CN106256014B - 压印装置、压印方法及物品的制造方法 - Google Patents

压印装置、压印方法及物品的制造方法 Download PDF

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Publication number
CN106256014B
CN106256014B CN201580021792.3A CN201580021792A CN106256014B CN 106256014 B CN106256014 B CN 106256014B CN 201580021792 A CN201580021792 A CN 201580021792A CN 106256014 B CN106256014 B CN 106256014B
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CN
China
Prior art keywords
impression materials
substrate
aperture
mold
supplied
Prior art date
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CN201580021792.3A
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English (en)
Chinese (zh)
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CN106256014A (zh
Inventor
山口裕充
田村泰之
宫岛义一
齐藤昭男
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Canon Inc
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Canon Inc
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Publication date
Application filed by Canon Inc filed Critical Canon Inc
Publication of CN106256014A publication Critical patent/CN106256014A/zh
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/30—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to control volume of flow, e.g. with adjustable passages
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
    • B05B12/02—Arrangements for controlling delivery; Arrangements for controlling the spray area for controlling time, or sequence, of delivery
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/12—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by mechanical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J3/00—Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed
    • B41J3/407—Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed for marking on special material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
    • H01L21/0334—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
    • H01L21/0337—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane characterised by the process involved to create the mask, e.g. lift-off masks, sidewalls, or to modify the mask, e.g. pre-treatment, post-treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D2203/00—Other substrates
    • B05D2203/30—Other inorganic substrates, e.g. ceramics, silicon
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
CN201580021792.3A 2014-05-02 2015-04-16 压印装置、压印方法及物品的制造方法 Active CN106256014B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014095502A JP6329425B2 (ja) 2014-05-02 2014-05-02 インプリント装置、インプリント方法、および物品の製造方法
JP2014-095502 2014-05-02
PCT/JP2015/062315 WO2015166870A1 (en) 2014-05-02 2015-04-16 Imprint apparatus, imprint method, and method of manufacturing article

Publications (2)

Publication Number Publication Date
CN106256014A CN106256014A (zh) 2016-12-21
CN106256014B true CN106256014B (zh) 2019-06-21

Family

ID=54358600

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201580021792.3A Active CN106256014B (zh) 2014-05-02 2015-04-16 压印装置、压印方法及物品的制造方法

Country Status (7)

Country Link
US (1) US10406743B2 (enExample)
JP (1) JP6329425B2 (enExample)
KR (2) KR101900585B1 (enExample)
CN (1) CN106256014B (enExample)
SG (1) SG11201608330YA (enExample)
TW (1) TWI564935B (enExample)
WO (1) WO2015166870A1 (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6329437B2 (ja) * 2014-06-10 2018-05-23 キヤノン株式会社 インプリント装置、インプリント方法、および物品の製造方法
JP6566843B2 (ja) * 2015-11-12 2019-08-28 キヤノン株式会社 パターン形成方法、インプリントシステムおよび物品製造方法
JP6666039B2 (ja) * 2016-03-07 2020-03-13 キヤノン株式会社 インプリント方法、インプリント装置、プログラム、および物品の製造方法
JP6726987B2 (ja) * 2016-03-17 2020-07-22 キヤノン株式会社 インプリント装置および物品製造方法
SG10201709153VA (en) * 2016-12-12 2018-07-30 Canon Kk Fluid droplet methodology and apparatus for imprint lithography
US10493672B2 (en) * 2017-06-26 2019-12-03 Canon Kabushiki Kaisha Imprint apparatus, method of manufacturing article, information processing apparatus, method of supporting map editing, and storage medium
US11131923B2 (en) * 2018-10-10 2021-09-28 Canon Kabushiki Kaisha System and method of assessing surface quality by optically analyzing dispensed drops
US10725375B2 (en) 2018-12-04 2020-07-28 Canon Kabushiki Kaisha Using non-linear fluid dispensers for forming thick films
JP7149870B2 (ja) 2019-02-08 2022-10-07 キヤノン株式会社 インプリント装置および物品製造方法
JP7171468B2 (ja) * 2019-02-20 2022-11-15 キヤノン株式会社 情報処理装置、プログラム、リソグラフィ装置、物品の製造方法、物品の製造システム、及び出力方法
CN110143061B (zh) * 2019-07-02 2020-07-24 敏达环保科技（嘉兴）有限公司 一种铁皮专用压印装置
JP7271352B2 (ja) * 2019-07-17 2023-05-11 キオクシア株式会社 インプリント装置、インプリント方法、および半導体装置の製造方法
KR102776383B1 (ko) * 2020-03-18 2025-03-10 삼성디스플레이 주식회사 표시 장치의 제조장치 및 표시 장치의 제조방법
JP7532234B2 (ja) * 2020-12-10 2024-08-13 キヤノン株式会社 平坦化装置、平坦化方法及び物品の製造方法
KR102509680B1 (ko) * 2020-12-31 2023-03-15 (주)유니젯 잉크방울 측정패드와 이를 구비한 잉크젯 프린터 장치 및 잉크방울 측정방법
JP2023012047A (ja) * 2021-07-13 2023-01-25 東京エレクトロン株式会社 機能液測定装置および機能液測定方法
JP7667047B2 (ja) * 2021-09-22 2025-04-22 キオクシア株式会社 ドロップレシピの作成方法、パターン形成方法、半導体装置の製造方法
EP4250006A1 (en) * 2022-03-23 2023-09-27 Koninklijke Philips N.V. Quality control method for imprint lithography

