power device | |
| CN104505380A (en) | Semiconductor packaging body and manufacturing method thereof | |
| CN104796833A (en) | Product module with microphone | |
| CN204271072U (en) | Lead-frame packages structure | |
| CN102738018A (en) | Framework carrier pore opening and solder ball film sticking based AAQFN (quad flat no-lead) product secondary plastic packaging manufacturing technology | |
| CN203882999U (en) | Packaging structure for tire pressure sensor circuit | |
| CN203721712U (en) | Lead frame strip used for semiconductor packaging | |
| CN102738016A (en) | Framework carrier pore opening based AAQFN product secondary plastic packaging manufacturing technology | |
| CN202766286U (en) | Micro-electromechanical systems (MEMS) packaging structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 261031 Dongfang Road, Weifang high tech Development Zone, Shandong, China, No. 268 Patentee after: Goertek Inc. Address before: 261031 Dongfang Road, Weifang high tech Development Zone, Shandong, China, No. 268 Patentee before: Goertek Inc. |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20200624 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 261031 Dongfang Road, Weifang high tech Development Zone, Shandong, China, No. 268 Patentee before: GOERTEK Inc. |
|
| TR01 | Transfer of patent right |