JPH0465900A - Positioning apparatus for board - Google Patents

Positioning apparatus for board

Info

Publication number
JPH0465900A
JPH0465900A JP2180036A JP18003690A JPH0465900A JP H0465900 A JPH0465900 A JP H0465900A JP 2180036 A JP2180036 A JP 2180036A JP 18003690 A JP18003690 A JP 18003690A JP H0465900 A JPH0465900 A JP H0465900A
Authority
JP
Japan
Prior art keywords
board
substrate
deflection
clamper
sides
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2180036A
Other languages
Japanese (ja)
Other versions
JP2808840B2 (en
Inventor
Wataru Hidese
渡 秀瀬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP2180036A priority Critical patent/JP2808840B2/en
Publication of JPH0465900A publication Critical patent/JPH0465900A/en
Application granted granted Critical
Publication of JP2808840B2 publication Critical patent/JP2808840B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Manufacturing Of Printed Wiring (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

PURPOSE:To advantageously cope with step replacement upon alteration of the type of a board by lifting both sides of a board from below by lifters in a state that clampers are brought into contact with upper edges of both side ends of the board from above to correct the deflection of the board, and positioning the board. CONSTITUTION:Rods 34, 35 are vertically movably inserted into guide tubes 36, 37 passing through a ground plate 26. When the rods 31, 33 of cylinders 30, 32 are moved down, ground parts 24a, 25a are landed on a ground plate 26, and moved down while compressing a spring 28. Simultaneously, a board l is moved down, the upper steps of lifters 22, 23 are pressed to both sides of the board l to correct the deflection of the board l. The board l is snugly secured to clampers 2, 3 by the lifters 22, 23, and the deflection is corrected to provide excellent flatness. Accordingly, even if a transfer head 40 is vertically moved up and down to land an electronic component 42 sucked to the nozzle 41 on the board l, the board l is not fluctuated by the load at the time of landing.

Description

【発明の詳細な説明】 (産業上の利用分野) 本発明は基板の位置決め装置に関し、詳しくは、基板の
撓みを矯正して、基板を位置決めするための装置に関す
る。
DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a substrate positioning device, and more particularly to a device for positioning a substrate by correcting its deflection.

(従来の技術) 基板に電子部品を実装する場合や、回路パターンなどを
印刷する場合、基板は位置決め装置に位置決めされる。
(Prior Art) When mounting electronic components on a board or printing a circuit pattern, the board is positioned by a positioning device.

第5図は従来の位置決め装置を示すものであって、10
1は基板であり、若干の撓みを有している。102は固
定クランパー 103は可動クランパー、104はシリ
ンダ、105は多数本のビン106が立設されたプレー
ト、107は基板101の搬送用ベルトコンベヤである
FIG. 5 shows a conventional positioning device, with 10
Reference numeral 1 denotes a substrate, which is slightly bent. 102 is a fixed clamper, 103 is a movable clamper, 104 is a cylinder, 105 is a plate on which a large number of bins 106 are erected, and 107 is a belt conveyor for transporting the substrate 101.

次にその動作を説明する。Next, its operation will be explained.

コンベヤ107により、基板101がプレート105上
へ搬送されてくると、シリンダ(図外)に駆動されてプ
レート105は上昇し、ビン106により基板101を
持ち上げる。次いでシリンダ104が作動して、可動ク
ランパー103は右方へ移動し、基板101は両クラン
パー102,103により挟み付けられて位置決めされ
る。次いでこの基板101上に、移載ヘッド108によ
り電子部品109が実装される。
When the substrate 101 is conveyed onto the plate 105 by the conveyor 107, the plate 105 is raised by a cylinder (not shown), and the substrate 101 is lifted by the bin 106. Next, the cylinder 104 is activated, the movable clamper 103 moves to the right, and the substrate 101 is sandwiched and positioned by both clampers 102 and 103. Next, electronic components 109 are mounted on this substrate 101 by a transfer head 108.

