WO2018051495A1

WO2018051495A1 - Substrate correction method and substrate correction system

Info

Publication number: WO2018051495A1
Application number: PCT/JP2016/077494
Authority: WO
Inventors: 丈喜加藤; 利律清水; 実絹田
Original assignee: 富士機械製造株式会社
Priority date: 2016-09-16
Filing date: 2016-09-16
Publication date: 2018-03-22
Also published as: JPWO2018051495A1; JP6796878B2

Abstract

The present invention excellently performs correction of substrates. A spot for pressing a substrate S is automatically set on the basis of the thickness D of the substrate S and the supporting spots of the substrate S. For example, the spot for pressing the substrate S is set at the center when the thickness D of the substrate S is larger than a first setting value, regardless of where the supporting spots of the substrate S are located (S5), and is set at a spot on the upper surface corresponding to a supporting spot closest to the center of the substrate S when the thickness D of the substrate S is equal to or smaller than a second setting value (S6). Thus, on the basis of the thickness D of the substrate S and the supporting spots of the substrate S, the substrate S can be excellently corrected by appropriately setting the spot for pressing the substrate S.

Description

Substrate correction method and substrate correction system

The present invention relates to correction of circuit boards.

Patent Document 1 describes a substrate correction method and a substrate correction system, which are methods for correcting a circuit board. In the description column of [0011] (2) of Patent Document 1, when it is estimated that there is a warp based on the material, thickness, etc. of the substrate, the execution of correction is set, It is described that the selection or setting may be automatically performed by the control device. In [0046], “when there is one substrate pressing portion, it is a position corresponding to the central portion of the substrate 40. If the vicinity of the center of 40 is adsorbed from below by the substrate support pins 84, the supported portion may be pressed. "

JP 2007-245593 A

An object of the present invention is to enable automatic setting of a substrate pressing portion by a method different from the method described in Patent Document 1.

In the present invention, the board pressing location is automatically set based on the thickness of the circuit board (hereinafter simply referred to as the board) and the board support location. For example, when the thickness of the substrate is larger than the first set value, regardless of the support location of the substrate, the holding location of the substrate is the central portion, and the thickness of the substrate is equal to or less than the second set value In this case, the upper surface portion corresponds to the support portion of the substrate closest to the center of the substrate. As described above, based on the thickness of the substrate and the supporting portion of the substrate, the pressing portion of the substrate can be appropriately set and correction can be performed satisfactorily.

It is a front view of the screen printing machine in which correction | amendment of a board | substrate is performed. It is a side view showing a part of the screen printing machine. It is a side view which shows the board | substrate holding apparatus of the said screen printer. It is sectional drawing showing the principal part of the board | substrate support apparatus of the said board | substrate holding apparatus. It is a top view showing the imaging device moving apparatus of the said screen printer. It is a figure showing the board | substrate holding | suppressing apparatus of the said board | substrate holding apparatus. It is a block diagram which shows notionally the periphery of the control apparatus of the said screen printer. It is a flowchart showing the correction program memorize | stored in the memory | storage part of the said control apparatus. It is a figure which shows an example of the display of the said screen printer. It is a figure which shows the action | operation of the said screen printer. (a) A state where the center is pressed. (b) The state moved to the support position closest to the center. (c) The state moved to a support position next to the center. (D) A state of pressing at that position. It is sectional drawing which shows the board | substrate support apparatus (a support block is included) different from the said board | substrate support apparatus. It is a figure which shows an example of a display when the said another board | substrate support apparatus is attached.

Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings.

Figure 1 shows a screen printer. This screen printing machine prints cream-like solder (hereinafter abbreviated as solder) on a substrate S. The printing machine main body 6, the substrate transport device 8, the substrate holding device 10, the screen 12, the screen holding device 14, The squeegee device 16 and the like are included.

