CN106338281B - 物理量传感器、电子设备以及移动体 - Google Patents

物理量传感器、电子设备以及移动体 Download PDF

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Publication number
CN106338281B
CN106338281B CN201610509140.0A CN201610509140A CN106338281B CN 106338281 B CN106338281 B CN 106338281B CN 201610509140 A CN201610509140 A CN 201610509140A CN 106338281 B CN106338281 B CN 106338281B
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China
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movable electrode
movable
electrode side
fixed
physical quantity
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English (en)
Chinese (zh)
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CN106338281A (zh
Inventor
木暮翔太
田中悟
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Seiko Corp
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Seiko Corp
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G01C19/5642—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using vibrating bars or beams
    • G01C19/5656—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using vibrating bars or beams the devices involving a micromechanical structure
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0228—Inertial sensors
    • B81B2201/0235—Accelerometers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/05—Type of movement
    • B81B2203/051—Translation according to an axis parallel to the substrate
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
    • G01P2015/0808—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate
    • G01P2015/0811—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate for one single degree of freedom of movement of the mass
    • G01P2015/0814—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate for one single degree of freedom of movement of the mass for translational movement of the mass, e.g. shuttle type

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Pressure Sensors (AREA)
CN201610509140.0A 2015-07-10 2016-06-30 物理量传感器、电子设备以及移动体 Active CN106338281B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015138779A JP6558110B2 (ja) 2015-07-10 2015-07-10 物理量センサー、電子機器および移動体
JP2015-138779 2015-07-10

Publications (2)

Publication Number Publication Date
CN106338281A CN106338281A (zh) 2017-01-18
CN106338281B true CN106338281B (zh) 2019-10-29

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CN201610509140.0A Active CN106338281B (zh) 2015-07-10 2016-06-30 物理量传感器、电子设备以及移动体

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US (2) US10324106B2 (enExample)
JP (1) JP6558110B2 (enExample)
CN (1) CN106338281B (enExample)

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* Cited by examiner, † Cited by third party
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JP6485260B2 (ja) * 2015-07-10 2019-03-20 セイコーエプソン株式会社 物理量センサー、物理量センサー装置、電子機器および移動体
JP2018179575A (ja) * 2017-04-05 2018-11-15 セイコーエプソン株式会社 物理量センサー、電子機器、および移動体
JP6922594B2 (ja) * 2017-09-22 2021-08-18 セイコーエプソン株式会社 物理量センサー、物理量センサーデバイス、電子機器、携帯型電子機器および移動体
JP6939475B2 (ja) * 2017-11-28 2021-09-22 セイコーエプソン株式会社 物理量センサー、物理量センサーデバイス、複合センサーデバイス、慣性計測装置、移動体測位装置、携帯型電子機器、電子機器および移動体
JP7123881B2 (ja) * 2019-08-28 2022-08-23 株式会社東芝 センサ
JP2024101653A (ja) 2023-01-18 2024-07-30 セイコーエプソン株式会社 慣性センサー、および慣性計測装置
EP4756434A1 (en) 2024-12-05 2026-06-10 Murata Manufacturing Co., Ltd. Accelerometer

Citations (3)

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CN101830426A (zh) * 2009-03-12 2010-09-15 精工爱普生株式会社 微机电传感器、其制造方法以及电子设备
CN102449488A (zh) * 2009-05-26 2012-05-09 罗伯特·博世有限公司 微机械结构
CN102530819A (zh) * 2010-12-10 2012-07-04 美商明锐光电股份有限公司 微机电系统装置及其半成品及制造方法

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DE19639946B4 (de) 1996-09-27 2006-09-21 Robert Bosch Gmbh Mikromechanisches Bauelement
JPH11230986A (ja) * 1998-02-18 1999-08-27 Denso Corp 半導体力学量センサ
US6065341A (en) 1998-02-18 2000-05-23 Denso Corporation Semiconductor physical quantity sensor with stopper portion
EP1626283B1 (en) * 2004-08-13 2011-03-23 STMicroelectronics Srl Micro-electromechanical structure, in particular accelerometer, with improved insensitivity to thermomechanical stresses
DE102007047592B4 (de) * 2007-10-05 2022-01-05 Robert Bosch Gmbh Beschleunigungssensor
DE102008001863A1 (de) * 2008-05-19 2009-11-26 Robert Bosch Gmbh Beschleunigungssensor mit umgreifender seismischer Masse
DE102008002606B4 (de) * 2008-06-24 2020-03-12 Robert Bosch Gmbh Mikromechanischer Beschleunigungssensor mit offener seismischer Masse
US8371167B2 (en) * 2008-07-29 2013-02-12 Pixart Imaging Inc. In-plane sensor, out-of-plane sensor, and method for making same
US8207586B2 (en) * 2008-09-22 2012-06-26 Alps Electric Co., Ltd. Substrate bonded MEMS sensor
JP5237733B2 (ja) 2008-09-22 2013-07-17 アルプス電気株式会社 Ｍｅｍｓセンサ
DE102009029202B4 (de) * 2009-09-04 2017-05-24 Robert Bosch Gmbh Verfahren zum Herstellen eines mikromechanischen Systems
US8610222B2 (en) * 2011-04-18 2013-12-17 Freescale Semiconductor, Inc. MEMS device with central anchor for stress isolation
EP3059595B1 (en) 2012-01-12 2018-07-04 Murata Electronics Oy Acceleration sensor structure and use thereof
JP5799942B2 (ja) * 2012-11-27 2015-10-28 株式会社村田製作所 加速度センサ
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JP2014115080A (ja) 2012-12-06 2014-06-26 Alps Electric Co Ltd 物理量センサ
JP6020392B2 (ja) * 2013-09-03 2016-11-02 株式会社デンソー 加速度センサ

Patent Citations (4)

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Publication number Priority date Publication date Assignee Title
CN101830426A (zh) * 2009-03-12 2010-09-15 精工爱普生株式会社 微机电传感器、其制造方法以及电子设备
CN102449488A (zh) * 2009-05-26 2012-05-09 罗伯特·博世有限公司 微机械结构
CN102530819A (zh) * 2010-12-10 2012-07-04 美商明锐光电股份有限公司 微机电系统装置及其半成品及制造方法
CN102530819B (zh) * 2010-12-10 2015-04-01 美商明锐光电股份有限公司 微机电系统装置及其半成品及制造方法

Also Published As

Publication number Publication date
JP2017020898A (ja) 2017-01-26
US20170010295A1 (en) 2017-01-12
US10324106B2 (en) 2019-06-18
CN106338281A (zh) 2017-01-18
US10656174B2 (en) 2020-05-19
US20190154727A1 (en) 2019-05-23
JP6558110B2 (ja) 2019-08-14

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