CN105990191B - Substrate transfer stage, scribing device, and method of transferring substrate - Google Patents
Substrate transfer stage, scribing device, and method of transferring substrate Download PDFInfo
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- CN105990191B CN105990191B CN201510666645.3A CN201510666645A CN105990191B CN 105990191 B CN105990191 B CN 105990191B CN 201510666645 A CN201510666645 A CN 201510666645A CN 105990191 B CN105990191 B CN 105990191B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
Abstract
The present invention relates to a substrate transport pallet, a scribing device including the substrate transport pallet, and a method of transporting a substrate to prevent damage of the substrate transported on the pallet. The substrate conveying pallet includes: a stage on which a substrate is placed and which rotates to convey the substrate placed thereon in one direction; and an antistatic tape disposed to surround the stage and prevent static charge from being accumulated between the substrate and the stage, wherein the stage includes a first stage and a second stage disposed to be spaced apart from each other at a predetermined interval in a conveying direction of the substrate, and rotation of the first stage and rotation of the second stage are controlled in an asynchronous manner.
Description
Technical Field
The present invention relates to a substrate transport pallet, a scribing device including the substrate transport pallet, and a method of transporting a substrate for preventing the substrate transported on the pallet from being damaged.
Background
In general, an LCD panel, an organic EL panel, an inorganic EL panel, a transmissive projector substrate, a reflective projector substrate, and the like, which are used as a flat display panel, are manufactured by using a unit glass panel (hereinafter, referred to as a "unit substrate") that is made by cutting a brittle mother glass panel (hereinafter, referred to as a "substrate") such as glass into a predetermined size.
The process of cutting the substrate includes a scribing process of forming a scribe line by pressing and moving a cutter wheel made of diamond or the like along a predetermined cutting line formed on the surface of the substrate, and cutting the substrate along the scribe line to obtain a split of the unit substrate.
Generally, the process of cutting the substrate is performed by a tape scribing apparatus.
A general tape scribing device is provided with a separate tape for each process.
For example, the substrate is supplied onto any one of the belts by the conveying unit, then the substrate is conveyed in the conveying direction, the conveyed substrate is transferred onto the other belt to perform the scribing process, and then the scribed substrate is transferred onto the other belt to perform the breaking and picking process.
In this case, for example, a scribing process or a breaking process, for example, may be performed between the respective tapes, and as a result, the tapes are inevitably placed so as to form a separation space having a predetermined pitch between the tapes.
In the case where the belts are placed to be spaced apart from each other at a predetermined interval as described above, there is a problem in that, when the scribed substrate or the broken unit substrate passes through the separation space, the inactive portion around the unit substrate falls through the separation space between the belts, or the conveyed substrate is misaligned due to a difference in flatness or height between the belts.
Further, when unit substrates are obtained by cutting the substrates and then conveyed on these belts, there often occurs a problem that the preceding unit substrates and the following unit substrates are damaged by colliding with each other.
The reason is that there is a predetermined frictional force between the substrate and the belt, and because the belt is generally made of a stretchable material, there is a difference in time between the point of time when the belt is actually operated and the point of time when the substrate is moved.
In order to solve these problems, it is attempted to synchronize the previous and subsequent belts and operate them at the same speed at the same time, but in the case where the above-described method is applied to a practical process, the belts are stretched due to the weight of the substrate, so that there is still a difference in time between the point of time when the belts are actually operated and the point of time when the substrate is moved, and as a result, there still occurs a problem that the previous and subsequent unit substrates are damaged by colliding with each other, resulting in defects.
Disclosure of Invention
The present invention has been made in an effort to provide a substrate transport tray and a scribing apparatus including the same, which reduce a defect rate by preventing collision between unit substrates obtained by cutting a substrate by scribing or breaking when the unit substrates are transported by a belt.
The present invention has been made in an effort to provide a substrate conveying pallet and a scribing apparatus including the same that reduce a defect rate that may occur in a process of conveying a substrate by reducing a possibility of generating a frictional force and an electrostatic charge between the substrate and a belt.
An exemplary embodiment of the present invention provides a substrate transfer pallet, including: a stage on which a substrate is placed and which rotates to convey the substrate placed thereon in one direction; and an antistatic tape which is provided to surround the stage and prevents static charge from being formed between the substrate and the stage, wherein the stage includes a first stage and a second stage which are placed to be spaced apart from each other by a predetermined interval in a conveying direction of the substrate, and rotation of the first stage and rotation of the second stage are controlled in an asynchronous manner.