As shown in FIGS. 1 and 3, the substrate transfer device 8 transfers the substrate S and includes a pair of

conveyors

20a and 20b, a transfer motor (not shown) that drives the pair of

conveyors

20a and 20b, and the like. . Hereinafter, in the present specification, the transport direction of the substrate S is defined as the x direction, the width direction perpendicular to the transport direction of the substrate S is defined as the y direction, and the thickness direction of the substrate S, that is, the vertical direction of the screen printer. Is the z direction.

The screen 12 is held in a horizontal posture by a screen holding device 14 provided on the upper part of the printer main body 6. In the screen 12, a plurality of through holes are formed in a portion corresponding to a printing location on the substrate S. The squeegee device 16 is provided above the screen 12 and, as shown in FIG. 2, a pair of

squeegees

30a and 30b and a pair of

squeegee lifting devices

32a and 32b that raise and lower each of the pair of

squeegees

30a and 30b. A squeegee moving device 34 (see FIG. 7) or the like that moves the pair of

squeegees

30a and 30b in the width direction (y direction) of the substrate S along the screen 12 is included. The pair of

squeegees

30 a and 30 b are moved up and down while being moved in the y direction, and brought into contact with the screen 12. Thereby, the solder is printed on the corresponding portion of the upper surface of the substrate S through the through hole of the screen 12.

As shown in FIG. 3, the substrate holding device 10 includes a substrate support device 40, a clamp device 42, a top surface defining device 46, and the like.

The clamp device 42 includes a pair of

main bodies

43a and 43b provided at a distance in the y direction, a pair of

clamp members

44a and 44b provided on the

main bodies

43a and 43b, and the like. Is held from both sides in the width direction. One main body 43a is fixed and the other main body 43b is movable, and the distance between the pair of

clamp members

44a and 44b is variable.

Conveyors

20a and 20b are attached to the pair of

main bodies

43a and 43b, respectively. The upper surface defining device 46 is provided outside the clamp device 42 in the y direction, and includes a pair of

main bodies

47a and 47b movable in the y direction, a pair of

alignment members

48a and 48b attached to the

main bodies

47a and 47b, respectively. . When the upper surfaces of the pair of

clamp members

44a and 44b and the upper surface of the substrate S are brought into contact with the lower surfaces of the pair of

alignment members

48a and 48b, the height of the upper surface of the substrate S is defined.

As shown in FIG. 4, the substrate support device 40 includes a plurality of substrate support pins 50, a pin support base 52, and the like as a plurality of substrate support members that can come into contact with each other at a plurality of locations on the lower surface of the substrate S. The substrate support pins 50 each include a main body 53, a negative pressure passage 54 formed inside the main body 53, a suction pad 56 attached around an upper end opening of the negative pressure passage 54, and the like. The pin support base 52 includes a negative pressure passage 60 and a plurality of negative pressure supply ports 62 communicated with the negative pressure passage 60. Each of the plurality of substrate support pins 50 is detachably attached to the pin support base 62 with the negative pressure supply port 62 opened in the negative pressure passage 54. The substrate support pins 50 are not necessarily attached to all of the plurality of negative pressure supply ports 62, and are attached to places that do not interfere with components already attached to the lower surface of the substrate S. A cap 70 is attached to the negative pressure supply port 62 to which the substrate support pin 50 is not attached, and negative pressure leakage is prevented. In addition, a negative pressure source 64 is connected to the negative pressure passage 60 via an electromagnetic valve 65 and a negative pressure sensor 66 is provided. The negative pressure sensor 66 commonly detects the negative pressure in the negative pressure passage 54 of each of the plurality of substrate support pins 50. As described above, the substrate support pins 50 support the substrate S from below and prevent the displacement of the substrate S by supplying (suctioning) negative pressure. Therefore, the location on the substrate to which the substrate support pin 50 is attached can be referred to as a support location or a suction location. In this embodiment, the support location and the suction location are represented by a support location and a suction location that are positions on the x and y coordinates on the substrate at the center of the substrate support pin 50. In addition, it can be considered that the region inside the outer peripheral edge of the annular portion where the suction pad 56 of the substrate support pin 50 contacts the lower surface of the substrate S is a support location. In this case, the center of the support location is the support location. You can think of it as a position.

