CN106365633B - 一种片式ptcr及其制备方法 - Google Patents

一种片式ptcr及其制备方法 Download PDF

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CN106365633B
CN106365633B CN201610735835.0A CN201610735835A CN106365633B CN 106365633 B CN106365633 B CN 106365633B CN 201610735835 A CN201610735835 A CN 201610735835A CN 106365633 B CN106365633 B CN 106365633B
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ptc
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ball milling
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CN106365633A (zh
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庞锦标
韩玉成
何创创
居奎
班秀峰
李程峰
周瑞山
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China Zhenhua Group Yunke Electronics Co Ltd
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Abstract

本发明提供了一种片式PTCR及其制备方法。本发明方法中,通过采用流延方式成型,并对陶瓷表面减薄抛光处理并采用薄膜溅射的方法形成电极,从而能够在升阻比和阻值不变的情况下,提高所制得PTCR的阻值精度,降低产品的尺寸;从而解决了现有技术圆片式PTCR产品尺寸过大、阻值精度低等技术问题。同时,本发明片式PTCR具有尺寸小、精度高等优点。

Description

一种片式PTCR及其制备方法
技术领域
本发明涉及非线性正温度系数(PTC)热敏陶瓷材料及元器件领域,具体而言,涉及一种片式PTCR及其制备方法。
背景技术
热敏元器件大都由正温度系数或者负温度系数热敏陶瓷材料制造而成,其工作原理是利用热敏陶瓷的电阻率随温度变化。热敏元器件包括非线性NTC(NegativeTemperature Coefficient)、非线性PTC(Positive Temperature Coefficient)、线性NTC以及线性PTC四种。
非线性PTC热敏陶瓷材料是指在某一温度范围内电阻率基本不变化,但是当温度达到陶瓷材料的居里温度点附近时,陶瓷的电阻率会在较小的温度范围内发生突变,电阻率增大至103~109数量级的材料。因此,由这种材料所制成的非线性正温度系数热敏电阻器(PTCR)在加热、温度补偿、限流的等方面均有广泛应用。
到目前为止,投入实际应用的非线性PTC陶瓷材料主要是钛酸钡,通过添加施主、受主元素和其他添加剂,进而形成钛酸钡半导化及晶界势垒,并在居里点处电阻率发生突变。由于碳酸钡陶瓷烧结温度很高,且电极匹配困难,一般电极材料与其接触都会电阻过高。因此钛,酸钡体系的PTCR多为圆片式,采用造粒压片方式成型,并在烧结成瓷后,进行表面研磨,再分别印刷铝浆烧结、印刷银浆烧结。由于圆片式PTCR的厚度均一性、晶粒大小、陶瓷与铝电极的欧姆接触电阻大小等参数一般并不可控,因此,批量生产的PTCR普遍存在阻值离散度过大、产品合格率低等的缺点,而这也这极大的限制了PTC热敏陶瓷在高端领域的应用。另外,随着表面贴装技术的不断普及,电路板所用的电子元器件均趋于片式化、小型化,圆片式PTCR占据大量的安装空间,而这也大大增加了电路板的成本。因此,如何制备小型化、片式化的PTCR必然是未来的发展方向。
有鉴于此,特提出本发明。
发明内容
本发明的第一目的在于提供一种片式PTCR的制备方法,所述方法中,通过采用流延方式成型,并对陶瓷表面减薄抛光处理并采用薄膜溅射的方法形成电极,从而能够在升阻比和阻值不变的情况下,提高所制得PTCR的阻值精度,降低产品的尺寸;从而解决了现有技术圆片式PTCR产品尺寸过大、阻值精度低等技术问题。
本发明的第二目的在于提供一种本发明方法所制得的片式PTCR,本发明所制得的片式PTCR具有尺寸小、精度高等优点。
为了实现本发明的上述目的,特采用以下技术方案:
一种片式PTCR的制备方法,所述方法包括如下步骤:
(1)按照质量百分数,碳酸钡67~71%,二氧化钛28~33%,三氧化二钇0.1~0.8%,三氧化二硅0.2~1%,称取原料;
然后将原料混合后球磨;
(2)将球磨后所得混合物烘干后过筛,然后进行烧制,并得到钇掺杂钛酸钡粉体;