The surface resistance of the antistatic tape adjacent to the substrate may be 106To 1010Ω/□。
The voltage of the electrostatic charge generated on the antistatic tape adjacent to the substrate may be 100V or less.
The antistatic tape may include a surface layer adjoining the substrate and having an uneven pattern, and an intermediate layer including a conductive material.
The conductive material in the intermediate layer may be oriented parallel to the transport direction of the substrate.
The conductive material may be carbon nanotubes or a conductive metal.
The spacing between the first and second pallets provides a space in which the cutter wheel contacts the substrate.
The rotational speeds of the first and second pallets may be different from each other.
Another exemplary embodiment of the present invention provides a scribing apparatus including: a substrate transport pallet; a substrate conveying unit that conveys a substrate placed on a substrate conveying stage in a conveying direction at a predetermined speed; and a scribing unit cutting the substrate in a direction orthogonal to a conveying direction of the substrate to produce a first unit substrate placed on the first stage and a second unit substrate placed on the second stage.
The first and second pallets may be controlled in an asynchronous manner so as to convey the first and second unit substrates in a state where the first and second unit substrates are in contact with each other.
The first pallet and the substrate conveying unit may be controlled in a synchronized manner.
The first and second pallets may be controlled in an asynchronous manner so as to convey the first and second unit substrates in a state where the first and second unit substrates are spaced apart from each other.
Another exemplary embodiment of the present invention provides a method of conveying a substrate, the method including: conveying a substrate placed on a first pallet in one direction and placing the substrate on both the first pallet and a second pallet, wherein the second pallet is placed to be spaced apart from the first pallet; cutting the substrate between the first pallet and the second pallet into a first unit substrate placed on the first pallet and a second unit substrate placed on the second pallet; rotating the first pallet and simultaneously conveying the first unit substrate and the second unit substrate so that both the first unit substrate and the second unit substrate are placed on the second pallet in a state where the first unit substrate and the second unit substrate are in contact with each other; and rotating the second pallet and conveying the first unit substrate and the second unit substrate in a state where the first unit substrate and the second unit substrate are in contact with each other.
Yet another exemplary embodiment of the present invention provides a method of conveying a substrate, the method including: conveying a substrate placed on a first pallet in one direction and placing the substrate on both the first pallet and a second pallet, wherein the second pallet is placed to be spaced apart from the first pallet; cutting the substrate between the first pallet and the second pallet into a first unit substrate placed on the first pallet and a second unit substrate placed on the second pallet; rotating the second pallet and conveying the second unit substrate in one direction; and simultaneously rotating the first and second pallets to place the first unit substrate on the second pallet and conveying the first and second unit substrates in a state where the first and second unit substrates are spaced apart from each other.
According to exemplary embodiments of the present invention, when unit substrates, which are obtained by cutting a substrate by scribing or breaking, are conveyed by a belt, a defect rate may be reduced by preventing collision between the unit substrates.
Further, according to the present invention, defects that may occur during the conveyance of the substrate can be reduced by reducing the possibility of generating friction and static charges between the substrate and the belt.
Drawings
Fig. 1 is a plan view schematically illustrating a substrate transport pallet according to an exemplary embodiment of the present invention.
Fig. 2A and 2B are perspective views schematically illustrating an antistatic tape provided on first and second stages of a substrate transport stage according to an exemplary embodiment of the present invention.
Fig. 3 is a view illustrating an antistatic tape according to an exemplary embodiment of the present invention.
Fig. 4A to 4D are views schematically showing a process of conveying and cutting a substrate according to an exemplary embodiment of the present invention.
Fig. 5A to 5E are views schematically showing a process of conveying and cutting a substrate according to another exemplary embodiment of the present invention.
Detailed Description
Specific terms are defined herein for convenience to facilitate the understanding of the present invention. Unless otherwise defined herein, all terms used herein including technical or scientific terms have the meaning commonly understood by those skilled in the art. Furthermore, it is to be understood that as used herein, the singular expression includes the plural expression thereof, and the plural expression also includes the singular expression thereof, unless the context clearly dictates otherwise.
Terms including ordinal words, such as "first", "second", etc., may be used to describe different constituent elements, but the constituent elements are not limited by the terms. These terms are only used to distinguish one constituent element from another constituent element.
The configuration of a substrate transport tray and a scribing apparatus including the same, and the principle of a method of transporting a substrate using the same according to exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings.
Fig. 1 is a plan view schematically illustrating a substrate transport pallet according to an exemplary embodiment of the present invention.
