TW201636144A - 雷射焊接裝置 - Google Patents
雷射焊接裝置 Download PDFInfo
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- TW201636144A TW201636144A TW104126188A TW104126188A TW201636144A TW 201636144 A TW201636144 A TW 201636144A TW 104126188 A TW104126188 A TW 104126188A TW 104126188 A TW104126188 A TW 104126188A TW 201636144 A TW201636144 A TW 201636144A
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Abstract
本發明提供一種雷射焊接裝置,無需確認雷射照射點的可視光光源,抑制輸出功率為低功率,且結構相對簡單。雷射焊接裝置包括一雷射光源,發射一雷射光,該雷射光的波長是350 nm~550 nm的可視光,其中該雷射光源的輸出功率是在預定值以下的低功率。而且,雷射光源為一藍色雷射二極體,且該雷射光的波長是430 nm~460 nm。
Description
本發明是關於一種焊接裝置,且特別是關於一種通過雷射光來進行焊接的雷射焊接裝置。
一直以來,通過雷射光來進行焊接的雷射焊接裝置陸續被提出。例如,在特開2001-47222號公報中,提出一種通過雷射的披覆細線的焊錫回流法。在特開2001-47222號公報中,為了將披覆材移除的雷射照射與為了焊錫回流的雷射照射,是使用波長相異的雷射。具體來說,為了將披覆材移除的雷射是使用波長為532nm的雷射,而為了焊錫回流的雷射是使用波長為1064nm的雷射。
然而,習知用於焊錫回流(包含:焊接)的雷射,其波長是介於800 nm~1100 nm,並非為可見光。因此,為了確認雷射照射點,必須另外設置可視光光源,且還必須設置大功率所必需的紅外光雷射,而這會造成裝置大型化的問題。
為了解決上述之問題,本發明其中一目的在於提供一種簡易的雷射焊接裝置,其無須用以確認雷射照射點的可視光光源,且能將輸出功率抑制在低功率。
基於上述目的與其他目的,本發明提供一種雷射焊接裝置,該雷射焊接裝置包括一雷射光源,發射一雷射光,該雷射光的波長是350 nm~550 nm的可視光,其中該雷射光源的輸出功率是在預定值以下的低功率。
在上述之雷射焊接裝置中,雷射光源為一藍色雷射二極體,且該雷射光的波長是430 nm~460 nm。
在上述之雷射焊接裝置中,雷射光的輸出功率為5W以下。
在上述之雷射焊接裝置中,通過控制該雷射光源,相應於焊接的程度對該雷射光源的輸出功率及該雷射光的照射點的點徑進行最佳化。
在上述之雷射焊接裝置中,更包括一紅外線溫度計,該紅外線溫度計用於測量該雷射光的照射點的溫度,其中通過測量該雷射光的照射點的溫度,控制該雷射光源的輸出功率及該雷射光的照射點的點徑。
通過本發明所提供的備有雷射光的雷射焊接裝置,可提供波長於350 nm~550 nm可視光範圍的雷射光,能將雷射光的輸出功率控制在預定值以下的低功率,且無需用於確認雷射照射點的可視光光源。因此,本發明的雷射焊接裝置為一能將輸出功率抑制在低功率且相對簡易的雷射焊接裝置。
1‧‧‧雷射焊接裝置
10‧‧‧裝置本體
12‧‧‧微電腦
12a‧‧‧RS232C連接器
12b‧‧‧外部介面連接器
14‧‧‧數位類比轉換器
16‧‧‧電流緩衝器
20‧‧‧類比數位轉換器
22‧‧‧類比數位轉換器
24‧‧‧類比數位轉換器
30‧‧‧雷射二極體
32‧‧‧透鏡
34‧‧‧分光器
36‧‧‧透鏡
40‧‧‧紅外線溫度感測器
42‧‧‧感光二極體
圖1所繪示為本發明的雷射焊接裝置之實施例的構成圖。
以下,將參照圖面對本發明的型態進行具體的說明。請參照圖1,圖1所繪示為本發明的雷射焊接裝置之實施例的構成圖,圖中的雷射焊接裝置為通過雷射而進行焊接的裝置。
雷射焊接裝置1包括一裝置本體10、作為雷射光源的一雷射二極體30、包含透鏡32的一光學系統、及紅外線溫度計40。在裝置本體10中,於內部設置有微電腦(micro computer)12,藉由該微電腦12能對雷射焊接裝置1的全體進行控制。而且,本實施例的控制方法是使用微電腦12來實現,然而作為雷射焊接裝置1全體的控制方法,並不一定需要使用微電腦12,也可為單純使用硬體而無須軟體的控制。此外,在微電腦12中,可藉由RS232C連接器12a與外部介面連接器12b,來與外部的各種輸入裝置(例如:鍵盤)相連接。
