CN106287589A - 照明设备、形成照明设备及制造电子设备的方法和装置 - Google Patents
照明设备、形成照明设备及制造电子设备的方法和装置 Download PDFInfo
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- CN106287589A CN106287589A CN201610500213.XA CN201610500213A CN106287589A CN 106287589 A CN106287589 A CN 106287589A CN 201610500213 A CN201610500213 A CN 201610500213A CN 106287589 A CN106287589 A CN 106287589A
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/0015—Fastening arrangements intended to retain light sources
- F21V19/002—Fastening arrangements intended to retain light sources the fastening means engaging the encapsulation or the packaging of the semiconductor device
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
- F21V17/101—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening permanently, e.g. welding, gluing or riveting
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/08—Modifications for protecting switching circuit against overcurrent or overvoltage
- H03K17/082—Modifications for protecting switching circuit against overcurrent or overvoltage by feedback from the output to the control circuit
- H03K17/0828—Modifications for protecting switching circuit against overcurrent or overvoltage by feedback from the output to the control circuit in composite switches
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
- H05K1/0265—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09118—Moulded substrate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10121—Optical component, e.g. opto-electronic component
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0706—Inactivating or removing catalyst, e.g. on surface of resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0709—Catalytic ink or adhesive for electroless plating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0716—Metallic plating catalysts, e.g. for direct electroplating of through holes; Sensitising or activating metallic plating catalysts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
- H05K2203/108—Using a plurality of lasers or laser light with a plurality of wavelengths
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1131—Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivity
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Structure Of Printed Boards (AREA)
- Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202111613301.8A CN114234138A (zh) | 2015-06-29 | 2016-06-29 | 制造电子装置的方法和装置 |
Applications Claiming Priority (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201562186102P | 2015-06-29 | 2015-06-29 | |
US62/186,102 | 2015-06-29 | ||
US201562254574P | 2015-11-12 | 2015-11-12 | |
US62/254,574 | 2015-11-12 | ||
US201562256477P | 2015-11-17 | 2015-11-17 | |
US62/256,477 | 2015-11-17 | ||
US201662326539P | 2016-04-22 | 2016-04-22 | |
US62/326,539 | 2016-04-22 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202111613301.8A Division CN114234138A (zh) | 2015-06-29 | 2016-06-29 | 制造电子装置的方法和装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN106287589A true CN106287589A (zh) | 2017-01-04 |
Family
ID=57379833
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201620672647.3U Expired - Fee Related CN205746638U (zh) | 2015-06-29 | 2016-06-29 | 照明设备和装置 |
CN202111613301.8A Pending CN114234138A (zh) | 2015-06-29 | 2016-06-29 | 制造电子装置的方法和装置 |