(発明が解決しようとする課題) ところが上記従来手段は、ビン106は基板101を持
ち上げるだけで、基板lotの撓みは矯正されず、基板
101の両側部はピン106の上端部から小間隔を浮き
上っていることから、この両側部に電子部品109を着
地させて実装する場合、着地時の荷重により基板101
ががたつきやすい問題があった。
(Problem to be Solved by the Invention) However, with the above conventional means, the bottle 106 only lifts the substrate 101, but the deflection of the substrate lot is not corrected, and both sides of the substrate 101 are lifted a small distance from the upper end of the pin 106. Since the electronic components 109 are mounted on both sides, the load at the time of landing causes the board 101 to
There was a problem where it rattled easily.

また基板101の品種が変更される場合には、新たな基
板に適合するプレート105やピン106と交換せねば
ならず、殊に基板101の上下両面に電子部品109を
実装する両面実装の場合には、ピン106が基板下面に
実装された電子部品109に当たらないように、ピン1
06の配設位置を変更しなければならず、更には基板の
厚さが変る場合には、プレート105の高さ調整やピン
106の長さ調整をしなければならないなど、基板の品
種変更にともなう段取替に多大な手間と時間を要する問
題があった。
Furthermore, when the type of board 101 is changed, it is necessary to replace the plate 105 and pins 106 with ones that are compatible with the new board, especially in the case of double-sided mounting in which electronic components 109 are mounted on both the upper and lower surfaces of the board 101. In order to prevent the pin 106 from hitting the electronic component 109 mounted on the bottom surface of the board,
06 must be changed, and furthermore, when the thickness of the board changes, the height of the plate 105 and the length of the pin 106 must be adjusted. There was a problem in that the accompanying setup changes required a great deal of effort and time.

そこで本発明は、上記従来手段の問題点を解消できる基
板の位置決め装置を提供することを目的とする。
SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a substrate positioning device that can solve the problems of the conventional means described above.

(課題を解決するための手段) 本発明は、基板の両側端部の上縁部に上方から当接する
クランパーと、この基板の両側部の下方に設けられた押
上体と、基板をこの押上体に対して相対的に昇降させる
ことにより、基板とクランパーの当接部の内方に上記押
上体の上端部を押し付けて、この基板の撓みを矯正する
昇降手段とから基板の位置決め装置を構成している。
(Means for Solving the Problems) The present invention provides a clamper that abuts the upper edges of both side ends of a board from above, a push-up body provided below both sides of the board, and a push-up body that moves the board. A board positioning device comprises a lifting means for correcting the deflection of the board by pressing the upper end of the pushing body against the inside of the contact portion of the board and the clamper by raising and lowering the board relative to the clamper. ing.

(作用) 上記構成において、クランパーが基板の両側端部の上縁
部に上方から当接している状態で、押上体が基板の両側
部を下方から押し上げることにより、基板の撓みを矯正
し、基板を位置決めする。
(Function) In the above configuration, when the clamper is in contact with the upper edge of both side ends of the board from above, the push-up body pushes up both sides of the board from below, thereby correcting the deflection of the board. position.

(実施例1) 次に、図面を参照しながら本発明の詳細な説明を行う。(Example 1) Next, the present invention will be described in detail with reference to the drawings.

第1図は基板の位置決め装置の正面図である。FIG. 1 is a front view of the substrate positioning device.

1は基板であり、下凸状に若干の撓みを有している。2
.3は、基板lの両側部に設けられた固定クランパーと
可動クランパーである。クランパー2.3の内側面は、
上り勾配の傾斜面4゜5となっており、基板1の両側端
部の上縁部に上方から押当する(第2図も参照)。6は
シリンダであり、そのロッド7はクランパー3に結合さ
れている。このシリンダ6が作動すると、クランパー3
は横方向に移動し、基板1をクランプする。なお固定ク
ランパー2も、可動クランパーにしてもよい。
Reference numeral 1 denotes a substrate, which has a downward convex shape and is slightly bent. 2
.. 3 is a fixed clamper and a movable clamper provided on both sides of the substrate l. The inner surface of clamper 2.3 is
It has an upward slope of 4.degree. 5, and is pressed against the upper edges of both ends of the substrate 1 from above (see also FIG. 2). 6 is a cylinder, the rod 7 of which is connected to the clamper 3. When this cylinder 6 operates, the clamper 3
moves laterally and clamps the substrate 1. Note that the fixed clamper 2 may also be a movable clamper.

