CN106042361A - 雷射焊接装置 - Google Patents

雷射焊接装置 Download PDF

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CN106042361A
CN106042361A CN201610076646.7A CN201610076646A CN106042361A CN 106042361 A CN106042361 A CN 106042361A CN 201610076646 A CN201610076646 A CN 201610076646A CN 106042361 A CN106042361 A CN 106042361A
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laser
laser light
welder
light source
resin
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小山泰典
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Yi Ding Au Optronics Co
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Yi Ding Au Optronics Co
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Abstract

本发明提供一种雷射焊接装置，无需确认雷射照射点的可视光光源，抑制输出功率为低功率，且结构相对简单。雷射焊接装置包括一雷射光源，发射一雷射光，该雷射光的波长是350nm～550nm的可视光，其中该雷射光源的输出功率是在预定值以下的低功率。而且，雷射光源为一蓝光雷射二极管，且该雷射光的波长是430nm～460nm。本发明的有益效果是其无需用以确认雷射照射点的可视光光源，且能将输出功率抑制在低功率。

Description

雷射焊接装置
技术领域
本发明是关于一种焊接装置，且特别是关于一种通过雷射光来将原料熔解后，以进行焊接的雷射焊接装置。
背景技术
一直以来，通过雷射光来将原料溶解以进行焊接，例如进行软焊的雷射焊接装置陆续被提出。例如，在特开2001-47222号公报中，提出一种通过雷射的披覆细线的回流焊法。在特开2001-47222号公报中，为了将披覆材移除的雷射照射与为了焊锡回流的雷射照射，是使用波长相异的雷射。具体来说，为了将披覆材移除的雷射是使用波长为532nm的雷射，而为了回流焊的雷射是使用波长为1064nm的雷射。
然而，公知用于回流焊(包含：软焊)的雷射，其波长是介于800nm～1100nm，并非为可见光。因此，为了确认雷射照射点，必须另外设置可视光光源，且还必须设置大功率所必需的红外光雷射，而这会造成装置大型化的问题。
发明内容
为了解决上述的问题，本发明其中一目的在于提供一种简易的雷射焊接装置，其无需用以确认雷射照射点的可视光光源，且能将输出功率抑制在低功率。
基于上述目的与其他目的，本发明提供一种雷射焊接装置，该雷射焊接装置包括一雷射光源，发射一雷射光，该雷射光的波长是350nm～550nm的可视光，其中该雷射光源的输出功率是在预定值以下的低功率。
在上述的雷射焊接装置中，雷射光源为一蓝光雷射二极管，且该雷射光的波长是430nm～460nm。
在上述的雷射焊接装置中，雷射光的输出功率为5W以下。
在上述的雷射焊接装置中，通过控制该雷射光源，相应于焊接的程度对该雷射光源的输出功率及该雷射光的照射点的点径进行优化。
在上述的雷射焊接装置中，还包括一红外线温度计，该红外线温度计用于测量该雷射光的照射点的温度，其中通过测量该雷射光的照射点的温度，控制该雷射光源的输出功率及该雷射光的照射点的点径。
上述的雷射焊接装置例如为：借由雷射光进行软焊的雷射焊接装置。而且，此雷射焊接装置是借由雷射光将树脂熔解，并经由已熔解的树脂，进行物体的接合。此外，此雷射焊接装置是借由可穿透透光性材料的雷射光，将位于透光性材料前端的树脂熔解，经由已熔解的树脂，将透光性材料与树脂进行接合。通过本发明所提供的备有雷射光的雷射焊接装置，可提供波长于350nm～550nm可视光范围的雷射光，能将雷射光的输出功率控制在预定值以下的低功率，且无需用于确认雷射照射点的可视光光源。因此，本发明的雷射焊接装置为一能将输出功率抑制在低功率且相对简易的雷射焊接装置。
为让本发明的上述目的、特征和优点更能明显易懂，下文将以实施例并配合所附图式，作详细说明如下。需注意的是，所附图式中的各组件仅是示意，并未按照各组件的实际比例进行绘示。
附图说明
图1所示为本发明的雷射焊接装置的实施例的构成图；
图2所示为图1的雷射焊接装置的使用说明图。
具体实施方式
以下，将参照图面对本发明的型态进行具体的说明。请参照图1与图2，图1所示为本发明的雷射焊接装置的实施例的构成图，图2所示为本发明的雷射焊接装置的使用说明图。