The substrate holding device 10 further includes a clamp member approaching / separating device 74, a mating member moving device 76, a first lifting device 80, a second lifting device 82, a third lifting device 84, etc., as shown in FIG.

The clamp member approaching / separating device 74 moves the main body 43b in the y direction via the motion conversion mechanism by driving the electric motor 77, and the alignment member moving device 76 is operated by the operation of the pair of

air cylinders

79a, 79b. The

main bodies

47a and 47b are respectively moved in the y direction.

The first elevating device 80 elevates and lowers a first elevating table 86, to which the substrate support device 40, the clamp device 42, and the upper surface defining device 46 are attached, via a motion conversion mechanism 91 by an electric motor 90 as a drive source. is there. The second elevating device 82 elevates and lowers the second elevating platform 88 to which the clamp device 42 is attached. The movement of the air cylinder 92 as a driving source and the piston of the air cylinder 92 in the y direction is changed to the movement in the z direction. A pair of

cam mechanisms

93a, 93b and the like that convert and transmit to the second lifting platform 88 are included. The third elevating device 84 elevates and lowers the substrate support device 40, and elevates and lowers the substrate support device 40 via the motion conversion mechanism 96 by driving an electric motor 95 as a drive source fixed to the second elevating table 88. It is something to be made.

As shown in FIGS. 1 and 5, the screen printing machine includes an imaging device 100 and an imaging device that moves the imaging device 100 in parallel with the screen 12 and the substrate S between the screen 12 and the substrate holding device 10. Mobile device 102. The image pickup apparatus 100 picks up images of the marks provided on the substrate S and the screen 12, but in the present embodiment also picks up an image of the substrate support device 40. The imaging device moving device 102 includes an x moving device 104 that moves the imaging device 100 in the x direction and a y moving device 106 that moves the imaging device 100 in the y direction. The x moving device 104 includes an x slider 110, an x axis motor 112 as a drive source, a motion conversion mechanism 114 that converts rotation of the x axis motor 112 into linear movement of the x slider 110, a pair of

guide rails

116a and 116b, and the like. . The y-moving device 106 is provided on the x-slider 110, the y-slider 120 to which the imaging device 100 is attached, the y-axis motor 122 as a driving source, and the movement that converts the rotation of the y-axis motor 122 into linear movement of the y-slider 120. A conversion mechanism 124, a guide rail 126, and the like are included.

A substrate pressing device 130 is also attached to the y slider 120. The substrate pressing device 130 presses the upper surface of the substrate S from above, and includes a substrate pressing member 132, a pressing member lifting / lowering device 134, a guide device 136 and the like as shown in FIG. The holding member elevating device 134 is constituted by a double-acting air cylinder, and

electromagnetic valves

140 and 142 are connected to an upper chamber and a lower chamber on both sides of a piston (not shown), respectively. By switching the

electromagnetic valves

140 and 142, the upper chamber and the lower chamber are selectively communicated with the positive pressure source 144 as the air source and the atmosphere, respectively, and the substrate pressing member 132 is moved to the rising end position and the falling end position. Moved.

A height sensor 146 is attached to the substrate pressing device 130. The height sensor 146 irradiates light at an irradiation angle θ and receives reflected light, for example, so that the pressing portion on the upper surface of the substrate S below the substrate pressing member 132 (strictly speaking, the light is irradiated). The distance L to the point) is detected. Further, the height Hs, which is the distance between the height sensor 146 and a predetermined reference position of the screen printing machine, is known. Therefore, if the distance L between the height sensor 146 and the set portion of the substrate S is obtained by the height sensor 146, the height H from the reference position of the set portion of the substrate S can be obtained (H = Hs-L).

