CN104182738A - Fingerprint identification module and manufacturing method thereof - Google Patents
Fingerprint identification module and manufacturing method thereof Download PDFInfo
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- CN104182738A CN104182738A CN201410425248.2A CN201410425248A CN104182738A CN 104182738 A CN104182738 A CN 104182738A CN 201410425248 A CN201410425248 A CN 201410425248A CN 104182738 A CN104182738 A CN 104182738A
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- fingerprint
- frame
- recognition module
- substrate
- detection element
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
- H01L2924/15321—Connection portion the connection portion being formed on the die mounting surface of the substrate being a ball array, e.g. BGA
Abstract
The invention provides a fingerprint identification module and a manufacturing method of the fingerprint identification module. The fingerprint identification module comprises a substrate, a frame located on the substrate and a fingerprint sensor located in the frame and a first filling layer, wherein the interior of the frame is filled with the first filling layer. The fingerprint sensor is electrically connected with the substrate. The fist filling layer wraps the fingerprint sensor. The frame is provided with a protruding part, and the protruding part covers the preset region on the upper surface of the first filling layer. By means of the fingerprint identification module and the manufacturing method of the fingerprint identification module, the manufacturing technology processes of the fingerprint identification module can be simplified effectively, and manufacturing efficiency is improved. Furthermore, the protruding part of the frame can fix the filling layer and the packaging structure inside the filling layer more effectively, and reliability of devices is improved.
Description
Technical field
The present invention relates to technical field of semiconductors, relate in particular to a kind of fingerprint recognition module and manufacture method thereof.
Background technology
There is the characteristics such as unchangeable property, uniqueness and convenience due to fingerprint, therefore, can accurately and reliably identify user identity by identification fingerprint.Further, fingerprint identification technology can utilize the fingerprint image that fingerprint recognition module is convenient, obtain rapidly user, and then user's fingerprint is identified.
Concrete, fingerprint recognition module comprises the fingerprint sensor that is positioned at substrate top and is electrically connected with it at present, be positioned on described substrate and surround the frame of described fingerprint sensor, and be filled in the packed layer in described frame, its corresponding preparation scheme is, first fingerprint sensor and substrate are electrically connected, then mould is set on substrate, described mould surrounds described fingerprint sensor, in this mould, pour into encapsulating material, be positioned on described substrate to form, wrap up described fingerprint sensor and do not cover the packed layer of described fingerprint sensor upper surface, remove afterwards described mould, wherein, described packed layer can be EMC.Then on the surface of current structure, can also prepare successively color layers (color coating) and protective seam (hard coating); last again at overall module edge cover upper side frame (Bezel); concrete, can utilize tackifier that frame is adhesively fixed on described substrate.Visible, the technological process of above-mentioned fingerprint recognition module is more loaded down with trivial details, complexity.
Summary of the invention
The invention provides a kind of fingerprint recognition module and manufacture method thereof, for solving the too loaded down with trivial details problem of technological process of other module of existing fingerprint.
First aspect of the present invention is to provide a kind of fingerprint recognition module, comprising: substrate, be positioned at frame on described substrate, be positioned at the fingerprint sensor of described frame and be filled in the first packed layer of described frame;
Described fingerprint sensor is electrically connected with described substrate;
Described the first packed layer wraps up described fingerprint sensor;
Described frame possesses teat, and described teat covers the predeterminable area of described the first packed layer upper surface.
Another aspect of the present invention is to provide a kind of fingerprint recognition module making method, comprising:
Utilize flip-chip technique, chip is attached on the lower surface of fingerprint detection element, and described chip is electrically connected to described fingerprint detection element, to form fingerprint sensor, described fingerprint detection element comprises the upper surface for responding to fingerprint;
Substrate is provided, described fingerprint sensor is electrically connected to described substrate;
Make frame, described frame possesses teat, and described frame is fixedly installed on described substrate, so that described fingerprint sensor is positioned at described frame;
In described frame, pour into encapsulating material, to form the first packed layer being filled in described frame, described the first packed layer wraps up described fingerprint sensor, and described teat covers the predeterminable area of described packed layer upper surface.
Fingerprint recognition module provided by the invention, utilizes frame perfusion capsulation material to form packed layer, can form packed layer without mould is set, and has follow-uply effectively simplified preparation technology's flow process of fingerprint recognition module also without removing mould, improves preparation efficiency.
