CN106413972A - 对具有顶端板和底端板的多个薄金属箔层的堆进行焊接的方法 - Google Patents

对具有顶端板和底端板的多个薄金属箔层的堆进行焊接的方法 Download PDF

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CN106413972A
CN106413972A CN201480063843.4A CN201480063843A CN106413972A CN 106413972 A CN106413972 A CN 106413972A CN 201480063843 A CN201480063843 A CN 201480063843A CN 106413972 A CN106413972 A CN 106413972A
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metal foil
foil layer
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H·赵
E·J·霍夫兰
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Abstract

公开了一种利用贯穿焊接将金属箔层(16)的堆(10)焊接在一起的方法。该方法包括堆叠金属箔层(16)，将金属箔层(16)挤压或压缩在端板之间，以及将端板和压缩的金属箔层堆(10)焊接在一起。

Description

对具有顶端板和底端板的多个薄金属箔层的堆进行焊接的方法
背景技术
本公开涉及将薄金属箔层接合到一起形成接合堆的方法，该接合堆是导电性的，例如用于电化电池的电极的导电接片的堆。
堆叠板电化电池包含彼此上下堆叠的金属箔层或涂覆的金属箔层。典型地，这种堆叠的金属箔具有接片，这些接片在一共同的位置处接合在一起以形成电接触点。利用贯穿或边缘焊接工艺将金属箔接片的堆焊接在一起是困难的，因为难以在任意层之间无间隙的情况下将各层紧密地夹持在一起。层间的间隙会导致单独的层燃烧或没有完全熔化。
发明内容
本公开揭示了将金属箔层的堆焊接在一起的方法。在一个实施例中，该方法包括堆叠多个金属箔层以形成金属箔层堆，该金属箔层堆具有宽度、长度和金属箔层堆边缘；将金属箔层堆夹置在顶端板与底端板之间；将顶端板和底端板的边缘与金属箔层堆的边缘对齐并将顶端板和底端板之间的金属箔层挤压或压缩在一起；以及将金属箔层堆、顶端板和底端板焊接在一起。
在特定实施例中，端板的厚度至少为20微米。在特定的实施例中，将金属箔层堆、顶端板和底端板接在一起的焊接是贯穿焊接。在特定的实施例中，贯穿焊接是激光贯穿焊接。
附图说明
图1是电极的堆的图示。
图2是电极的堆的图示，其中电极的接片被聚集。
图3是端板的平面图。
图4是端板的透视图。
图5是电极的堆的图示，其中电极的接片被聚集并且金属箔堆边缘与端板的边缘对齐。
图6是自激光接触侧的焊接的金属箔层堆的图示。
图7是自图6所示相对侧的焊接的金属箔层堆的图示。
图8是在已叠置和焊接后形成的单独电极的堆的使用的图示。
图9是夹具组件的实施例的部件的图示。
图10是包含金属箔层的堆的部分组装夹具组件的实施例的图示。
具体实施方式
图1是能够用于电化电池中的堆叠电极的图示的侧视图。电极堆10包括组合成堆的单独电极12。每个电极12包括涂覆在金属箔层16上的电极材料14。每个金属箔层16具有未涂覆电极材料的接片部分或接片18。典型地，电极堆中的每个电极12具有一接片18，该接片18预期在位置、长度、宽度和厚度上是相同的，使得当将单独的电极堆叠以形成金属箔层堆19时，所述单独的接片对齐。电极堆还可以具有隔离层或隔离物(未示出)以及第二(相反)极性(未示出)的电极，所述第二极性的电极适当地置于电极层之间，例如围绕阴极材料。隔离层可以是板、包裹物或袋子等的形式。
如图2所示，一旦电极12被堆叠，金属箔层的接片18通过将金属箔层的接片挤压或压缩到一起而聚集在一起，然后夹置在顶或第一端板20与底或第二端板22之间。图3是端板24的实施例的顶视图或平面图。如图3所示，每个端板24可具有圆边26或直角边28。参照图3和图4，每个端板具有长度30、宽度32和由端板的边缘36限定的厚度34。