The substrate conveying pallet according to an exemplary embodiment of the present invention includes pallets on which the substrates P are placed and antistatic belts respectively disposed to surround the pallets.
More specifically, the pallet includes first and second pallets 100 and 200 disposed to be spaced apart from each other by a predetermined interval in a conveyance direction of the substrate P, and the first and second pallets 100 and 200 rotate to convey the substrate P placed thereon in one direction.
In this case, the rotation of the first pallet 100 and the rotation of the second pallet 200 are controlled in an asynchronous manner.
Here, the asynchronous control may mean that the rotation of the first pallet 100 and the rotation of the second pallet 200 do not start at the same time, i.e., a time point at which the first pallet 100 starts to rotate and a time point at which the second pallet 200 starts to rotate are different from each other. Further, the asynchronous control may mean that the rotation speed of the first pallet 100 and the rotation speed of the second pallet 200 are different from each other.
Although not separately shown, a point of time at which the first and second pallets 100 and 200 start to rotate, rotational speeds thereof, and the like may be controlled by means of control driving units respectively provided in the first and second pallets 100 and 200.
The substrate P placed on the substrate transport stage is held by the substrate transport unit 120 and then transported at a predetermined speed in the transport direction. The substrate transfer unit 120 has a plurality of chucking units 121 for chucking one end portion of the substrate P.
The substrate P, which has been provided on the first pallet 100, is conveyed with one end of the substrate P held by the substrate conveying unit 120, and is transferred to the second pallet 200 in the conveying direction with one end of the substrate P held by the substrate conveying unit 120. For the subsequent process, the substrate P transferred to the second pallet 200 by the substrate transfer unit 120 is transferred again in the transfer direction.
Fig. 2A and 2B are perspective views schematically illustrating an antistatic tape provided on first and second stages of a substrate transport stage according to an exemplary embodiment of the present invention.
Referring to fig. 2A and 2B, accommodating parts 130 and 230 for accommodating a plurality of chucking units 121 of the substrate conveying unit 120 and guide rollers 140 and 240 for supporting rotation of the antistatic belts 110 and 210 are provided in the antistatic belts 110 and 210, wherein the antistatic belts 110 and 210 are disposed to surround the first and second stages 100 and 200, respectively.
More specifically, the accommodating parts 130 and 230 have a plurality of grooves 131 and 231 for accommodating the plurality of clamping units 121, and the plurality of grooves 131 and 231 are disposed to be spaced apart from each other in the width direction of the antistatic tapes 110 and 210 at intervals at which the clamping units 121 are spaced apart from each other.
Further, the accommodating parts 130 and 230 are disposed to be spaced apart from each other at a predetermined interval d in the longitudinal direction of the antistatic tapes 110 and 210 to continuously accommodate the substrate conveying unit 120. Here, the pitch d may be set in proportion to the conveyance speed of the substrate P according to the rotation of the first pallet 100, the conveyance speed and the driving distance of the substrate conveyance unit 120, and the like.
Here, the antistatic bands 110 and 210 may be configured as flat bands.
In general, a plurality of tapes extending in the longitudinal direction are used by being arranged in parallel, but in this case, the flatness (height) of the plurality of tapes needs to be kept equal to each other.
If a plurality of belts are provided at different heights, the substrate cannot be stably placed on the belts while being conveyed, which may cause misalignment of the substrate and increase inaccuracy of subsequent processes.
Therefore, in the present invention, the belt on which the substrate P is placed is configured as a flat belt, thereby allowing the entire bottom surface of the substrate P conveyed on the corresponding pallet to be placed on the belt.
Further, the flat belts constituting the antistatic belts 110 and 210 are rotatably provided in the form of caterpillar belts, and both ends of the flat belts are attached to each other by an adhesive so as to configure the flat belts in the form of caterpillar belts.
However, when both ends of the flat belt are attached to each other, an attachment surface formed by an adhesive needs to be located between the flat belt and the pallet. If the attachment surface is formed on the upper surface of the flat belt on which the substrate P is placed, the amount of frictional force applied to the substrate P is necessarily different in the region where the attachment surface is formed and in the region where the attachment surface is not formed, and as a result, the tension of the flat belt may vary depending on the position on which the substrate P is placed.
Referring to fig. 2A, the substrate P is supplied to the first pallet 100 with one end of the substrate P held by the substrate conveying unit 120, and in this case, the substrate conveying unit 120 may supply the substrate P in a vertical or horizontal direction.
