CN106102342A - Flexible printed circuit board installs additional uses vacuum fixture system - Google Patents

Flexible printed circuit board installs additional uses vacuum fixture system Download PDF

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Publication number
CN106102342A
CN106102342A CN201610282056.XA CN201610282056A CN106102342A CN 106102342 A CN106102342 A CN 106102342A CN 201610282056 A CN201610282056 A CN 201610282056A CN 106102342 A CN106102342 A CN 106102342A
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China
Prior art keywords
vacuum
additional
flexible pcb
plate
hole
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CN201610282056.XA
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CN106102342B (en
Inventor
郑泰国
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Ora Cam Kk
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Ora Cam Kk
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452Solder masks
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05Flexible printed circuits [FPCs]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01Tools for processing; Objects used during processing
    • H05K2203/0147Carriers and holders
    • H05K2203/0165Holder for holding a Printed Circuit Board [PCB] during processing, e.g. during screen printing

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

The present invention relates to flexible printed circuit board and install vacuum fixture system of using additional, described fixture is fixing in the parts topping-off operation operation of flexible PCB (10) installs flexible PCB (10) additional, including: clamping plate (110);Vacuum adsorption plate (120), it is incorporated into below clamping plate (110) removedly;Vacuum provides plate (130), and it is incorporated into below vacuum adsorption plate (120) and mask plate (140), and it is installed on above clamping plate (110) removedly.The chucking appliance system of the present invention is conducive to the operation of automatization, job stabilization and efficiency can be greatly improved, and when dismounting, flexible PCB does not stay residue, in addition, carry out inter process when moving or carry out keeping, it is also possible to stably support, fixing flexible circuit board perform operation, and when mask plate to be installed, when sprinkling brazing powder is coated, raise above flexible PCB, above clamping plate, enabling efficiently perform operation.

