CN106019824A - 压印装置和方法、材料分配数据创建方法及物品制造方法 - Google Patents
压印装置和方法、材料分配数据创建方法及物品制造方法 Download PDFInfo
- Publication number
- CN106019824A CN106019824A CN201610195961.1A CN201610195961A CN106019824A CN 106019824 A CN106019824 A CN 106019824A CN 201610195961 A CN201610195961 A CN 201610195961A CN 106019824 A CN106019824 A CN 106019824A
- Authority
- CN
- China
- Prior art keywords
- substrate
- pattern
- information
- unit
- imprinting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/7035—Proximity or contact printers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/201—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by an oblique exposure; characterised by the use of plural sources; characterised by the rotation of the optical device; characterised by a relative movement of the optical device, the light source, the sensitive system or the mask
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
- G03F7/70508—Data handling in all parts of the microlithographic apparatus, e.g. handling pattern data for addressable masks or data transfer to or from different components within the exposure apparatus
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7042—Alignment for lithographic apparatus using patterning methods other than those involving the exposure to radiation, e.g. by stamping or imprinting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015074495A JP6602033B2 (ja) | 2015-03-31 | 2015-03-31 | インプリント装置、供給量分布の作成方法、インプリント方法、及び物品の製造方法 |
| JP2015-074495 | 2015-03-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106019824A true CN106019824A (zh) | 2016-10-12 |
Family
ID=57015896
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610195961.1A Pending CN106019824A (zh) | 2015-03-31 | 2016-03-31 | 压印装置和方法、材料分配数据创建方法及物品制造方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20160291486A1 (https=) |
| JP (1) | JP6602033B2 (https=) |
| KR (1) | KR102055972B1 (https=) |
| CN (1) | CN106019824A (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11131923B2 (en) * | 2018-10-10 | 2021-09-28 | Canon Kabushiki Kaisha | System and method of assessing surface quality by optically analyzing dispensed drops |
| JP7286400B2 (ja) * | 2019-04-24 | 2023-06-05 | キヤノン株式会社 | 成形装置、決定方法、および物品製造方法 |
| JP2024078506A (ja) * | 2022-11-30 | 2024-06-11 | キヤノン株式会社 | インプリント装置、物品製造方法、決定方法及びプログラム |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1876395A (zh) * | 2005-06-08 | 2006-12-13 | 佳能株式会社 | 模子、图案形成方法以及图案形成设备 |
| US20100072653A1 (en) * | 2008-09-25 | 2010-03-25 | Canon Kabushiki Kaisha | Imprinting apparatus and method therefor |
| US20110057354A1 (en) * | 2009-09-10 | 2011-03-10 | Canon Kabushiki Kaisha | Imprinting method and imprinting apparatus |
| CN103624992A (zh) * | 2013-11-22 | 2014-03-12 | 北京化工大学 | 一种聚合物微结构的压制装置及压制加工方法 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005101201A (ja) * | 2003-09-24 | 2005-04-14 | Canon Inc | ナノインプリント装置 |
| US20070228593A1 (en) * | 2006-04-03 | 2007-10-04 | Molecular Imprints, Inc. | Residual Layer Thickness Measurement and Correction |
| US8011916B2 (en) * | 2005-09-06 | 2011-09-06 | Canon Kabushiki Kaisha | Mold, imprint apparatus, and process for producing structure |
| JP4908369B2 (ja) * | 2007-10-02 | 2012-04-04 | 株式会社東芝 | インプリント方法及びインプリントシステム |
| JP2010239118A (ja) * | 2009-03-11 | 2010-10-21 | Canon Inc | インプリント装置および方法 |
| JP5563243B2 (ja) * | 2009-06-01 | 2014-07-30 | キヤノン株式会社 | インプリント装置、および、物品の製造方法 |
| JP2010283207A (ja) * | 2009-06-05 | 2010-12-16 | Toshiba Corp | パターン形成装置およびパターン形成方法 |
| JP5744422B2 (ja) * | 2010-06-17 | 2015-07-08 | キヤノン株式会社 | インプリント方法及びインプリント装置、サンプルショット抽出方法、並びにそれを用いた物品の製造方法 |
| JP5214683B2 (ja) * | 2010-08-31 | 2013-06-19 | 株式会社東芝 | インプリントレシピ作成装置及び方法並びにインプリント装置及び方法 |
| JP5337776B2 (ja) * | 2010-09-24 | 2013-11-06 | 富士フイルム株式会社 | ナノインプリント方法およびそれを利用した基板の加工方法 |
| JP2012114157A (ja) * | 2010-11-22 | 2012-06-14 | Toshiba Corp | ドロップレシピ作成方法およびデータベース作成方法 |
| JP6313591B2 (ja) * | 2013-12-20 | 2018-04-18 | キヤノン株式会社 | インプリント装置、異物除去方法及び物品の製造方法 |
-
2015
- 2015-03-31 JP JP2015074495A patent/JP6602033B2/ja active Active
-
2016
- 2016-03-28 US US15/082,985 patent/US20160291486A1/en not_active Abandoned
- 2016-03-30 KR KR1020160038093A patent/KR102055972B1/ko active Active
- 2016-03-31 CN CN201610195961.1A patent/CN106019824A/zh active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1876395A (zh) * | 2005-06-08 | 2006-12-13 | 佳能株式会社 | 模子、图案形成方法以及图案形成设备 |
| US20100072653A1 (en) * | 2008-09-25 | 2010-03-25 | Canon Kabushiki Kaisha | Imprinting apparatus and method therefor |
| US20110057354A1 (en) * | 2009-09-10 | 2011-03-10 | Canon Kabushiki Kaisha | Imprinting method and imprinting apparatus |
| CN103624992A (zh) * | 2013-11-22 | 2014-03-12 | 北京化工大学 | 一种聚合物微结构的压制装置及压制加工方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6602033B2 (ja) | 2019-11-06 |
| US20160291486A1 (en) | 2016-10-06 |
| JP2016195184A (ja) | 2016-11-17 |
| KR20160117322A (ko) | 2016-10-10 |
| KR102055972B1 (ko) | 2019-12-13 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20161012 |
|
| WD01 | Invention patent application deemed withdrawn after publication |