That is, when the accommodating part 130 is positioned at the starting point of the first pallet 100, the substrate conveying unit 120 may be moved in parallel to the first pallet 100 in the conveying direction so that the plurality of clamping units 121 are accommodated in the plurality of grooves 131, wherein the plurality of grooves 131 are provided in the accommodating part 130 of the antistatic tape 110.
In another modified embodiment, when the receiving part 130 is positioned at the starting point of the first pallet 100, the substrate conveying unit 120 may be vertically moved from the top side of the first pallet 100 so that the plurality of clamping units 121 are received in the plurality of grooves 131, wherein the plurality of grooves 131 are provided in the receiving part 130 of the antistatic tape 110.
In this way, the substrate conveying unit 120 may provide the substrate P to the first pallet 100 in a vertical or horizontal direction, and as a result, the substrate conveying unit 120 may be applied to different types of apparatuses. Further, in some cases, the substrate conveying unit 120 is configured to provide the substrate P in a direction perpendicular to the first pallet 100, thereby reducing the overall size of the apparatus.
As described above, the substrate conveying unit 120 allows the plurality of clamping units 121 to be accommodated in the plurality of grooves 131, wherein the plurality of grooves 131 are provided in the accommodating part 130 of the antistatic tape 110, and as a result, the entire bottom surface of the substrate clamped by the clamping units 121 can be stably placed on the antistatic tape 110.
Further, since the plurality of clamping units 121 are accommodated in the plurality of grooves 131, interference between the clamping units 121 and the antistatic tape 110 can be prevented.
Next, the substrate P moving in the conveying direction is transferred to the second pallet 200 due to the rotation of the first pallet 100 and the movement of the substrate conveying unit 120.
In this case, the first and second pallets 100 and 200 may have the same height, i.e., the antistatic tape 110 of the first pallet 100 and the antistatic tape 210 of the second pallet 200 may have the same height.
Since the antistatic bands of the two stages are formed at the same height, it is not considered that a collision caused by a height difference between the two stages is applied to the substrate P transferred from the first stage 100 to the second stage 200, thereby preventing a problem that an alignment state of the substrate P is changed.
Further, the substrate P is transferred to the second pallet 200 in a state where the substrate P is held by the substrate transfer unit 120.
That is, the substrate conveying unit 120 moves so that the plurality of gripper units 121 of the substrate conveying unit 120 can be moved out of the plurality of grooves 131 when the plurality of grooves 131 are positioned at the end point of the first pallet 100 by the rotation of the first pallet 100, and the plurality of gripper units 121 can be accommodated in the plurality of grooves 231 when the plurality of grooves 231 are positioned at the start point of the second pallet 200, thereby transferring the substrate P to the second pallet 200.
In this case, the distance by which the substrate P transferred to the second pallet 200 is spaced apart from the bottom surface with the substrate P held by the substrate transfer unit 120 is kept constant, thereby preventing a problem of impact or a change in the alignment state of the substrate P caused by a difference in height applied to the substrate P during the transfer of the substrate P to the second pallet 200.
The time points at which the first and second pallets 100 and 200 rotate and the rotation speeds of the first and second pallets 100 and 200 may be controlled in an asynchronous manner, respectively, but the time at which the substrate conveying unit 120 moved away from the first pallet 100 reaches the start point of the second pallet 200 may be synchronized with the time at which the plurality of grooves 231 are positioned at the start point of the second pallet 200.
Accordingly, it is possible to significantly reduce the overall time required for the process of transferring the substrate P from the first pallet 100 to the second pallet 200, and to further maintain the stability of the process of transferring the substrate P at a high level even if the process time is shortened.
Fig. 3 schematically shows a top view of the antistatic tape 110 or 210 and the intermediate layer 110a or 210a provided in the antistatic tape 110 or 210, and a cross-sectional view of the surface layer 110b or 210b, according to an exemplary embodiment of the present invention.
The antistatic tape 110 and 210 is a tape for preventing static charge from being formed between the substrate P and the stage or between the substrate P and the tape, and as shown in fig. 3, the antistatic tape 110 and 210 includes an intermediate layer 110a and 210a and a surface layer 110b and 210b, wherein the intermediate layer 110a and 210a includes a conductive material C and the surface layer 110b and 210b has an uneven pattern.
The conductive material C included in the intermediate layers 110a and 210a may be oriented parallel to the transport direction of the substrate to improve the antistatic property. That is, the conductive material C is placed in a shape extending in the longitudinal direction of the antistatic tapes 110 and 210.
Examples of the conductive material C that may be used to provide antistatic properties include carbon nanotubes, conductive metals, and the like.