参照图5，金属箔堆边缘38与端板的边缘36对齐。典型地，通过将延伸超过端板的对齐边缘的任何多余金属箔层剪掉或切掉来使端板的边缘36与箔层堆垛的边缘38对齐。将端板挤压或压缩在一起以形成压缩的金属箔层堆23，然后将端板焊接至该压缩的金属箔层堆并彼此焊接。一旦焊接，堆就成为导电性的。
图6和图7是焊接在一起并焊接到金属箔层堆23的端板20，22的图示。从图6和图7中能够看出，如由焊接标记42所显示的，贯穿焊接40(从底侧焊接)穿过底端板20、压缩的金属箔层堆和顶端板22。典型地，端板的长度30大约等于金属箔层堆23的宽度。
金属箔层能够由任意的导电性和可焊接材料制成。这些材料的示例是铜、铝、镍、钛或者它们中的任一种或包含它们中的任一种的合金。金属箔层的厚度范围从5微米至40微米，在其它实施例中，从10微米至20微米。从5微米至40微米的范围旨在包括5至40微米的范围内的任意范围或值。
在一些实施例中，金属箔层可以局部涂覆涂层，例如用于电极的活性涂层。涂层厚度范围可以从25微米至大约250微米。在其它实施例中，涂层厚度范围可以从50微米至125微米。从25微米至250微米的范围旨在包括25至250微米的范围内的任意范围或值。
涂覆的金属箔片的堆能够如所期望的包含许多层或片，只要压缩的箔层片堆和端板能够充分地焊接在一起。在特定实施例中，涂覆的铝和铜金属箔片能各自包含多达20层、多达16层或多达14层，并且范围可各自从1至20，包括1至20之间的任意范围或数量。涂覆的金属箔层的总数量范围从多达40层、多达32层或多达28层。
端板也能够由任意的导电性和可焊接材料制成。这些材料的示例是包括钛、钒、铝、镍的金属或者它们中的任一种或包含它们中的任一种的合金。在此组中，端板应当由与金属箔层和堆的金属在冶金学上相容的金属制成。典型地，端板具有至少20微米的厚度。在其它实施例中，端板具有至少20微米的厚度或者压缩金属箔层堆两倍的厚度，两者中取较小值。端板还应当确保其足够厚以便具有足够的刚性来传递夹紧或压缩力，从而在焊接前消除单独的金属箔层之间的间隙。
采用贯穿焊接将端板和压缩的金属箔层堆焊接在一起。贯穿焊接定义为“熔融通过焊接部件的整个厚度的焊接”。典型地，使用激光贯穿焊接工艺。理想的是，顶端板具有低电阻率以便提供激光能的充分耦合。例如，由镍制成或包含镍的顶端板能够用于焊接由铜金属箔层形成的金属箔层堆。底板也可以具有低电阻率，但对底端板而言不是必需的。在其他方面，底端板的要求与顶端板的要求相同。
图8是如上所述在已堆叠和焊接之后形成的单独电极的堆的典型用途的图示。电化电池组件50包括位于绝热器54内的电极堆52。该电极堆通过绝缘挡板51，例如涂覆有粘合剂的柔性衬底材料包裹或固定。在此图示中，包含电极堆的绝热器在箱盖56之上定向。电极堆具有两组端板58，59，其中每组端板都接至压缩的金属箔层堆60，62以形成焊接的金属箔层堆和端板组件61，63。馈通销64，66通过附接到端板20的附接件附接到每个焊接金属箔层堆和端板组件。每个馈通销64，66从各自的焊接端板20延伸穿过馈通孔68，70并延伸到盖的外部。如图8所示，每对焊接端板的位置对准，使得馈通销在被焊接至焊接端板时与每个馈通孔中的孔对准。
图9是用于组装金属箔层堆的夹具的部件的示例。夹具组件80包括金属箔层堆推顶组件81、带有定位销89(图10中示出)的堆叠槽88、接片收集器90、堆柱塞92和夹板94。堆推顶组件包括推顶基板82、小推顶杆84和大推顶杆86。
使用过程中，将一端板套在定位销89上，并将金属箔层堆叠在堆叠槽88中，接片通过堆叠槽中的通道83伸出。将另一端板套在定位销89上，并且置于接片堆之上。接片收集器90和堆柱塞92分别固定在定位销上、堆叠的金属箔层之上以及堆叠槽88内。
夹板94置于堆柱塞92上并紧固，这向堆柱塞和接片收集器施加载荷。在焊接前将多余的金属箔层接片材料剪掉。该带有堆叠金属箔层的夹具组件可以置于一焊接夹具上，该焊接夹具将压缩的端板和金属箔层接片与激光焊头对准。在该实施例中，将金属箔层具有图10所示定向的完全组装的夹具组件在置于焊接夹具中并然后使用激光焊接机焊接之前翻转。用于焊接的有用激光包括具有红外光谱(CO2，ND：YAG)中的波长至可见光谱(绿色激光器)中的波长的激光。激光焊接机可以是脉冲波或连续波的，只要相比于烧蚀或钻孔，能量和脉冲持续时间适于熔化金属即可。
焊接后，堆推顶组件81用于施加均匀的载荷以将焊接的堆叠金属箔层从堆叠槽中顶出。图10显示了部分组装的夹具组件，其中来自接片18的多余的接片材料从堆叠槽88的通道83延伸。