Brief description of the drawings
The cross-sectional view of the fingerprint recognition module that Fig. 1 provides for the embodiment of the present invention two;
The cross-sectional view of the fingerprint recognition module that Fig. 2 provides for the embodiment of the present invention three;
The cross-sectional view of the fingerprint recognition module that Fig. 3 provides for the embodiment of the present invention four;
The cross-sectional view of the fingerprint recognition module that Fig. 4 provides for the embodiment of the present invention five;
The cross-sectional view of the fingerprint recognition module that Fig. 5 provides for the embodiment of the present invention six;
The schematic flow sheet of the fingerprint recognition module making method that Fig. 6 provides for the embodiment of the present invention seven.
Embodiment
For making object, technical scheme and the advantage of the embodiment of the present invention clearer, below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is clearly and completely described.For convenience of description, the size in zoomed in or out different layers and region, so size shown in figure and ratio might not represent physical size, does not reflect the proportionate relationship of size yet.
The embodiment of the present invention one provides a kind of fingerprint recognition module, and described fingerprint recognition module comprises: substrate 11, be positioned at frame 12 on described substrate, be positioned at the fingerprint sensor 13 of described frame 12 and be filled in the first packed layer 14 of described frame 12;
Described fingerprint sensor 13 is electrically connected with described substrate 11;
Described the first packed layer 14 wraps up described fingerprint sensor 13;
Described frame 12 possesses teat 121, and described teat 121 covers the predeterminable area of described the first packed layer 14 upper surfaces.
Wherein, substrate 11 specifically can comprise flexible PCB (Flexible Printed Circuit is called for short FPC) or printed circuit board (PCB) (Printed Circuit Board is called for short PCB).Concrete, described flexible PCB can be Kapton.
Concrete, described frame 12 can be made up of suitable material, and optional, described material can include but not limited to plastics, metal etc., for example aluminium.
Optionally, the upper surface of the teat 121 of described frame 12 can be inclined-plane, thereby makes fingerprint sensor 13 form concave shape with respect to frame 12, therefore can be by user's finger-guided to this depression, preferably user's finger is positioned, so that carry out fingerprint recognition.
Concrete, described fingerprint sensor 13 specifically can comprise: fingerprint detection element 131 and chip 132; Described fingerprint detection element 131 is electrically connected with described substrate 11 by ball grid array (Ball Grid Array is called for short BGA) soldered ball 15, and described BGA soldered ball 15 is between described fingerprint detection element 131 and described substrate 11; Described chip 132 is positioned at the below of described fingerprint detection element 131, and is attached on described fingerprint detection element 131, and described chip 132 is electrically connected with described fingerprint detection element 131.
Wherein, described BGA soldered ball 15 can be made up of metal material, for example tin.
Concrete, described fingerprint detection element 131 can be for possessing any element of fingerprint detection function, for example, described fingerprint detection element 131 can be one-dimensional finger print detecting element, also can be two-dimentional fingerprint detection element, can be swiping formula fingerprint detection element, can be also push type fingerprint detection element.Concrete, for swiping formula fingerprint detection element, in the time carrying out fingerprint recognition, user can slide finger above described detecting element, in the present embodiment, to slide covering on the lip-deep Coating layer of described detecting element, accordingly, in the time that finger slips on fingerprint sensor, described detecting element gathers several fingerprint images, and speed and the direction of the initial position of pointing by detection, finger sliding carry out the whole fingerprint image of reconstruct, finally form the fingerprint image of whole finger.And for push type fingerprint detection element, user is by finger presses above described detecting element time, described detecting element can obtain corresponding finger print information.Optionally, described fingerprint detection element can be coupled with capacitive way, or is otherwise coupled to the subcutaneous part of user's finger with electromagnetic mode.In addition, described fingerprint detection element can or be worked in combination with the combination of elements of optics sensing, infrared sensing or other sensings of execution to user fingerprints, and these elements itself can be coupled to certain other features of epidermis, the subcutaneous part of user's finger or expression user's the fingerprint of user's finger.
