CN104743508A - Packaging method and packaging structure for module comprising sensor unit - Google Patents
Packaging method and packaging structure for module comprising sensor unit Download PDFInfo
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- CN104743508A CN104743508A CN201510182304.9A CN201510182304A CN104743508A CN 104743508 A CN104743508 A CN 104743508A CN 201510182304 A CN201510182304 A CN 201510182304A CN 104743508 A CN104743508 A CN 104743508A
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- group substrates
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Abstract
The invention discloses a packaging method for a module comprising a sensor unit. The packaging method comprises the following steps: S1. providing a module substrate, a chip for the sensor unit and other units; S2. mounting the other units on the module substrate; and S3. directly processing the chip for the sensor unit on the module substrate and packaging. The invention also discloses a packaging structure for the module comprising the sensor unit. The packaging structure comprises a module substrate, a chip for the sensor unit and a packaging part, wherein the chip for the sensor unit is directly arranged on the module substrate; and the packaging structure is defined by the encircling of the packaging part and the module substrate, so that the sensor unit is packaged in the packaging structure. According to the packaging method and the packaging structure disclosed by the invention, the influence of the SMT welding process on the performance of the sensor can be avoided as much as possible.
Description
Technical field
The present invention relates to a kind of method for packing and encapsulating structure of the module containing sensor unit.
Background technology
Shown in figure 1, module containing sensor unit comprises module group substrates 1, packaged sensor monomer 100 and other unit 7, sensor monomer 100 comprises the encapsulating structure that shell 2 and monomer substrate 5 surround, the chip of sensor is provided with, the asic chip 5 comprising MEMS sensor chip 3 and be electrically connected by lead-in wire 4 with described MEMS sensor chip 3 in encapsulating structure inside.Current is generally be affixed on module group substrates by packaged sensor monomer and other unit by SMT welding for this module containing sensor unit, forms final module application product.Likely have a strong impact on the chip generation of sensor monomer inside the SMT welding process of sensor monomer and other unit in this technical scheme, such as, backflow phenomenon in SMT welding process can cause sensor function to reduce or drift.
Summary of the invention
The object of this invention is to provide the new encapsulation scheme of the module containing sensor unit, to avoid above-mentioned SMT welding process on the impact of sensor.
According to a first aspect of the invention, provide a kind of method for packing of the module containing sensor unit, comprise the following steps: S1, the chip that module group substrates, sensor unit are provided and other unit; S2, first other unit is mounted on described module group substrates; S3, the chip of described sensor unit directly to be processed on described module group substrates and encapsulate again.
Preferably, in described step S3, with conducting resinl by the die bonding of described sensor unit on described module group substrates, or by the chips welding of described sensor unit on described module group substrates.
Preferably, in described step S3, utilize shell and the described module group substrates of part surround encapsulation cavity with by the chip package of described sensor unit interior, or the chip covering described sensor unit with mould-injection is to realize encapsulating.
Preferably, described shell is metal shell or substrate package.
Wherein, the chip of the described sensor unit asic chip that comprises MEMS sensor chip and connect with described MEMS sensor chip electrical.
According to a second aspect of the invention, provide a kind of encapsulating structure of the module containing sensor unit, comprising: module group substrates, the chip of sensor unit, packaging part; The chip of described sensor unit is set directly on described module group substrates, and described packaging part and described module group substrates surround in described sensor unit is encapsulated in by encapsulating structure.
Further, other unit be mounted on described module group substrates is also comprised.
Preferably, the chip of described sensor unit, or to be welded on described module group substrates by conductive adhesive on described module group substrates.
Preferably, described packaging part is shell or mould-injection.
Preferably, described shell is metal shell or substrate package.
Wherein, the chip of the described sensor unit asic chip that comprises MEMS sensor chip and connect with described MEMS sensor chip electrical.
The present invention has following beneficial effect:
1) chip of sensor unit is directly processed on module group substrates, instead of the chip of sensor unit first encapsulated form sensor monomer and then be welded on module group substrates by SMT, avoid sensor monomer SMT welding process to the impact of sensor performance.
2) first other unit of module is mounted on module group substrates, and then the chip of sensor unit is directly processed on module group substrates, avoid other cell S MT welding process to the impact of sensor performance.
3) simplifying manufacturing process and the structure of module product, because this reducing the cost of module product, also reducing the height of sensor unit simultaneously.
By referring to the detailed description of accompanying drawing to exemplary embodiment of the present invention, further feature of the present invention and advantage thereof will become clear.
Accompanying drawing explanation
In the description combined and the accompanying drawing forming a part for description shows embodiments of the invention, and illustrate that one is used from and explains principle of the present invention together with it.
Fig. 1 is the encapsulating structure of the module containing sensor unit in prior art.
Fig. 2 is the schematic flow sheet that the present invention contains the method for packing of the module of sensor unit.
Fig. 3 is the structural representation that the present invention contains the first embodiment of the encapsulating structure of the module of sensor unit.
Fig. 4 is the structural representation that the present invention contains the second embodiment of the encapsulating structure of the module of sensor unit.