雷射焊接装置1是通过雷射光来将原料熔解以进行焊接，例如进行软焊的雷射焊接装置，以及将树脂熔解以进行接合的焊接装置。雷射焊接装置1包括一装置本体10、作为雷射光源的一雷射二极管30、包含透镜32的一光学系统、及红外线温度计40。在装置本体10中，于内部设置有微电脑(micro computer)12，借由该微电脑12能对雷射焊接装置1的全体进行控制。而且，本实施例的控制方法是使用微电脑12来实现，然而作为雷射焊接装置1全体的控制方法，并不一定需要使用微电脑12，也可为单纯使用硬件而无需软件的控制。此外，在微电脑12中，可借由RS232C连接器12a与外部接口连接器12b，来与外部的各种输入设备(例如：键盘)相连接。
接着，将对装置本体10进行具体的说明。首先，微电脑12连接有一数字模拟转换器(DA converter，简称DAC)14，此数字模拟转换器14用以将微电脑12所输出的指令转换为模拟信号。数字模拟转换器14的作用在电流设定(LD电流设定)，以对后述雷射二极管30进行输出功率控制并将其驱动，其通过电流缓冲器(current buffer)16，而与雷射二极管30相连接。而且，为了检测与控制雷射二极管30的雷射电流而进行的反馈(feedback)，设置一模拟数字转换器(AD converter，简称ADC)24，以用于检测雷射二极管30中的雷射电流。
雷射二极管30所发出的雷射光的波长为介于350nm～550nm的可视光，且输出功率为预定值以下的低功率。在这样的波长范围内，且雷射焊接装置1为雷射软焊装置的场合时，焊接材料的主成分(如：锡、铜等金属)的反射率约为50％。由于反射率低，故吸收雷射光功率的热转换效率便会提高，也能更有效率地熔解焊接材料。此外，更具体地，雷射二极管30较佳为蓝光雷射二极管，雷射光波长介于430nm～460nm。此外，不管后述用于控制雷射二极管30的装置为何，雷射二极管30的输出功率是可以控制在5W以下。
作为照射焊接位置(照射点P)的光学系统，具有透镜32,36。而且，在雷射光的光路的途中，设置有分光器(beam splitter)34，能将穿透光1/100的反射光反射至感光二极管(photo diode，简称PD)42。感光二极管42是与模拟数字转换器22相连接，模拟数字转换器22是用于检测装置本体10的雷射功率，所检测出的雷射功率值是发送到微电脑12。
而且，做为控制装置的微电脑12，在考虑量测后的雷射光的雷射电流与雷射功率的因素后，设定各种要素(如：软焊、树脂的材质、焊接面积等焊接所必要的各种要素)。藉此，通过对雷射光源的控制，能相应于焊接的程度对该雷射光源的输出功率及该雷射光的照射点P的点径进行优化。也因此，能抑制雷射光的输出功率，而达到最佳的焊接。
此外，通过设置可对雷射光的照射点P的温度进行量测的红外线温度传感器40，并通过设置于装置本体10且用于温度检测的模拟数字转换器20，可将红外线温度传感器40所检测出的温度数据传送到微电脑12。微电脑12对所检测出的温度进行考虑后，能相应于焊接的程度对该雷射光源的输出功率及该雷射光的照射点P的点径进行优化。也因此，能抑制雷射光的输出功率，而达到最佳的焊接。
通过上述的雷射焊接装置1，雷射光的波长为350nm～550nm的可视光，雷射光源的输出功率是在预定值以下的低功率，且不需要用于确认雷射照射点的可视光光源，而且输出功率抑制在低功率，且构造相对简易。更具体的说，热转换效率较高，使照射点P的点径优化，藉此能够在只用公知的使用30W～100W的雷射产品的1/10的雷射功率便能够进行焊接。此外，由于使用低功率的雷射，能使散热机构简单化。此外，由于电源容量较小，装置小型化的原因，故也可应用在原本难以进行焊接的部位。
此外，雷射焊接装置1的用途实例之一为雷射软焊装置，而作为其以外的例子，亦可用作达成下述功效的装置：借由雷射光将树脂熔解，并经由已熔解的树脂，进行物体的接合。
作为上述借由雷射光将树脂熔解，并经由已熔解的树脂进行物体接合之装置的具体实施例，亦可用作达成下述功效的装置：借由穿透透光性材料的雷射光，将位于透光性材料前端的树脂熔解，经由已熔解的树脂，将透光性材料与树脂进行接合。作为更具体的例子，如图2所示，可使用于将透光性材料的透镜与透镜框52接合的情况。透镜50系由玻璃或透光性树脂所形成，其能让从雷射光输出部38(设于图1之构成的装置本体10外侧的透镜32至透镜36的光学形态)所输出的雷射光L穿透。接着，穿透透镜50的雷射光L，将与透镜50连接之透镜框52的接合部52a熔解，该透镜框52的接合部52a系由以雷射光L熔解的树脂所形成；再借由使该接合部52a冷却凝固，而可将透镜50与透镜框52接合。如此，若为本实施形态的雷射焊接装置1，亦可在透镜50内侧的狭窄区域进行接合。
此外，在以光吸收性树脂为前提之下，作为以雷射光L所熔解之一侧的树脂之中，较佳为热塑性树脂，例如聚乙烯、聚丙烯、聚苯乙烯、聚氯乙烯、聚酯、甲基丙烯酸、聚碳酸酯、丙烯酸等。树脂对雷射光L的吸收性较差的情况下，只要在树脂中加入颜料等即可提高吸收率。
由上可知，通过本发明的雷射焊接装置，便无需使用确认雷射照射点的可视光光源，且能抑制输出功率为低功率，且结构相对简单。
上述实施例仅是为了方便说明而举例，虽遭所属技术领域的技术人员任意进行修改，均不会脱离如权利要求书中所欲保护的范围。