8.9はクランパー2.3の下部に設けられた本体ブロ
ックであり、基板1を搬送するコンヘヤヘル)10.1
1が設けられている。本体ブロック8.9は、支持ブロ
ック12.13に支持されている。基板1の下方にはガ
イドレール15が配設されており、支持ブロック12゜
13は、スライダ16.17を介してこのガイドレール
15に載置されている。
8.9 is a main body block provided at the lower part of the clamper 2.3, and is a container conveyor for transporting the substrate 1) 10.1
1 is provided. The body block 8.9 is supported on a support block 12.13. A guide rail 15 is arranged below the substrate 1, and the support block 12.13 is placed on this guide rail 15 via sliders 16, 17.

一方の支持ブロック12は、ビス18によりガイドレー
ル15に固定されている。他方のスライダ17は、シリ
ンダ19のロッド20に結合されている。このロッド2
0が突没すると、スライダ17は横方向に摺動し、基板
1の横巾に対応して、クランパー2とクランパー3の間
隔を中調整する。
One support block 12 is fixed to the guide rail 15 with screws 18. The other slider 17 is connected to a rod 20 of the cylinder 19. This rod 2
0 protrudes and retracts, the slider 17 slides in the lateral direction, and adjusts the distance between the clamper 2 and the clamper 3 to a medium distance in accordance with the width of the substrate 1.

支持ブロック12.13上には、押上体22゜23が設
けられている。この押上体22.23は基板1の両側部
の下方にあって、その上端部は基板1とクランパー2,
3の当接部eよりも小距離l内方に位置している。また
支持ブロック12.13には、接地棒24,25が挿着
されている。24a、25agその下端の接地部、27
はベアリング部、28は弾接用コイルばねである。また
接地部24a、25aの下方には、接地板26が設けら
れている。上記押上体22゜23は、この接地棒24.
25の上端部に取り付けられている。
A push-up body 22, 23 is provided on the support block 12.13. The push-up bodies 22 and 23 are located below both sides of the board 1, and their upper ends are connected to the board 1 and the clamper 2.
It is located a short distance l inward from the contact portion e of No. 3. Further, grounding rods 24 and 25 are inserted into the support blocks 12 and 13. 24a, 25ag lower end grounding part, 27
28 is a bearing portion, and 28 is an elastic coil spring. Further, a grounding plate 26 is provided below the grounding portions 24a, 25a. The push-up bodies 22 and 23 are connected to this ground rod 24.
It is attached to the upper end of 25.

接地板26の下方には、昇降手段としてのシリンダ30
.32が配設されている。シリンダ30.32のロッド
31.33は、上記ガイドレール15に垂設されたロフ
ト34.35に結合されている。このロフト34.35
は、接地板26を貫通するガイド管36.37に昇降自
在に挿入されている。シリンダ30.32のロフト31
.33が下降すると、接地部24a。
Below the ground plate 26 is a cylinder 30 as a lifting means.
.. 32 are arranged. The rod 31.33 of the cylinder 30.32 is connected to a loft 34.35 which is suspended from the guide rail 15. This loft 34.35
are inserted into guide tubes 36 and 37 passing through the ground plate 26 so as to be movable up and down. Loft 31 of cylinder 30.32
.. 33 descends, the grounding portion 24a.

25aは接地板26に着地し、ばね28を圧縮しながら
下降する。これとともに基板1も下降し、基板1の両側
部には押当体22,23の上端部が押し付けられて、基
板1の撓みは矯正される(第2図鎖線参照)。
25a lands on the ground plate 26 and descends while compressing the spring 28. At the same time, the substrate 1 is also lowered, and the upper ends of the pressing bodies 22 and 23 are pressed against both sides of the substrate 1, so that the deflection of the substrate 1 is corrected (see chain lines in FIG. 2).