Claims (15)

1.一种方法，包括：
将多个金属箔层叠置以形成金属箔层堆，所述金属箔层堆具有宽度、长度和金属箔层堆边缘；
将所述金属箔层堆夹置在顶端板与底端板之间，每个端板都具有宽度、长度和限定边缘的厚度，每个端板的厚度为至少20微米；
将所述顶端板和所述底端板的所述边缘与所述金属箔层堆的所述边缘对齐，并且将所述顶端板与所述底端板之间的所述金属箔层挤压或压缩在一起；以及
利用贯穿焊接将所述金属箔层堆、所述顶端板和所述底端板焊接在一起。
2.根据权利要求1所述的方法，其特征在于，所述金属箔层由包括铜、铝、镍、钛或其合金的金属制成。
3.根据权利要求1或2所述的方法，其特征在于，所述端板由包括钛、钒、铝、镍或其合金的金属制成。
4.根据权利要求1或2所述的方法，其特征在于，所述金属箔层的长度大于所述金属箔层的宽度。
5.根据权利要求1或2所述的方法，其特征在于，所述顶端板和所述底端板的长度大于所述端板的宽度。
6.根据权利要求1或2所述的方法，其特征在于，进一步包括焊接所述顶端板和所述底端板的所述边缘以及所述金属箔层堆的所述边缘。
7.根据权利要求1或2所述的方法，其特征在于，进一步包括对金属箔层堆进行切割以形成金属箔层堆边缘，其中所述多个金属箔层的切割边缘对齐。
8.根据权利要求1或2所述的方法，其特征在于，所述贯穿焊接是激光贯穿焊接。
9.根据权利要求1或2所述的方法，其特征在于，所述金属箔层堆包括连接到形成电极堆的电极的电极接片的堆。
10.根据权利要求9所述的方法，其特征在于，进一步包括用绝缘挡板固定所述电极堆。
11.根据权利要求1、2或10所述的方法，其特征在于，进一步包括将馈通销附接至焊接在一起并焊接到所述金属箔层堆的所述端板。
12.根据权利要求1、2或10所述的方法，其特征在于，在将所述金属箔层堆与所述顶端板和所述底端板焊接在一起之前将所述金属箔层堆翻转。
13.根据权利要求1、2或10所述的方法，其特征在于，每个金属箔层部分涂覆有涂层。
14.根据权利要求1、2或10所述的方法，其特征在于，每个金属箔层的厚度范围从5微米至40微米。
15.根据权利要求13所述的方法，其特征在于，所述涂层的厚度范围从25微米至250微米。
CN201480063843.4A 2013-11-21 2014-10-28 对具有顶端板和底端板的多个薄金属箔层的堆进行焊接的方法 Pending CN106413972A (zh)

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