CN106252457B - 混合型多晶硅异质结背接触电池 - Google Patents
混合型多晶硅异质结背接触电池 Download PDFInfo
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- CN106252457B CN106252457B CN201610206738.2A CN201610206738A CN106252457B CN 106252457 B CN106252457 B CN 106252457B CN 201610206738 A CN201610206738 A CN 201610206738A CN 106252457 B CN106252457 B CN 106252457B
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- solar cell
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- silicon
- band gap
- silicon substrate
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 153
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 153
- 239000010703 silicon Substances 0.000 title claims abstract description 153
- 239000000758 substrate Substances 0.000 claims abstract description 74
- 239000004065 semiconductor Substances 0.000 claims abstract description 71
- 238000000034 method Methods 0.000 claims abstract description 68
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims abstract description 51
- 229920005591 polysilicon Polymers 0.000 claims abstract description 40
- 230000008569 process Effects 0.000 claims abstract description 27
- 229910052751 metal Inorganic materials 0.000 claims abstract description 25
- 239000002184 metal Substances 0.000 claims abstract description 25
- 238000004519 manufacturing process Methods 0.000 claims abstract description 21
- 238000005530 etching Methods 0.000 claims abstract 4
- 239000011248 coating agent Substances 0.000 claims description 63
- 238000000576 coating method Methods 0.000 claims description 63
- 239000002019 doping agent Substances 0.000 claims description 40
- 239000000463 material Substances 0.000 claims description 35
- 229910021417 amorphous silicon Inorganic materials 0.000 claims description 15
- 230000008021 deposition Effects 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 7
- 238000002425 crystallisation Methods 0.000 claims description 6
- 230000008025 crystallization Effects 0.000 claims description 6
- 230000001590 oxidative effect Effects 0.000 claims description 6
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 5
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 5
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 4
- 229910052796 boron Inorganic materials 0.000 claims description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 229910052698 phosphorus Inorganic materials 0.000 claims description 3
- 239000011574 phosphorus Substances 0.000 claims description 3
- 229910002601 GaN Inorganic materials 0.000 claims description 2
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 claims description 2
- 229910045601 alloy Inorganic materials 0.000 claims description 2
- 239000000956 alloy Substances 0.000 claims description 2
- 239000004411 aluminium Substances 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 230000008878 coupling Effects 0.000 claims description 2
- 238000010168 coupling process Methods 0.000 claims description 2
- 238000005859 coupling reaction Methods 0.000 claims description 2
- 230000005611 electricity Effects 0.000 claims description 2
- 239000000203 mixture Substances 0.000 claims 3
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 claims 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims 1
- 229910010271 silicon carbide Inorganic materials 0.000 claims 1
- 238000001465 metallisation Methods 0.000 abstract description 3
- 238000007747 plating Methods 0.000 abstract 1
- 210000004027 cell Anatomy 0.000 description 62
- 238000005516 engineering process Methods 0.000 description 16
- 239000013078 crystal Substances 0.000 description 6
- 238000000151 deposition Methods 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- 229910052814 silicon oxide Inorganic materials 0.000 description 4
- 238000005137 deposition process Methods 0.000 description 3
- 238000007641 inkjet printing Methods 0.000 description 3
- 238000007650 screen-printing Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 229910003978 SiClx Inorganic materials 0.000 description 2
- 238000001505 atmospheric-pressure chemical vapour deposition Methods 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000000608 laser ablation Methods 0.000 description 2
- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 2
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 description 1