Description

Flexible printed circuit board installs additional uses vacuum fixture system
Technical field
The present invention relates to flexible printed circuit board and install vacuum fixture system of using additional, described fixture is at flexible PCB (10) Fixing in parts topping-off operation operation and install described flexible PCB (10) additional, the flexible printed circuit board related to installs additional uses vacuum clip Tool system (100) is characterised by, including: clamping plate (110), it arranges and is formed with installing additional of shape of through holes with having predetermined distance Depressed part (111) so that described flexible PCB (10) can insert to enter from above the state of the set degree of depth (d) and add Dress, and described each install additional depressed part (111) be formed in its lower end support described flexible PCB (10) install staggered floor portion additional (112), it is formed and through to bottom installs through hole (113) additional;
Vacuum adsorption plate (120), it is incorporated into removedly below described clamping plate (110), is formed the most respectively Have insert respectively install additional described in each through hole (113) and be formed multiple vacuum provide through hole (122) there is intended height (h) Protrusion supporting part (121);
Vacuum provides plate (130), and it is incorporated into below described vacuum adsorption plate (120), and depression is formed in the above More than one bonding in vacuum hole (131) and more than one vacuum chamber (132), described bonding in vacuum hole (131) is connected to borrow Help vacuum provide means (not shown) and accept provide vac sorb pressure, described vacuum chamber (132) continuously coupled in Described bonding in vacuum hole (131), so as to provide through hole (122) to provide vacuum to described vacuum;
Mask plate (140), it is installed on above described clamping plate (110) removedly, with at described flexible PCB (10) the corresponding chadless of the soldering pattern (40) that surface is formed is formed with pattern holes (141);
And, it is characterised in that described intended height (h) is when described protrusion supporting part (121) is inserted in described respectively When installing through hole (113) additional, make described flexible PCB (10) above can raise so that close to described clamping plate (110) above Highly.
Background technology
It is said that in general, flexible PCB (FPCB:Flexible Printed Circuit Board) is to have flexibility (Flexiblity) printed circuit the substrate of mounted member are constituted in the one or two sides of base material, recently, as constituting hands Machine, smart mobile phone, panel computer etc. are small-sized/element of the circuit of portable electronic device and be widely used.
Constitute in the method for circuit parts are installed in this flexible PCB, have various technique, but due to tool There is flexibility, thus in process, himself be difficult to fix to keep set shape, due to this spy of flexible PCB Property, typically more than one multiple described flexible PCBs are installed in fixture, fix and carry out operation.Most situation Be, by silk screen printing or corresponding method, welding paste (Cream Solder) coat on flexible PCB required Behind position, install parts additional, by reflow soldering (Reflow-Soldering), be brazed in pattern (pattern).In order to perform this Plant operation, need described flexible PCB to be installed additional and is fixed on means or the method for described fixture, mainly used such as Fig. 1 in the past Shown in, after described fixture adheres to the cohesive component of such as two-sided tape, described flexible PCB is attached to described double The method carrying out operation after the adhesive tape of face.But, for this original method, major part situation is to utilize manual work seriatim Industry carries out the attachment of two-sided tape and the attachment of flexible PCB, thus there is the problem that its working performance greatly declines.It addition, There is problems of, during operation is repeated, the bonding force of described two-sided tape declines gradually, thus not only needs at any time Change and paste described two-sided tape, and, in operation is carried out, owing to the bonding force of described two-sided tape is bad, frequently occur Described flexible PCB separates the phenomenon come off from described fixture.
On the other hand, about utilizing vacuum and the fixture of fixing described flexible PCB or be similarly comprised therewith, under State in patent documentation 1 " the fixing vacuum chuck of flexible base board " (Republic of Korea's registered patent the 10-0570972nd) and disclose one Plant and constitute, including: adsorption plate, flattened formed above it, place for processed substrate;Inner vacuum pipeline, it is in described suction Being internally formed of attached plate;Exterior vacuum line, it is while connecting with described inner vacuum pipeline, on the limit of described adsorption plate Position, edge is formed, the edge of substrate described in vac sorb.
But, the edge of this described existing invention vac sorb substrate, due to the characteristic in this composition, as Such as in the initial process making the thin film absorption process of the conductive layer of flexible PCB self like that, work as flexible circuit The shape of plate has when circle or tetragon etc. compare the most simple shape can be applied, but there is problems of, as in figure 2 it is shown, It is difficult to use in and makes the flexible PCB with more complicated shape firmly be adjacent to the folder being fixed in parts topping-off operation operation Tool.
[prior art literature]
[patent documentation]
Patent documentation 1: Republic of Korea's registered patent the 10-0570972nd
Summary of the invention
(solving the technical problem that)
