CN106191990A - A kind of air intake installation of boiler tube - Google Patents

A kind of air intake installation of boiler tube Download PDF

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Publication number
CN106191990A
CN106191990A CN201610770371.7A CN201610770371A CN106191990A CN 106191990 A CN106191990 A CN 106191990A CN 201610770371 A CN201610770371 A CN 201610770371A CN 106191990 A CN106191990 A CN 106191990A
Authority
CN
China
Prior art keywords
air inlet
cassette
inlet pipe
boiler tube
intake installation
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201610770371.7A
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Chinese (zh)
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CN106191990B (en
Inventor
祁鹏
王智
苏俊铭
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Shanghai Huali Microelectronics Corp
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Shanghai Huali Microelectronics Corp
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Priority to CN201610770371.7A priority Critical patent/CN106191990B/en
Publication of CN106191990A publication Critical patent/CN106191990A/en
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    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02Epitaxial-layer growth
    • C30B25/14Feed and outlet means for the gases; Modifying the flow of the reactive gases

Abstract

The invention discloses the air intake installation of a kind of boiler tube, including: air inlet, it is located at the side wall lower ends in furnace process chamber, it connects external reaction gas piping;Air inlet pipe, is located in process cavity, and its one end connects air inlet, and the other end is closed, and the air inlet pipe cassette in process cavity from bottom to top is arranged;Multiple nozzles, along intake manifold length direction and are uniformly arranged towards cassette;During technique, by being passed through reacting gas in air inlet pipe by air inlet, and sprayed to cassette by each nozzle, make the every layer of silicon chip all uniform contact in cassette to reacting gas, simultaneously, cassette is kept to be in transfixion state, with while ensureing product thickness uniformity, it is to avoid bring particle contamination because cassette rotates.