(3)向钇掺杂钛酸钡粉体中加入硝酸锰溶液,进行二次球磨,并加入有机溶剂和粘合剂,混合后得到流延料;
将流延料经流延成型制得PTC生瓷带,然后经叠层、等静压以及切割,得到方形PTCR巴块;
将方形PTCR巴块烧结,并得到PTC陶瓷;
将所得到的PTC陶瓷进行减薄和抛光,然后进行清洗,并得到PTC陶瓷基板;
(4)在所得PTC陶瓷基板上溅射Ni和Au,然后再电镀Au加厚电极,并进行切割,即得到本发明片式PTCR。
本发明中,通过采用流延方式成型,并对陶瓷表面减薄抛光处理并采用薄膜溅射的方法形成电极,从而能够在升阻比和阻值不变的情况下,提高所制得PTCR的阻值精度,降低产品的尺寸;同时,本发明中,通过添加SiO2作为原料,能够提高进一步烧结所制得产品的致密度;同样的,本发明中,通过过筛也能够消除由于原料比重差异所引起的分层现象;进一步的,本发明中,通过在PTC陶瓷基板上溅射Ni,能够更好的与PTC陶瓷形成欧姆接触,进而降低接触电阻。本发明方法具有操作步骤便捷,所制得的PTCR尺寸小,精度好等优点。
可选的,本发明中,所述片式PTCR为方片形结构。
可选的,本发明中,步骤(1)中所述球磨为以无水乙醇为分散剂、玛瑙为研磨球进行的球磨,其中混合原料、分散剂与玛瑙的质量克数比为(1~2):(1~2):(1~2)。
可选的,本发明中,步骤(1)中所述球磨的工频为30~50Hz,球磨的时间为4~6h;优选的,本发明中所述球磨的工频为35~40Hz,例如可以为,但不限于36、37或者39Hz等;优选的,本发明中,所述球磨的时间为4~5h。
可选的,本发明中,步骤(2)中所述烘干的温度为70~90℃,烘干的时间为9~12h;优选的,本发明中,所述烘干的温度为80~85℃,例如可以为,但不限于81、82、83或者84℃等;优选的,本发明中,所述烘干的时间为10~11h。
可选的,本发明中,所述过筛为过孔径为100目的筛子;进一步的,本发明中,在过筛前还包括将烘干后的混合物打粉的步骤。
可选的,本发明中,步骤(2)中所述烧制是在马弗炉中进行的。
可选的,本发明中,步骤(2)中所述烧制的温度为1000~1200℃,例如可以为,但不限于1050、1100或者1150℃等;烧制的保温时间为2~4h,例如可以为3h等。具体,本发明步骤(2)中,是将烘干过筛后的混合物在马弗炉中从室温逐步加热升温至1000~1200℃进行保温烧制,最后在室温下进行冷却。
可选的,本发明中,步骤(3)中所述硝酸锰溶液的质量分数为30~50%;硝酸锰溶液与钇掺杂钛酸钡粉体的质量克数比例为3:(1000~10000)。
可选的,本发明中,步骤(3)中所述有机溶剂为乙醇,甲苯、二甲苯、乙醚等中的一种或多种,所述粘合剂为PVB(聚乙烯醇缩丁醛)。
可选的,本发明中,步骤(3)中所述方形PTCR巴块烧结的温度为1250~1380℃,烧结的保温时间为0.5~3h。具体的,本发明步骤(3)中,是方形PTCR巴块在马弗炉中从室温加热逐步至1250~1380℃,然后保温烧制,最后在室温下进行冷却。
可选的,本发明中,步骤(3)中所述减薄和抛光为采用研磨机和抛光机,并对所得到的PTC陶瓷的两面进行减薄和抛光。
本发明中,通过减薄和抛光能够除去烧结成瓷的PTC陶瓷表面烧结的不致密和凹凸不平部分。
可选的,本发明中,所述清洗为超声清洗,清洗的时间为30~60min。进一步的,本发明通过PTC陶瓷进行减薄、抛光以及清洗等处理,可以得到厚度小于0.5mm,厚度精度和均匀性小于±3μm,表面粗糙度小于0.06μm的PTC陶瓷基板。
可选的,本发明中,步骤(4)所述切割为精密切割,切割的精度要求小于±5μm。同时,本发明中,还可以根据需要,通过切割得到具有不同尺寸的片式PTCR。
同时,本发明还提供了一种片式PTCR,所述片式PTCR是由本发明方法制备得到的。
可选的,本发明中,所述片式PTCR的升阻比>2×105,电阻率小于100Ω·cm。
与现有技术相比,本发明的有益效果为:
本发明中,通过改进钛酸钡体系陶瓷粉料的成型工艺、表面处理、电极形成方式,从而得到了具有的片式PTCR;与现有的圆片式PTCR相比,本发明片式PTCR阻值精度大大提高,产品尺寸大幅度减小,且适合表面贴装,这对高性能热敏元器件的工业化生产具有重要实用价值。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案,以下将对实施例或现有技术描述中所需要使用的附图作简单地介绍。
图1为本发明片式PTCR制备流程图;
图2为本发明实施例1所制备的片式PTCR样品图;
图3为本发明实施例1所制备的片式PTCR样品电阻温度测试曲线图;
图4为本发明对比例1所制备的圆片式PTC陶瓷样品照片,按从左至右顺序为1#、2#和3#样品;
图5为本发明对比例所制备的圆片式PTCR电阻温度测试曲线图。
具体实施方式