The problem that the present invention is to solve described original invention, its problem is to provide a kind of flexible PCB vac sorb folder Tool device, it is possible to recycle vacuum with limiting without number of times, make multiple flexible PCB firmly be adjacent to be fixed on parts and install additional Fixture in flow chart, in order to be conducive to the operation of automatization, job stabilization and efficiency can not only be greatly improved, and When dismounting, flexible PCB is not remained in office meaning residue.
It addition, its problem is so that flexible PCB is installed in folder to be inserted in the state installing the set degree of depth of depressed part additional Plate, even if thus carrying out inter process when peeling off from vacuum adsorption plate, removing vacuum pressure supply and move or protect Guan Shi, it is also possible to stably support, fixing flexible circuit board perform operation.
On the other hand, its problem is so that when mask plate to be installed, and when sprinkling brazing powder is coated, makes flexible PCB Above raise, in order to above described clamping plate, enabling efficiently perform operation.
(solving the means of problem)
For reaching described problem, just fix in the parts topping-off operation operation of flexible PCB (10) and install described flexibility additional For the fixture of circuit board (10), it is a feature of the present invention that and include: clamping plate (110), it arranges formation with having predetermined distance Have shape of through holes installs depressed part (111) additional so that described flexible PCB (10) can be to enter from above the set degree of depth (d) State insert and install additional, and described each install additional depressed part (111) be formed in its lower end support described flexible PCB (10) the staggered floor portion that installs additional (112), is formed and through to bottom installs through hole (113) additional;
Vacuum adsorption plate (120), it is incorporated into removedly below described clamping plate (110), is formed the most respectively Have insert respectively install additional described in each through hole (113) and be formed multiple vacuum provide through hole (122) there is intended height (h) Protrusion supporting part (121);
Vacuum provides plate (130), and it is incorporated into below described vacuum adsorption plate (120), and depression is formed in the above More than one bonding in vacuum hole (131) and more than one vacuum chamber (132), described bonding in vacuum hole (131) is connected to borrow Help vacuum provide means (not shown) and accept provide vac sorb pressure, described vacuum chamber (132) continuously coupled in Described bonding in vacuum hole (131), so as to provide through hole (122) to provide vacuum to described vacuum;
Mask plate (140), it is installed on above described clamping plate (110) removedly, with at described flexible PCB (10) the corresponding chadless of the soldering pattern (40) that surface is formed is formed with pattern holes (141);
And, it is characterised in that described intended height (h) is when described protrusion supporting part (121) is inserted in described respectively When installing through hole (113) additional, make described flexible PCB (10) above can raise so that close to described clamping plate (110) above Highly.
Additionally, it is characterised in that described mask plate (140) also includes protruding protuberance (142) below formation, when described When mask plate (140) is installed on described clamping plate (110) above, described protuberance (142) below be inserted in described in install depression additional Portion (111), be inserted in respectively when described protrusion supporting part (121) described in install through hole (113) additional, make described flexible PCB (10) Above raise so that during close to described clamping plate (110) above, described protuberance (142) below can contact described flexible electrical Above road plate (10).
Additionally, it is characterised in that described vacuum chamber (132) is by providing plate (130) company that depression is formed in described vacuum Connect passage portion (133) and continuously coupled, be connected to described bonding in vacuum hole (131).
Additionally, it is characterised in that the described set degree of depth (d) has the thickness (t) big 0.5 than described flexible PCB (10) ~the value of 5.
Additionally, it is characterised in that described each installs depressed part (111) additional and carry out classification configurations on described clamping plate (110), Be divided into: on described flexible PCB (10) facing to upside insert should have position carry out installing additional described in install depressed part additional (111), on described flexible PCB (10) facing to downside insert backward position carry out installing additional described in install depression additional Portion (111).
Additionally, it is characterised in that also include: pattern connecting path portion (133a), it is formed to be positioned to described flexible electrical The pattern that described pattern (40) the institute forming part of road plate (10) is supported protrudes the bottom of supporting part (121a), the most mutually Formed communicatively;Substrate connecting path portion (133b), it forms to be positioned at the substrate position to described flexible PCB (10) and enters The substrate that row supports protrudes the bottom of supporting part (121b), is formed with being interconnected respectively.
(effect of invention)
According to the present invention, this have the advantage that and a kind of flexible PCB vacuum adsorption fixture device can be provided, it is possible to nothing Number of times recycles vacuum with limiting, and makes multiple flexible PCB firmly be adjacent to the folder being fixed in parts topping-off operation operation Tool, in order to be conducive to the operation of automatization, can not only be greatly improved job stabilization and efficiency, and when dismounting, flexible Meaning residue is not remained in office on circuit board.