The screen printing machine is controlled by the control device 150 shown in FIG. The control device 150 is mainly composed of a computer 152, and includes an execution unit 154, a storage unit 156, an input / output unit 158, and the like. The input / output unit 158 is connected to a drive source and the like included in the screen printing machine via a drive circuit 170, and includes the imaging device 100, a negative pressure sensor 66, a height sensor 146, a display 164, and an operation input unit. 166, an external computer 168, etc. are connected. In the case where the display 164 has a touch panel function, the operation input unit 166 may have a part of the function. Although it is not indispensable that the external computer 168 is connected to the control device 150, in this embodiment, the external computer 168 performs processing of a captured image captured by the imaging device 100.

Next, a method for correcting the substrate S will be described.
When the substrate S reaches a predetermined position below the screen 12, a predetermined operation is performed, and as shown in FIG. 10 (a), both side edges of the upper surface of the substrate S are aligned with the

alignment members

48a and 48b. The both end surfaces in the y direction of the substrate S are brought into contact with the lower surface, and are separated from the

clamp members

44a and 44b. In this state, the substrate pressing member 132 is moved to a predetermined pressing position, and the plurality of substrate support pins 50 and the

alignment members

48a and 48b are operated by at least one of the first lifting device 80 and the pressing member lifting device 134. Then, the substrate pressing member 132 is brought close to the substrate S to press the substrate S (hereinafter simply referred to as pressing the substrate, pressing the substrate, etc.). As described above, since the substrate pressing is performed in a state in which the lifting of the substrate S is suppressed and the expansion in the width direction is allowed, the warp of the substrate S can be reduced satisfactorily.

Further, there are cases where the substrate pressing is performed a plurality of times in the correction of the substrate S, but the negative pressure sensor 66 before the correction of the substrate S is started and after each of the plurality of substrate pressings is performed. Thus, the negative pressure in the negative pressure passage 60 is detected. When the detected negative pressure is closer to the atmospheric pressure than the set negative pressure, there is a negative pressure leak and all the substrate support pins 50 are not in contact with the lower surface of the substrate S, that is, the substrate S is warped. Determined. On the other hand, when the negative pressure is closer to the vacuum than the set negative pressure, there is substantially no negative pressure leakage, and all the substrate support pins 50 are in contact with the lower surface of the substrate S, that is, substantially the substrate. It is determined that S is not warped. Therefore, when it is determined that there is no negative pressure leakage before the correction of the substrate S is started, the correction of the substrate S is not started, and it is determined that there is no leakage after the substrate pressing is performed. Then, the correction of the substrate S is terminated.

The pressing location of the substrate S is automatically determined based on the thickness D of the substrate, the location where the secant A passes, the support position of the substrate support pins 50, and the like. In this embodiment, the pressing location is represented by a pressing position that is a position on the x and y coordinates where the center point of the lower surface 132f of the substrate pressing member 132 is located.
The size, thickness D, and substrate division of the substrate S are read from the work plan information and the like, and numerical values are displayed on the input display unit 180 of the display 164 shown in FIG. 9, and the graphic representing the substrate S is the input display unit 182. Is displayed. The position through which the dividing line A passes is determined based on the size of the substrate S (dimensions in the x and y directions) and the division number of the substrate S in the x and y directions, and is superimposed on the image of the substrate S on the input display unit 182. Is displayed.

The support position of the substrate support pins 50 is input via the operation input unit 166 after the pin selection unit 188a on the display 164 is touched or clicked (hereinafter referred to as touch etc.) by the operator. However, the input numerical value is displayed on the input display unit 184. On the other hand, when the support position etc. acquisition command 186 is touched or the like, a plurality of reference support pins 50 and the like are picked up from above by the image pickup apparatus 100, and the picked-up images are processed by the external computer 168 and the support location is input. It is displayed on the display unit 182 so as to overlap the substrate S. As described above, since the support location is acquired and displayed based on the image captured by the imaging device 100, the operator can perform input by the operator or check the mounting position of the substrate support pin 50, and an error is caused. If there is, it can be corrected. The support position may be acquired based on the captured image and displayed on the input display unit 182.

