CN106489194B - 基板传送机械手终端受动器 - Google Patents

基板传送机械手终端受动器 Download PDF

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Publication number
CN106489194B
CN106489194B CN201580036350.6A CN201580036350A CN106489194B CN 106489194 B CN106489194 B CN 106489194B CN 201580036350 A CN201580036350 A CN 201580036350A CN 106489194 B CN106489194 B CN 106489194B
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China
Prior art keywords
substrate
contact surface
contact
support member
angle
Prior art date
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CN201580036350.6A
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English (en)
Chinese (zh)
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CN106489194A (zh
Inventor
普及特·阿咖瓦
丹尼尔·格林伯格
徐松文
杰弗里·布罗丁
史蒂芬·V·桑索尼
格伦·莫里
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Applied Materials Inc
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Applied Materials Inc
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Publication date
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Priority to CN201811152281.7A priority Critical patent/CN109727900B/zh
Publication of CN106489194A publication Critical patent/CN106489194A/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/36—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations using air tracks
    • H10P72/3602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations using air tracks with angular orientation of the workpieces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/38—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations with angular orientation of workpieces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Manipulator (AREA)
CN201580036350.6A 2014-07-03 2015-06-05 基板传送机械手终端受动器 Active CN106489194B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201811152281.7A CN109727900B (zh) 2014-07-03 2015-06-05 基板传送机械手终端受动器

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201462020769P 2014-07-03 2014-07-03
US62/020,769 2014-07-03
US14/476,224 US9425076B2 (en) 2014-07-03 2014-09-03 Substrate transfer robot end effector
US14/476,224 2014-09-03
PCT/US2015/034333 WO2016003598A1 (en) 2014-07-03 2015-06-05 Substrate transfer robot end effector

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN201811152281.7A Division CN109727900B (zh) 2014-07-03 2015-06-05 基板传送机械手终端受动器

Publications (2)

Publication Number Publication Date
CN106489194A CN106489194A (zh) 2017-03-08
CN106489194B true CN106489194B (zh) 2020-12-04

Family

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Family Applications (2)

Application Number Title Priority Date Filing Date
CN201580036350.6A Active CN106489194B (zh) 2014-07-03 2015-06-05 基板传送机械手终端受动器
CN201811152281.7A Active CN109727900B (zh) 2014-07-03 2015-06-05 基板传送机械手终端受动器

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Application Number Title Priority Date Filing Date
CN201811152281.7A Active CN109727900B (zh) 2014-07-03 2015-06-05 基板传送机械手终端受动器

Country Status (9)

Country Link
US (1) US9425076B2 (https=)
EP (1) EP3164883A4 (https=)
JP (2) JP2017522738A (https=)
KR (1) KR102509442B1 (https=)
CN (2) CN106489194B (https=)
IL (1) IL249505A0 (https=)
SG (1) SG11201610314UA (https=)
TW (1) TWI628738B (https=)
WO (1) WO2016003598A1 (https=)

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US10312127B2 (en) 2013-09-16 2019-06-04 Applied Materials, Inc. Compliant robot blade for defect reduction
US9536329B2 (en) * 2014-05-30 2017-01-03 Adobe Systems Incorporated Method and apparatus for performing sentiment analysis based on user reactions to displayable content
JP6276317B2 (ja) * 2016-03-31 2018-02-07 平田機工株式会社 ハンドユニットおよび移載方法
US10090188B2 (en) * 2016-05-05 2018-10-02 Applied Materials, Inc. Robot subassemblies, end effector assemblies, and methods with reduced cracking
JP6757646B2 (ja) * 2016-10-27 2020-09-23 川崎重工業株式会社 基板把持ハンド及びそれを備える基板搬送装置
US10781056B2 (en) 2016-12-22 2020-09-22 General Electric Company Adaptive apparatus and system for automated handling of components
US10773902B2 (en) 2016-12-22 2020-09-15 General Electric Company Adaptive apparatus and system for automated handling of components
USD822735S1 (en) * 2017-03-17 2018-07-10 Donald Dimattia, Jr. Positionable end effector link
US10399231B2 (en) * 2017-05-22 2019-09-03 Taiwan Semiconductor Manufacturing Company, Ltd. Substrate handling contacts and methods
EP3867047B1 (en) 2018-10-15 2024-11-27 General Electric Company System and methods of automated film removal
US11600580B2 (en) 2019-02-27 2023-03-07 Applied Materials, Inc. Replaceable end effector contact pads, end effectors, and maintenance methods
JP7415782B2 (ja) * 2020-05-11 2024-01-17 東京エレクトロン株式会社 基板搬送機構及び基板搬送方法
US20220063113A1 (en) * 2020-08-26 2022-03-03 WaferPath, Inc. Protective cap for a robot end effector
CN112060116B (zh) * 2020-09-02 2021-08-24 深圳市大族富创得科技有限公司 一种搬运机器人
JP7580333B2 (ja) * 2021-05-12 2024-11-11 三菱電機株式会社 ウエハハンド、半導体製造装置、および半導体装置の製造方法

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EP1063683A2 (en) * 1999-06-03 2000-12-27 Applied Materials, Inc. Robot blade for semiconductor processing equipment
US20040113444A1 (en) * 2002-12-17 2004-06-17 Blonigan Wendell T. End effector assembly
JP2004235234A (ja) * 2003-01-28 2004-08-19 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP2004266202A (ja) * 2003-03-04 2004-09-24 Daihen Corp ワークピースの保持機構
US7048316B1 (en) * 2002-07-12 2006-05-23 Novellus Systems, Inc. Compound angled pad end-effector
US20120049555A1 (en) * 2008-02-06 2012-03-01 Yoshinori Fujii Robot hand for substrate transfer

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EP1063683A2 (en) * 1999-06-03 2000-12-27 Applied Materials, Inc. Robot blade for semiconductor processing equipment
US7048316B1 (en) * 2002-07-12 2006-05-23 Novellus Systems, Inc. Compound angled pad end-effector
US20040113444A1 (en) * 2002-12-17 2004-06-17 Blonigan Wendell T. End effector assembly
JP2004235234A (ja) * 2003-01-28 2004-08-19 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP2004266202A (ja) * 2003-03-04 2004-09-24 Daihen Corp ワークピースの保持機構
US20120049555A1 (en) * 2008-02-06 2012-03-01 Yoshinori Fujii Robot hand for substrate transfer

Also Published As

Publication number Publication date
CN109727900A (zh) 2019-05-07
IL249505A0 (en) 2017-02-28
US20160005638A1 (en) 2016-01-07
WO2016003598A1 (en) 2016-01-07
CN109727900B (zh) 2023-05-09
CN106489194A (zh) 2017-03-08
EP3164883A4 (en) 2018-08-01
US9425076B2 (en) 2016-08-23
TWI628738B (zh) 2018-07-01
TW201608671A (zh) 2016-03-01
EP3164883A1 (en) 2017-05-10
KR20170026595A (ko) 2017-03-08
JP2017522738A (ja) 2017-08-10
JP7169334B2 (ja) 2022-11-10
SG11201610314UA (en) 2017-01-27
JP2021048406A (ja) 2021-03-25
KR102509442B1 (ko) 2023-03-10

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