CN201610500213.XA Pending CN106287589A (zh) | 2015-06-29 | 2016-06-29 | 照明设备、形成照明设备及制造电子设备的方法和装置 |
Family Applications Before (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201620672647.3U Expired - Fee Related CN205746638U (zh) | 2015-06-29 | 2016-06-29 | 照明设备和装置 |
CN202111613301.8A Pending CN114234138A (zh) | 2015-06-29 | 2016-06-29 | 制造电子装置的方法和装置 |
Country Status (7)
Country | Link |
---|---|
US (4) | US10433428B2 (fr) |
EP (1) | EP3314991A4 (fr) |
JP (2) | JP6742352B2 (fr) |
KR (4) | KR102282488B1 (fr) |
CN (3) | CN205746638U (fr) |
TW (1) | TWI656663B (fr) |
WO (1) | WO2017004064A1 (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113316874A (zh) * | 2019-01-22 | 2021-08-27 | 莫列斯有限公司 | 使用专用电子封装制造工艺的智能连接器及制造其的方法 |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3314991A4 (fr) | 2015-06-29 | 2019-03-27 | Molex, LLC | Systèmes, procédés et dispositifs de conditionnement d'électronique à application spécifique |
KR102215095B1 (ko) * | 2016-07-07 | 2021-02-10 | 몰렉스 엘엘씨 | 마이크로 배전 박스 및 애플리케이션 특정 전자기기 패키징 기법을 사용한 그의 제조 방법 |
CN110959231B (zh) | 2017-08-16 | 2021-04-09 | 莫列斯有限公司 | 电连接器组件 |
WO2021173693A1 (fr) * | 2020-02-26 | 2021-09-02 | Ticona Llc | Dispositif électronique |
WO2021173412A1 (fr) | 2020-02-26 | 2021-09-02 | Ticona Llc | Structure de circuit |
EP4110610A4 (fr) | 2020-02-26 | 2024-03-27 | Ticona Llc | Composition polymère pour dispositif électronique |
CN115151607A (zh) * | 2020-02-26 | 2022-10-04 | 提克纳有限责任公司 | 电子器件 |
US11728065B2 (en) | 2020-07-28 | 2023-08-15 | Ticona Llc | Molded interconnect device |
CN117981478A (zh) * | 2021-09-22 | 2024-05-03 | Ksr Ip控股有限责任公司 | 具有多层不同类型包覆材料的踏板组件 |
WO2023170533A1 (fr) * | 2022-03-07 | 2023-09-14 | Molex, Llc | Connecteur électrique pour coupler des conducteurs à un composant électronique |
Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2290912A (en) * | 1994-06-28 | 1996-01-10 | Honda Motor Co Ltd | Wiring board |
JPH09274121A (ja) * | 1996-04-02 | 1997-10-21 | Shinko Electric Ind Co Ltd | 光用半導体装置とその製造方法 |
JPH11176966A (ja) * | 1997-12-10 | 1999-07-02 | Hitachi Ltd | 半導体素子収納パッケージ |
JP2007071980A (ja) * | 2005-09-05 | 2007-03-22 | Mitsubishi Electric Corp | 光モジュール |
JP2007273533A (ja) * | 2006-03-30 | 2007-10-18 | Sumitomo Heavy Ind Ltd | 導電パターンの形成方法及び形成装置 |
KR100937136B1 (ko) * | 2007-12-24 | 2010-01-18 | (주)루미브라이트 | 복수의 패키지를 모듈화한 리드프레임을 이용한 발광다이오드 모듈 |
CN202012788U (zh) * | 2011-04-28 | 2011-10-19 | 东莞勤上光电股份有限公司 | 一种led照明设备 |
CN102236820A (zh) * | 2010-04-27 | 2011-11-09 | 上海长丰智能卡有限公司 | 一种带负载电容的微型射频模块及其封装方法 |
US20120043660A1 (en) * | 2010-08-17 | 2012-02-23 | National Semiconductor Corporation | Thin foil semiconductor package |
CN102378490A (zh) * | 2010-08-06 | 2012-03-14 | 日东电工株式会社 | 布线电路基板集合体片及其制造方法 |
CN103426776A (zh) * | 2013-07-09 | 2013-12-04 | 上海百嘉电子有限公司 | 智能卡载带的制造方法 |
TW201401951A (zh) * | 2012-06-19 | 2014-01-01 | Taiyo Holdings Co Ltd | 印刷配線板之電路形成方法,熱硬化性樹脂組成物,及印刷配線板 |
Family Cites Families (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4689103A (en) * | 1985-11-18 | 1987-08-25 | E. I. Du Pont De Nemours And Company | Method of manufacturing injection molded printed circuit boards in a common planar array |
US4954872A (en) * | 1988-04-29 | 1990-09-04 | Altair International, Inc. | Electrical contact stabilizer assembly |
