JP2006329729A - Measurement method for gap between substrate and mask, gap measurement means, and printer - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a measurement means for a gap between a substrate and a mask for automatically eliminating the gap between the substrate and the mask. <P>SOLUTION: This means is used for measuring the gap between the substrate and the mask in a printer 1. The printer 1 is equipped with a stage 3 for supporting a peripheral part of the mask 2 for printing an electrical circuit on the substrate K and a substrate support table 5 for ascending/descending the substrate mounted thereon at a position below a printed part of the mask 2 supported on the stage. This means is equipped with a pressure sensor 14, communicating with substrate suction holes 12 opening in the surface of the support table. This means is equipped with a position detector 21 for detecting the height of the support table when the degree of vacuum, caused by the pressure sensor becomes a prescribed value or more in bringing the support table close to the mask supported on the stage, and an arithmetic part 22 for finding a difference between the height detected by the position detector and a reference height of the support table. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a gap measuring method and a gap measuring means between a screen mask and a substrate in a screen printing apparatus provided in a manufacturing process of electronic parts and the like, a printing apparatus equipped with the gap measuring means, and an electronic device using the gap measuring method. The present invention relates to a printing method for parts, a mask replacement method, and a mask abnormality detection method.

  The electronic component manufacturing process includes a printing process in which a conductive paste such as solder (hereinafter referred to as a paste) is printed on a substrate using a screen mask, and is automatically performed by a screen printing apparatus.

  In this screen printing apparatus, as shown in FIG. 4, a screen mask (hereinafter referred to as a mask) 51 is placed and supported on a stage 52, and is moved up and down to a position below the mask 51 supported by the stage 52. When the substrate K is placed on the freely arranged substrate support base 53, the substrate K is raised to the lower surface position of the mask 51 by the lifting device 54 of the substrate support base 53 and then filled on the mask 51. The paste P was applied through the squeegee 55, and an electric circuit or the like was printed on the substrate K (see, for example, Patent Document 1).

  By the way, as shown in FIG. 5, this type of mask 51 is usually made up of a mask main body 51a which is a printing unit on which an electric circuit is formed, and a holding frame 51b which holds the periphery of the mask main body 51a. Although it is configured, when the mask main body 51a is attached to the holding frame 51b, the mask main body 51a is attached in a state of being pulled in four directions, so after attaching the mask main body 51a, Therefore, as shown by the phantom line in FIG. 5, the mask main body 51a as a whole is in a state of being recessed toward the central opening side of the holding frame 51b.

  The mask 51 is exchanged according to the type of product. However, the amount of the dent differs for each mask 51 (specifically, for each manufacturer of the mask), and when the mask 51 is exchanged, A gap (gap) is inevitably formed between the lower surface of the mask body 51a and the upper surface of the substrate K.

As described above, when printing is performed in a state where there is a gap, the printed electric circuit is blurred and the quality is deteriorated.
Therefore, conventionally, every time the mask is replaced, the substrate support base is raised by an amount corresponding to the thickness of the substrate to be printed, and the operator presses the mask body from above with his / her hand, and there is a gap. I was checking to see if there was.
JP 2000-141600 A

  As described above, it is a very troublesome task to check whether there is a gap between the substrate and the mask main body by hand each time, and when there is a gap. However, since it is necessary to adjust the lift of the substrate support so that the gap is eliminated, there is a problem that it takes time to replace the mask.

  Accordingly, the present invention provides a gap measuring method and a gap measuring means between a substrate and a mask that can easily and quickly eliminate a gap between the substrate and the mask, a printing apparatus including the gap measuring means, and the gap measuring method. An object of the present invention is to provide a printing method, a mask replacement method, and a mask abnormality detection method in an electronic component using a mask.

In order to solve the above problems, a method for measuring a gap between a substrate and a mask according to the present invention includes a stage for supporting a peripheral portion of a mask for printing an electric circuit on the substrate, and a printing unit for the mask supported by the stage. A method of measuring a gap between a substrate and a mask in a printing apparatus provided with a substrate support that places the substrate at a lower position and moves up and down,
The substrate is raised with respect to the mask supported by the stage, and the degree of vacuum in the suction hole opened on the surface of the substrate support is measured, and the substrate when the degree of vacuum reaches a predetermined value or more. In this method, the height of the support base relative to the reference height is detected as a gap.