It addition, this have the advantage that so that flexible PCB installs additional to be inserted in the state installing the set degree of depth of depressed part additional In clamping plate, even if thus carrying out inter process when peeling off from vacuum adsorption plate, removing vacuum pressure supply and move or enter During row keeping, it is also possible to stably support, fixing flexible circuit board perform operation.
On the other hand, this have the advantage that, when mask plate to be installed, when sprinkling brazing powder is coated, make flexible circuit The above of plate raises, in order to above described clamping plate, enabling efficiently perform operation.
Accompanying drawing explanation
Fig. 1 shows the flow chart of the flexible PCB flow chart of original one embodiment of invention.
Fig. 2 shows the flexible PCB one of the flexible PCB vacuum adsorption fixture device of application one embodiment of the invention The axonometric chart of individual example.
Fig. 3 shows the solid being monolithically fabricated of the flexible PCB vacuum adsorption fixture device of one embodiment of the invention Figure.
Fig. 4 shows the solid of the composition of the clamping plate of the flexible PCB vacuum adsorption fixture device of one embodiment of the invention Figure.
Fig. 5 shows the composition of the vacuum adsorption plate of the flexible PCB vacuum adsorption fixture device of one embodiment of the invention Axonometric chart.
Fig. 6 shows that the vacuum of the flexible PCB vacuum adsorption fixture device of one embodiment of the invention provides the composition of plate Axonometric chart.
Fig. 7 shows that the vacuum of the flexible PCB vacuum adsorption fixture device of one embodiment of the invention provides the composition of plate Rear perspective view.
Fig. 8 shows the section mould of the use process of the flexible PCB vacuum adsorption fixture device of one embodiment of the invention Formula figure.
Fig. 9 shows installing and using of the flexible PCB vacuum adsorption fixture device mask plate of one embodiment of the invention The profile schema diagram of journey.
Figure 10 shows the mode above of the composition of the flexible PCB vacuum adsorption fixture device of another embodiment of the present invention Figure.
(symbol description)
10: flexible PCB
40: soldering pattern
100: flexible PCB vacuum adsorption fixture device
110: clamping plate
111: install depressed part 112 additional: install staggered floor portion additional
113: install through hole additional
120: vacuum adsorption plate
121: protrude supporting part
121a: pattern protrudes supporting part 121b: substrate and protrudes supporting part
122: vacuum provides through hole
122a: pattern vacuum provides through hole 122b: substrate vacuum to provide through hole
124: parts install caught portion 125: the first additional and combine through hole
130: vacuum provides plate
131: bonding in vacuum hole 132: vacuum chamber
133: connecting path portion 133a: pattern connecting path portion
133b: substrate connecting path portion
140: mask plate
141: pattern holes 142: protuberance below
Detailed description of the invention
With reference to the accompanying drawings, the flexible printed circuit board of detailed description one embodiment of the invention installs additional and uses vacuum fixture system System.It is initially noted that in the accompanying drawings, identical element or parts represent with identical reference marks as far as possible. Aspect of the present invention is being described, in order to not make idea of the invention unclear, is omitting to relevant known function or composition specifically Bright.
First, just the flexible PCB (10) of the application present invention illustrates.On described flexible PCB (10), such as figure Shown in 2, the above and below at the described flexible PCB (10) with flexibility (Flexibility) is formed for soldering (soldering) soldering pattern (40), typically, can install such as headphone jack connector, Micro USB additional and connect Device, connect even the most first-class protrusion attachment members, or install additional such as resistor disc, capacitance sheet or CPU surface mounting devices (SMD: Surface mounted device) install.
Flexible PCB vacuum adsorption fixture device (100) of one embodiment of the invention relates in flexible PCB (10) Parts topping-off operation operation in the fixing fixture installing described flexible PCB (10) additional, as it is shown on figure 3, generally comprise clamping plate (110), vacuum adsorption plate (120), vacuum provide plate (130) and mask plate (140) to constitute.
First, clamping plate (110) are illustrated.Described clamping plate (110), as shown in Fig. 3, Fig. 4 and Fig. 8, have predetermined distance What ground arrangement was formed with shape of through holes installs depressed part (111) additional so that described flexible PCB (10) can be to enter from above The state of the set degree of depth (d) is inserted and is installed additional.Now, described each installs depressed part (111) additional as shown in Fig. 3 and Fig. 8, under it End is formed with the staggered floor portion that installs additional (112) supporting described flexible PCB (10), is formed and through to bottom installs through hole additional (113).This described clamping plate (110) have and carry out transferring or execution unit adds in the state installing described flexible PCB (10) additional A kind of function of the jig pallet of each operations such as dress, soldering.