Fig. 5 is the structural representation that the present invention contains the 3rd embodiment of the encapsulating structure of the module of sensor unit.
Detailed description of the invention
Various exemplary embodiment of the present invention is described in detail now with reference to accompanying drawing.It should be noted that: unless specifically stated otherwise, otherwise positioned opposite, the numerical expression of the parts of setting forth in these embodiments and step and numerical value do not limit the scope of the invention.
Illustrative to the description only actually of at least one exemplary embodiment below, never as any restriction to the present invention and application or use.
May not discuss in detail for the known technology of person of ordinary skill in the relevant, method and apparatus, but in the appropriate case, technology, method and apparatus should be regarded as a part for description.
In all examples with discussing shown here, any occurrence should be construed as merely exemplary, instead of as restriction.Therefore, other example of exemplary embodiment can have different values.
It should be noted that: represent similar terms in similar label and letter accompanying drawing below, therefore, once be defined in an a certain Xiang Yi accompanying drawing, then do not need to be further discussed it in accompanying drawing subsequently.
Shown in figure 2, provide a kind of method for packing of the module containing sensor unit, comprise the following steps: S1, the chip that module group substrates, sensor unit are provided and other unit; S2, first other unit is mounted on module group substrates; S3, the chip of sensor unit directly to be processed on module group substrates and encapsulate again.
In step s3, can with conducting resinl by the die bonding of sensor unit on module group substrates, or by the chips welding of sensor unit on module group substrates.
In step s3, can utilize shell and part module group substrates surround encapsulation cavity with by the chip package of sensor unit interior, or with the chip of mould-injection covering sensor unit to realize encapsulating.
Wherein, shell can be metal shell or substrate package.
Wherein, the chip of the sensor unit asic chip that comprises MEMS sensor chip and connect with MEMS sensor chip electrical.
Reference Figure 3 shows that the first embodiment of the encapsulating structure of the module containing sensor unit, comprises module group substrates 1, sensor unit, and other unit 7.MEMS sensor chip 3 and the asic chip 5 of sensor unit are set directly on module group substrates 1, and the substrate package that utilizes substrate to surround 21 and module group substrates 1 surround and encapsulate in MEMS sensor chip 3 and asic chip 5 be encapsulated in by cavity.MEMS sensor chip 3 and asic chip 5 are electrically connected by lead-in wire 4, and asic chip 5 is electrically connected with the circuit on module group substrates 1 by another lead-in wire.
With reference to the second embodiment of encapsulating structure that Figure 4 shows that the module containing sensor unit, and the difference of the first embodiment is, is to cover MEMS sensor chip 3 and asic chip 5 completely from top to form the encapsulation to both by mould-injection 22.
Reference Figure 5 shows that the 3rd embodiment of the encapsulating structure of the module containing sensor unit, be with the difference of the first embodiment, comprise two sensor units, first sensor unit comprises MEMS sensor chip 31 and asic chip 51, and both are electrically connected by lead-in wire 41; Second sensor unit comprises MEMS sensor chip 32 and asic chip 52, and both are electrically connected by lead-in wire 42.Metal shell 23 and module group substrates 1 surround encapsulation cavity, in MEMS sensor chip 31, asic chip 51, MEMS sensor chip 32 and asic chip 52 being all encapsulated in.
In above three embodiments, following manner can be adopted to be fixed on module group substrates 1 by the chip of sensor unit: with conducting resinl by the die bonding of described sensor unit on described module group substrates, or by the chips welding of described sensor unit on described module group substrates.
The present invention has following beneficial effect:
1) chip of sensor unit is directly processed on module group substrates, instead of the chip of sensor unit first encapsulated form sensor monomer and then be welded on module group substrates by SMT, avoid sensor monomer SMT welding process to the impact of sensor performance.
2) first other unit of module is mounted on module group substrates, and then the chip of sensor unit is directly processed on module group substrates, avoid other cell S MT welding process to the impact of sensor performance.
3) simplifying manufacturing process and the structure of module product, because this reducing the cost of module product, also reducing the height of sensor unit simultaneously.
Although be described in detail specific embodiments more of the present invention by example, it should be appreciated by those skilled in the art, above example is only to be described, instead of in order to limit the scope of the invention.It should be appreciated by those skilled in the art, can without departing from the scope and spirit of the present invention, above embodiment be modified.Scope of the present invention is limited by claims.
Claims (10)
1. a method for packing for the module containing sensor unit, is characterized in that, comprise the following steps:
S1, the chip that module group substrates, sensor unit are provided and other unit;
S2, first other unit is mounted on described module group substrates;
S3, the chip of described sensor unit directly to be processed on described module group substrates and encapsulate again.
2. method according to claim 1, is characterized in that, in described step S3, with conducting resinl by the die bonding of described sensor unit on described module group substrates, or by the chips welding of described sensor unit on described module group substrates.
3. method according to claim 1, it is characterized in that, in described step S3, utilize shell and the described module group substrates of part surround encapsulation cavity with by the chip package of described sensor unit interior, or the chip covering described sensor unit with mould-injection is to realize encapsulating.
4. method according to claim 3, is characterized in that, described shell is metal shell or substrate package.