US5283717A (en) * | 1992-12-04 | 1994-02-01 | Sgs-Thomson Microelectronics, Inc. | Circuit assembly having interposer lead frame |
DE19535777A1 (de) | 1995-09-26 | 1997-03-27 | Siemens Ag | Optoelektronisches Halbleiter-Bauelement und Verfahren zur Herstellung |
DE19623826C2 (de) * | 1996-06-14 | 2000-06-15 | Siemens Ag | Verfahren zur Herstellung eines Trägerelements für Halbleiterchips |
JPH11195851A (ja) * | 1997-12-26 | 1999-07-21 | Hitachi Cable Ltd | 成形基板 |
JP3675364B2 (ja) * | 2001-05-30 | 2005-07-27 | ソニー株式会社 | 半導体装置用基板その製造方法および半導体装置 |
US6664615B1 (en) | 2001-11-20 | 2003-12-16 | National Semiconductor Corporation | Method and apparatus for lead-frame based grid array IC packaging |
KR100623867B1 (ko) * | 2004-12-31 | 2006-09-14 | 동부일렉트로닉스 주식회사 | 반도체 회로기판의 레이아웃 방법 |
WO2007002644A2 (fr) * | 2005-06-27 | 2007-01-04 | Lamina Lighting, Inc. | Ensemble diode electroluminescente et procede de fabrication |
JP4549939B2 (ja) * | 2005-06-28 | 2010-09-22 | 日東電工株式会社 | 配線回路基板保持シート |
US7341365B2 (en) * | 2005-12-16 | 2008-03-11 | Ford Global Technologies, Llc | LED unit for a vehicle lamp assembly |
US8624129B2 (en) * | 2006-01-12 | 2014-01-07 | Samsung Electronics Co., Ltd. | Method of attaching a high power surface mount transistor to a printed circuit board |
US7763478B2 (en) * | 2006-08-21 | 2010-07-27 | Cree, Inc. | Methods of forming semiconductor light emitting device packages by liquid injection molding |
US7592691B2 (en) * | 2006-09-01 | 2009-09-22 | Micron Technology, Inc. | High density stacked die assemblies, structures incorporated therein and methods of fabricating the assemblies |
JP2008263118A (ja) * | 2007-04-13 | 2008-10-30 | Nec Lighting Ltd | 発光デバイス |
US7836586B2 (en) | 2008-08-21 | 2010-11-23 | National Semiconductor Corporation | Thin foil semiconductor package |
JP2010140820A (ja) * | 2008-12-12 | 2010-06-24 | Toshiba Corp | 灯具、配線基板及び配線基板の製造方法 |
US8021919B2 (en) * | 2009-03-31 | 2011-09-20 | Infineon Technologies Ag | Method of manufacturing a semiconductor device |
US7955873B2 (en) * | 2009-03-31 | 2011-06-07 | Infineon Technologies Ag | Method of fabricating a semiconductor device |
CN103747994A (zh) | 2011-09-05 | 2014-04-23 | 本田技研工业株式会社 | 混合动力车辆的控制装置和控制方法 |
CN103294249B (zh) * | 2012-08-17 | 2016-05-18 | 上海天马微电子有限公司 | 触摸屏的制造方法 |
US9829159B2 (en) | 2013-08-23 | 2017-11-28 | Molex, Llc | LED module |
US9318411B2 (en) * | 2013-11-13 | 2016-04-19 | Brodge Semiconductor Corporation | Semiconductor package with package-on-package stacking capability and method of manufacturing the same |
CN104851812B (zh) * | 2014-02-19 | 2017-10-20 | 钰桥半导体股份有限公司 | 半导体元件及其制作方法 |
US9733304B2 (en) * | 2014-09-24 | 2017-08-15 | Micron Technology, Inc. | Semiconductor device test apparatuses |
US9252337B1 (en) * | 2014-12-22 | 2016-02-02 | Bridgelux, Inc. | Composite substrate for light emitting diodes |
TW201626531A (zh) * | 2015-01-14 | 2016-07-16 | 鈺橋半導體股份有限公司 | 中介層嵌置於加強層中之線路板及其製作方法 |
EP3314991A4 (fr) | 2015-06-29 | 2019-03-27 | Molex, LLC | Systèmes, procédés et dispositifs de conditionnement d'électronique à application spécifique |
-
2016
- 2016-06-28 EP EP16818608.8A patent/EP3314991A4/fr active Pending
- 2016-06-28 KR KR1020207022507A patent/KR102282488B1/ko active IP Right Grant
- 2016-06-28 KR KR1020227029996A patent/KR102625466B1/ko active IP Right Grant