この状態で、基板lはクランパー2,3と押上体22.
23によりしっかりと固定されており、しかも撓みは矯
正されて良好な平面性を有するので、移載ヘッド40を
昇降させて、そのノズル41に吸着された電子部品42
を基板1に着地させても、着地時の荷重により基板1が
がたつくことはない。またスクリーン印刷機により基板
1の上面にクリーム半田や回路パターンを印刷する場合
も、基板lの平面性は確保されていることから、良好に
印刷できる。
In this state, the board l is connected to the clampers 2, 3 and the pusher 22.
23, and the bending is corrected to ensure good flatness. Therefore, the electronic components 42 adsorbed by the nozzles 41 can be moved up and down by the transfer head 40.
Even if it lands on the board 1, the board 1 will not shake due to the load upon landing. Furthermore, even when cream solder or a circuit pattern is printed on the upper surface of the substrate 1 using a screen printer, since the flatness of the substrate 1 is ensured, printing can be performed satisfactorily.

(実施例2) 第3図及び第4図において、クランパー51゜52は基
板1の上方へ延出する延出部51a。
(Embodiment 2) In FIGS. 3 and 4, the clampers 51 and 52 are extended portions 51a extending upward from the substrate 1.

52aを有しており、この延出部51a、52aは基板
1の両側部の上縁部に上方から押当する。またこのもの
も、押当体22,23は、当接部eよりも小距離!内方
に当接する。
52a, and these extending portions 51a, 52a press against the upper edges of both sides of the substrate 1 from above. Also, in this case, the distance between the pressing bodies 22 and 23 is smaller than the contact part e! Abut inward.

上記シリンダ30.32のロフト31.33が下降して
、基板lが下降すると、基板1の両側端部1よ延出部5
1a、52aと押上体22゜23により挟持される。5
3は挟持用パッドである。その状態で上記シリンダ19
のロフト20を退去させて、スライダ13を左方へ移動
させると、基板1は両側方へ引っ張られ、基板lの撓み
は矯正される(第4図鎖線参照)。本手段によれば、基
板1が上凸状あるいは下凸状の何れの方向に撓んでいて
も、その撓みを矯正できる利点がある。
When the loft 31.33 of the cylinder 30.32 is lowered and the substrate 1 is lowered, the extending portion 5
It is held between 1a and 52a and push-up bodies 22 and 23. 5
3 is a holding pad. In that state, the cylinder 19
When the loft 20 is removed and the slider 13 is moved to the left, the substrate 1 is pulled to both sides, and the deflection of the substrate 1 is corrected (see the chain line in FIG. 4). According to this means, there is an advantage that even if the substrate 1 is bent in either an upwardly convex shape or a downwardly convex shape, the deflection can be corrected.

(発明の効果) 以上説明したように本発明は、基板の両側端部の上縁部
に上方から当接するクランパーと、この基板の両側部の
下方に設けられた押上体と、基板をこの押上体に対して
相対的に昇降させることにより、基板とクランパーの当
接部の内方に上記押上体の上端部を押し付けて、この基
板の撓みを矯正する昇降手段とから基板の位置決め装置
を構成しているので、基板の撓みを矯正し、基板をしっ
かり位置決めできる。殊にこのものは、押上体は基板の
両側部に押当するので、基板の上下両面に電子部品が両
面実装される場合も、基板の下面に実装された電子部品
に当らないので、押上体の配置調整を行う必要がなく、
またこの押上体は基板の品種変更に応じて交換する必要
がないなど、基板の品種変更にともなう段取替に有利に
対応できる。
(Effects of the Invention) As explained above, the present invention includes a clamper that abuts the upper edges of both side ends of the board from above, a push-up body provided below both sides of the board, and a push-up body that pushes up the board. A substrate positioning device is constituted by a lifting means that corrects the deflection of the substrate by pressing the upper end of the push-up body inward of the contact portion of the substrate and the clamper by raising and lowering it relative to the body. This makes it possible to correct board deflection and securely position the board. In particular, since the push-up body presses against both sides of the board, even if electronic components are mounted on both the top and bottom of the board, the push-up body does not hit the electronic components mounted on the bottom surface of the board. There is no need to adjust the placement of
In addition, this push-up body does not need to be replaced in response to a change in the type of board, so that it can advantageously respond to setup changes that occur when the type of board changes.