5. the method according to any one of claim 1-4, is characterized in that, the asic chip that the chip of described sensor unit comprises MEMS sensor chip and connects with described MEMS sensor chip electrical.
6. an encapsulating structure for the module containing sensor unit, is characterized in that, comprising:
Module group substrates, the chip of sensor unit, packaging part;
The chip of described sensor unit is set directly on described module group substrates, and described packaging part and described module group substrates surround in described sensor unit is encapsulated in by encapsulating structure.
7. structure according to claim 6, is characterized in that, also comprises other unit be mounted on described module group substrates.
8. structure according to claim 6, is characterized in that, the chip of described sensor unit, or to be welded on described module group substrates by conductive adhesive on described module group substrates.
9. structure according to claim 6, is characterized in that, described packaging part is shell or mould-injection, and described shell is metal shell or substrate package.
10. the structure according to any one of claim 6-9, is characterized in that, the asic chip that the chip of described sensor unit comprises MEMS sensor chip and connects with described MEMS sensor chip electrical.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510182304.9A CN104743508A (en) | 2015-04-16 | 2015-04-16 | Packaging method and packaging structure for module comprising sensor unit |
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| CN201510182304.9A CN104743508A (en) | 2015-04-16 | 2015-04-16 | Packaging method and packaging structure for module comprising sensor unit |
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| CN104743508A true CN104743508A (en) | 2015-07-01 |
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Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6005771A (en) * | 1996-12-20 | 1999-12-21 | Trw Inc. | Electronics cooling technique for spacecraft modules |
| CN2613049Y (en) * | 2003-01-27 | 2004-04-21 | 胜开科技股份有限公司 | Simplified image sensor die set |
| CN1983536A (en) * | 2005-12-12 | 2007-06-20 | 嘉田科技股份有限公司 | Improvement for packing image sensing chip construction oncircuit board |
| US20090184404A1 (en) * | 2008-01-17 | 2009-07-23 | En-Min Jow | Electromagnetic shilding structure and manufacture method for multi-chip package module |
| CN101620022A (en) * | 2008-07-01 | 2010-01-06 | 欣兴电子股份有限公司 | Pressure sensing element encapsulation and manufacturing method thereof |
| CN202549824U (en) * | 2012-02-22 | 2012-11-21 | 苏州晶方半导体科技股份有限公司 | Chip packaging structure |
| CN203339158U (en) * | 2013-05-20 | 2013-12-11 | 江苏长电科技股份有限公司 | Multi-chip stack packaging structure of multilayer wire substrate of metal plate |
| CN104011855A (en) * | 2011-12-21 | 2014-08-27 | 武汉飞恩微电子有限公司 | Packaging structure and packaging process of power device |
| CN104182738A (en) * | 2014-08-26 | 2014-12-03 | 南昌欧菲生物识别技术有限公司 | Fingerprint identification module and manufacturing method thereof |
| CN204550044U (en) * | 2015-04-16 | 2015-08-12 | 歌尔声学股份有限公司 | The encapsulating structure of the module containing sensor unit |
-
2015
- 2015-04-16 CN CN201510182304.9A patent/CN104743508A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6005771A (en) * | 1996-12-20 | 1999-12-21 | Trw Inc. | Electronics cooling technique for spacecraft modules |
| CN2613049Y (en) * | 2003-01-27 | 2004-04-21 | 胜开科技股份有限公司 | Simplified image sensor die set |
| CN1983536A (en) * | 2005-12-12 | 2007-06-20 | 嘉田科技股份有限公司 | Improvement for packing image sensing chip construction oncircuit board |
| US20090184404A1 (en) * | 2008-01-17 | 2009-07-23 | En-Min Jow | Electromagnetic shilding structure and manufacture method for multi-chip package module |
| CN101620022A (en) * | 2008-07-01 | 2010-01-06 | 欣兴电子股份有限公司 | Pressure sensing element encapsulation and manufacturing method thereof |
| CN104011855A (en) * | 2011-12-21 | 2014-08-27 | 武汉飞恩微电子有限公司 | Packaging structure and packaging process of power device |
| CN202549824U (en) * | 2012-02-22 | 2012-11-21 | 苏州晶方半导体科技股份有限公司 | Chip packaging structure |
| CN203339158U (en) * | 2013-05-20 | 2013-12-11 | 江苏长电科技股份有限公司 | Multi-chip stack packaging structure of multilayer wire substrate of metal plate |
| CN104182738A (en) * | 2014-08-26 | 2014-12-03 | 南昌欧菲生物识别技术有限公司 | Fingerprint identification module and manufacturing method thereof |
| CN204550044U (en) * | 2015-04-16 | 2015-08-12 | 歌尔声学股份有限公司 | The encapsulating structure of the module containing sensor unit |
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Address after: 261031 Dongfang Road, Weifang high tech Development Zone, Shandong, China, No. 268 Applicant after: Goertek Inc. Address before: 261031 Dongfang Road, Weifang high tech Development Zone, Shandong, China, No. 268 Applicant before: Goertek Inc. |
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Application publication date: 20150701 |