- 238000002679 ablation Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- -1 aluminium gold Chemical compound 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 125000005842 heteroatom Chemical group 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000002082 metal nanoparticle Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/06—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers
- H01L31/072—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN heterojunction type
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0216—Coatings
- H01L31/02161—Coatings for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/02167—Coatings for devices characterised by at least one potential jump barrier or surface barrier for solar cells
- H01L31/02168—Coatings for devices characterised by at least one potential jump barrier or surface barrier for solar cells the coatings being antireflective or having enhancing optical properties for the solar cells
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
- H01L31/022441—Electrode arrangements specially adapted for back-contact solar cells
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0236—Special surface textures
- H01L31/02366—Special surface textures of the substrate or of a layer on the substrate, e.g. textured ITO/glass substrate or superstrate, textured polymer layer on glass substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/036—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes
- H01L31/0368—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including polycrystalline semiconductors
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/036—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes
- H01L31/0376—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including amorphous semiconductors
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- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/06—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers
- H01L31/072—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN heterojunction type
- H01L31/0745—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN heterojunction type comprising a AIVBIV heterojunction, e.g. Si/Ge, SiGe/Si or Si/SiC solar cells
- H01L31/0747—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN heterojunction type comprising a AIVBIV heterojunction, e.g. Si/Ge, SiGe/Si or Si/SiC solar cells comprising a heterojunction of crystalline and amorphous materials, e.g. heterojunction with intrinsic thin layer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic Table
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic Table
- H01L31/182—Special manufacturing methods for polycrystalline Si, e.g. Si ribbon, poly Si ingots, thin films of polycrystalline Si
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Energy (AREA)
- Sustainable Development (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Photovoltaic Devices (AREA)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/333,904 | 2011-12-21 | ||
US13/333,904 US8597970B2 (en) | 2011-12-21 | 2011-12-21 | Hybrid polysilicon heterojunction back contact cell |
US13/333,908 US8679889B2 (en) | 2011-12-21 | 2011-12-21 | Hybrid polysilicon heterojunction back contact cell |
US13/333,908 | 2011-12-21 | ||
CN201280063686.8A CN104011881B (zh) | 2011-12-21 | 2012-12-19 | 混合型多晶硅异质结背接触电池 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201280063686.8A Division CN104011881B (zh) | 2011-12-21 | 2012-12-19 | 混合型多晶硅异质结背接触电池 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN106252457A CN106252457A (zh) | 2016-12-21 |
CN106252457B true CN106252457B (zh) | 2018-10-12 |
Family
ID=48669465
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201610206738.2A Active CN106252457B (zh) | 2011-12-21 | 2012-12-19 | 混合型多晶硅异质结背接触电池 |
CN201280063686.8A Active CN104011881B (zh) | 2011-12-21 | 2012-12-19 | 混合型多晶硅异质结背接触电池 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201280063686.8A Active CN104011881B (zh) | 2011-12-21 | 2012-12-19 | 混合型多晶硅异质结背接触电池 |
Country Status (7)
Country | Link |
---|---|
JP (4) | JP6208682B2 (ko) |
KR (3) | KR102101408B1 (ko) |
CN (2) | CN106252457B (ko) |
AU (4) | AU2012358982B2 (ko) |
DE (1) | DE112012005381T5 (ko) |
TW (2) | TWI559563B (ko) |