【図面の簡単な説明】[Brief explanation of drawings]

図は本発明の実施例を示すものであって、第1図は基板
の位置決め装置の正面図、第2図は部分正面図、第3図
は他の実施例の正面図、第4図は部分正面図、第5図は
従来手段の正面図である。 1・・・基板 2.3,51.52・・・クランパー 22.23・・・押上体 30.32・・・昇降手段
The drawings show an embodiment of the present invention, in which Fig. 1 is a front view of a substrate positioning device, Fig. 2 is a partial front view, Fig. 3 is a front view of another embodiment, and Fig. 4 is a front view of a substrate positioning device. Partial front view, FIG. 5 is a front view of the conventional means. 1... Board 2.3, 51.52... Clamper 22.23... Pusher body 30.32... Lifting means

Claims (1)

【特許請求の範囲】[Claims]  基板の両側端部の上縁部に上方から当接するクランパ
ーと、この基板の両側部の下方に設けられた押上体と、
基板をこの押上体に対して相対的に昇降させることによ
り、基板とクランパーの当接部の内方に上記押上体の上
端部を押し付けて、この基板の撓みを矯正する昇降手段
とから成ることを特徴とする基板の位置決め装置。
a clamper that abuts the upper edge of both ends of the board from above; a push-up body provided below both sides of the board;
and a lifting means for correcting the deflection of the substrate by raising and lowering the substrate relative to the push-up body and pressing the upper end of the push-up body inward of the contact portion between the board and the clamper. A board positioning device characterized by:
JP2180036A 1990-07-06 1990-07-06 Substrate positioning device Expired - Fee Related JP2808840B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2180036A JP2808840B2 (en) 1990-07-06 1990-07-06 Substrate positioning device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2180036A JP2808840B2 (en) 1990-07-06 1990-07-06 Substrate positioning device

Publications (2)

Publication Number Publication Date
JPH0465900A true JPH0465900A (en) 1992-03-02
JP2808840B2 JP2808840B2 (en) 1998-10-08

Family

ID=16076359

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2180036A Expired - Fee Related JP2808840B2 (en) 1990-07-06 1990-07-06 Substrate positioning device

Country Status (1)

Country Link
JP (1) JP2808840B2 (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05276326A (en) * 1992-03-25 1993-10-22 Canon Inc Photographing device
JPH08261944A (en) * 1995-03-20 1996-10-11 Sony Corp Net-shaped object holding device
GB2338776A (en) * 1998-06-23 1999-12-29 Starturn Ltd Fireworks
KR20000001325A (en) * 1998-06-10 2000-01-15 유무성 Device for fixing printed circuit board of chip mounter
CN101850650A (en) * 2009-03-31 2010-10-06 松下电器产业株式会社 Substrate fixing device and substrate fixing method
JP2013051309A (en) * 2011-08-31 2013-03-14 Ngk Spark Plug Co Ltd Manufacturing method of wiring board
WO2018051495A1 (en) * 2016-09-16 2018-03-22 富士機械製造株式会社 Substrate correction method and substrate correction system
JP2018195690A (en) * 2017-05-17 2018-12-06 株式会社Fuji Substrate transfer holding device

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05276326A (en) * 1992-03-25 1993-10-22 Canon Inc Photographing device
JPH08261944A (en) * 1995-03-20 1996-10-11 Sony Corp Net-shaped object holding device
KR20000001325A (en) * 1998-06-10 2000-01-15 유무성 Device for fixing printed circuit board of chip mounter
GB2338776A (en) * 1998-06-23 1999-12-29 Starturn Ltd Fireworks
CN101850650A (en) * 2009-03-31 2010-10-06 松下电器产业株式会社 Substrate fixing device and substrate fixing method
JP2013051309A (en) * 2011-08-31 2013-03-14 Ngk Spark Plug Co Ltd Manufacturing method of wiring board
WO2018051495A1 (en) * 2016-09-16 2018-03-22 富士機械製造株式会社 Substrate correction method and substrate correction system
JPWO2018051495A1 (en) * 2016-09-16 2019-06-27 株式会社Fuji Substrate correction method, substrate correction system
JP2018195690A (en) * 2017-05-17 2018-12-06 株式会社Fuji Substrate transfer holding device

Also Published As

Publication number Publication date
JP2808840B2 (en) 1998-10-08

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