Description

A kind of air intake installation of boiler tube
Technical field
The present invention relates to semiconductor processing equipment technical field, more particularly, to the boiler tube air inlet of a kind of particular design Device.
Background technology
Along with integrated circuit continues the development toward high density direction, on one piece of chip the least, incorporate and more come The most assemblies so that chip is more and more lower to the tolerance of defect, more smaller size of defects have been increasingly becoming yield Killer.Meanwhile, the uniformity requirement to full wafer silicon chip also becomes more and more higher.
Referring to Fig. 1, Fig. 1 is existing a kind of furnace tube structure schematic diagram.As it is shown in figure 1, boiler tube is provided with process cavity 12, work The bottom in skill chamber 12 is provided with base 10, and cassette 13 is carried on base 10, in cassette 13 from bottom to top level equipped with multilamellar silicon Sheet 14.Base 10 is provided with magnetic fluid 16, is used for driving cassette 13 to rotate.The sidewall bottom of process cavity 12 is additionally provided with nozzle 11 (Injector), for being passed through reacting gas in process cavity 12.During technique, cassette 13 rotates under the drive of magnetic fluid 16, Make the silicon chip 14 in cassette 13 be in the atmosphere of reacting gas and accept technique.
Above-mentioned boiler tube uses batch (batch) operating type, i.e. disposably equipped with multiple (layers) in cassette 13 Silicon chip 14 carries out technique simultaneously.Owing to it is positioned at the bottom of process cavity 12 for the nozzle 11 being passed through reacting gas, in order to ensure The reacting gas that in technique, silicon chip 14 touches is uniform, thus the uniformity of product thickness after ensureing technique, make at silicon chip During industry, by the magnetic fluid 16 installed below cassette 13, drive cassette 13 to rotate, make silicon chip 14 in cassette 13 with Rotation so that the silicon chip 14 of each layer uniformly in contact with to reacting gas, thus can ensure the uniform of product thickness.
But, in above-mentioned existing boiler tube, between magnetic fluid 16 and the rotation of cassette 13, and silicon chip 14 and cassette 13 The Relative friction produced, the problem that all can bring granule 15 so that process cavity 12 and product 14 are contaminated.This will have a strong impact on The quality of product and production efficiency.
Summary of the invention
It is an object of the invention to the drawbacks described above overcoming prior art to exist, it is provided that the air intake installation of a kind of boiler tube, with The uniformity of product thickness is ensured while reducing granule source.
For achieving the above object, technical scheme is as follows:
A kind of air intake installation of boiler tube, including:
Air inlet, is located at the side wall lower ends in furnace process chamber, and it connects external reaction gas piping;
Air inlet pipe, is located in process cavity, and its one end connects air inlet, and the other end is closed, described air inlet pipe ring from bottom to top The cassette of winding technologe intracavity is arranged;
Multiple nozzles, along intake manifold length direction and are uniformly arranged towards cassette;
Wherein during technique, by being passed through reacting gas in air inlet pipe by air inlet, and sprayed to cassette by each nozzle, make Every layer of silicon chip all uniform contact in cassette are to reacting gas, meanwhile, keep cassette to be in transfixion state, to ensure product While product thickness evenness, it is to avoid bring particle contamination because cassette rotates.
Preferably, described air inlet is one to several, and each air inlet correspondence connects an air inlet pipe.
Preferably, described air inlet pipe is arranged around the sidepiece of cassette from bottom to top by screw type.
Preferably, in described air inlet pipe, the area of injection orifice summation of each nozzle is less than the cross-sectional area of this air inlet pipe.
Preferably, the cross section of described air inlet pipe is circular or polygon.
Preferably, the spout of described nozzle is circular, triangle or polygon.
Preferably, the diameter of described air inlet pipe is gradually reduced from bottom to top.
Preferably, the area of injection orifice of each described nozzle is gradually reduced from bottom to top along described air inlet pipe.
Preferably, the spout of described nozzle is horizontally disposed with towards cassette.
Preferably, described air inlet pipe is two, connects an air inlet respectively, and two described air inlet pipe are respectively by left and right The hand of spiral is symmetrical arranged around the sidepiece of cassette from bottom to top.
From technique scheme it can be seen that the present invention by furnace process intracavity from bottom to top around cassette arrange into Trachea, and in air inlet pipe, it is uniformly arranged multiple nozzle, can be from the side of cassette equably to every layer cassette by nozzle Silicon chip injection reacting gas, make product when technique can uniform contact to reacting gas, and the magnetic fluid bottom cassette can be removed, Make cassette keep transfixion in operation process, thus while ensureing product thickness uniformity, decrease granule and cause Pollution.
Accompanying drawing explanation
Fig. 1 is existing a kind of furnace tube structure schematic diagram;
Fig. 2 is the air intake installation structural representation of a kind of boiler tube of a preferred embodiment of the present invention.
Detailed description of the invention
Below in conjunction with the accompanying drawings, the detailed description of the invention of the present invention is described in further detail.
It should be noted that in following detailed description of the invention, when describing embodiments of the present invention in detail, in order to clear Ground represent the structure of the present invention so that explanation, special to the structure in accompanying drawing not according to general scale, and carried out local Amplify, deform and simplification process, therefore, should avoid being understood in this, as limitation of the invention.
In detailed description of the invention of the invention below, refer to the one that Fig. 2, Fig. 2 are a preferred embodiment of the present invention The air intake installation structural representation of boiler tube.As in figure 2 it is shown, the air intake installation of a kind of boiler tube of the present invention, it is arranged in boiler tube, stove Pipe is provided with process cavity 23, and the bottom of process cavity 23 is provided with base 20, and cassette 24 is carried on base 20, in cassette 24 from lower and Upper level is equipped with multiple (layer) silicon chip 26.The top of process cavity 23 is provided with exhaust tube 25, the residual gas after discharging technique. The air intake installation of this boiler tube includes: air inlet 21, air inlet pipe 22 and the nozzle (figure is slightly) being arranged in air inlet pipe 22.
Refer to Fig. 2.Air inlet 21 is arranged on the side wall lower ends in furnace process chamber 23.Air inlet 21 connects external reaction gas Body pipeline, for being passed through reacting gas in process cavity 23.
Refer to Fig. 2.Air inlet pipe 22 is arranged in process cavity 23.One end of air inlet pipe 22 connects air inlet 21, the other end For blind end.Described air inlet pipe 22 is arranged, by the side of cassette 24 according to the cassette 24 in mode cincture process cavity from bottom to top Face surrounds, and leaves certain spacing.
In air inlet pipe 22, it is evenly arranged with multiple nozzle along the length direction of air inlet pipe 22.The spout of each nozzle towards Cassette 24 direction is arranged, and such as, the spout of each described nozzle all uses the direction towards cassette 24 to be horizontally disposed with, to guarantee reaction Blow to gas level every layer of silicon chip 26.
When carrying out technique, by being passed through reacting gas in air inlet pipe 22 by air inlet 21, and by each nozzle to cassette 24 injections, can make the every layer of silicon chip 26 in cassette 24 can be uniformly in contact with to reacting gas, thus after can ensureing technique The thickness evenness of every silicon chip product;Meanwhile, original magnetic fluid being arranged on bottom cassette can be removed, to keep cassette 24 are in actionless state, so can be while ensureing product thickness uniformity, it is to avoid carry because cassette 24 rotates The particle contamination problems come.
As one preferred embodiment, can by described air inlet pipe 22 according to the pattern of spiral from bottom to top around cassette The sidepiece of 24 is configured.Such that make only to arrange an air inlet pipe, it is also ensured that the silicon chip of every layer can connect equably Contact reacting gas.
In view of gas along the crushing of tube wall, it is also possible to by the area of injection orifice summation design of each nozzle in described air inlet pipe 22 For the cross-sectional area less than this air inlet pipe, it is uniformity to ensure the amount of the reacting gas sprayed from each nozzle.
As other preferred embodiment, the cross section of described air inlet pipe 22 can be processed as circle or polygon, with Ensure that reacting gas can flow in air inlet pipe swimmingly.
It is also possible that the spout stating nozzle is processed as circle, triangle or polygon, to ensure that reacting gas can be equal Even and spray from each nozzle glibly.
As further preferred embodiment, for avoiding gas along the crushing of tube wall, it is also possible to by described air inlet pipe Diameter is processed according to being gradually reduced from bottom to top.It is equally possible that to each described nozzle in this air inlet pipe according to spray The mode that open area is gradually reduced from bottom to top along described air inlet pipe is processed.
As an optional embodiment, on the basis of said structure, can set in the side wall lower ends in furnace process chamber Putting several air inlets, meanwhile, make each air inlet correspondence connect an air inlet pipe, each air inlet pipe is from bottom to top around brilliant The sidepiece of boat is configured, thus can ensure more uniformly to eject reacting gas from the sidepiece of cassette.
As one preferred embodiment, can arrange two air inlet pipe, each air inlet pipe connects an air inlet respectively, Two described air inlet pipe are symmetrical arranged around the sidepiece of cassette from bottom to top by the left and right hand of spiral respectively, to be formed more preferably Uniformly spray the effect of reacting gas.
In sum, the present invention is by arranging air inlet pipe around cassette from bottom to top at furnace process intracavity, and in air inlet Multiple nozzle it is uniformly arranged on pipe, can be from the side of cassette equably to every layer of silicon chip injection reaction gas cassette by nozzle Body, make product when technique can uniform contact to reacting gas, and the magnetic fluid bottom cassette can be removed, make cassette in operation Journey keeps transfixion, thus while ensureing product thickness uniformity, decreases the pollution that granule causes.
The above-described the preferred embodiments of the present invention that are only, described embodiment is also not used to limit the patent guarantor of the present invention Protect scope, the equivalent structure change that the description of the most every utilization present invention and accompanying drawing content are made, in like manner should be included in In protection scope of the present invention.