In actual applications, described fingerprint detection element comprises the upper surface for responding to fingerprint, can utilize flip-chip technology, and described chip 132 is attached on the lower surface of described fingerprint detection element 131.Concrete; on chip, conventionally can be provided with at least one solder joint 133, therefore optional, can chip 132 be attached on fingerprint detection element 131 by welding; corresponding, the solder joint 133 of chip 132 can be fixedly connected by welding on the lower surface of fingerprint detection element 131.Concrete, described solder joint can be by the material being applicable to arbitrarily, and for example metal is made, and further specifically, described solder joint can be made up of materials such as tin, aluminium, copper, silver, and the present embodiment is not limited at this.
In addition,, in order to realize being better fixedly connected with of chip 131 and fingerprint detection element 132, described fingerprint recognition module can also comprise: be filled in the bonding coat 134 between described chip 131 and described fingerprint detection element 132.
In the present embodiment, described the first packed layer 14 is thermosetting material, can form by perfusion encapsulating material, and described encapsulating material can be normally used capsulation material, for example, and plastics, resin etc.Concrete, be positioned at the structure of described frame 12, for example, described fingerprint sensor, BGA soldered ball etc., all wrapped up by described the first packed layer 14.Therefore described the first packed layer 14 can also play certain support fixation to the described chip 132 of upside-down mounting.Concrete, described the first packed layer 14 both can cover the upper surface of described fingerprint sensor, also can not cover the upper surface of described fingerprint sensor.
In actual applications, in the time that described the first packed layer 14 does not cover the upper surface of described fingerprint sensor, in order to protect described fingerprint recognition module, conventionally can prepare on the surface of described fingerprint sensor protective seam (hard coating).Concrete; described protective seam can be sapphire, diamond-like carbon film-coating (Diamond-like carbon; be called for short DLC), tempered glass or pottery etc., in order to ensure the accuracy of fingerprint recognition, the thickness to protective seam and planarization all have certain requirement.Optional again, before the described protective seam of preparation, color layers (color coating) is prepared on surface that can present described fingerprint sensor, to block the inner structure of module.
The fingerprint recognition module that the present embodiment provides, can utilize frame to carry out the perfusion of capsulation material, forms packed layer, without being set, mould can form packed layer, and follow-uply effectively simplify preparation technology's flow process of fingerprint recognition module also without removing mould, improved preparation efficiency.And the teat of described frame can be fixed the structure of described packed layer and inner encapsulation thereof more effectively, improve device reliability.
Optionally, the cross-sectional view of the fingerprint recognition module that Fig. 1 provides for the embodiment of the present invention two, as shown in Figure 1, according to the fingerprint recognition module described in embodiment mono-, the teat 121 of described frame 12 does not contact with described fingerprint sensor 13, and the height of described teat 121 is not higher than the height of the upper surface of described fingerprint sensor 13, it is the gap that has certain distance between described frame 12 and described fingerprint sensor 13, this is apart from can determining according to actual process, and the present embodiment is not limited.Corresponding, in the process of described the first packed layer 14 of formation, can be by the gap between described frame 12 and described fingerprint sensor 13, to the interior perfusion encapsulating material of described frame 12, to form described the first packed layer 14, and described the first packed layer 14 does not cover the upper surface of described fingerprint sensor 13.
Optional again, the cross-sectional view of the fingerprint recognition module that Fig. 2 provides for the embodiment of the present invention three, as shown in Figure 2, according to the fingerprint recognition module described in embodiment mono-, the teat 121 of described frame 12 does not contact with described fingerprint sensor 13, and higher than the height of the upper surface of described fingerprint sensor 13, also there is gap between described frame 12 and described fingerprint sensor 13 in the height of described teat 121.Corresponding, in the process of described the first packed layer 14 of formation, equally can be by the gap between described frame 12 and described fingerprint sensor 13, to the interior perfusion encapsulating material of described frame 12, to form described the first packed layer 14, and described the first packed layer 14 covers the upper surface of described fingerprint sensor 13, therefore in the present embodiment, can not be coating processes on the surface of described fingerprint detection element 131, but directly utilize the first packed layer as protective seam (hard coating) and color layers (color coating), thereby further simplify structure and the preparation flow of device.
Optional again, the cross-sectional view of the fingerprint recognition module that Fig. 3 provides for the embodiment of the present invention four, as shown in Figure 3, according to the fingerprint recognition module described in embodiment mono-, on the sidewall of described frame 12, possesses fill orifice 122, the teat of described frame extends the described fingerprint sensor of contact, and just contacts the edge of described fingerprint sensor, and the teat of described frame and described fingerprint sensor form enclosed construction.Corresponding, forming in the process of described the first packed layer 14, can pass through the fill orifice 122 on the sidewall of described frame 12, to the interior perfusion encapsulating material of described frame 12, to form described the first packed layer 14.
