CN106102337B - 线路板防湿防腐处理的真空浸涂方法及其设备 - Google Patents
线路板防湿防腐处理的真空浸涂方法及其设备 Download PDFInfo
- Publication number
- CN106102337B CN106102337B CN201610635996.2A CN201610635996A CN106102337B CN 106102337 B CN106102337 B CN 106102337B CN 201610635996 A CN201610635996 A CN 201610635996A CN 106102337 B CN106102337 B CN 106102337B
- Authority
- CN
- China
- Prior art keywords
- valve
- vacuum
- solution tank
- barrel
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1377—Protective layers
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
Description
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610635996.2A CN106102337B (zh) | 2016-08-05 | 2016-08-05 | 线路板防湿防腐处理的真空浸涂方法及其设备 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610635996.2A CN106102337B (zh) | 2016-08-05 | 2016-08-05 | 线路板防湿防腐处理的真空浸涂方法及其设备 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN106102337A CN106102337A (zh) | 2016-11-09 |
CN106102337B true CN106102337B (zh) | 2018-10-30 |
Family
ID=57454040
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201610635996.2A Active CN106102337B (zh) | 2016-08-05 | 2016-08-05 | 线路板防湿防腐处理的真空浸涂方法及其设备 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN106102337B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109201424B (zh) * | 2018-11-14 | 2021-12-10 | 珠海格力智能装备有限公司 | 电路板的喷涂方法及装置、存储介质及处理器 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101086921A (zh) * | 2007-04-20 | 2007-12-12 | 上海同立电工材料有限公司 | 一种真空压力浸渍工艺及其应用装置 |
CN201804709U (zh) * | 2010-10-11 | 2011-04-20 | 南车株洲电机有限公司 | 一种变压器线圈浸漆装置 |
CN103208361A (zh) * | 2013-03-29 | 2013-07-17 | 徐州格利尔科技有限公司 | 一种变压器真空浸漆工艺 |
CN206005026U (zh) * | 2016-08-05 | 2017-03-08 | 江阴市立信智能设备有限公司 | 线路板防湿防腐处理的真空浸涂设备 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61231711A (ja) * | 1985-04-05 | 1986-10-16 | Nissin Electric Co Ltd | モ−ルドコイルの製造方法 |
-
2016
- 2016-08-05 CN CN201610635996.2A patent/CN106102337B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101086921A (zh) * | 2007-04-20 | 2007-12-12 | 上海同立电工材料有限公司 | 一种真空压力浸渍工艺及其应用装置 |
CN201804709U (zh) * | 2010-10-11 | 2011-04-20 | 南车株洲电机有限公司 | 一种变压器线圈浸漆装置 |
CN103208361A (zh) * | 2013-03-29 | 2013-07-17 | 徐州格利尔科技有限公司 | 一种变压器真空浸漆工艺 |
CN206005026U (zh) * | 2016-08-05 | 2017-03-08 | 江阴市立信智能设备有限公司 | 线路板防湿防腐处理的真空浸涂设备 |
Also Published As
Publication number | Publication date |
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CN106102337A (zh) | 2016-11-09 |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Vacuum dip coating method and equipment for moisture proof and anti-corrosion treatment of circuit board Effective date of registration: 20211230 Granted publication date: 20181030 Pledgee: Jiangyin branch of Bank of China Ltd. Pledgor: Jiangyin Lixin Intelligent Device Co.,Ltd. Registration number: Y2021980017184 |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20221220 Granted publication date: 20181030 Pledgee: Jiangyin branch of Bank of China Ltd. Pledgor: Jiangyin Lixin Intelligent Device Co.,Ltd. Registration number: Y2021980017184 |