Further, the gap measuring means between the substrate and the mask of the present invention includes a stage that supports a peripheral portion of the mask for printing an electric circuit on the substrate, and a substrate below the printing portion of the mask supported by the stage. Means for measuring a gap between a substrate and a mask in a printing apparatus provided with a substrate support for mounting and moving up and down,
A pressure sensor that communicates with a suction hole of the substrate that opens on the surface of the substrate support; and when the substrate support is brought close to a mask supported by a stage, the degree of vacuum by the pressure sensor is a predetermined value. A position detection unit that detects the height of the substrate support table when the above is reached, and a calculation unit that obtains the difference between the height detected by the position detection unit and the reference height of the substrate support table. is there.

The printing apparatus for an electronic component according to the present invention includes a stage for supporting a peripheral portion of a mask for printing an electric circuit on a substrate constituting the electronic component, and a position below the printing portion of the mask supported by the stage. And a substrate supporting base for placing the substrate and raising and lowering the substrate,
A pressure sensor that communicates with a suction hole of the substrate that opens on the surface of the substrate support; and when the substrate support is brought close to a mask supported by a stage, the degree of vacuum by the pressure sensor is a predetermined value. A position detection unit that detects the height of the substrate support table when the above is reached, and a calculation unit that obtains the difference between the height detected by the position detection unit and the reference height of the substrate support table. is there.

In the printing method for an electronic component according to the present invention, the substrate is placed at a position below the printing unit with respect to the mask supported by the stage that supports the peripheral portion of the mask for printing the electric circuit on the substrate. The substrate support is raised and the degree of vacuum in the suction hole opened on the surface of the substrate support is measured, and the height relative to the reference height of the substrate support when the degree of vacuum exceeds a predetermined value. Using a mask gap measurement method that detects a gap as a gap,
In this method, an electrical circuit is printed on a substrate by adjusting the gap by periodically measuring the gap.

Further, the mask replacement method of the present invention is a substrate in which a substrate is placed at a position below the printing unit with respect to a mask supported by a stage that supports a peripheral portion of the mask for printing an electric circuit on the substrate. While raising the support table, measure the degree of vacuum in the suction holes opened on the surface of the substrate support table, and determine the height of the substrate support table relative to the reference height when the vacuum level exceeds a predetermined value. Using the mask gap measurement method to detect as a gap,
In this method, the gap is measured and the mask is replaced based on the measured gap size.

Furthermore, in the mask abnormality detection method of the present invention, the substrate is placed at a position below the printing unit with respect to the mask supported by the stage that supports the peripheral portion of the mask for printing the electric circuit on the substrate. The substrate support is raised and the degree of vacuum in the suction hole opened on the surface of the substrate support is measured, and the height relative to the reference height of the substrate support when the degree of vacuum exceeds a predetermined value. Using a mask gap measurement method that detects a gap as a gap,
In this method, a gap is measured and a mask abnormality is detected based on the measured gap size.

  According to the gap measuring method, the gap measuring means, and the printing apparatus, when replacing the mask, the substrate support is raised with respect to the mask placed on the stage, and the vacuum in the suction hole formed in the substrate support is increased. When the degree of vacuum exceeds a predetermined value, that is, when the gap disappears, the height relative to the reference height of the substrate support base is obtained, so the gap between the substrate and the mask Therefore, by reflecting this gap on the amount of elevation of the substrate support base, even when the mask is replaced, the gap can be easily and quickly eliminated, and high-precision printing can be performed. .

  According to the printing method for the electronic component, the gap between the substrate and the mask can be stably measured in a short time and accurately, so that the electronic component can be stably produced over a long period of time. it can. For example, even when the type of product is changed frequently, stable production can be performed without any trouble.

  Further, according to the mask exchange method, the gap between the substrate and the mask is stably and accurately measured, and based on the size of the gap, that is, the gap value is statistically treated and the mask is set at a certain reference value. Since replacement is made, electronic components can be stably produced over a long period of time. For example, even when the type of product is changed frequently, stable production can be performed without any trouble.

  Further, according to the above-described mask abnormality detection method, the mask abnormality is detected based on the size of the gap between the substrate and the mask. Therefore, production can be resumed without producing defective products.