Optional again, the cross-sectional view of the fingerprint recognition module that Fig. 4 provides for the embodiment of the present invention five, as shown in Figure 4, according to the fingerprint recognition module described in embodiment mono-, on the sidewall of described frame 12, possesses fill orifice 122, the teat of described frame extends the described fingerprint sensor of contact, and covers the subregion of described fingerprint sensor upper surface, the i.e. teat of described frame form enclosed construction same with described fingerprint sensor.Corresponding, forming in the process of described the first packed layer 14, can pass through the fill orifice 122 on the sidewall of described frame 12, to the interior perfusion encapsulating material of described frame 12, to form described the first packed layer 14.
In actual applications, described fingerprint recognition module also comprises the capacitance resistance being arranged on substrate conventionally, concrete, and it is nearer that capacitance resistance and fingerprint sensing element lean on, and its voltage stabilizing, filter effect are better, and the image effect collecting is better.Corresponding, in order to realize this capacitance-resistance encapsulation, optionally, based on the fingerprint recognition module described in above-mentioned arbitrary embodiment, for example, the fingerprint recognition module based on described in embodiment tetra-is example, the cross-sectional view of the fingerprint recognition module that Fig. 5 provides for the embodiment of the present invention six, as shown in Figure 5, described fingerprint recognition module can also comprise: be positioned at the second packed layer 16 on described substrate, described the second packed layer 16 surrounds described frame 12.
The fingerprint recognition module that the present embodiment provides, can utilize frame to carry out the perfusion of capsulation material, forms packed layer, without being set, mould can form packed layer, and follow-uply effectively simplify preparation technology's flow process of fingerprint recognition module also without removing mould, improved preparation efficiency.And the teat of described frame can be fixed the structure of described packed layer and inner encapsulation thereof more effectively, improve device reliability.
The schematic flow sheet of the fingerprint recognition module making method that Fig. 6 provides for the embodiment of the present invention seven, as shown in Figure 6, described method comprises:
401, utilize flip-chip technique, chip is attached on the lower surface of fingerprint detection element, and described chip is electrically connected to described fingerprint detection element, to form fingerprint sensor, described fingerprint detection element comprises the upper surface for responding to fingerprint;
402, provide substrate, described fingerprint sensor is electrically connected to described substrate;
403, make frame, described frame possesses teat, and described frame is fixedly installed on described substrate, so that described fingerprint sensor is positioned at described frame;
404, in described frame, pour into encapsulating material, to form the first packed layer being filled in described frame, described the first packed layer wraps up described fingerprint sensor, and described teat covers the predeterminable area of described packed layer upper surface.
Concrete, in actual applications, 403 can realize by numerous embodiments, for example, can, for each fingerprint sensor, the frame of making be enclosed within to described fingerprint sensor around one by one, make described fingerprint sensor be positioned at described frame.Or, also can make in advance multiple frames of justifying design, the frame of this justifying design can be in the time carrying out mould combined pressure to it, a set of each fingerprint sensor, thus realize justifying formula technique, enhance productivity.
Wherein, described substrate specifically can comprise flexible PCB (Flexible Printed Circuit is called for short FPC) or printed circuit board (PCB) (rinted Circuit Board is called for short PCB).Concrete, described flexible PCB can be made up of the flexible electrical dielectric material of any appropriate, for example, and Kapton.
Concrete, described frame can be made up of suitable material, and optional, described material can include but not limited to plastics, metal etc., for example aluminium.
Optionally, the upper surface of the teat of described frame can be inclined-plane, thereby makes fingerprint sensor form concave shape with respect to frame, therefore can be by user's finger-guided to this depression, preferably user's finger is positioned, so that carry out fingerprint recognition.
Concrete, described fingerprint sensing implement body can comprise: fingerprint detection element and chip; Described fingerprint detection element is electrically connected with described substrate by ball grid array (Ball Grid Array is called for short BGA) soldered ball, and described BGA soldered ball is between described fingerprint detection element and described substrate; Described chip is positioned at the below of described fingerprint detection element, and is attached on described fingerprint detection element, and described chip is electrically connected with described fingerprint detection element.Corresponding, described in 401, described fingerprint sensor is electrically connected to described substrate, specifically can comprise:
By ball grid array BGA soldered ball, described bio-identification detecting element is electrically connected with described substrate, described BGA soldered ball is between described bio-identification detecting element and described substrate.