- 2016-06-28 US US15/737,935 patent/US10433428B2/en active Active
- 2016-06-28 JP JP2017568255A patent/JP6742352B2/ja active Active
- 2016-06-28 WO PCT/US2016/039860 patent/WO2017004064A1/fr active Application Filing
- 2016-06-28 KR KR1020217023239A patent/KR102439790B1/ko active IP Right Grant
- 2016-06-28 KR KR1020187002708A patent/KR102143400B1/ko active IP Right Grant
- 2016-06-29 CN CN201620672647.3U patent/CN205746638U/zh not_active Expired - Fee Related
- 2016-06-29 TW TW105120444A patent/TWI656663B/zh active
- 2016-06-29 CN CN202111613301.8A patent/CN114234138A/zh active Pending
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-
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- 2019-09-24 US US16/579,890 patent/US10667407B2/en active Active
-
2020
- 2020-04-21 JP JP2020075175A patent/JP7127083B2/ja active Active
- 2020-05-22 US US16/881,017 patent/US10905014B2/en active Active
-
2021
- 2021-01-20 US US17/152,804 patent/US11503718B2/en active Active
Patent Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2290912A (en) * | 1994-06-28 | 1996-01-10 | Honda Motor Co Ltd | Wiring board |
JPH09274121A (ja) * | 1996-04-02 | 1997-10-21 | Shinko Electric Ind Co Ltd | 光用半導体装置とその製造方法 |
JPH11176966A (ja) * | 1997-12-10 | 1999-07-02 | Hitachi Ltd | 半導体素子収納パッケージ |
JP2007071980A (ja) * | 2005-09-05 | 2007-03-22 | Mitsubishi Electric Corp | 光モジュール |
JP2007273533A (ja) * | 2006-03-30 | 2007-10-18 | Sumitomo Heavy Ind Ltd | 導電パターンの形成方法及び形成装置 |
KR100937136B1 (ko) * | 2007-12-24 | 2010-01-18 | (주)루미브라이트 | 복수의 패키지를 모듈화한 리드프레임을 이용한 발광다이오드 모듈 |
CN102236820A (zh) * | 2010-04-27 | 2011-11-09 | 上海长丰智能卡有限公司 | 一种带负载电容的微型射频模块及其封装方法 |
CN102378490A (zh) * | 2010-08-06 | 2012-03-14 | 日东电工株式会社 | 布线电路基板集合体片及其制造方法 |
US20120043660A1 (en) * | 2010-08-17 | 2012-02-23 | National Semiconductor Corporation | Thin foil semiconductor package |
CN202012788U (zh) * | 2011-04-28 | 2011-10-19 | 东莞勤上光电股份有限公司 | 一种led照明设备 |
TW201401951A (zh) * | 2012-06-19 | 2014-01-01 | Taiyo Holdings Co Ltd | 印刷配線板之電路形成方法,熱硬化性樹脂組成物,及印刷配線板 |
CN103426776A (zh) * | 2013-07-09 | 2013-12-04 | 上海百嘉电子有限公司 | 智能卡载带的制造方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113316874A (zh) * | 2019-01-22 | 2021-08-27 | 莫列斯有限公司 | 使用专用电子封装制造工艺的智能连接器及制造其的方法 |
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TW201709564A (zh) | 2017-03-01 |
KR20200096683A (ko) | 2020-08-12 |
KR102282488B1 (ko) | 2021-07-28 |
KR20220124823A (ko) | 2022-09-14 |
TWI656663B (zh) | 2019-04-11 |
EP3314991A1 (fr) | 2018-05-02 |
KR102143400B1 (ko) | 2020-08-11 |
KR20180016611A (ko) | 2018-02-14 |
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CN205746638U (zh) | 2016-11-30 |
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JP2018532251A (ja) | 2018-11-01 |
JP7127083B2 (ja) | 2022-08-29 |
US20180184526A1 (en) | 2018-06-28 |
US10433428B2 (en) | 2019-10-01 |
JP2020120125A (ja) | 2020-08-06 |
KR102439790B1 (ko) | 2022-09-02 |
KR102625466B1 (ko) | 2024-01-17 |
US10667407B2 (en) | 2020-05-26 |
JP6742352B2 (ja) | 2020-08-19 |
WO2017004064A1 (fr) | 2017-01-05 |
US20210144861A1 (en) | 2021-05-13 |
US20200352032A1 (en) | 2020-11-05 |
US10905014B2 (en) | 2021-01-26 |
EP3314991A4 (fr) | 2019-03-27 |
CN114234138A (zh) | 2022-03-25 |
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