[Embodiment]
Hereinafter, a substrate-mask gap measuring method and a gap measuring unit according to an embodiment of the present invention, and an electronic component printing apparatus including the gap measuring unit will be described. In addition, a printing method, a mask replacement method, and a mask abnormality detection method for an electronic component using the gap measurement method will be described later.

  This printing apparatus (also referred to as a screen printing apparatus) is disposed in the middle of the manufacturing process of an electronic component, and a conductive mask (hereinafter referred to as paste) such as solder is applied to a substrate (for example, a printed board) with a screen mask (hereinafter referred to as a paste). The electrical circuit is printed using a mask.

First, a schematic configuration of the printing apparatus will be described with reference to FIG.
In this printing apparatus 1, an opening 3a capable of guiding the substrate K is formed at the center, and a stage 3 for placing and supporting a mask 2 which can be raised and lowered at the periphery, and an opening of the stage 3 A substrate support 5 (also referred to as a support block) 5 is provided at the lower position in 3a so as to be movable up and down by the lifting device 4, and is provided on the substrate support 5 and connected to the substrate support 5 on the stage 3 And an adsorption means 6 for adsorbing and fixing the substrate K placed on the substrate, and when the substrate K placed on the substrate support 5 is raised, its upper surface is Control means 7 for controlling the lifting device 4 is provided so as to coincide (contact) with the lower surface of the mask 2 placed on the surface 3.

Next, the adsorption means 6 will be described.
The suction means 6 includes a vacuum chamber 11 formed in the substrate support 5, a plurality of suction holes 12 having an upper surface opened on the surface of the substrate support 5 and a lower end communicated with the vacuum chamber 11. An exhaust device 13 such as a vacuum pump that discharges air in the vacuum chamber 11 and a pressure sensor (also referred to as a vacuum pressure sensor) that communicates with the vacuum chamber 11 and measures the degree of vacuum in the vacuum chamber 11. 14).

  Further, the control means 7 controls the amount of lifting of the lifting device 4 of the substrate support 5 so that at least the upper surface of the substrate K used in the product matches the lower surface of the mask 2 placed on the stage 3. For controlling, for example, a position detector (position detecting unit) 21 for detecting the raising / lowering position of the substrate support 5 and a detection signal from the position detector 21 are input and a reference height (to be described later). And a control unit 23 for controlling the lifting device 4 based on the calculation result from the calculation unit 22.

  A reference height is determined for the amount of elevation of the substrate support 5 and the amount of elevation relative to the reference height is determined. For example, as the reference height, the upper surface of the substrate support 5 is set to a height that matches the upper surface of the table 3 on which the mask 2 is placed. Therefore, when the substrate K is placed on the substrate support 5, the upper surface of the substrate support 5 is usually thicker than the substrate K so that the upper surface of the substrate K coincides with the upper surface of the substrate support 5. It will be lowered by that much. When such a reference height is selected, the height relative to the reference height itself becomes a gap, that is, a dent amount. A method of measuring the dent amount corresponding to the gap will be described later. Note that it is not always necessary to select a position at which the upper surface of the substrate support 5 matches the upper surface of the table 3 on which the mask 2 is placed as the reference height.

  The control unit 23 includes at least a data on the thickness of the substrate K used in accordance with the type of product and a dent as a mask correction amount specific to the manufacturer for each mask 2 used in the product. A data table storing quantities is provided.

  That is, when the product number to be manufactured (which is also the type of product) is input, the substrate K and the mask 2 used for this are specified, and the thickness of the specified substrate K and the dent amount of the mask 2 are The amount of lifting of the substrate support 5 is determined based on these amounts extracted from the data table.

  Next, a mask replacement operation when manufacturing another electronic component after manufacturing a certain electronic component, that is, a gap measuring operation and a gap adjusting operation between the substrate and the mask will be described.

  Even when the electronic component is manufactured for the first time, the gap measurement operation and the adjustment operation are performed in the same manner. However, since it is the same as the mask replacement operation, the description of the operation at the time of the initial manufacturing is omitted. .

When there is a command to change the product to be manufactured, the mask 2 is replaced in the printing apparatus 1.
That is, as shown in FIG. 1, the mask 2 formed by holding the mask main body 2 b on the holding frame 2 a is lowered and placed on the stage 3. At this time, normally, the lower surface of the mask main body 2b is slightly swelled upward from the lower surface of the holding frame 2a (when viewed from the holding frame, it is recessed on the side filled with the paste. It is in a state.