Wherein, described BGA soldered ball can be made up of metal material, for example tin.Concrete, described fingerprint detection element can be for possessing any element of fingerprint detection function, and for example, described fingerprint detection element can be one-dimensional finger print detecting element, can be also two-dimentional fingerprint detection element.
In actual applications, described fingerprint detection element comprises the upper surface for responding to fingerprint, can utilize flip-chip technology, described chip is attached on the lower surface of described fingerprint detection element.Concrete, on chip, conventionally can be provided with at least one solder joint, therefore, the solder joint of chip can be fixedly connected by welding on the lower surface of fingerprint detection element.Concrete, described solder joint can be by the material being applicable to arbitrarily, and for example metal is made, and further specifically, described solder joint can be made up of materials such as aluminium, copper, silver, and the present embodiment is not limited at this.
In addition, in order to realize being better fixedly connected with of chip and fingerprint detection element, described method can also comprise: form the bonding coat being filled between described chip and described fingerprint detection element.
In the present embodiment, described the first packed layer can form by perfusion encapsulating material, and described encapsulating material can be normally used capsulation material, for example, plastics, resin etc., it is thermosetting material.Concrete, described the first packed layer can also play certain support fixation to the described chip of upside-down mounting.
Optionally, as a kind of embodiment of the present embodiment, the teat of described frame does not contact with described fingerprint sensor, between described frame and described fingerprint sensor, has the gap of certain distance.Corresponding, described in 404, in described frame, pour into encapsulating material, specifically can comprise:
By the gap between teat and the described fingerprint sensor of described frame, in described frame, pour into encapsulating material.
The height of described teat can be higher than the upper surface of described fingerprint sensor in the present embodiment, and corresponding described the first packed layer forming covers the upper surface of described fingerprint sensor; Or the height of described teat is not higher than the upper surface of described fingerprint sensor, corresponding, described the first packed layer will not cover the upper surface of described fingerprint sensor.
Optional again, as the another kind of embodiment of the present embodiment, on the sidewall of described frame, possesses fill orifice, the teat of described frame extends the described fingerprint sensor of contact, concrete, described teat can just contact the edge of described fingerprint sensor, also can cover the subregion of described fingerprint sensor upper surface, and the teat of described frame and described fingerprint sensor form enclosed construction.Corresponding, described in 404, in described frame, pour into encapsulating material, specifically can comprise:
By described fill orifice, in described frame, pour into encapsulating material.
In actual applications, described fingerprint recognition module also comprises the capacitance resistance being arranged on substrate conventionally, concrete, and it is nearer that capacitance resistance and fingerprint sensing element lean on, and its voltage stabilizing, filter effect are better, and the image effect collecting is better.Corresponding, in order to realize this capacitance-resistance encapsulation, optional, described method can also comprise: on described substrate, mould is set, described mould surrounds described frame, and does not contact described frame; Utilize described mould, form the second packed layer being filled between described frame and described mould; Remove described mould.Concrete, described capacitance resistance can, between described mould and described frame, be embedded in described the second packed layer, thereby encapsulates described capacitance resistance by described the second packed layer.
The fingerprint recognition module making method that the present embodiment provides, can utilize frame to carry out the perfusion of capsulation material, forms packed layer, without being set, mould can form packed layer, and follow-uply effectively simplify preparation technology's flow process of fingerprint recognition module also without removing mould, improved preparation efficiency.And the teat of described frame can be fixed the structure of described packed layer and inner encapsulation thereof more effectively, improve device reliability.
Finally it should be noted that: above each embodiment, only in order to technical scheme of the present invention to be described, is not intended to limit; Although the present invention is had been described in detail with reference to aforementioned each embodiment, those of ordinary skill in the art is to be understood that: its technical scheme that still can record aforementioned each embodiment is modified, or some or all of technical characterictic is wherein equal to replacement; And these amendments or replacement do not make the essence of appropriate technical solution depart from the scope of various embodiments of the present invention technical scheme.