下面将结合实施例对本发明的实施方案进行详细描述,但是本领域技术人员将会理解,下列实施例仅用于说明本发明,而不应视为限制本发明的范围。实施例中未注明具体条件者,按照常规条件或制造商建议的条件进行。所用试剂或仪器未注明生产厂商者,均为可以通过市售购买获得的常规产品。
实施例1
(1)配料、球磨
按以下原料配比称取各原料:碳酸钡(BaCO3)69.59克;二氧化钛(TiO2)29.77克;三氧化二钇(Y2O3)0.41克;二氧化硅(SiO2)0.48克;其中,以上原料纯度均为分析纯;
将各原料分别称重后,以无水乙醇为分散介质,玛瑙为研磨球进行球磨混合;
其中,球磨的工频为50Hz,球磨的时间为5h;同时,混合原料、分散剂与玛瑙的质量克数比为1:1:1。
(2)烘干、预烧
将球磨后的混合物在80℃条件下保温烘干10h,然后打粉过100目筛;并将过筛后的混合物放入马弗炉内进行烧制,并得到Y掺杂BaTiO3粉体,烧制的具体升温步骤如下:
(3)配置流延料
在制得的Y掺杂BaTiO3粉体中,加入90μl质量分数为50%的硝酸锰溶液,进行二次球磨混合;并按常规的流延料制备工艺加入乙醇等有机溶剂和PVB等粘合剂,并制得流延料;
(4)流延、层压
采用流延成型法,将步骤(4)中所制得的流延料通过流延机,并得到PTC生瓷带,再进行叠层、等静压及切割工序,得到方形PTCR巴块。
(5)排胶、烧结
将成型好的PTCR巴块,置入马弗炉中进行空气气氛烧结,并得到PTC陶瓷基板;其中,烧结的具体升温步骤为:
(6)减薄、抛光
用减薄机对步骤(5)中烧结成瓷的PTC陶瓷基板进行两面减薄和抛光处理,以去除样品表面烧结不致密和凹凸不平部分;再降减薄和抛光后的PTC陶瓷基板超声清洗30min,得到厚度0.3mm,厚度精度和均匀性±2μm,表面粗糙度0.04μm的陶瓷基板。
(7)金属化及产品切割
采用薄膜溅射工艺,在表面处理过的PTC陶瓷基板上溅射Ni与Au,然后再电镀Au加厚电极,最后进行精确切割,得到3×3mm(尺寸公差<0.005mm)大小的片式PTCR。
实施例1的制备流程如图1所示;实施例所制得的片式PTCR样品照片如图2所示。
实施例2
(1)配料、球磨
按以下原料配比称取各原料:碳酸钡(BaCO3)69.59克;二氧化钛(TiO2)30.25克;三氧化二钇(Y2O3)0.41克;二氧化硅(SiO2)0.48克;其中,以上原料纯度均为分析纯;
然后,按照实施例1中所述方法制备得到实施例2的片式PTCR。
实验例1电学性能测试
随机选取实施例1与实施例2所制得的片式PTCR样品,并进行样品电阻温度测试,结果如图3所示。
同时,随机选取6片实施例1与实施例2所制得的片式PTCR样品,并进行室温电阻、室温电阻率以及升阻比测试,结果如下表1与表2所示:
表1实施例1制备的片式PTCR样品电性能
其中,电阻率ρ由公式R=ρL/S计算得到,R为电阻体的阻值大小,L为电阻体的长度,S为电阻体的横截面积。
表2实施例2制备的片式PTCR样品电性能
其中,电阻率ρ由公式R=ρL/S计算得到,R为电阻体的阻值大小,L为电阻体的长度,S为电阻体的横截面积。
从表1以及表2的测试结果可以看出,本发明片式PTCR的阻值精度非常高,阻值精度<1.5%。
本发明片式PTCR阻值精度高的原因在于以下几点:首先,是对PTC陶瓷基板的厚度和表面粗糙度进行了严格控制;其次,是采用了一致性好的薄膜溅射工艺制备电极;最后,是采用精密切割方式对产品尺寸进行了严格控制。
对比例1:采用常规方法制备的圆片式PTCR
参考实施例1的方法制备得到对比例1的圆片式PTCR,其中,在对比例1中:
步骤(3)与步骤(4)分别为:对二次球磨混合物进行干燥后,添加约10%的PVA(质量分数为5%)进行造粒;
其中造粒工艺为:将PVA均匀混合后,过40目筛造粒。再采用干压成型法,通过单向、单轴压力对造好粒的颗粒进行成型;采用的成型压力为5MPa,制备的素坯片子尺寸为Φ10mm×(2.5~3.0)mm。
步骤(6)与(7)分别:对烧结好的陶瓷片,用砂纸进行两面抛光处理,去除样品表面烧结不致密部分,再进行超声波清洗30min,干燥后双面均匀涂覆Al电极。置入马弗炉中进行浆料固化烧结,铝浆烧结的升温步骤为:
对比例1所制得的圆片式PTCR样品照片如图4所示,电阻温度特性如图5所示。
同时,对对比例1所制得的圆片式PTCR进行电性能测试,结果如表2所示:
表2对比例1的圆片式PTCR样品电性能
其中,电阻率ρ由公式R=ρL/S计算得到,R为电阻体的阻值大小,L为电阻体的长度,S为电阻体的横截面积。
从表2测试结果可以看出,由常规工艺制备的圆片式PTCR升阻比与本发明实施例的测试结果相比差别不大,但是阻值精度很差、离散度大,阻值精度>10%,相比之下由本发明所提供的方法所制备的片式PTCR不仅片式化、尺寸小,还具备阻值精度高的特点。
尽管已用具体实施例来说明和描述了本发明,然而应意识到,在不背离本发明的精神和范围的情况下可以作出许多其它的更改和修改。因此,这意味着在所附权利要求中包括属于本发明范围内的所有这些变化和修改。