On the other hand, described flexible PCB (10), as shown in (A) in Fig. 8, installs depressed part additional described in being inserted in (111) state of the described set degree of depth (d) is installed in described clamping plate (110), even if thus for each inter process transfer etc., from Inter process is carried out when moving or carry out keeping, also under the state that described vacuum adsorption plate (120) peels off, remove vacuum pressure supply Can stably support, fix described flexible PCB (10) and perform operation.Now, described each installs depressed part (111) additional As shown in Fig. 3 and Fig. 8, it is processed according to the shape of described flexible PCB (10).That is, depressed part (111) is installed described in additional Inner peripheral surface has such a shape, that the outer peripheral face of described flexible PCB (10) is properly inserted, meanwhile so that described flexibility Circuit board (10) can move up and down so that has and both adds on the basis of the outer peripheral face shape of described flexible PCB (10) The shape of fixed machining tolerance (usual 50~200 μm).
It addition, be respectively shown according to the needs in operation, such as (A) and (B) in Fig. 2, there is flexible circuit described in requirement Plate (10) is installed in should be had position or be installed in the situation of the backward position turned upside down.For this situation, in order to utilize one Individual described clamping plate (110), can all be installed in described flexible PCB (10) and should have position or backward position, preferably described Each installs depressed part (111) additional as it is shown on figure 3, carry out classification configurations on described clamping plate (110), is divided into: for described flexible electrical On road plate (10) facing to upside insert should have position carry out installing additional described in install depressed part (111) additional, for described flexibility On circuit board (10) facing to downside insert backward position carry out installing additional described in install depressed part (111) additional.
Below vacuum adsorption plate (120) is illustrated.Described vacuum adsorption plate (120) as depicted in figs. 3 and 5, can be torn open It is incorporated into unloading below described clamping plate (110), is respectively formed with in the above to insert respectively and described in each, installs through hole (113) additional And the protrusion supporting part (121) with intended height (h) of multiple vacuum offer through hole (122) is formed.Now, described vacuum There is provided through hole (122) that can be changed it according to the size of described flexible PCB (10) or area and form number.That is, needing very In place of the larger area of the attached fixing described flexible PCB (10) of suction, it is preferable that form multiple described vacuum and through hole is provided (122), in place of needing vac sorb to fix the less area portions of described flexible PCB (10) so that formed described in one or two Vacuum provides through hole (122) to meet.
On the other hand, the described intended height (h) of described protrusion supporting part (121) is as shown in (B) in Fig. 8, preferably When installing through hole (113) additional described in described protrusion supporting part (121) is inserted in respectively, make above described flexible PCB (10) Can raise so that close to described clamping plate (110) height above.
It addition, the described flexible PCB that the above shape of described protrusion supporting part (121) is preferably processed into and supports (10) shape of the parts installed additional on is corresponding.
Plate (130) is provided to illustrate with regard to vacuum below.Described vacuum provides plate (130) as shown in Figure 3 and Figure 6, in conjunction with Below described vacuum adsorption plate (120), depression is formed with more than one bonding in vacuum hole (131) and one in the above Above vacuum chamber (132), described bonding in vacuum hole (131) is connected to provide means (not shown) to accept by vacuum The vac sorb pressure provided, described vacuum chamber (132) is continuously coupled in described bonding in vacuum hole (131), so as to institute Stating vacuum provides through hole (122) to provide vacuum.Now, the most described vacuum chamber (132) is by providing plate (130) in described vacuum The connecting path portion (133) that upper depression is formed is continuously coupled, is connected to described bonding in vacuum hole (131).
Below mask plate (140) is illustrated.Described mask plate (140), as shown in Fig. 3 and Fig. 7, is installed removedly Above described clamping plate (110), be configured with the soldering pattern (40) formed on the surface of described flexible PCB (10) Corresponding chadless is formed with pattern holes (141).
Now, described mask plate (140), as shown in Fig. 7 and Fig. 9, the most also includes protruding protuberance below formation (142), when described mask plate (140) is installed on described clamping plate (110) above, described protuberance (142) below is inserted in Described install depressed part (111) additional, be inserted in respectively when described protrusion supporting part (121) described in install through hole (113) additional, make described soft Property circuit board (10) above raise so that during close to described clamping plate (110) above, described protuberance (142) below can connect Touch above described flexible PCB (10);Make it possible to prevent the brazing powder of sprinkling or soldering from sticking with paste and be attached to described soldering pattern (40) part outside.
On the other hand, described flexible PCB (10) as shown in Figure 10, can be divided into and carry out being formed with of the operations such as soldering The position of described pattern (40) and the position installed additional for parts etc. in addition, in flow chart, often consolidate by different absorption affinities The position and the position installed additional for parts etc. in addition that are shaped as described pattern (40) are more favourable.
