CN105950904A - 一种镀银石墨烯增强铜基电接触材料的制备方法 - Google Patents
一种镀银石墨烯增强铜基电接触材料的制备方法 Download PDFInfo
- Publication number
- CN105950904A CN105950904A CN201610527507.1A CN201610527507A CN105950904A CN 105950904 A CN105950904 A CN 105950904A CN 201610527507 A CN201610527507 A CN 201610527507A CN 105950904 A CN105950904 A CN 105950904A
- Authority
- CN
- China
- Prior art keywords
- copper
- graphene
- electric contact
- silver
- powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/04—Making non-ferrous alloys by powder metallurgy
- C22C1/05—Mixtures of metal powder with non-metallic powder
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
- C23C18/44—Coating with noble metals using reducing agents
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/02—Contacts characterised by the material thereof
- H01H1/021—Composite material
- H01H1/025—Composite material having copper as the basic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/02—Contacts characterised by the material thereof
- H01H1/021—Composite material
- H01H1/027—Composite material containing carbon particles or fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
- B22F2998/10—Processes characterised by the sequence of their steps
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Composite Materials (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Contacts (AREA)
- Powder Metallurgy (AREA)
Abstract
Description
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610527507.1A CN105950904B (zh) | 2016-07-07 | 2016-07-07 | 一种镀银石墨烯增强铜基电接触材料的制备方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610527507.1A CN105950904B (zh) | 2016-07-07 | 2016-07-07 | 一种镀银石墨烯增强铜基电接触材料的制备方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN105950904A true CN105950904A (zh) | 2016-09-21 |
CN105950904B CN105950904B (zh) | 2018-04-27 |
Family
ID=56899565
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201610527507.1A Active CN105950904B (zh) | 2016-07-07 | 2016-07-07 | 一种镀银石墨烯增强铜基电接触材料的制备方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN105950904B (zh) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108330312A (zh) * | 2018-03-06 | 2018-07-27 | 昆明理工大学 | 一种金属包覆的石墨烯增强金属基复合材料的制备方法 |
CN109807331A (zh) * | 2019-01-24 | 2019-05-28 | 西安交通大学 | 一种铜基石墨自润滑道岔滑床板的制备方法 |
CN110695372A (zh) * | 2019-10-10 | 2020-01-17 | 天津大学 | 一种稀土元素改善铜—石墨烯界面的制备方法 |
CN111001963A (zh) * | 2019-12-27 | 2020-04-14 | 苏州优诺电子材料科技有限公司 | 一种可低温焊接的焊锡丝及其制备方法 |
CN111926205A (zh) * | 2020-08-25 | 2020-11-13 | 宝鸡文理学院 | 一种Cu-C-Ag合金电触头材料的制备方法 |
CN112210690A (zh) * | 2020-08-31 | 2021-01-12 | 河南科技大学 | 多序度负载型go混杂的铜铬电触头材料及其制备方法 |
CN113106286A (zh) * | 2021-03-15 | 2021-07-13 | 江阴金湾合金材料有限公司 | 一种5g通信用高导电铍铜合金棒及其制备工艺 |
CN113131307A (zh) * | 2021-03-26 | 2021-07-16 | 上海联影医疗科技股份有限公司 | 滑环碳刷制备方法以及滑环碳刷 |
CN113512662A (zh) * | 2021-07-16 | 2021-10-19 | 陕西科技大学 | 一种负载银的石墨烯/铜自润滑材料及其制备方法 |
CN117292873A (zh) * | 2022-06-16 | 2023-12-26 | 温州泰钰新材料科技有限公司 | 电接触导体 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105237847A (zh) * | 2015-08-27 | 2016-01-13 | 常州大学 | 一种镀银石墨烯的制备方法及其在导电阻燃高密度聚乙烯抑爆材料中的应用 |
CN105428097A (zh) * | 2015-12-24 | 2016-03-23 | 济南大学 | 一种银基电触头复合材料及其制备方法 |