WO (1) | WO2013096500A1 (ko) |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9054255B2 (en) | 2012-03-23 | 2015-06-09 | Sunpower Corporation | Solar cell having an emitter region with wide bandgap semiconductor material |
CN103594541B (zh) * | 2013-10-12 | 2017-01-04 | 南昌大学 | 用于太阳能电池的多晶硅/单晶硅异质结结构及其制备方法 |
US9196758B2 (en) | 2013-12-20 | 2015-11-24 | Sunpower Corporation | Solar cell emitter region fabrication with differentiated p-type and n-type region architectures |
WO2015122242A1 (ja) * | 2014-02-13 | 2015-08-20 | シャープ株式会社 | 裏面接合型の光電変換素子および太陽光発電システム |
US9837576B2 (en) * | 2014-09-19 | 2017-12-05 | Sunpower Corporation | Solar cell emitter region fabrication with differentiated P-type and N-type architectures and incorporating dotted diffusion |
US9520507B2 (en) * | 2014-12-22 | 2016-12-13 | Sunpower Corporation | Solar cells with improved lifetime, passivation and/or efficiency |
US9997652B2 (en) | 2015-03-23 | 2018-06-12 | Sunpower Corporation | Deposition approaches for emitter layers of solar cells |
US9525083B2 (en) * | 2015-03-27 | 2016-12-20 | Sunpower Corporation | Solar cell emitter region fabrication with differentiated P-type and N-type architectures and incorporating a multi-purpose passivation and contact layer |
US20160284917A1 (en) * | 2015-03-27 | 2016-09-29 | Seung Bum Rim | Passivation Layer for Solar Cells |
US11355657B2 (en) * | 2015-03-27 | 2022-06-07 | Sunpower Corporation | Metallization of solar cells with differentiated p-type and n-type region architectures |
FR3037721B1 (fr) * | 2015-06-19 | 2019-07-19 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Procede de realisation d’une cellule photovoltaique a heterojonction et cellule photovoltaique ainsi obtenue. |
US10505064B2 (en) * | 2015-09-14 | 2019-12-10 | Sharp Kabushiki Kaisha | Photovoltaic device |
US9502601B1 (en) * | 2016-04-01 | 2016-11-22 | Sunpower Corporation | Metallization of solar cells with differentiated P-type and N-type region architectures |
CN107611183B (zh) * | 2016-06-30 | 2020-06-19 | 比亚迪股份有限公司 | 电池片、电池片矩阵、太阳能电池及电池片的制备方法 |
US11233162B2 (en) | 2017-03-31 | 2022-01-25 | The Boeing Company | Method of processing inconsistencies in solar cell devices and devices formed thereby |
EP3685445A1 (en) | 2017-09-22 | 2020-07-29 | Nederlandse Organisatie voor toegepast- natuurwetenschappelijk Onderzoek TNO | Interdigitated back-contacted solar cell with p-type conductivity |
CN109308470B (zh) * | 2018-09-28 | 2021-01-01 | 武汉华星光电技术有限公司 | 指纹感测装置及其制造方法 |
CN111834470A (zh) * | 2019-03-26 | 2020-10-27 | 福建金石能源有限公司 | 一种交叉网状电接触的背接触异质结电池及组件制作方法 |
ES2901323T3 (es) | 2019-07-26 | 2022-03-22 | Meyer Burger Germany Gmbh | Dispositivo fotovoltaico y método para fabricar el mismo |
CN113284794B (zh) * | 2021-02-25 | 2023-03-24 | 宁夏隆基乐叶科技有限公司 | 一种硅基底的掺杂方法、太阳能电池及其制作方法 |
CN115548155A (zh) | 2021-06-30 | 2022-12-30 | 晶科绿能(上海)管理有限公司 | 太阳能电池及光伏组件 |
CN114744056A (zh) * | 2022-04-01 | 2022-07-12 | 西安隆基乐叶光伏科技有限公司 | 太阳能电池及其加工方法 |
CN114823973A (zh) * | 2022-04-20 | 2022-07-29 | 通威太阳能(眉山)有限公司 | 一种p型背接触太阳电池及其制备方法 |
CN114792743B (zh) * | 2022-05-05 | 2024-07-05 | 通威太阳能(成都)有限公司 | 太阳电池及其制备方法、光伏系统 |
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CN117673207B (zh) * | 2024-02-01 | 2024-05-14 | 通威太阳能(眉山)有限公司 | 一种太阳电池的制备方法、太阳电池及光伏组件 |
CN117810310B (zh) * | 2024-02-29 | 2024-06-07 | 浙江晶科能源有限公司 | 太阳能电池制备方法、太阳能电池及光伏组件 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101401215A (zh) * | 2006-01-26 | 2009-04-01 | 阿莱斯技术公司 | 太阳能电池 |
CN101438420A (zh) * | 2006-05-04 | 2009-05-20 | 太阳能公司 | 具有掺杂的半导体异质结触点的太阳能电池 |
TW200947725A (en) * | 2008-01-24 | 2009-11-16 | Applied Materials Inc | Improved HIT solar cell structure |
CN101999175A (zh) * | 2008-04-09 | 2011-03-30 | 应用材料股份有限公司 | 用于多晶硅发射极太阳能电池的简化背触点 |
Family Cites Families (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4152824A (en) * | 1977-12-30 | 1979-05-08 | Mobil Tyco Solar Energy Corporation | Manufacture of solar cells |
US5057439A (en) * | 1990-02-12 | 1991-10-15 | Electric Power Research Institute | Method of fabricating polysilicon emitters for solar cells |
US7119271B2 (en) * | 2001-10-12 | 2006-10-10 | The Boeing Company | Wide-bandgap, lattice-mismatched window layer for a solar conversion device |
JP4511146B2 (ja) * | 2003-09-26 | 2010-07-28 | 三洋電機株式会社 | 光起電力素子およびその製造方法 |
EP1763086A1 (en) * | 2005-09-09 | 2007-03-14 | Interuniversitair Micro-Elektronica Centrum | Photovoltaic cell with thick silicon oxide and silicon nitride passivation and fabrication method |