Claims (15)
1. a fingerprint recognition module, is characterized in that, comprising: substrate, be positioned at frame on described substrate, be positioned at the fingerprint sensor of described frame and be filled in the first packed layer of described frame;
Described fingerprint sensor is electrically connected with described substrate;
Described the first packed layer wraps up described fingerprint sensor;
Described frame possesses teat, and described teat covers the predeterminable area of described the first packed layer upper surface.
2. fingerprint recognition module according to claim 1, is characterized in that, described the first packed layer is thermosetting material.
3. fingerprint recognition module according to claim 1, is characterized in that, described fingerprint sensor comprises: fingerprint detection element and chip; Wherein,
Described fingerprint detection element is electrically connected with described substrate by ball grid array BGA soldered ball, and described BGA soldered ball is between described fingerprint detection element and described substrate;
Described chip is positioned at the below of described fingerprint detection element, and is attached on described fingerprint detection element, and described chip is electrically connected with described fingerprint detection element.
4. fingerprint recognition module according to claim 3, is characterized in that, the solder joint of described chip is fixedly connected by welding on the lower surface of described fingerprint detection element, and described fingerprint detection element comprises the upper surface for responding to fingerprint.
5. fingerprint recognition module according to claim 4, is characterized in that, described fingerprint recognition module also comprises: be filled in the bonding coat between described chip and described fingerprint detection element.
6. fingerprint recognition module according to claim 1, is characterized in that, described substrate comprises flexible PCB FPC or printing board PCB.
7. according to the fingerprint recognition module described in any one in claim 1-6, it is characterized in that, the teat of described frame does not contact with described fingerprint sensor.
8. according to the fingerprint recognition module described in any one in claim 1-6, it is characterized in that, on the sidewall of described frame, possess fill orifice, the teat of described frame extends the described fingerprint sensor of contact.
9. fingerprint recognition module according to claim 1, is characterized in that, described fingerprint recognition module also comprises:
Be positioned at the second packed layer on described substrate, described the second packed layer surrounds described frame.
10. a fingerprint recognition module making method, is characterized in that, comprising:
Utilize flip-chip technique, chip is attached on the lower surface of fingerprint detection element, and described chip is electrically connected to described fingerprint detection element, to form fingerprint sensor, described fingerprint detection element comprises the upper surface for responding to fingerprint;
Substrate is provided, described fingerprint sensor is electrically connected to described substrate;
Make frame, described frame possesses teat, and described frame is fixedly installed on described substrate, so that described fingerprint sensor is positioned at described frame;
In described frame, pour into encapsulating material, to form the first packed layer being filled in described frame, described the first packed layer wraps up described fingerprint sensor, and described teat covers the predeterminable area of described packed layer upper surface.
11. methods according to claim 10, is characterized in that, described the first packed layer is thermosetting material.
12. methods according to claim 10, is characterized in that, described described fingerprint sensor are electrically connected to described substrate, comprising:
By ball grid array BGA soldered ball, described bio-identification detecting element is electrically connected with described substrate, described BGA soldered ball is between described bio-identification detecting element and described substrate.
13. according to the method described in any one in claim 10-12, it is characterized in that, the teat of described frame does not contact with described fingerprint sensor; Describedly in described frame, pour into encapsulating material, comprising:
By the gap between teat and the described fingerprint sensor of described frame, in described frame, pour into encapsulating material.
14. according to the method described in any one in claim 10-12, it is characterized in that possessing fill orifice on the sidewall of described frame, and the teat of described frame extends the described fingerprint sensor of contact; Describedly in described frame, pour into encapsulating material, comprising:
By described fill orifice, in described frame, pour into encapsulating material.
15. methods according to claim 10, is characterized in that, described method also comprises:
On described substrate, mould is set, described mould surrounds described frame, and does not contact described frame;
Utilize described mould, form the second packed layer being filled between described frame and described mould;
Remove described mould.
