JP2808840B2 - Substrate positioning device - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to an apparatus for positioning a substrate, and more particularly, to an apparatus for correcting the deflection of a substrate and positioning the substrate.

(Prior Art) When electronic components are mounted on a substrate, or when a circuit pattern or the like is printed, the substrate is positioned or positioned by an apparatus.

FIG. 5 shows a conventional positioning device.
Reference numeral 1 denotes a substrate, which has a slight bending. 102 is a solid clamper, 103 is a movable clamper, 104 is a cylinder, 105
Is a plate on which a number of pins 106 are erected, and 107 is a substrate 10
This is the conveyor belt conveyor No. 1. Next, the operation will be described.

When the substrate 101 is conveyed onto the plate 105 by the conveyor 107, it is driven by a cylinder (not shown) to
105 rises and lifts substrate 101 by pins 106. Next, the cylinder 104 operates, the movable clamper 103 moves to the right, and the substrate 101 is sandwiched and positioned by the two clampers 102, 103. Next, the electronic component 109 is mounted on the substrate 101 by the transfer head.

(Problems to be Solved by the Invention) However, in the above-described conventional means, the pins 106 only lift the substrate 101, the bending of the substrate 101 is not corrected, and the both sides of the substrate 101 float at a small interval t from the upper end of the pins 106. When the electronic component 109 is landed and mounted on both sides, the substrate 101 is liable to rattle due to the load at the time of landing.

Also, when the type of the board 101 is changed, it is necessary to replace the plate 105 or the pin 106 with the new board, especially in the case of a double-sided mounting in which the electronic components 109 are mounted on the upper and lower surfaces of the substrate 101. In order to prevent the pins 106 from hitting the electronic components 109 mounted on the lower surface of the substrate, the positions of the pins 106 must be changed. Further, when the thickness of the substrate changes, the height of the plate 105 must be changed. There is a problem that a great deal of labor and time is required for the setup change accompanying the change of the board type, such as the need to adjust the length and the length of the pins 106.

Therefore, an object of the present invention is to provide a substrate positioning device which can solve the problems of the conventional means.

(Means for Solving the Problems) The present invention provides a clamper which abuts both side edges of a substrate,
A push-up body provided below both sides of the substrate, and an elevating means for raising and lowering the substrate relative to the push-up body,
The inner surface of the clamper is an uphill slope, and the upper edges of both side edges of the substrate are brought into contact with the slope from below,
Press the upper end of the push-up body inside this abutment,
The deflection of the substrate is corrected.

Further, the present invention, a clamper abutting on the upper surface of both ends of the substrate, a lifting body provided below the both sides of the substrate,
Elevating means for moving the substrate up and down relative to the push-up body, and moving means for moving the clamper and the push-up body in the horizontal direction, with both ends of the substrate held between the clamper and the push-up body from above and below. The deflection of the substrate is corrected by moving the clamper and the push-up body to the side by the moving means and pulling the substrate to the side.

(Operation) In the above configuration, in a state where the upper edges of both side ends of the substrate are in contact with the inclined surface of the clamper, the lifting body pushes up both sides of the substrate from below, thereby correcting the deflection of the substrate, Position the substrate.

In addition, while the both ends of the substrate are sandwiched between the clamper and the push-up body from above and below, the clamper and the push-up body are moved to the side and the substrate is pulled to the side, thereby correcting the deflection of the board.

Embodiment 1 Next, an embodiment of the present invention will be described with reference to the drawings.

FIG. 1 is a front view of a substrate positioning device. Reference numeral 1 denotes a substrate, which has a slight downward bending. 2,3 is
A fixed clamper and a movable clamper provided on both sides of the substrate 1. The inner surfaces of the clampers 2 and 3 are slopes 4 and 5 having upward slopes, and press the upper edges of both side edges of the substrate 1 from above (see also FIG. 2). Reference numeral 6 denotes a cylinder whose rod 7 is connected to the clamper 3. When the cylinder 6 operates, the clamper 3 moves in the lateral direction and clamps the substrate 1. Fixed clamper 2
Alternatively, a movable clamper may be used.

Reference numerals 8 and 9 denote main body blocks provided below the clampers 2 and 3, on which conveyor belts 10 and 11 for transporting the substrate 1 are provided. The main body blocks 8, 9 are supported by support blocks 12, 13. Guide rails 15 are disposed above and below the substrate 1, and the support blocks 12 and 13 are mounted on the guide rails 15 via sliders 16 and 17.

One support block 12 is guided by screws 18
Fixed to 15. The other slider 17 has a cylinder 19
The rod 20 is connected to the When the rod 20 protrudes and retracts, the slider 17 slides laterally, and adjusts the width of the gap between the clamper 2 and the clamper 3 according to the width of the substrate 1.