Claims (9)

1.一种片式PTCR的制备方法,其特征在于,所述方法包括如下步骤:
(1)按照质量百分数,碳酸钡67~71%,二氧化钛28~33%,三氧化二钇0.1~0.8%,二氧化硅0.2~1%,称取原料;然后将原料混合后球磨;
(2)将球磨后所得混合物烘干后过筛,然后进行烧制,并得到钇掺杂钛酸钡粉体;
(3)向钇掺杂钛酸钡粉体中加入硝酸锰溶液,进行二次球磨,并加入有机溶剂和粘合剂,混合后得到流延料;
将流延料经流延成型制得PTC生瓷带,然后经叠层、等静压以及切割,得到方形PTC巴块;
将方形PTC巴块烧结,并得到PTC陶瓷;
将所得到的PTC陶瓷进行减薄和抛光,然后进行清洗,并得到PTC陶瓷基板;
其中,硝酸锰溶液的质量分数为30~50%;硝酸锰溶液与钇掺杂钛酸钡粉体的质量克数比例为3:(1000~10000);
(4)在所得PTC陶瓷基板上溅射Ni和Au,然后再电镀Au加厚电极,并进行切割,即得到片式PTCR。
2.根据权利要求1所述的制备方法,其特征在于,步骤(1)中所述球磨为以无水乙醇为分散剂、玛瑙为研磨球进行的球磨,其中混合原料、分散剂与玛瑙的质量克数比为(1~2):(1~2):(1~2)。
3.根据权利要求2所述的制备方法,其特征在于,步骤(1)中所述球磨的工频为30~50Hz,球磨的时间为4~6h。
4.根据权利要求1所述的制备方法,其特征在于,步骤(2)中所述烘干的温度为70~90℃,烘干的时间为9~12h。
5.根据权利要求1所述的制备方法,其特征在于,步骤(2)中所述烧制的温度为1000~1200℃,烧制的保温时间为2~4h。
6.根据权利要求1所述的制备方法,其特征在于,步骤(3)中所述方形PTCR巴块烧结的温度为1250~1380℃,烧结的保温时间为0.5~3h。
7.根据权利要求1所述的制备方法,其特征在于,步骤(3)中所述减薄和抛光为采用研磨机和抛光机,并对所得到的PTC陶瓷的两面进行减薄和抛光。
8.一种片式PTCR,其特征在于,所述片式PTCR是由权利要求1-7中任一项所述方法制备得到的。
9.根据权利要求8所述的片式PTCR,其特征在于,所述片式PTCR的升阻比>2×105,电阻率小于100Ω·cm。
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