CN106432725B - 聚酰胺酰亚胺树脂及其制造方法、热硬化性树脂组合物及其硬化物 - Google Patents

聚酰胺酰亚胺树脂及其制造方法、热硬化性树脂组合物及其硬化物 Download PDF

Info

Publication number
CN106432725B
CN106432725B CN201610626304.8A CN201610626304A CN106432725B CN 106432725 B CN106432725 B CN 106432725B CN 201610626304 A CN201610626304 A CN 201610626304A CN 106432725 B CN106432725 B CN 106432725B
Authority
CN
China
Prior art keywords
polyamide
acid
imide resin
imide
diamines
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201610626304.8A
Other languages
English (en)
Chinese (zh)
Other versions
CN106432725A (zh
Inventor
恩田真司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Air Water Inc
Taiyo Holdings Co Ltd
Original Assignee
Taiyo Ink Mfg Co Ltd
Air Water Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Ink Mfg Co Ltd, Air Water Inc filed Critical Taiyo Ink Mfg Co Ltd
Publication of CN106432725A publication Critical patent/CN106432725A/zh
Application granted granted Critical
Publication of CN106432725B publication Critical patent/CN106432725B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/14Polyamide-imides
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003Preparatory processes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003Preparatory processes
    • C08G73/1035Preparatory processes from tetracarboxylic acids or derivatives and diisocyanates
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00Properties
    • C08L2201/08Stabilised against heat, light or radiation or oxydation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
CN201610626304.8A 2015-08-12 2016-08-02 聚酰胺酰亚胺树脂及其制造方法、热硬化性树脂组合物及其硬化物 Active CN106432725B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015159407A JP5934419B1 (ja) 2015-08-12 2015-08-12 ポリアミドイミド樹脂、熱硬化性樹脂組成物、当該熱硬化性樹脂組成物の硬化物およびポリアミドイミド樹脂の製造方法
JP2015-159407 2015-08-12

Publications (2)

Publication Number Publication Date
CN106432725A CN106432725A (zh) 2017-02-22
CN106432725B true CN106432725B (zh) 2018-03-27

Family

ID=56120517

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610626304.8A Active CN106432725B (zh) 2015-08-12 2016-08-02 聚酰胺酰亚胺树脂及其制造方法、热硬化性树脂组合物及其硬化物

Country Status (4)

Country Link
JP (1) JP5934419B1 (ko)
KR (1) KR101713996B1 (ko)
CN (1) CN106432725B (ko)
TW (1) TWI574998B (ko)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016171101A1 (ja) * 2015-04-20 2016-10-27 宇部興産株式会社 ポリイミド、硬化性樹脂組成物、硬化物
CN108693702A (zh) * 2017-03-31 2018-10-23 太阳油墨制造株式会社 固化性树脂组合物、层叠结构体、其固化物和电子部件
JP6869078B2 (ja) * 2017-03-31 2021-05-12 太陽インキ製造株式会社 硬化性樹脂組成物、積層構造体、その硬化物、および電子部品
GB2561907A (en) * 2017-04-28 2018-10-31 Mahle Int Gmbh Bearing material, bearing and method
JP7205335B2 (ja) * 2018-03-28 2023-01-17 荒川化学工業株式会社 ポリイミド、接着剤、架橋剤、フィルム状接着材、接着層、接着シート、樹脂付銅箔、銅張積層板、プリント配線板、並びに多層配線板及びその製造方法
JP2020086387A (ja) * 2018-11-30 2020-06-04 太陽インキ製造株式会社 感光性熱硬化性樹脂組成物、ドライフィルムおよびプリント配線板
WO2020158360A1 (ja) * 2019-01-29 2020-08-06 東洋紡株式会社 ダイマージオール共重合ポリイミドウレタン樹脂を含む接着剤組成物
CN114364718A (zh) * 2019-09-09 2022-04-15 索尔维特殊聚合物美国有限责任公司 聚酰胺-酰亚胺聚合物及其制造方法
CN111333841A (zh) * 2020-03-20 2020-06-26 住井工业(湖南)有限公司 聚酰胺酰亚胺树脂、绝缘皮膜、绝缘电线、线圈及电动机
CN111574923A (zh) * 2020-05-28 2020-08-25 苏州东特绝缘科技有限公司 聚酰胺酰亚胺绝缘涂料及其制备方法
JP6981522B1 (ja) * 2020-12-15 2021-12-15 東洋インキScホールディングス株式会社 熱硬化性樹脂組成物、およびその利用
US11964730B2 (en) 2021-05-22 2024-04-23 Sram, Llc Controller indication
WO2023276093A1 (ja) * 2021-06-30 2023-01-05 昭和電工マテリアルズ株式会社 樹脂組成物、半導体装置の製造方法
JP2023177415A (ja) * 2022-06-02 2023-12-14 株式会社レゾナック ポリアミドイミド及びポリアミドイミドフィルム