On the support blocks 12, 13, push-up bodies 22, 23 are provided. The push-up bodies 22 and 23 are located below both sides of the substrate 1, and the upper ends thereof are located within a small distance 1 from the contact portions e between the substrate 1 and the clampers 2 and 3. Also support block 1
Ground rods 24, 25 are inserted into 2, 13, respectively. Reference numerals 24a and 25a denote grounding portions at the lower ends, 27 denotes a bearing portion, and 28 denotes a coil spring for elastic contact. In addition, below the grounding portions 24a and 25a, a grounding plate 26 is provided.
Is provided. The push-up bodies 22, 23 are connected to the ground rods 24,
It is attached to the upper end of 25.

Below the ground plate 26, cylinders 30, 3 as elevating means are provided.
Two are arranged. The rods 31, 33 of the cylinders 30, 32 are
It is connected to rods 34 and 35 suspended from the guide rail 15. The rods 34 and 35 are inserted into guide tubes 36 and 37 penetrating the ground plate 26 so as to be able to move up and down. Cylinder 30,
When the rods 31 and 33 of 32 are lowered, the grounding portions 24a and 25a
It lands on 26 and descends while compressing the spring 28. At the same time, the substrate 1 also descends, and the pressing members 22 and 23
At this time, the upper edges of both side edges of the substrate 1 are in contact with the inclined surfaces 4, 5 of the clampers 2, 3 from below. By being pushed up from below at 22, 23, the deflection of the substrate 1 is corrected (see the chain line in FIG. 2).

In this state, the substrate 1 is firmly fixed by the clampers 2 and 3 and the push-up bodies 22 and 23, and the deflection is corrected, and the substrate 1 has good flatness. Even if the electronic component 42 adsorbed by the 41 lands on the substrate 1, the substrate 1 does not rattle due to the load at the time of landing. Also, when a cream solder or a circuit pattern is printed on the upper surface of the substrate 1 by a screen printer, good printing can be performed because the flatness of the substrate 1 is ensured.

(Embodiment 2) In FIGS. 3 and 4, the clampers 51, 52 have extending portions 51a, 52a extending above the substrate 1, and the extending portions 51a, 52a It contacts the upper surface of both ends.
Also in this case, the pressing bodies 22 and 23 are located below the both side portions of the substrate 1 and are in contact with the inside of the contact portion e by a small distance l.

The rods 31 and 33 of the cylinders 30 and 32 are lowered and the substrate 1
Is lowered, both end portions of the substrate 1 are sandwiched from above and below by the extension portions 51a, 52a and the push-up bodies 22, 23. 53 is a pad for holding. In this state, when the rod 20 of the cylinder 19 is retracted and the slider 13 is moved to the left, the substrate 1 is pulled to both sides, and the deflection of the substrate 1 is corrected (see a chain line in FIG. 4). That is, the cylinder 19 serves as moving means for moving the clamper 52 and the push-up body 23 in the lateral direction. According to this means, even if the substrate 1 is bent in any of the upwardly convex and downwardly convex directions, there is an advantage that the bending can be corrected.

(Effects of the Invention) As described above, according to the present invention, the deflection of the substrate can be corrected, and the substrate can be firmly positioned. In particular, in this case, since the push-up body presses against both side portions of the board, even when electronic components are mounted on both upper and lower surfaces of the board, the push-up body does not hit the electronic components mounted on the lower surface of the board. It is not necessary to adjust the arrangement of the substrates, and it is not necessary to replace the lifting body according to the change in the type of the board. In addition, by clamping both sides of the substrate from above and below with a clamper and a push-up body, and pulling the substrate to the side, even if the substrate is bent in either the upwardly convex or downwardly convex direction, the deflection of the substrate is corrected. can do.

[Brief description of the drawings]

1 shows an embodiment of the present invention. FIG. 1 is a front view of a substrate positioning apparatus, FIG. 2 is a partial front view, FIG. 3 is a front view of another embodiment, and FIG. FIG. 5 is a partial front view of the conventional means. 1 ... board 2,3,51,52 ... clamper 22,23 ... push-up body 30,32 ... lifting means

Claims (2)

(57) [Claims] 1. A clamper contacting both side edges of a substrate;
A push-up body provided below both sides of the substrate, and an elevating means for raising and lowering the substrate relative to the push-up body,
The inner surface of the clamper is an uphill slope, and the upper edges of both side edges of the substrate are brought into contact with the slope from below,
Press the upper end of the push-up body inside this abutment,
A substrate positioning device for correcting deflection of a substrate. 2. A clamper in contact with the upper surfaces of both side edges of the substrate, a push-up body provided below both sides of the substrate, and lifting means for lifting and lowering the substrate relative to the push-up body.
Moving means for moving the clamper and the push-up body in the lateral direction, and in a state in which both ends of the substrate are sandwiched by the clamper and the push-up body from above and below, the moving means moves the clamper and the push-up body to the side to move the substrate. A substrate positioning device for correcting deflection of a substrate by pulling the substrate laterally.