The antistatic tape 110 and 210 according to an exemplary embodiment of the present invention may have 10 due to the intermediate layer 110a and 210a including the conductive material C6To 1010Ω/□, and can maintain the voltage of static charges generated on the antistatic tapes 110 and 210 to 100V or less.
Further, since the antistatic tapes 110 and 210 are provided with the surface layers 110b and 210b formed with uneven patterns on the intermediate layers 110a and 210a, the frictional force between the substrate P and the antistatic tapes 110 and 210 can be reduced. The shape of the uneven pattern is not particularly limited as long as the frictional force between the antistatic tapes 110 and 210 and the substrate P placed on the surface layers 110b and 210b is reduced.
The antistatic tapes 110 and 210 according to the exemplary embodiments of the present invention can not only prevent the substrate P from being damaged due to the occurrence of static charges by improving the performance of preventing the static charges from being accumulated on the placed substrate P, but also reduce the frictional force between the antistatic tapes 110 and 210 and the substrate P placed on the antistatic tapes 110 and 210, thereby reducing the difference in time between the point of time when the antistatic tapes 110 and 210 operate and the point of time when the substrate P placed on the antistatic tapes 110 and 210 actually moves.
Fig. 4A to 4D are views schematically showing a process of conveying and cutting a substrate according to an exemplary embodiment of the present invention.
Referring to fig. 4A, the antistatic belt 110 on which the substrate P is placed rotates on the first pallet 100 like a caterpillar.
Referring to fig. 4B, the substrate P is transported in one direction by the crawler-type rotation of the antistatic belt 100 according to the rotation of the first pallet 100 and then simultaneously placed on the first pallet 100 and the second pallet 200, wherein the second pallet 200 is placed to be spaced apart from the first pallet 100.
Here, the interval at which the first and second stages 100 and 200 are spaced apart from each other defines a space in which the cutter wheel 300 is in contact with the substrate and the cutter wheel 300 cuts the upper surface and/or the lower surface of the substrate P in a direction orthogonal to the conveying direction of the substrate P.
Accordingly, the first unit substrate P1 placed on the antistatic tape 110 of the first pallet 100 and the second unit substrate P2 placed on the antistatic tape 210 of the second pallet 200 are produced.
Referring to fig. 4C, after the cutting of the substrate P using the cutter wheel 300 is completed, the first unit substrate P1 and the second unit substrate P2 are simultaneously conveyed by the crawler-type rotation (r) of the antistatic tape 110 to be placed on the antistatic tape 210 of the second pallet 200, with the first unit substrate P1 and the second unit substrate P2 contacting each other.
In this case, the antistatic tape 110 and the antistatic tape 210 are controlled in an asynchronous manner so that the antistatic tape 110 rotates like a caterpillar, while the antistatic tape 210 is maintained in a stopped state.
Further, the substrate conveying unit 120 and the antistatic tape 110 may be controlled in a synchronous manner or in an asynchronous manner. For example, the antistatic belt 110 may first start to rotate like a caterpillar, and then the substrate conveying unit 120 may move.
Due to the crawler-type rotation of the antistatic belt 110 and the movement of the substrate transfer unit 120, both the first unit substrate P1 and the second unit substrate P2 are placed on the antistatic belt 210 of the second pallet 200 under the condition that the first unit substrate P1 and the second unit substrate P2 contact each other.
In this case, as described above, the substrate transfer unit 120 moves so that the plurality of gripper units 121 of the substrate transfer unit 120 are moved out of the plurality of grooves 131 when the plurality of grooves 131 are positioned at the end point of the first pallet 100, and the plurality of gripper units 121 may be accommodated in the plurality of grooves 231 when the plurality of grooves 231 are positioned at the start point of the second pallet 200, thereby transferring both the first unit substrate P1 and the second unit substrate P2 to the second pallet 200.
Next, referring to fig. 4D, in a state where the first unit substrate P1 and the second unit substrate P2 are in contact with each other, the first unit substrate P1 and the second unit substrate P2 are transferred in a transfer direction by the crawler-type rotation of the antistatic belt 210 according to the rotation of the second pallet 200 to be subjected to the subsequent process.
The process of conveying and cutting the substrates according to the exemplary embodiment of the present invention illustrated in fig. 4A to 4D is characterized in that the rotation of the first pallet 100 and the rotation of the second pallet 200 are controlled in an asynchronous manner to prevent the first unit substrate P1 and the second unit substrate P2 from repeatedly colliding with and separating from each other due to the expansion and contraction of the antistatic tape 210, in consideration of the time difference generated between the time point at which the antistatic tape 210 operates and the time point at which the second unit substrate P2 placed on the antistatic tape 210 actually moves due to the frictional force between the antistatic tape 110 and 210 and the substrates P placed on the antistatic tape 110 and 210, particularly, the frictional force between the antistatic tape 210 and the second unit substrate P2 placed on the antistatic tape 210.
