CN106227004A - 一种铜或铜合金布线用水系光阻剥离液 - Google Patents
一种铜或铜合金布线用水系光阻剥离液 Download PDFInfo
- Publication number
- CN106227004A CN106227004A CN201610829920.3A CN201610829920A CN106227004A CN 106227004 A CN106227004 A CN 106227004A CN 201610829920 A CN201610829920 A CN 201610829920A CN 106227004 A CN106227004 A CN 106227004A
- Authority
- CN
- China
- Prior art keywords
- copper
- acid
- water system
- alloy wiring
- stripper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/422—Stripping or agents therefor using liquids only
- G03F7/425—Stripping or agents therefor using liquids only containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
Description
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610829920.3A CN106227004B (zh) | 2016-09-19 | 一种铜或铜合金布线用水系光阻剥离液 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610829920.3A CN106227004B (zh) | 2016-09-19 | 一种铜或铜合金布线用水系光阻剥离液 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN106227004A true CN106227004A (zh) | 2016-12-14 |
CN106227004B CN106227004B (zh) | 2019-07-16 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110441997A (zh) * | 2019-08-19 | 2019-11-12 | 江阴江化微电子材料股份有限公司 | 一种改进的环保水系光刻胶剥离液 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1591199A (zh) * | 2003-08-27 | 2005-03-09 | Lg.菲利浦Lcd有限公司 | 用于除去与铜相容的抗蚀剂的组合物和方法 |
CN1840624A (zh) * | 2005-03-11 | 2006-10-04 | 罗门哈斯电子材料有限公司 | 聚合物去除剂 |
CN101228481A (zh) * | 2005-02-25 | 2008-07-23 | Ekc技术公司 | 从包括铜和低k电介体的基片上除去抗蚀剂、蚀刻残余物和氧化铜的方法 |
CN101290482A (zh) * | 2007-04-19 | 2008-10-22 | 安集微电子(上海)有限公司 | 一种清洗等离子刻蚀残留物的清洗液 |
CN101398639A (zh) * | 2007-09-28 | 2009-04-01 | 三星电子株式会社 | 用于剥离的组合物以及剥离方法 |
CN102163011A (zh) * | 2011-04-29 | 2011-08-24 | 西安东旺精细化学有限公司 | 一种光致抗蚀剂的剥离液组合物 |
CN103513523A (zh) * | 2013-09-26 | 2014-01-15 | 杨桂望 | 光刻胶清洗剂 |
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1591199A (zh) * | 2003-08-27 | 2005-03-09 | Lg.菲利浦Lcd有限公司 | 用于除去与铜相容的抗蚀剂的组合物和方法 |
CN101228481A (zh) * | 2005-02-25 | 2008-07-23 | Ekc技术公司 | 从包括铜和低k电介体的基片上除去抗蚀剂、蚀刻残余物和氧化铜的方法 |
CN1840624A (zh) * | 2005-03-11 | 2006-10-04 | 罗门哈斯电子材料有限公司 | 聚合物去除剂 |
CN101290482A (zh) * | 2007-04-19 | 2008-10-22 | 安集微电子(上海)有限公司 | 一种清洗等离子刻蚀残留物的清洗液 |
CN101398639A (zh) * | 2007-09-28 | 2009-04-01 | 三星电子株式会社 | 用于剥离的组合物以及剥离方法 |
CN102163011A (zh) * | 2011-04-29 | 2011-08-24 | 西安东旺精细化学有限公司 | 一种光致抗蚀剂的剥离液组合物 |
CN103513523A (zh) * | 2013-09-26 | 2014-01-15 | 杨桂望 | 光刻胶清洗剂 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110441997A (zh) * | 2019-08-19 | 2019-11-12 | 江阴江化微电子材料股份有限公司 | 一种改进的环保水系光刻胶剥离液 |
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A water-based photoresist stripper for copper or copper alloy wiring Effective date of registration: 20201109 Granted publication date: 20190716 Pledgee: Jiangsu Jiangyin Rural Commercial Bank Co., Ltd. Zhouzhuang sub branch Pledgor: JIANGYIN JIANGHUA MICROELECTRONICS MATERIALS Co.,Ltd. Registration number: Y2020320010181 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20220209 Granted publication date: 20190716 Pledgee: Jiangsu Jiangyin Rural Commercial Bank Co.,Ltd. Zhouzhuang sub branch Pledgor: JIANGYIN JIANGHUA MICROELECTRONICS MATERIALS Co.,Ltd. Registration number: Y2020320010181 |