Further, in addition to the plurality of substrate support pins 50, although not shown, there may be provided support pins that are not supplied with negative pressure (not provided with a suction function). In this case, negative pressure is supplied. A support position of the substrate support pin 50 (described as a Vac support position in FIG. 9) and a support position of a support pin to which no negative pressure is supplied (described as a non-Vac support position) are input separately.

When the pressing position automatic setting command 190 is touched after the support position or the like is input, the pressing position is determined and displayed on the pressing position display unit 192.
The first pressing position is determined as follows.
(a) When the thickness D is larger than the first set value Dth1 (D> Dth1), in principle, the pressing position is determined at the center of the substrate S. When the substrate S is thick, it is considered that the substrate S is hardly damaged even if the substrate is pressed regardless of the presence of the dividing line A and the substrate support pins 50. Further, if the substrate pressing is performed at the center of the substrate S, the warpage of the entire substrate can be satisfactorily reduced. From the above, when the substrate S is thick, the pressing position is determined at the center. On the other hand, when it is not desirable to perform board pressing at the center of the board S, such as when a component is already mounted on the lower surface of the center of the board S, the pressing position is determined to be a position near the center away from the center. May be. This is because if the holding position is in the vicinity of the center of the substrate S, it is considered that the warpage of the entire substrate can be satisfactorily reduced. As described above, regardless of whether the pressing position is at the center or near the center (hereinafter, these may be collectively referred to as the center), the substrate pressing member 132 is pressed at the center point of the lower surface 132f. It is moved to a position that matches the position and brought into contact with the upper surface of the substrate S. Therefore, a portion where the lower surface 132f of the substrate pressing member 132 and the upper surface of the substrate S abut corresponds to the pressing portion, and the pressing portion corresponds to the central portion of the substrate S. From the above, it is considered that the central portion of the substrate S is a portion including the center of the substrate S.

(b) When the thickness D is less than or equal to the second set value Dth2 (Dth2 <Dth1) smaller than the first set value Dth1 (Dth2 ≧ D), the pressing position is among the support positions of the plurality of substrate support pins 50. The upper surface position corresponding to the support position closest to the center of the substrate S is used. This is because when the substrate S is thin, the substrate S is easily damaged when the substrate is pressed at a position not supported by the substrate support pins 50 from below.

(c) When the thickness D is greater than the second set value and less than or equal to the first set value (Dth1 ≧ D> Dth2), the dividing line A must pass even if there is no substrate support pin 50 below the substrate S. For example, even if the substrate is pressed at that position, the substrate S is hardly damaged. However, if the substrate is pressed at a position where the dividing line A passes and there is no substrate support pin 50, the substrate S is damaged. It becomes easy. Therefore, in principle, the pressing position is set to the center or the like when the dividing line A does not pass through the central portion of the substrate S. Substrate pressing is performed in a state where the dividing line A does not pass through the pressing location. On the other hand, when the secant A passes through the central portion of the substrate, the upper surface position corresponding to the support position closest to the center is set.
On the other hand, in this embodiment, it is determined whether or not the dividing line A passes through the center of the substrate S. Since the dividing line A is a boundary line when the substrate S is divided by a division number, the dividing line A is obtained when the pressing position is the center or the like based on the area of the lower surface 132f of the substrate pressing member 132 and the size of the substrate S. A hardly passes through the contact portion with the lower surface 132f of the substrate pressing member 132 without passing through the center of the substrate S. Therefore, it is considered that it is sufficient to determine whether or not the dividing line A passes through the center of the substrate S. It is also possible to determine whether or not the dividing line A passes through the central portion.

The pressing positions after the second are sequentially from the positions close to the center among the supporting positions of the plurality of substrate supporting pins 50 except for the pressing positions determined up to the previous time (including the positions where the substrate pressing is not performed). It is determined. For example, when the substrate is pressed at the center for the first time, the support positions of the plurality of substrate support pins 50 excluding the center are determined in order from the position close to the center. In some cases, the center is the support position of the substrate support pins 50.