US7375378B2 (en) * | 2005-05-12 | 2008-05-20 | General Electric Company | Surface passivated photovoltaic devices |
US7468485B1 (en) * | 2005-08-11 | 2008-12-23 | Sunpower Corporation | Back side contact solar cell with doped polysilicon regions |
US8008575B2 (en) * | 2006-07-24 | 2011-08-30 | Sunpower Corporation | Solar cell with reduced base diffusion area |
US20110000532A1 (en) | 2008-01-30 | 2011-01-06 | Kyocera Corporation | Solar Cell Device and Method of Manufacturing Solar Cell Device |
KR101155343B1 (ko) | 2008-02-25 | 2012-06-11 | 엘지전자 주식회사 | 백 콘택 태양전지의 제조 방법 |
US7851698B2 (en) | 2008-06-12 | 2010-12-14 | Sunpower Corporation | Trench process and structure for backside contact solar cells with polysilicon doped regions |
US8242354B2 (en) | 2008-12-04 | 2012-08-14 | Sunpower Corporation | Backside contact solar cell with formed polysilicon doped regions |
CN101777603B (zh) * | 2009-01-08 | 2012-03-07 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 背接触太阳能电池的制造方法 |
KR101142861B1 (ko) * | 2009-02-04 | 2012-05-08 | 엘지전자 주식회사 | 태양 전지 및 그 제조 방법 |
JP5461028B2 (ja) | 2009-02-26 | 2014-04-02 | 三洋電機株式会社 | 太陽電池 |
CN102349166A (zh) | 2009-03-10 | 2012-02-08 | 三洋电机株式会社 | 太阳能电池的制造方法和太阳能电池 |
MY152718A (en) * | 2009-03-30 | 2014-11-28 | Sanyo Electric Co | Solar cell |
DE102009024598A1 (de) * | 2009-06-10 | 2011-01-05 | Institut Für Solarenergieforschung Gmbh | Solarzelle mit Kontaktstruktur mit geringen Rekombinationsverlusten sowie Herstellungsverfahren für solche Solarzellen |
CN102044579B (zh) | 2009-09-07 | 2013-12-18 | Lg电子株式会社 | 太阳能电池 |
KR101141219B1 (ko) * | 2010-05-11 | 2012-05-04 | 엘지전자 주식회사 | 태양 전지 및 그 제조 방법 |
KR101146736B1 (ko) * | 2009-09-14 | 2012-05-17 | 엘지전자 주식회사 | 태양 전지 |
US8465909B2 (en) * | 2009-11-04 | 2013-06-18 | Varian Semiconductor Equipment Associates, Inc. | Self-aligned masking for solar cell manufacture |
US20110132444A1 (en) | 2010-01-08 | 2011-06-09 | Meier Daniel L | Solar cell including sputtered reflective layer and method of manufacture thereof |
JP5627243B2 (ja) | 2010-01-28 | 2014-11-19 | 三洋電機株式会社 | 太陽電池及び太陽電池の製造方法 |
US8932724B2 (en) * | 2010-06-07 | 2015-01-13 | General Atomics | Reflective coating, pigment, colored composition, and process of producing a reflective pigment |
KR20120068226A (ko) * | 2010-12-17 | 2012-06-27 | 엘지전자 주식회사 | 태양 전지의 제조 방법 |
KR101292061B1 (ko) * | 2010-12-21 | 2013-08-01 | 엘지전자 주식회사 | 박막 태양전지 |
KR101773837B1 (ko) * | 2011-01-21 | 2017-09-01 | 엘지전자 주식회사 | 태양전지 및 그 제조방법 |
CN102185030B (zh) | 2011-04-13 | 2013-08-21 | 山东力诺太阳能电力股份有限公司 | 基于n型硅片的背接触式hit太阳能电池制备方法 |
CN102437243B (zh) * | 2011-12-08 | 2013-11-20 | 常州天合光能有限公司 | 异质浮动结背钝化的hit太阳能电池结构及其制备工艺 |
-
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Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101401215A (zh) * | 2006-01-26 | 2009-04-01 | 阿莱斯技术公司 | 太阳能电池 |
CN101438420A (zh) * | 2006-05-04 | 2009-05-20 | 太阳能公司 | 具有掺杂的半导体异质结触点的太阳能电池 |
TW200947725A (en) * | 2008-01-24 | 2009-11-16 | Applied Materials Inc | Improved HIT solar cell structure |
CN101999175A (zh) * | 2008-04-09 | 2011-03-30 | 应用材料股份有限公司 | 用于多晶硅发射极太阳能电池的简化背触点 |
Also Published As
Publication number | Publication date |
---|---|
JP2015505167A (ja) | 2015-02-16 |
AU2012358982B2 (en) | 2015-05-07 |
AU2015210421B2 (en) | 2017-06-01 |
KR20140106701A (ko) | 2014-09-03 |
CN104011881B (zh) | 2016-05-04 |
KR102223562B1 (ko) | 2021-03-04 |
KR102101408B1 (ko) | 2020-04-17 |
AU2015210421B9 (en) | 2017-11-09 |
KR20190073594A (ko) | 2019-06-26 |
AU2012358982A1 (en) | 2014-07-03 |
AU2015210421A1 (en) | 2015-09-03 |
DE112012005381T5 (de) | 2014-09-04 |
JP2020129689A (ja) | 2020-08-27 |
TWI685984B (zh) | 2020-02-21 |
JP2017228796A (ja) | 2017-12-28 |
TW201707224A (zh) | 2017-02-16 |
AU2020200717A1 (en) | 2020-02-20 |
WO2013096500A1 (en) | 2013-06-27 |
KR101991791B1 (ko) | 2019-06-21 |
TWI559563B (zh) | 2016-11-21 |
JP7120514B2 (ja) | 2022-08-17 |
KR20200039850A (ko) | 2020-04-16 |
JP6411604B2 (ja) | 2018-10-24 |
JP6701295B2 (ja) | 2020-05-27 |
TW201344931A (zh) | 2013-11-01 |
CN104011881A (zh) | 2014-08-27 |
JP6208682B2 (ja) | 2017-10-04 |
AU2017221854A1 (en) | 2017-09-21 |
CN106252457A (zh) | 2016-12-21 |
JP2019024107A (ja) | 2019-02-14 |
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