接著,將對裝置本體10進行具體的說明。首先,微電腦12連接有一數位類比轉換器(DA converter,簡稱DAC)14,此數位類比轉換器14用以將微電腦12所輸出的指令轉換為類比訊號。數位類比轉換器14的作用在電流設定(LD電流設定),以對後述雷射二極體30進行輸出功率控制並將其驅動,其透過電流緩衝器(current buffer)16,而與雷射二極體30相連接。而且,為了檢測與控制雷射二極體30的雷射電流而進行的反饋(feedback),設置一類比數位轉換器(AD converter,簡稱ADC)24,以用於檢測雷射二極體30中的雷射電流。
雷射二極體30所發出的雷射光的波長為介於350 nm~550 nm的可視光,且輸出功率為預定值以下的低功率。在這樣的波長範圍內,焊接材料的主成分(如:錫、銅等金屬)的反射率約為50%。由於反射率低,故吸收雷射光功率的熱變換效率便會提高,也能更有效率地溶解焊接材料。此外,更具體地,雷射二極體30較佳為藍色雷射二極體,雷射光波長介於430 nm~460 nm。此外,不管後述用於控制雷射二極體30的裝置為何,雷射二極體30的輸出功率是可以控制在5W以下。
作為照射焊接位置(照射點P)的光學系統,具有透鏡32, 36。而且,在雷射光的光路的途中,設置有分光器(beam splitter)34,能將穿透光1/100的反射光反射至感光二極體(photo diode,簡稱PD)42。感光二極體42是與類比數位轉換器22相連接,類比數位轉換器22是用於檢測裝置本體10的雷射功率,所檢測出的雷射功率值是發送到微電腦12。
而且,做為控制裝置的微電腦12,在考慮量測後的雷射光的雷射電流與雷射功率的因素後,設定各種要素(如:焊接材質、焊接面積等焊接所必要的各種要素)。藉此,通過對雷射光源的控制,能相應於焊接的程度對該雷射光源的輸出功率及該雷射光的照射點P的點徑進行最佳化。也因此,能抑制雷射光的輸出功率,而達到最佳的焊接。
此外,通過設置可對雷射光的照射點P的溫度進行量測的紅外線溫度感測器40,並通過設置於裝置本體10且用於溫度檢測的類比數位轉換器20,可將紅外線溫度感測器40所檢測出的溫度資料傳送到微電腦12。微電腦12對所檢測出的溫度進行考量後,能相應於焊接的程度對該雷射光源的輸出功率及該雷射光的照射點P的點徑進行最佳化。也因此,能抑制雷射光的輸出功率,而達到最佳的焊接。
通過上述的雷射焊接裝置1,雷射光的波長為350 nm~550 nm的可視光,雷射光源的輸出功率是在預定值以下的低功率,且不需要用於確認雷射照射點的可視光光源,而且輸出功率抑制在低功率,且構造相對簡易。更具體的說,熱變換率較高,使照射點P的的點徑最佳化,藉此能夠在只用習知的使用30W〜100W的雷射產品的1/10的雷射功率便能夠進行焊接。此外,由於使用低功率的雷射,能使散熱機構簡單化。
由上可知,通過本發明的雷射焊接裝置,便無需使用確認雷射照射點的可視光光源,抑制輸出功率為低功率,且結構相對簡單。
本創作以實施例說明如上,然其並非用以限定本創作所主張之專利權利範圍。其專利保護範圍當視後附之申請專利範圍及其等同領域而定。凡本領域具有通常知識者,在不脫離本專利精神或範圍內,所作之更動或潤飾,均屬於本創作所揭示精神下所完成之等效改變或設計,且應包含在下述之申請專利範圍內。
1‧‧‧雷射焊接裝置
10‧‧‧裝置本體
12‧‧‧微電腦
12a‧‧‧RS232C連接器
12b‧‧‧外部介面連接器
14‧‧‧數位類比轉換器
16‧‧‧電流緩衝器
20‧‧‧類比數位轉換器
22‧‧‧類比數位轉換器
24‧‧‧類比數位轉換器
30‧‧‧雷射二極體
32‧‧‧透鏡
34‧‧‧分光器
36‧‧‧透鏡
40‧‧‧紅外線溫度感測器
42‧‧‧感光二極體
Claims (5)
- 一種雷射焊接裝置,通過雷射來進行焊接,該雷射焊接裝置包括一雷射光源,發射一雷射光,該雷射光的波長是350 nm~550 nm的可視光,其中該雷射光源的輸出功率是在預定值以下的低功率。
- 如申請專利範圍第1項所述之雷射焊接裝置,其中該雷射光源為一藍色雷射二極體,且該雷射光的波長是430 nm~460 nm。
- 如申請專利範圍第1項所述之雷射焊接裝置,其中該雷射光的輸出功率為5W以下。
- 如申請專利範圍第1項至第3項任一項所述之雷射焊接裝置,其中通過控制該雷射光源,相應於焊接的程度對該雷射光源的輸出功率及該雷射光的照射點的點徑進行最佳化。
- 如申請專利範圍第4項任一項所述之雷射焊接裝置,更包括一紅外線溫度計,該紅外線溫度計用於測量該雷射光的照射點的溫度,其中通過測量該雷射光的照射點的溫度,控制該雷射光源的輸出功率及該雷射光的照射點的點徑。
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