As it has been described above, to enable with the fixing position being formed with described pattern (40) of different absorption affinities and in addition The position installed additional for parts etc., the flexible printed circuit board of another embodiment of the present invention install additional with vacuum fixture system (100) as Shown in Figure 10, the most also including: pattern connecting path portion (133a), it forms to be positioned at the institute to described flexible PCB (10) State the bottom of pattern protrusion supporting part (121a) that pattern (40) institute forming part is supported, formed with being interconnected respectively; Substrate connecting path portion (133b), it forms to be positioned at the substrate that the substrate position to described flexible PCB (10) is supported Protrude the bottom of supporting part (121b), formed with being interconnected respectively.That is, position such as Fig. 8 institute of described pattern (40) it is formed with Show, while protruded supporting part (121a) support by pattern, provide through hole (122a) by pattern vacuum, accept supply by leading to Cross the absorption affinity of the vacuum pressure generation supplied in pattern connecting path portion (133a) and be adsorbed.On the other hand, described flexible electrical The substrate position of road plate (10) as shown in Figure 8, while protruded supporting part (121b) support by substrate, is carried by substrate vacuum For through hole (122b), accept supply and by the absorption affinity of the vacuum pressure generation supplied by substrate connecting path portion (133b) and inhale Attached.
Therefore, supply to pattern connecting path portion (133a) and substrate connecting path portion (133b) by means of regulating equably Vacuum pressure and supply, in flow chart, it is possible to the fixing position being formed with described pattern (40) of different absorption affinities In addition the position installed additional for parts etc., so that can be fed to described soft the absorption affinity classification being best suitable for performing operation The position being formed with described pattern (40) of property circuit board (10) and position in addition.
Flexible printed circuit board with regard to one embodiment of the invention installs additional and enters with the operating of vacuum fixture system (100) below Row explanation.
First, as shown in (A) in Fig. 8, described flexible PCB (10) is transferred or in management process in operation, to insert Enter the described state installing the described set degree of depth (d) of depressed part (111) additional to be installed in described clamping plate (110) and transfer or protect Pipe.Therefore, for each inter process transfer etc., even if peeling off from described vacuum adsorption plate (120), removing vacuum pressure supply Inter process is carried out when moving or carry out keeping, it is also possible to stably support, fixing described flexible PCB (10) holding under state Row operation.
On the other hand, when need execution unit to install additional or soldering etc. to the manufacturing procedure of described flexible PCB (10) time, Described clamping plate (110), as shown in (B) in Fig. 8, are placed in described vacuum adsorption plate (120) and provide plate (130) with described vacuum Coalition on.Now, described protrusion supporting part (121) be inserted in described in install through hole (113) additional and boost described flexible circuit Plate (10), makes the above of described flexible PCB (10) can raise so that close to described clamping plate (110) above.Therefore, it can It is easily performed the parts to described flexible PCB (10) to install additional or the various manufacturing procedures such as soldering.
Then, the vac sorb pressure accepting to provide by means of vacuum offer means (not shown) passes sequentially through institute State bonding in vacuum hole (131), connecting path portion (133), described vacuum chamber (132), it is provided that provide through hole to described vacuum (122), vac sorb fixing described flexible PCB (10).Now, described vacuum adsorption plate (120) provides with described vacuum Plate (130) be combined with each other, thus the leakage of vacuum pressure does not the most occur, as shown in (B) in Fig. 8, and described flexible PCB (10) adsorbed in the described state installing depressed part (111) additional to be properly inserted, thus outside and described vacuum offer through hole (122), between, it is in the state cut off by described flexible PCB (10) and the described side wall surface installing depressed part (111) additional, because of And there is the leakage of vacuum pressure hardly.Therefore, can not only extremely efficiently carry out vac sorb, and not occur The noise caused because of the leakage of vacuum pressure or vibration.
Then, as it is shown in figure 9, described mask plate (140) be installed on described clamping plate (110) above after, spray soldering Powder or soldering are stuck with paste so that through described pattern holes (141), be attached to described soldering pattern (40) exactly.
On the other hand, after a manufacturing procedure completes, release and apply vacuum pressure, described clamping plate (110) again from institute Stating vacuum adsorption plate (120) provides the coalition of plate (130) to peel off with described vacuum.Now, as shown in (A) in Fig. 8, described Flexible PCB (10) is by means of deadweight, with again insertable in the described state installing the described set degree of depth (d) of depressed part (111) additional It is installed in described clamping plate (110), then, to keep the state stably installing state additional, to the transfer of next operation or keeping.
Above, most preferred embodiment is disclosed in the accompanying drawings and the description.Employ specific term at this, but this is In using for the purpose of illustrating the invention, it is not intended to meaning and defines or limits the present invention described in claims Scope.Therefore, as long as those skilled in the art are just it will be appreciated that various deformation and equalization can be derived there Other embodiments.Therefore, the real technical protection scope of the present invention should be true according to the technological thought of appended claims Fixed.