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5157097A (en) * 1990-08-23 1992-10-20 Mitsui Toatsu Chemicals, Incorporated Polyamide-imide resins and production thereof
JP4792626B2 (ja) 2000-09-14 2011-10-12 東洋紡績株式会社 アルカリ可溶性ポリアミドイミド共重合体
JP5176128B2 (ja) * 2006-04-14 2013-04-03 日立化成株式会社 ポリアミドイミド樹脂及びその製造方法、並びに、このポリアミドイミド樹脂を含む樹脂組成物
US8956732B2 (en) * 2006-10-04 2015-02-17 Hitachi Chemical Company, Ltd. Polyamideimide resin, adhesive agent, material for flexible substrate, flexible laminate, and flexible print wiring board
JP5732815B2 (ja) * 2009-10-30 2015-06-10 日立化成株式会社 感光性接着剤組成物、並びにそれを用いたフィルム状接着剤、接着シート、接着剤パターン、接着剤層付半導体ウェハ、接着剤層付透明基板、及び半導体装置。
JP2012098470A (ja) 2010-11-01 2012-05-24 Kaneka Corp 新規な感光性樹脂組成物及びその利用
JP2012224703A (ja) 2011-04-18 2012-11-15 Hitachi Chemical Co Ltd ポリアミドイミド樹脂、その製造方法、熱硬化性樹脂組成物、絶縁塗料及び絶縁電線

Also Published As

Publication number Publication date
CN106432725A (zh) 2017-02-22
KR101713996B1 (ko) 2017-03-07
JP2017036407A (ja) 2017-02-16
JP5934419B1 (ja) 2016-06-15
TW201706335A (zh) 2017-02-16
KR20170020220A (ko) 2017-02-22
TWI574998B (zh) 2017-03-21

Similar Documents

Publication Publication Date Title
CN106432725B (zh) 聚酰胺酰亚胺树脂及其制造方法、热硬化性树脂组合物及其硬化物
CN101133096B (zh) 含羧基的聚氨酯和使用其的热固性树脂组合物
CN110343241A (zh) 热硬化性树脂组合物、接着性片、硬化物及印刷配线板
KR101276986B1 (ko) (폴리)카르보네이트 폴리올 및 상기 (폴리)카르보네이트 폴리올을 원료로 하는 카르복실기 함유 폴리우레탄
TWI495662B (zh) Thermosetting composition for protective film of wiring board
CN102171263A (zh) 聚酰胺酰亚胺树脂、该树脂组合物、阻燃性粘合剂组合物以及由该组合物构成的粘合剂片、覆盖薄膜和印制线路板
TW201107418A (en) Resin composition, cured product, and circuit board using same
TW201012867A (en) Resin composition for forming the adhesive layers of a multi-layer flexible printed circuit board
JP3928329B2 (ja) ポリアミドイミド樹脂組成物及び被膜形成材
TW201038696A (en) Adhesive resin composition, laminate using it, and flexible-printed-circuit-board
JP6869078B2 (ja) 硬化性樹脂組成物、積層構造体、その硬化物、および電子部品
KR20100059812A (ko) 반도체 장치용 프라이머 수지 및 반도체 장치
CN107709462A (zh) 含有二聚体的聚酰胺树脂及其树脂组合物
TWI424004B (zh) Polyimide silicone resin and thermosetting composition containing the same
JP5573573B2 (ja) 樹脂組成物、プリプレグ、樹脂付き金属箔、接着フィルム及び金属箔張り積層板
JP4258589B2 (ja) 硬化性組成物
CN104974345B (zh) 聚酰胺酰亚胺树脂及该聚酰胺酰亚胺树脂的制造方法
JP5505240B2 (ja) ポリアミドイミド樹脂及びその製造方法
TWI631180B (zh) 熱硬化性樹脂組成物、接著性片、硬化物及印刷配線板
JP2004182792A (ja) ポリアミドイミド樹脂及びそれを用いた接着剤組成物
JP6168005B2 (ja) 電装部品
JP4428505B2 (ja) 芳香族ポリアミド樹脂、エポキシ樹脂組成物及びその硬化物
CN100343302C (zh) 阻燃性环氧树脂组合物及其固化物
JP5973003B2 (ja) ポリアミドイミド樹脂および当該ポリアミドイミド樹脂の製造方法、ならびに熱硬化性樹脂組成物および当該熱硬化性樹脂組成物の硬化物
JP6420171B2 (ja) ポリアミドイミド樹脂および当該ポリアミドイミド樹脂の製造方法、ならびに熱硬化性樹脂組成物および当該熱硬化性樹脂組成物の硬化物

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
TA01 Transfer of patent application right

Effective date of registration: 20170905

Address after: Hokkaido Japan

Applicant after: Air Water Inc.

Applicant after: Taiyo Ink Manufacturing Co., Ltd.

Address before: Hokkaido Japan

Applicant before: Air Water Inc.

TA01 Transfer of patent application right
GR01 Patent grant
GR01 Patent grant