When the pressing position is the supporting position of the substrate support pins 50, the distance L between the upper surface of the substrate S and the pressing position P is obtained by the height sensor 146 before pressing the substrate. When the distance L is shorter than the set value Lth, it can be seen that the lower surface of the substrate S is lifted from the substrate support pins 50 and the substrate S is warped in the vicinity of the position. Therefore, the substrate is pressed at the pressing position {FIG. 10 (d)}. On the other hand, when the distance L is greater than or equal to the set value Lth, the warpage of that portion of the substrate S is small, and it is estimated that the lower surface of the substrate S is in contact with the upper surface of the substrate support pins 50. For this reason, the substrate pressing device 130 is moved to the next pressing position {FIG. 10 (c)} without being pressed by the pressing position {FIG. 10 (b)}.
When the pressing position is at the center or the like, the substrate is pressed without measuring the distance L. This is because if the substrate is pressed at the center or the like, even if the substrate S is warped, it may be corrected.

The correction of the substrate is performed by executing the substrate correction program represented by the flowchart of FIG.
In step 1 (hereinafter abbreviated as S1, the same applies to other steps), the negative pressure sensor 66 detects a negative pressure and detects the presence or absence of leakage. If there is no leakage, it is not necessary to correct the substrate, and therefore S2 and subsequent steps are not executed. If there is a leak, information on the substrate thickness D, the position of the dividing line A, and the support position is read in S2. Based on the thickness D of the substrate S and the position of the dividing line A in S3 to 6, The pressing position of the second time is determined as the center or the like (S5), or the position (S6) on the upper surface corresponding to the support position closest to the center among the plurality of support positions.

In S5, when the pressing position is determined to be the center or the like, the substrate is pressed in S10, and the presence or absence of leakage is detected in S11. When the pressing position is determined to be the upper surface position corresponding to the support position in S6, the substrate pressing device 130 is moved to that position in S7 to 9, as shown in FIG. The distance L to the holding position P of the substrate S is measured, and the presence or absence of lifting is detected. When there is no lifting (L1 ≧ Lth), the substrate is not pressed at that position, and is moved to the next pressing position as shown in FIG. 10 (c), and S6 to S9 are executed again. Is done. When the substrate S is lifted (L2 <Lth), as shown in FIG. 10 (d), the substrate is pressed in S10 and 11 to detect the presence or absence of negative pressure leakage. Hereinafter, while there is a negative pressure leak, S6 to S11 are repeatedly executed. However, when the negative pressure leak is eliminated, it is determined that the warpage of the substrate S has been reduced, and the substrate pressing is terminated.

Thereafter, screen printing is performed, but since the warp of the substrate S is reduced, the solder can be satisfactorily applied to the upper surface. Further, since the plurality of substrate support pins 50 and the lower surface of the substrate S are in good contact with each other, the displacement of the substrate S can be satisfactorily prevented by suction, and the positioning accuracy can be improved.

In this embodiment, since the pressing position of the substrate is automatically determined based on the thickness D of the substrate, the position where the secant A passes, and the support position, the pressing position is appropriately determined while avoiding damage to the substrate. can do. Further, when the height of the pressing position P of the substrate S is detected, the presence / absence of warpage of the substrate S in the portion around the position is detected, and it is determined that there is no warping, it is determined as the pressing position. Substrate pressing is not performed. Therefore, even if there is variation in the warp of the substrate S, it is possible to perform substrate pressing only at a truly necessary portion, so that the working time can be shortened and correction can be performed efficiently. . Furthermore, the presence or absence of a negative pressure leak is detected, and when it is detected that there is no leak, the substrate pressing is terminated. It can be confirmed well that the warpage of the substrate is small, and the substrate can be pressed efficiently. Moreover, since the support location acquired based on the captured image is displayed on the display 164, the operator can correct input errors and the like satisfactorily.