Claims (10)

1. the air intake installation of a boiler tube, it is characterised in that including:
Air inlet, is located at the side wall lower ends in furnace process chamber, and it connects external reaction gas piping;
Air inlet pipe, is located in process cavity, and its one end connects air inlet, and the other end is closed, and described air inlet pipe is from bottom to top around work The cassette of skill intracavity is arranged;
Multiple nozzles, along intake manifold length direction and are uniformly arranged towards cassette;
Wherein during technique, by being passed through reacting gas in air inlet pipe by air inlet, and sprayed to cassette by each nozzle, make cassette In every layer of silicon chip all uniform contact to reacting gas, meanwhile, keep cassette to be in transfixion state, to ensure that product is thick While degree uniformity, it is to avoid bring particle contamination because cassette rotates.
The air intake installation of boiler tube the most according to claim 1, it is characterised in that described air inlet is one to several, often Individual air inlet correspondence connects an air inlet pipe.
The air intake installation of boiler tube the most according to claim 1, it is characterised in that described air inlet pipe is by screw type from bottom to top Sidepiece around cassette is arranged.
The air intake installation of boiler tube the most according to claim 1, it is characterised in that the spout face of each nozzle in described air inlet pipe Long-pending summation is less than the cross-sectional area of this air inlet pipe.
The air intake installation of boiler tube the most according to claim 1, it is characterised in that the cross section of described air inlet pipe is circular or many Limit shape.
The air intake installation of boiler tube the most according to claim 4, it is characterised in that the spout of described nozzle is circular, triangle Shape or polygon.
The air intake installation of boiler tube the most according to claim 3, it is characterised in that the diameter of described air inlet pipe from bottom to top by The least.
The air intake installation of boiler tube the most according to claim 7, it is characterised in that the area of injection orifice of each described nozzle is along described Air inlet pipe is gradually reduced from bottom to top.
The air intake installation of boiler tube the most according to claim 1, it is characterised in that the spout of described nozzle is towards cassette level Arrange.
The air intake installation of boiler tube the most according to claim 1, it is characterised in that described air inlet pipe is two, connects respectively One air inlet, two described air inlet pipe are symmetrical arranged around the sidepiece of cassette from bottom to top by the left and right hand of spiral respectively.
CN201610770371.7A 2016-08-30 2016-08-30 A kind of inlet duct of boiler tube Active CN106191990B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610770371.7A CN106191990B (en) 2016-08-30 2016-08-30 A kind of inlet duct of boiler tube