  Next, while exhausting the air in the vacuum chamber 11 with the exhaust device 13, the substrate support 5 is slowly moved and the pressure sensor 14 becomes a predetermined degree of vacuum or higher (the pressure value itself becomes lower). Raise to. Then, as shown in FIG. 2, when the degree of vacuum is higher than a predetermined degree (that is, the gap between the upper surface of the substrate support 5 and the lower surface of the mask main body 2b is eliminated), the control means. 7, the substrate support 5 is automatically stopped, the height relative to the reference height, so-called gap G, is calculated by the calculation unit 22, and this gap G is newly stored in the data table.

  When the substrate K is placed on the substrate support 5 during actual printing, the thickness of the substrate K is subtracted from the reference height, and the measured gap G is added. The substrate K is raised by the distance (distance). That is, printing is performed in a state where no gap is generated.

  As described above, in the printing apparatus 1, when replacing the mask 2, the substrate support 5 is raised with respect to the mask 2 placed on the stage 3, and the suction holes 12 formed in the substrate support 5 are in the suction holes 12. Since the degree of vacuum is detected and the height relative to the reference height of the substrate support 5 is obtained when the degree of vacuum exceeds a predetermined value, that is, when the gap G disappears, The gap G with the mask 2 can be measured automatically, that is, simply and quickly, and this gap G is reflected in the lift of the substrate support 4 via the control means 7. Even when the mask 2 is replaced, accurate printing can be performed.

  Next, a printing method for an electronic component using the gap measurement method, a mask replacement method using the gap measurement method, and a mask abnormality detection method using the gap measurement method will be described.

  In this electronic component printing method, a substrate support table on which a substrate is placed at a position below a printing unit is arranged with respect to a mask supported by a stage that supports a peripheral portion of the mask for printing an electric circuit on the substrate. Measures the degree of vacuum in the suction hole opened on the surface of the substrate support, and detects the height relative to the reference height of the substrate support when the degree of vacuum exceeds a predetermined value as a gap. This is a method of printing an electric circuit on a substrate by adjusting the gap by periodically measuring the gap using a mask gap measuring method.

  According to this printing method for electronic components, the gap between the substrate and the mask can be stably measured in a short time and accurately, so that the electronic components can be produced stably over a long period of time. it can. In particular, when the type of product is changed frequently, it is necessary to measure the size of the gap each time. For this reason, the measurement work requires time and labor, but the above-described gap measurement method is used. Therefore, it is possible to deal with it quickly, and stable production can be performed.

  In addition, the mask replacement method includes a substrate support table on which a substrate is placed at a position below the printing unit with respect to a mask supported by a stage that supports a peripheral portion of the mask for printing an electric circuit on the substrate. Measures the degree of vacuum in the suction hole opened on the surface of the substrate support, and detects the height relative to the reference height of the substrate support when the degree of vacuum exceeds a predetermined value as a gap. The gap is measured using the mask gap measuring method to be performed, and based on the measured gap size (for example, an absolute value is used), that is, exceeds the gap value (reference value) C shown in FIG. In this case, the mask is replaced.

  According to this mask exchange method, the gap between the substrate and the mask is stably and accurately measured, and based on the size of the gap, that is, the gap value is statistically treated and the mask is exchanged with a predetermined reference value. Thus, electronic parts can be stably produced over a long period of time. Specifically, the mask gradually grows with each use, but it is very difficult to find the replacement time. However, the replacement time can be easily detected by using the gap measuring method. Further, even when the type of product is changed frequently, the gap can be easily eliminated, so that stable production can be performed.

  Further, the mask abnormality detection method includes a substrate support base on which a substrate is placed at a position below the printing unit with respect to a mask supported by a stage that supports a peripheral portion of the mask for printing an electric circuit on the substrate. And the degree of vacuum in the suction hole opened on the surface of the substrate support table is measured, and the height relative to the reference height of the substrate support table when the vacuum level exceeds a predetermined value is defined as a gap. In this method, a gap is measured by using a mask gap measuring method to be detected, and a mask abnormality is detected based on the measured gap size (for example, an absolute value is used).