As described above, in the present embodiment, the pressing point determination unit is configured by the part that stores S2 to 6 of the control device 150, the part that executes the part, and the like. Further, the execution of S2 to 6 corresponds to the pressing point determination process, and the execution of S10 corresponds to the warp correction process. Furthermore, the execution of S11 corresponds to the contact state detection process, and the execution of S6 after the execution of S11 corresponds to the repressing position determination process. Further, the leakage presence / absence detection device is constituted by the negative pressure sensor 66, the portion storing S1 and S11 of the control device 150, the portion to execute, and the like. Further, the substrate correction system is configured by the substrate support device 40, the substrate pressing device 130, the portion for storing the substrate correction program of the control device 150, the portion to be executed, the height sensor 146, the negative pressure sensor 66, the display 164, and the like.

Further, one or more support blocks can be attached instead of the plurality of substrate support pins 50. An example in that case is shown in FIG. The substrate support device 198 includes one support block 200 and a block holding member 202. The support block 200 and the block holding member 202 are respectively formed with

negative pressure passages

204 and 206 communicated with each other, and are connected to the negative pressure source 64 via the electromagnetic valve 65 in the same manner as in the above embodiment. Is done. A plurality of openings 208 are formed on the upper surface of the support block 200. The upper surface of the support block 200 can be brought into contact with the lower surface of the substrate S at the periphery of the opening 208, supports the substrate S from below, and sucks it from the opening 208, thereby preventing the substrate S from being displaced. In that sense, the position of the center of the opening 208 can be referred to as a support position and a suction position, and the inside of the opening edge corresponds to the support location and the suction location.

As illustrated in FIG. 12, when the block setting unit 188 b of the display 164 is touched or the like, the mark M provided on the support block 200 is imaged and read by the imaging device 100, thereby reading the position of the opening 208. The suction position (support position) is automatically input and displayed on the input display unit 220. Further, when the support position etc. acquisition command 186 is touched or the like, the support block 200 is imaged by the imaging device 100, and a plurality of suction points are acquired based on the obtained captured image, and the input display unit 182 is displayed. The image is superimposed on the image of the substrate S.

For example, when a plurality of recesses are provided on the upper surface of the support block 200, the pressing position can be determined in the same manner as in the above embodiment. On the other hand, when the recess is not provided on the upper surface of the support block 200 (when almost the entire upper surface of the support block 200 has a shape capable of coming into contact with the lower surface of the substrate S), the pressing position is set to the substrate S. Can be determined based on the suction position without considering the position of the thickness D and the dividing line A, for example, in order from the position of the upper surface corresponding to the suction position (position of the opening 208) closest to the center. Can be determined. This is because the substrate is hardly damaged due to the substrate pressing. As described above, the lower surface of the substrate S reliably contacts the periphery of the opening 208, so that the displacement of the substrate S can be prevented and the positioning accuracy can be improved.

The plurality of substrate support pins 50 may be non-negative pressure type support pins to which no negative pressure is supplied. For example, the present invention is implemented in variously modified and improved forms based on the knowledge of those skilled in the art. Can do.

10: Substrate holding device 40, 198: Substrate support device 60: Negative pressure passage 80, Substrate support pin 66: Negative pressure sensor 100: Imaging device 130: Substrate pressing device 132: Substrate pressing member 146: Height sensor 150: Control device 164 : Display 200: Substrate support block