That is, in a state where the substrate P simultaneously placed on the first and second stages 100 and 200 is cut into the first and second unit substrates P1 and P2, the first stage 100 is rotated before the rotation of the second stage 200, so that both the first and second unit substrates P1 and P2 can be conveyed in a state where the first and second unit substrates P1 and P2 are in contact with each other on the second stage 200.
Fig. 5A to 5E are views schematically showing a process of conveying and cutting a substrate according to another exemplary embodiment of the present invention.
Referring to fig. 5A, the antistatic belt 110 on which the substrate P is placed rotates on the first pallet 100 like a caterpillar.
Referring to fig. 5B, the substrate P is transported in one direction by the crawler-type rotation of the antistatic belt 110 according to the rotation (r) of the first pallet 100, and then simultaneously placed on the first pallet 100 and the second pallet 200, wherein the second pallet 200 is placed to be spaced apart from the first pallet 100.
Here, the interval at which the first and second stages 100 and 200 are spaced apart from each other defines a space in which the cutter wheel 300 is in contact with the substrate and the cutter wheel 300 cuts the upper surface and/or the lower surface of the substrate P in a direction orthogonal to the conveying direction of the substrate P.
Accordingly, the first unit substrate P1 placed on the antistatic tape 110 of the first pallet 100 and the second unit substrate P2 placed on the antistatic tape 210 of the second pallet 200 are produced.
Referring to fig. 5C, in the case where the antistatic belt 110 is stopped after the cutting of the substrate P using the cutter wheel 300 is completed, the first unit substrate P1 and the second unit substrate P2 become spaced apart from each other by crawler-type rotation of the antistatic belt 210, and only the second unit substrate P2 is placed on the antistatic belt 210 of the second pallet 200 and conveyed on the antistatic belt 210 of the second pallet 200.
In this case, the antistatic tape 110 and the antistatic tape 210 are controlled in an asynchronous manner so that the antistatic tape 110 rotates like a caterpillar, while the antistatic tape 210 is maintained in a stopped state. Also, the substrate conveying unit 120 and the antistatic tape 210 are also controlled in an asynchronous manner so that the substrate conveying unit 120 is kept in a stopped state like the antistatic tape 210.
The second unit substrate P2 may be separated from the first unit substrate P1 without the substrate conveying unit 120 moving, and then the second unit substrate P2 is conveyed in the conveying direction by the crawler-type rotation of the antistatic belt 210 in a state where the second unit substrate P2 is placed on the antistatic belt 210 of the second pallet 200.
Next, referring to fig. 5D, both the first unit substrate P1 and the second unit substrate P2 may be conveyed in the conveying direction by the crawler-type rotation of the antistatic belts 110 and 210 according to the rotation (r) of the first pallet 100 and the rotation (r) of the second pallet 200, and in this case, the first unit substrate P1 may be placed on the antistatic belt 210. The process of placing the first unit substrate P1 on the antistatic tape 210 in the state where one end of the first unit substrate P1 is held by the substrate conveying unit 120 is the same as the above-described process.
Here, the first and second stages 100 and 200 are rotated at the same time point and at the same speed, and as a result, the first and second unit substrates P1 and P2 may be placed on the antistatic tape 210 in a state where the first and second unit substrates P1 and P2 are spaced apart from each other at a predetermined interval.
Next, referring to fig. 5E, in a state where the first unit substrate P1 and the second unit substrate P2 are spaced apart from each other, both the first unit substrate P1 and the second unit substrate P2 are conveyed in the conveying direction according to the rotation of the second pallet 200 (c) by the crawler-type rotation of the antistatic belt 210.
The process of conveying and cutting the substrates according to another exemplary embodiment of the present invention illustrated in fig. 5A to 5E is characterized in that the first unit substrate P1 and the second unit substrate P2 are conveyed by controlling the rotation of the first pallet 100 and the rotation of the second pallet 200 in an asynchronous manner in a state where the first unit substrate P1 and the second unit substrate P2 are spaced apart from each other, in consideration of a difference in time generated between a time point at which the antistatic tape 210 operates and a time point at which the second unit substrate P2 placed on the antistatic tape 210 actually moves.