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610770371.7A CN106191990B (en) 2016-08-30 2016-08-30 A kind of inlet duct of boiler tube

Publications (2)

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CN106191990A true CN106191990A (en) 2016-12-07
CN106191990B CN106191990B (en) 2018-10-16

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109161871A (en) * 2018-08-23 2019-01-08 德淮半导体有限公司 Furnace tube apparatus and its working method
CN110854047A (en) * 2019-11-27 2020-02-28 北京北方华创微电子装备有限公司 Process chamber and semiconductor processing equipment
CN111725102A (en) * 2020-06-18 2020-09-29 北京北方华创微电子装备有限公司 Furnace tube in semiconductor process equipment and semiconductor process equipment
CN111834257B (en) * 2020-06-11 2021-06-04 长江存储科技有限责任公司 Air inlet device of furnace tube and furnace tube structure thereof

Citations (11)

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Publication number Priority date Publication date Assignee Title
JPS52149064A (en) * 1976-06-07 1977-12-10 Nippon Telegr & Teleph Corp <Ntt> Device for ipitaxial growth
JPS62230978A (en) * 1986-03-31 1987-10-09 Canon Inc Deposited film forming device
JPH0766130A (en) * 1993-08-23 1995-03-10 Nec Kansai Ltd Chemical vapor deposition system
WO1999036588A1 (en) * 1998-01-15 1999-07-22 Torrex Equipment Corporation Method and apparatus for improved chemical vapor deposition processes using tunable temperature controlled gas injectors
KR20070059512A (en) * 2005-12-06 2007-06-12 주식회사 탑테크이십일 An ion plating jig ass'y
CN102586759A (en) * 2011-01-11 2012-07-18 北京北方微电子基地设备工艺研究中心有限责任公司 Gas delivery system and semiconductor processing equipment applying same
CN102639438A (en) * 2009-11-25 2012-08-15 戴纳泰克工程有限公司 Reactor and method for production of silicon
CN102732852A (en) * 2012-07-06 2012-10-17 乐山新天源太阳能科技有限公司 Silicon nitride film preparation device
CN102938389A (en) * 2012-11-20 2013-02-20 上海宏力半导体制造有限公司 Depositing device
CN103060774A (en) * 2011-10-24 2013-04-24 北京北方微电子基地设备工艺研究中心有限责任公司 Chamber device and substrate processing equipment with same
CN203741412U (en) * 2014-01-17 2014-07-30 北京七星华创电子股份有限公司 Atomic layer thin film deposition air inlet device

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52149064A (en) * 1976-06-07 1977-12-10 Nippon Telegr & Teleph Corp <Ntt> Device for ipitaxial growth
JPS62230978A (en) * 1986-03-31 1987-10-09 Canon Inc Deposited film forming device
JPH0766130A (en) * 1993-08-23 1995-03-10 Nec Kansai Ltd Chemical vapor deposition system
WO1999036588A1 (en) * 1998-01-15 1999-07-22 Torrex Equipment Corporation Method and apparatus for improved chemical vapor deposition processes using tunable temperature controlled gas injectors
KR20070059512A (en) * 2005-12-06 2007-06-12 주식회사 탑테크이십일 An ion plating jig ass'y
CN102639438A (en) * 2009-11-25 2012-08-15 戴纳泰克工程有限公司 Reactor and method for production of silicon
CN102586759A (en) * 2011-01-11 2012-07-18 北京北方微电子基地设备工艺研究中心有限责任公司 Gas delivery system and semiconductor processing equipment applying same
CN103060774A (en) * 2011-10-24 2013-04-24 北京北方微电子基地设备工艺研究中心有限责任公司 Chamber device and substrate processing equipment with same
CN102732852A (en) * 2012-07-06 2012-10-17 乐山新天源太阳能科技有限公司 Silicon nitride film preparation device
CN102938389A (en) * 2012-11-20 2013-02-20 上海宏力半导体制造有限公司 Depositing device
CN203741412U (en) * 2014-01-17 2014-07-30 北京七星华创电子股份有限公司 Atomic layer thin film deposition air inlet device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109161871A (en) * 2018-08-23 2019-01-08 德淮半导体有限公司 Furnace tube apparatus and its working method
CN110854047A (en) * 2019-11-27 2020-02-28 北京北方华创微电子装备有限公司 Process chamber and semiconductor processing equipment
CN110854047B (en) * 2019-11-27 2022-08-16 北京北方华创微电子装备有限公司 Process chamber and semiconductor processing equipment
CN111834257B (en) * 2020-06-11 2021-06-04 长江存储科技有限责任公司 Air inlet device of furnace tube and furnace tube structure thereof
CN111725102A (en) * 2020-06-18 2020-09-29 北京北方华创微电子装备有限公司 Furnace tube in semiconductor process equipment and semiconductor process equipment

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