Citations (4)

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US20110189601A1 (en) * 2010-01-29 2011-08-04 Takeshi Koshiba Method of forming pattern, system for calculating resist coating distribution and program for calculating the same
US20120028378A1 (en) * 2010-07-30 2012-02-02 Hiroyuki Morinaga Method for forming pattern and a semiconductor device
WO2013039259A1 (en) * 2011-09-15 2013-03-21 Fujifilm Corporation Ejection volume correction method for inkjet head, ejection volume correction apparatus
US8480933B2 (en) * 2008-10-22 2013-07-09 Molecular Imprints, Inc. Fluid dispense device calibration

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US13011A (en) * 1855-06-05 Daniel mint horn
JP2004337701A (ja) 2003-05-14 2004-12-02 Seiko Epson Corp 液滴吐出方法、及び液滴吐出装置
JP2007326003A (ja) * 2006-06-06 2007-12-20 Sharp Corp 液滴吐出装置およびその制御方法
JP2010240503A (ja) * 2009-04-01 2010-10-28 Seiko Epson Corp 液滴吐出量測定方法および有機エレクトロルミネッセンス装置の製造方法
JP5520612B2 (ja) * 2010-01-04 2014-06-11 東芝機械株式会社 ディスペンサを備えた転写装置、ディスペンサの吐出量検出方法、及びディスペンサの吐出量制御方法
JP5744422B2 (ja) 2010-06-17 2015-07-08 キヤノン株式会社 インプリント方法及びインプリント装置、サンプルショット抽出方法、並びにそれを用いた物品の製造方法
JP5489887B2 (ja) 2010-06-30 2014-05-14 富士フイルム株式会社 液体塗布装置及び液体塗布方法並びにナノインプリントシステム
JP2012114157A (ja) * 2010-11-22 2012-06-14 Toshiba Corp ドロップレシピ作成方法およびデータベース作成方法
JP6180131B2 (ja) 2012-03-19 2017-08-16 キヤノン株式会社 インプリント装置、それを用いた物品の製造方法
JP2014033069A (ja) * 2012-08-03 2014-02-20 Toshiba Corp パターン形成方法及びディスペンサー
JP5813603B2 (ja) * 2012-09-04 2015-11-17 株式会社東芝 インプリント装置およびインプリント方法

Patent Citations (4)

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Publication number Priority date Publication date Assignee Title
US8480933B2 (en) * 2008-10-22 2013-07-09 Molecular Imprints, Inc. Fluid dispense device calibration
US20110189601A1 (en) * 2010-01-29 2011-08-04 Takeshi Koshiba Method of forming pattern, system for calculating resist coating distribution and program for calculating the same
US20120028378A1 (en) * 2010-07-30 2012-02-02 Hiroyuki Morinaga Method for forming pattern and a semiconductor device
WO2013039259A1 (en) * 2011-09-15 2013-03-21 Fujifilm Corporation Ejection volume correction method for inkjet head, ejection volume correction apparatus

Also Published As

Publication number Publication date
US20170015045A1 (en) 2017-01-19
US10406743B2 (en) 2019-09-10
KR20180104777A (ko) 2018-09-21
CN106256014A (zh) 2016-12-21
SG11201608330YA (en) 2016-11-29
TW201545205A (zh) 2015-12-01
JP6329425B2 (ja) 2018-05-23
JP2015213130A (ja) 2015-11-26
WO2015166870A1 (en) 2015-11-05
TWI564935B (zh) 2017-01-01
KR101900585B1 (ko) 2018-09-19
KR20160146956A (ko) 2016-12-21

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