Claims (5)

1. a flexible printed circuit board installs additional and uses vacuum fixture system (100), and described fixture is in the portion of flexible PCB (10) Part topping-off operation operation is fixed and installs described flexible PCB (10) additional, it is characterised in that including:
Clamping plate (110), its arrange while there is predetermined distance be formed with shape of through holes install depressed part (111) additional so that described soft Property circuit board (10) can be inserted to enter from above the state of the set degree of depth (d) and install additional, and described each installs depressed part additional (111) it is formed with the staggered floor portion that installs additional (112) of the described flexible PCB of support (10) in its lower end, is formed to bottom through Install through hole (113) additional;
Vacuum adsorption plate (120), it is incorporated into below described clamping plate (110) removedly, is respectively formed with in the above point Do not insert install additional described in each through hole (113) and be formed multiple vacuum provide through hole (122) there is the convex of intended height (h) Go out supporting part (121);
Vacuum provides plate (130), and it is incorporated into below described vacuum adsorption plate (120), and depression is formed with one in the above Above bonding in vacuum hole (131) and more than one vacuum chamber (132), described bonding in vacuum hole (131) is connected to by very Empty offer means (not shown) and the vac sorb pressure provided is provided, described vacuum chamber (132) is continuously coupled in described Bonding in vacuum hole (131), so as to provide through hole (122) to provide vacuum to described vacuum;
Mask plate (140), it is installed on above described clamping plate (110) removedly, with in described flexible PCB (10) The corresponding chadless of soldering pattern (40) that formed of surface be formed with pattern holes (141);
And, it is characterised in that described intended height (h) be inserted in respectively when described protrusion supporting part (121) described in install additional During through hole (113), make the above of described flexible PCB (10) can raise so that close to described clamping plate (110) height above Degree.
Flexible printed circuit board the most according to claim 1 installs additional with vacuum fixture system (100), it is characterised in that
Described mask plate (140) also includes protruding protuberance (142) below formation, when described mask plate (140) is installed on institute When stating clamping plate (110) above, described protuberance (142) below be inserted in described in install depressed part (111) additional, when described protrusion props up Support part (121) installs through hole (113) additional described in being inserted in respectively, makes the above of described flexible PCB (10) raise so that close to institute When stating clamping plate (110) above, described protuberance (142) below can contact above described flexible PCB (10).
Flexible printed circuit board the most according to claim 1 installs additional with vacuum fixture system (100), it is characterised in that
Described vacuum chamber (132) is by providing plate (130) the connecting path portion (133) that depression is formed to connect continuously in described vacuum Connect, be connected to described bonding in vacuum hole (131).
Flexible printed circuit board the most according to claim 3 installs additional with vacuum fixture system (100), it is characterised in that also Including:
Pattern connecting path portion (133a), it forms to be positioned at the described pattern (40) to described flexible PCB (10) and is formed The pattern that position is supported protrudes the bottom of supporting part (121a), is formed with being interconnected respectively;
Substrate connecting path portion (133b), it forms to be positioned at what the substrate position to described flexible PCB (10) was supported Substrate protrudes the bottom of supporting part (121b), is formed with being interconnected respectively.
Flexible printed circuit board the most according to claim 1 installs additional with vacuum fixture system (100), it is characterised in that
Described each installs depressed part (111) additional and carries out classification configurations on described clamping plate (110), is divided into:
For on described flexible PCB (10) facing to upside insert should have position carry out installing additional described in install depressed part additional (111)、
For on described flexible PCB (10) facing to downside insert backward position carry out installing additional described in install depressed part additional (111)。
CN201610282056.XA 2015-04-30 2016-04-29 Flexible printed circuit board, which installs additional, uses vacuum fixture system Active CN106102342B (en)