Claims (8)

1.一种雷射焊接装置，通过雷射来进行焊接，其特征在于，该雷射焊接装置包括一雷射光源，发射一雷射光，该雷射光的波长是350nm～550nm的可视光，其中该雷射光源的输出功率是在预定值以下的低功率。
2.如权利要求1所述的雷射焊接装置，其特征在于，该雷射光源为一蓝色雷射二极管，且该雷射光的波长是430nm～460nm。
3.如权利要求1所述的雷射焊接装置，其特征在于，该雷射光的输出功率为5W以下。
4.如权利要求1所述的雷射焊接装置，其特征在于，通过控制该雷射光源，相应于焊接的程度对该雷射光源的输出功率及该雷射光的照射点的点径进行优化。
5.如权利要求4所述的雷射焊接装置，其特征在于，还包括一红外线温度计，该红外线温度计用于测量该雷射光的照射点的温度，其中通过测量该雷射光的照射点的温度，控制该雷射光源的输出功率及该雷射光的照射点的点径。
6.如权利要求1～5所述的雷射焊接装置，其特征在于，该雷射焊接装置为借由雷射光进行软焊的雷射软焊装置。
7.如权利要求1～5所述的雷射焊接装置，其特征在于，该雷射焊接装置是借由雷射光将树脂熔解，并经由已熔解的树脂，进行物体的接合。
8.如权利要求1～5所述的雷射焊接装置，其特征在于，雷射焊接装置是借由穿透透光性材料的雷射光，将位于透光性材料前端的树脂熔解，经由已熔解的树脂，将透光性材料与树脂进行接合。
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