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| CN201410425248.2A CN104182738A (en) | 2014-08-26 | 2014-08-26 | Fingerprint identification module and manufacturing method thereof |
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| CN201410425248.2A CN104182738A (en) | 2014-08-26 | 2014-08-26 | Fingerprint identification module and manufacturing method thereof |
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Cited By (20)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104615981A (en) * | 2015-01-27 | 2015-05-13 | 华进半导体封装先导技术研发中心有限公司 | Fingerprint identification module structure and manufacture method thereof |
| CN104743508A (en) * | 2015-04-16 | 2015-07-01 | 歌尔声学股份有限公司 | Packaging method and packaging structure for module comprising sensor unit |
| CN104766830A (en) * | 2015-04-02 | 2015-07-08 | 南昌欧菲生物识别技术有限公司 | Fingerprint sensor packaging structure, packaging method and electronic equipment |
| CN104779221A (en) * | 2015-04-08 | 2015-07-15 | 南昌欧菲生物识别技术有限公司 | Fingerprint identification module packaging structure, method for preparing fingerprint identification module packaging structure as well as electronic equipment |
| CN104933400A (en) * | 2015-03-26 | 2015-09-23 | 南昌欧菲生物识别技术有限公司 | Fingerprint identification module, manufacturing method thereof and fingerprint sensing device |
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| CN105740754A (en) * | 2014-12-12 | 2016-07-06 | 联想(北京)有限公司 | Fingerprint acquisition module set, manufacturing method and electronic device |
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| CN104615981A (en) * | 2015-01-27 | 2015-05-13 | 华进半导体封装先导技术研发中心有限公司 | Fingerprint identification module structure and manufacture method thereof |
| CN104933400A (en) * | 2015-03-26 | 2015-09-23 | 南昌欧菲生物识别技术有限公司 | Fingerprint identification module, manufacturing method thereof and fingerprint sensing device |
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| CN104779221A (en) * | 2015-04-08 | 2015-07-15 | 南昌欧菲生物识别技术有限公司 | Fingerprint identification module packaging structure, method for preparing fingerprint identification module packaging structure as well as electronic equipment |
| CN104743508A (en) * | 2015-04-16 | 2015-07-01 | 歌尔声学股份有限公司 | Packaging method and packaging structure for module comprising sensor unit |
| CN110739275A (en) * | 2015-05-12 | 2020-01-31 | 艾马克科技公司 | Fingerprint sensor and manufacturing method thereof |
| WO2017035765A1 (en) * | 2015-09-01 | 2017-03-09 | Shanghai Oxi Technology Co., Ltd | Fingerprint imaging device structure and method for packaging the same |
| CN105260707A (en) * | 2015-09-17 | 2016-01-20 | 南昌欧菲生物识别技术有限公司 | Fingerprint sensor module and electronic device |
| CN105488474A (en) * | 2015-11-30 | 2016-04-13 | 信利光电股份有限公司 | Fingerprint detection module, manufacturing method thereof and electronic device |
| CN105448859A (en) * | 2015-12-11 | 2016-03-30 | 华天科技（西安）有限公司 | Packaging part provided with glass cover board on chip and manufacturing method thereof |
| CN109727935A (en) * | 2016-04-08 | 2019-05-07 | Oppo广东移动通信有限公司 | A kind of chip-packaging structure, terminal device and method |
| CN105913012A (en) * | 2016-04-08 | 2016-08-31 | 广东欧珀移动通信有限公司 | Fingerprint module group, mobile terminal and fingerprint module group manufacture method |
| CN107765107A (en) * | 2016-08-18 | 2018-03-06 | 苏州迈瑞微电子有限公司 | Fingerprint recognition module sensitivity test tool and method of testing |
| CN107765107B (en) * | 2016-08-18 | 2023-09-15 | 苏州迈瑞微电子有限公司 | Fingerprint identification module sensitivity test fixture and test method |
| CN107292226A (en) * | 2017-04-24 | 2017-10-24 | 麦克思商务咨询(深圳)有限公司 | Fingerprint identification device and electronic installation |
| WO2018195870A1 (en) * | 2017-04-27 | 2018-11-01 | 深圳市汇顶科技股份有限公司 | Biological identification module and mobile terminal |
| US10643047B2 (en) | 2017-04-27 | 2020-05-05 | Shenzhen GOODIX Technology Co., Ltd. | Biometric module and mobile terminal |
| TWI680544B (en) * | 2017-05-19 | 2019-12-21 | 致伸科技股份有限公司 | Fingerprint identification module and manufacturing method thereof |
| CN109670372A (en) * | 2017-10-13 | 2019-04-23 | 南昌欧菲生物识别技术有限公司 | Fingerprint mould group |
| CN108764104A (en) * | 2018-05-22 | 2018-11-06 | 宇龙计算机通信科技(深圳)有限公司 | A kind of fingerprint recognition component and mobile terminal |
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Application publication date: 20141203 |