Claims

A substrate support device having one or more substrate support members capable of abutting at a plurality of positions separated from each other on the lower surface of the substrate, and supporting the substrate from below;
A substrate pressing member having a substrate pressing member capable of contacting the upper surface of the substrate, and pressing the substrate from above via the substrate pressing member; and the substrate pressing member and the one or more substrate supporting members; A substrate correction system for correcting the substrate by pressing the substrate against the substrate,
A plurality of support locations that represent a location where the substrate pressing member contacts the upper surface of the substrate, a thickness of the substrate, and a plurality of locations where the one or more substrate support members contact the lower surface of the substrate A substrate correction system including a pressing point determination unit that automatically determines the above.
When the thickness of the substrate is larger than a first set value, the pressing location determining unit determines the pressing location as a central portion of the substrate, and the thickness of the substrate is smaller than the first set value. 2. The substrate correction according to claim 1, wherein if it is equal to or less than 2 set values, the substrate correction is determined to be a location on the upper surface corresponding to a support location closest to the center among the plurality of support locations on the lower surface of the substrate. system.
In the case where the thickness of the substrate is greater than the second set value and equal to or less than the first set value, the press location determining unit determines the press location if the dividing line of the substrate does not pass through the central portion of the substrate. When the dividing line of the substrate passes through the central portion of the substrate, the upper surface corresponding to the support location closest to the center of the substrate among the plurality of support locations is determined. The substrate correction system according to claim 2, which is determined at a location.
The pressing part determining unit determines the pressing part based on the thickness of the substrate, the plurality of supporting parts, and the part through which the dividing line of the substrate passes. The substrate correction system described in 1.
The said board | substrate correction system contains the height sensor which measures the height of the setting location of the said board | substrate, The said holding | suppressing part determined by the said pressing location determination part as the said setting location of the said board | substrate measured by the said height sensor 5. The device according to claim 1, wherein the substrate pressing member and the one or more substrate supporting members are pressed against the substrate when the height of the portion is equal to or higher than a set height. Substrate correction system.
The substrate correction system
An imaging device capable of imaging the one or more substrate support members from above;
The substrate correction system according to any one of claims 1 to 5, further comprising a display that displays the plurality of support locations acquired based on images captured by the imaging device.
A substrate supporting device for supplying negative pressure to a plurality of locations separated from each other on the lower surface of the substrate and positioning the substrate by suction, and supporting the substrate from below,
A substrate pressing member capable of contacting the upper surface of the substrate, and a substrate pressing device that presses the substrate from above via the substrate pressing member, the operation of the substrate pressing device and the substrate support device A substrate correction system for correcting warping of a substrate,
A substrate correction system, comprising: a pressing location determining unit that automatically determines a pressing location, which is a location where the substrate pressing member contacts the upper surface of the substrate, based on the plurality of suction locations.
The substrate correction system includes a leakage presence / absence detection device that detects presence / absence of a negative pressure leak of the substrate support device, and when the leakage of the negative pressure is detected by the leakage presence / absence detection device, The substrate correction system according to claim 7, wherein the warp of the substrate is corrected by an operation with the substrate support device.
A substrate holding device for supporting the substrate from below at a plurality of positions on the lower surface of the substrate and a substrate pressing member capable of contacting the upper surface of the substrate, and pressing the substrate from above via the substrate pressing member A substrate correction method for correcting the substrate by an apparatus,
Based on the thickness of the substrate and the plurality of support locations that are the plurality of locations on the lower surface of the substrate supported by the substrate support device, the retainer that is the location where the substrate pressing member abuts and presses against the upper surface of the substrate A pressing point determination process for automatically determining the position,
A warp correcting step of bringing the substrate pressing member into contact with the pressing location determined in the pressing location determining step and correcting the warpage of the substrate by the substrate pressing device and the substrate support device. Substrate correction method.
The substrate support device includes one or more substrate support members capable of contacting the substrate;
The substrate correction method is
A contact state detection step of detecting whether the one or more substrate support members are in contact with the lower surface of the substrate at the plurality of support locations after the warp correction step;
In the contact state detection step, when it is detected that the one or more substrate support members are not in contact with the lower surface of the substrate at the plurality of support locations, the press location is determined in the press location determination step. The re-pressing part determining step of determining the position on the upper surface corresponding to the supporting part closest to the center of the substrate among the plurality of supporting parts excluding the determined pressing part. The substrate correction method as described.