That is, in a state where the substrate P simultaneously placed on the first and second stages 100 and 200 is cut into the first and second unit substrates P1 and P2, the second stage 200 is rotated before the rotation of the first stage 100, so that both the first and second unit substrates P1 and P2 can be conveyed in a state where the first and second unit substrates P1 and P2 are spaced apart from each other on the second stage 200.
According to the above-described respective exemplary embodiments of the present invention, when the substrate is cut into the unit substrates by scribing or breaking and then conveyed by the belt, it is possible to maintain the state in which the respective unit substrates are in contact with each other or spaced apart from each other, thereby preventing defects from being generated due to collision between the respective unit substrates.
Although the exemplary embodiments of the present invention have been described above, those skilled in the art may modify the present invention in various ways by adding, changing, deleting or modifying constituent elements without departing from the gist of the present invention disclosed in the claims, and these modifications and alterations also term the scope of the present invention.
Claims (14)
1. A substrate transport pallet comprising:
a stage on which a substrate is placed and which rotates to convey the substrate placed thereon in one direction; and
an antistatic tape disposed to surround the stage and preventing static charge from accumulating between the substrate and the stage,
wherein the pallet includes a first pallet and a second pallet disposed to be spaced apart from each other by a predetermined interval in a conveyance direction of the substrate,
wherein each of the antistatic tape of the first pallet and the antistatic tape of the second pallet includes a plurality of grooves for accommodating a clamping unit that clamps one end portion of the substrate,
wherein the plurality of grooves are disposed to be spaced apart from each other at a predetermined interval d in a longitudinal direction of the antistatic tape to continuously accommodate the substrate conveying unit,
wherein the pitch d is set in proportion to the conveying speed of the substrate according to the rotation of the first stage, the conveying speed and the driving distance of the substrate conveying unit, and
wherein the rotation of the first pallet and the rotation of the second pallet are controlled in an asynchronous manner.
2. The substrate transport tray of claim 1, wherein a surface resistance of the antistatic tape adjacent to the substrate is 106To 1010Ω/□。
3. The substrate transport tray according to claim 2, wherein a voltage of an electrostatic charge generated on the antistatic tape adjacent to the substrate is 100V or less.
4. The substrate transport pallet of claim 1, wherein the antistatic tape comprises a surface layer adjoining the substrate and having an uneven pattern, and an intermediate layer comprising a conductive material.
5. The substrate transport pallet of claim 4, wherein the conductive material in the intermediate layer is oriented parallel to a transport direction of the substrate.
6. The substrate transport pallet of claim 5, wherein the conductive material is a carbon nanotube or a conductive metal.
7. The substrate transport tray of claim 1, wherein a spacing between the first tray and the second tray provides a space in which a cutter wheel contacts the substrate.
8. The substrate transport tray of claim 1, wherein rotation speeds of the first tray and the second tray are different from each other.
9. A scribing apparatus, comprising:
the substrate transport pallet of any one of claims 1 to 8;
a substrate conveying unit that conveys a substrate placed on the substrate conveying pallet at a predetermined speed in a conveying direction;
a scribing unit cutting the substrate in a direction orthogonal to a conveying direction of the substrate to produce a first unit substrate placed on the first stage and a second unit substrate placed on the second stage.
10. The scribing apparatus according to claim 9, wherein the first and second stages are controlled in an asynchronous manner so as to convey the first and second unit substrates in a state in which the first and second unit substrates are in contact with each other.
11. The scribing apparatus according to claim 10, wherein the first stage and the substrate conveying unit are controlled in a synchronized manner.
12. The scribing apparatus according to claim 9, wherein the first and second stages are controlled in an asynchronous manner so as to convey the first and second unit substrates in a state where the first and second unit substrates are spaced apart from each other.
13. A method of transporting a substrate, the method comprising:
conveying a substrate placed on a first pallet in one direction and placing the substrate on both the first pallet and a second pallet, wherein the second pallet is placed to be spaced apart from the first pallet;
cutting the substrate between the first pallet and the second pallet into a first unit substrate placed on the first pallet and a second unit substrate placed on the second pallet;
rotating the first pallet and simultaneously conveying the first unit substrate and the second unit substrate so that both the first unit substrate and the second unit substrate are placed on the second pallet in a state where the first unit substrate and the second unit substrate are in contact with each other; and is
Rotating the second pallet and conveying the first unit substrate and the second unit substrate in a state where the first unit substrate and the second unit substrate are in contact with each other,
wherein each of the antistatic tape of the first pallet and the antistatic tape of the second pallet includes a plurality of grooves for accommodating a clamping unit that clamps one end portion of the substrate,
wherein the plurality of grooves are disposed to be spaced apart from each other at a predetermined interval d in a longitudinal direction of the antistatic tape to continuously accommodate the substrate conveying unit,
wherein the pitch d is set in proportion to the conveyance speed of the substrate according to the rotation of the first stage, the conveyance speed of the substrate conveyance unit, and the driving distance.