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KR10-2015-0061944 2015-04-30
KR1020150061944A KR101572124B1 (en) 2015-04-30 2015-04-30 Vaccum Zig For FPCB

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107613668A (en) * 2017-10-31 2018-01-19 广东欧珀移动通信有限公司 Flexible PCB patch jig

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101810491B1 (en) * 2016-06-01 2018-01-25 주식회사 오라컴 Cut off system for FPCB Vaccum Jig
KR102466154B1 (en) * 2021-03-25 2022-11-14 넥스타테크놀로지 주식회사 Apparatus for manufacturing printed circuit board
WO2023094908A1 (en) * 2021-11-25 2023-06-01 Orbotech Ltd. Improving processing of a flexible circuit board (cb) using a vacuum plate adapted to the cb design
KR200497336Y1 (en) * 2023-02-22 2023-10-11 김상봉 Vacuum valve and vacuum chuck equipped with vacuum valve

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201039592Y (en) * 2006-12-22 2008-03-19 英业达股份有限公司 Clamp for circuit board processing
KR20140024743A (en) * 2012-08-21 2014-03-03 삼성전기주식회사 Jig for manufacturing touch panel
KR20140058041A (en) * 2012-11-06 2014-05-14 주식회사 오라컴 Vaccum zig system for flexible printed circuit board

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003224395A (en) * 2002-01-31 2003-08-08 Matsushita Electric Ind Co Ltd Board receiving underlaid apparatus in electronic component mounting equipment
JP2006329729A (en) 2005-05-25 2006-12-07 Matsushita Electric Ind Co Ltd Measurement method for gap between substrate and mask, gap measurement means, and printer

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201039592Y (en) * 2006-12-22 2008-03-19 英业达股份有限公司 Clamp for circuit board processing
KR20140024743A (en) * 2012-08-21 2014-03-03 삼성전기주식회사 Jig for manufacturing touch panel
KR20140058041A (en) * 2012-11-06 2014-05-14 주식회사 오라컴 Vaccum zig system for flexible printed circuit board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107613668A (en) * 2017-10-31 2018-01-19 广东欧珀移动通信有限公司 Flexible PCB patch jig

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