  According to this mask abnormality detection method, the mask abnormality is detected based on the size of the gap between the substrate and the mask. Abnormalities can be found, and therefore production can be resumed without producing defective products.

1 is a cross-sectional view illustrating a schematic configuration of a printing apparatus according to an embodiment of the present invention. FIG. 3 is a cross-sectional view illustrating a state in which a gap is eliminated in the printing apparatus. It is a graph which shows the gap value at the time of mask exchange in the printing apparatus. It is sectional drawing explaining the printing operation to the board | substrate in the conventional printing apparatus. It is sectional drawing which shows the state of the screen mask at the time of printing by the conventional printing apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Printing apparatus 2 Screen mask 2a Holding frame part 2b Mask main-body part 3 Stage 4 Lifting apparatus 5 Substrate support stand 6 Adsorption means 7 Control means 11 Vacuum chamber 12 Adsorption hole 13 Exhaust apparatus 14 Pressure sensor 21 Position detector 22 Calculation part 23 Control Part

Claims (6)

A stage for supporting a peripheral portion of a mask for printing an electric circuit on the substrate, and a substrate support table for placing the substrate at a position below the printing portion of the mask supported by the stage and raising and lowering the substrate are provided. A method for measuring a gap between a substrate and a mask in a printing apparatus,
The substrate is raised with respect to the mask supported by the stage, and the degree of vacuum in the suction hole opened on the surface of the substrate support is measured, and the substrate when the degree of vacuum reaches a predetermined value or more. A method for measuring a gap of a mask with respect to a substrate, wherein a height relative to a reference height of a support base is detected as a gap. A stage for supporting a peripheral portion of a mask for printing an electric circuit on the substrate, and a substrate support table for placing the substrate at a position below the printing portion of the mask supported by the stage and raising and lowering the substrate are provided. A means for measuring a gap between a substrate and a mask in a printing apparatus,
A pressure sensor that communicates with a suction hole of the substrate that opens on the surface of the substrate support; and when the substrate support is brought close to a mask supported by a stage, the degree of vacuum by the pressure sensor is a predetermined value. A position detection unit that detects the height of the substrate support table when the above is reached, and a calculation unit that calculates a difference between the height detected by the position detection unit and the reference height of the substrate support table. Means for measuring a gap of a mask with respect to a featured substrate. A stage for supporting a peripheral portion of a mask for printing an electric circuit on a substrate constituting an electronic component, and a substrate support base for placing the substrate at a position below the printing portion of the mask supported by the stage and moving it up and down A printing apparatus comprising:
A pressure sensor that communicates with a suction hole of the substrate that opens on the surface of the substrate support; A position detection unit for detecting the height of the substrate support table when the above is reached, and a calculation unit for obtaining a difference between the height detected by the position detection unit and the reference height of the substrate support table. A printing apparatus for electronic parts. With respect to the mask supported by the stage that supports the peripheral portion of the mask for printing the electric circuit on the substrate, the substrate support on which the substrate is placed is raised at a position below the printing unit and the substrate support Using a mask gap measurement method that measures the degree of vacuum in the suction hole opened on the surface, and detects the height relative to the reference height of the substrate support when the degree of vacuum exceeds a predetermined value as a gap. And
A printing method for an electronic component, wherein an electrical circuit is printed on a substrate by adjusting the gap by periodically measuring the gap. With respect to the mask supported by the stage that supports the peripheral portion of the mask for printing the electric circuit on the substrate, the substrate support on which the substrate is placed is raised at a position below the printing unit and the substrate support Using a mask gap measurement method that measures the degree of vacuum in the suction hole opened on the surface, and detects the height relative to the reference height of the substrate support when the degree of vacuum exceeds a predetermined value as a gap. And
A mask exchange method characterized by measuring a gap and exchanging a mask based on the measured gap size. With respect to the mask supported by the stage that supports the peripheral portion of the mask for printing the electric circuit on the substrate, the substrate support on which the substrate is placed is raised at a position below the printing unit and the substrate support Using a mask gap measurement method that measures the degree of vacuum in the suction hole opened on the surface, and detects the height relative to the reference height of the substrate support when the degree of vacuum exceeds a predetermined value as a gap. And
A mask abnormality detection method characterized by measuring a gap and detecting a mask abnormality based on the measured gap size.

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