14. A method of transporting a substrate, the method comprising:
conveying a substrate placed on a first pallet in one direction and placing the substrate on both the first pallet and a second pallet, wherein the second pallet is placed to be spaced apart from the first pallet;
cutting the substrate between the first pallet and the second pallet into a first unit substrate placed on the first pallet and a second unit substrate placed on the second pallet;
rotating the second pallet and conveying the second unit substrate in one direction; and is
Simultaneously rotating the first and second pallets to place the first unit substrates on the second pallets and conveying the first and second unit substrates in a state where the first and second unit substrates are spaced apart from each other,
wherein each of the antistatic tape of the first pallet and the antistatic tape of the second pallet includes a plurality of grooves for accommodating a clamping unit that clamps one end portion of the substrate,
wherein the plurality of grooves are disposed to be spaced apart from each other at a predetermined interval d in a longitudinal direction of the antistatic tape to continuously accommodate the substrate conveying unit,
wherein the pitch d is set in proportion to the conveyance speed of the substrate according to the rotation of the first stage, the conveyance speed of the substrate conveyance unit, and the driving distance.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2015-0036259 | 2015-03-16 | ||
| KR1020150036259A KR102400552B1 (en) | 2015-03-16 | 2015-03-16 | Substrate transporting stage, scribing apparatus comprising the same and method for transporting substrate |
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| CN105990191A CN105990191A (en) | 2016-10-05 |
| CN105990191B true CN105990191B (en) | 2022-02-08 |
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| CN201510666645.3A Active CN105990191B (en) | 2015-03-16 | 2015-10-15 | Substrate transfer stage, scribing device, and method of transferring substrate |
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| KR102067983B1 (en) * | 2017-11-23 | 2020-01-20 | 주식회사 탑 엔지니어링 | Apparatus for cutting substrate |
| KR102461594B1 (en) * | 2017-12-27 | 2022-11-01 | 주식회사 케이씨텍 | Substrate procesing apparatus and transfer belt using the same |
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| CN1633466A (en) * | 2002-02-20 | 2005-06-29 | 电气化学工业株式会社 | Static electricity preventing method and method using the method |
| CN102795502A (en) * | 2012-09-06 | 2012-11-28 | 东莞市五株电子科技有限公司 | Method for picking and placing base plate during conveyance of base plate |
| CN103449714A (en) * | 2012-06-01 | 2013-12-18 | 三星钻石工业股份有限公司 | Panel cutting device and method of conveying panel in the same |
| CN103993275A (en) * | 2014-05-09 | 2014-08-20 | 浙江上方电子装备有限公司 | Quasi-static coating system and quasi-static coating method by utilization of quasi-static coating system |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1179456A (en) * | 1997-09-10 | 1999-03-23 | Gunze Ltd | Paper feeding endless belt and its manufacture and use |
| JP2002068439A (en) * | 2000-08-28 | 2002-03-08 | Mitsuboshi Belting Ltd | Antistatic carrier belt |
| JP4308071B2 (en) | 2004-04-19 | 2009-08-05 | 株式会社リコー | Image forming apparatus |
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2015
- 2015-03-16 KR KR1020150036259A patent/KR102400552B1/en active IP Right Grant
- 2015-10-15 CN CN201510666645.3A patent/CN105990191B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1633466A (en) * | 2002-02-20 | 2005-06-29 | 电气化学工业株式会社 | Static electricity preventing method and method using the method |
| CN103449714A (en) * | 2012-06-01 | 2013-12-18 | 三星钻石工业股份有限公司 | Panel cutting device and method of conveying panel in the same |
| CN102795502A (en) * | 2012-09-06 | 2012-11-28 | 东莞市五株电子科技有限公司 | Method for picking and placing base plate during conveyance of base plate |
| CN103993275A (en) * | 2014-05-09 | 2014-08-20 | 浙江上方电子装备有限公司 | Quasi-static coating system and quasi-static coating method by utilization of quasi-static coating system |
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| CN105990191A (en) | 2016-10-05 |
| KR102400552B1 (en) | 2022-05-23 |
| KR20160111605A (en) | 2016-09-27 |
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