-
2016
- 2016-07-07 CN CN201610527507.1A patent/CN105950904B/zh active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105237847A (zh) * | 2015-08-27 | 2016-01-13 | 常州大学 | 一种镀银石墨烯的制备方法及其在导电阻燃高密度聚乙烯抑爆材料中的应用 |
CN105428097A (zh) * | 2015-12-24 | 2016-03-23 | 济南大学 | 一种银基电触头复合材料及其制备方法 |
Non-Patent Citations (1)
Title |
---|
赵亚茹等: "《石墨烯增强铜基复合材料的研究进展》", 《表面技术》 * |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108330312A (zh) * | 2018-03-06 | 2018-07-27 | 昆明理工大学 | 一种金属包覆的石墨烯增强金属基复合材料的制备方法 |
CN109807331A (zh) * | 2019-01-24 | 2019-05-28 | 西安交通大学 | 一种铜基石墨自润滑道岔滑床板的制备方法 |
CN110695372A (zh) * | 2019-10-10 | 2020-01-17 | 天津大学 | 一种稀土元素改善铜—石墨烯界面的制备方法 |
CN111001963A (zh) * | 2019-12-27 | 2020-04-14 | 苏州优诺电子材料科技有限公司 | 一种可低温焊接的焊锡丝及其制备方法 |
CN111926205A (zh) * | 2020-08-25 | 2020-11-13 | 宝鸡文理学院 | 一种Cu-C-Ag合金电触头材料的制备方法 |
CN111926205B (zh) * | 2020-08-25 | 2021-10-19 | 宝鸡文理学院 | 一种Cu-C-Ag合金电触头材料的制备方法 |
CN112210690A (zh) * | 2020-08-31 | 2021-01-12 | 河南科技大学 | 多序度负载型go混杂的铜铬电触头材料及其制备方法 |
CN113106286A (zh) * | 2021-03-15 | 2021-07-13 | 江阴金湾合金材料有限公司 | 一种5g通信用高导电铍铜合金棒及其制备工艺 |
CN113106286B (zh) * | 2021-03-15 | 2022-07-01 | 江阴金湾合金材料有限公司 | 一种5g通信用高导电铍铜合金棒及其制备工艺 |
CN113131307A (zh) * | 2021-03-26 | 2021-07-16 | 上海联影医疗科技股份有限公司 | 滑环碳刷制备方法以及滑环碳刷 |
CN113512662A (zh) * | 2021-07-16 | 2021-10-19 | 陕西科技大学 | 一种负载银的石墨烯/铜自润滑材料及其制备方法 |
CN117292873A (zh) * | 2022-06-16 | 2023-12-26 | 温州泰钰新材料科技有限公司 | 电接触导体 |
Also Published As
Publication number | Publication date |
---|---|
CN105950904B (zh) | 2018-04-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN105950904A (zh) | 一种镀银石墨烯增强铜基电接触材料的制备方法 | |
CN101651050B (zh) | 亚微米颗粒增强银基电触头材料及其制备方法 | |
JP6100978B1 (ja) | グラフェン補強銅系複合接点材料及びその製造方法 | |
US10210965B2 (en) | Method for electrical contact materials including Ag plated CNTs | |
JP2015105439A (ja) | 電気接点材料及びその製造方法 | |
CN110157932B (zh) | 一种基于原位合成的石墨烯改性铜基电触头材料的制备方法 | |
CN107723500A (zh) | 一种石墨烯‑氧化铝混杂增强铜基复合材料及其制备方法 | |
CN105603247B (zh) | 一种石墨烯增强铜‑稀土基电触头材料及其制备方法 | |
CN102925741A (zh) | 一种铜基固体自润滑复合材料及其制备方法 | |
CN110102758B (zh) | 一种Cu-X/C复合材料及其制备方法 | |
CN105385883B (zh) | 一种电触头材料 | |
WO2014029210A1 (zh) | 一种电接触材料的制备方法 | |
CN105609159B (zh) | 一种镀铜石墨烯增强铜基电触头材料及其制备方法 | |
CN106086495B (zh) | 氧化铜掺杂银氧化锡复合材料及其制备方法 | |
CN102683050A (zh) | 纳米Ag-SnO2电接触复合材料的制备方法 | |
CN105679560B (zh) | 一种镀镍石墨烯增强银基电触头材料的制备方法 | |
CN108441668B (zh) | 一种银钨电接触材料及其制备方法 | |
CN101763956B (zh) | 银石墨电触头材料及其制备方法 | |
CN105719854A (zh) | 一种具有石墨烯的铜基电触点材料的制备方法 | |
CN102969082B (zh) | Ag包覆Ni复合纳米粉体导电浆料的制备方法 | |
CN105349820A (zh) | 一种铜基电接触复合材料及其放电等离子烧结工艺 | |
CN111001801A (zh) | 一种银碳化钨-钼复合电触头材料及其骨架粉体和制备方法 | |
CN107675108B (zh) | 一种碳-铜复合材料的制备方法 | |
CN107385254B (zh) | 一种纤维丝型银基电接触材料的制备方法 | |
CN105761956A (zh) | 一种触头材料、真空灭弧室触头及其制备方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB03 | Change of inventor or designer information | ||
CB03 | Change of inventor or designer information |
Inventor after: Teng Xinying Inventor after: Liu Huanchao Inventor after: Geng Haoran Inventor after: Wu Xiangwei Inventor after: Xiao Zhen Inventor after: Dai Wenyan Inventor before: Liu Huanchao Inventor before: Geng Haoran Inventor before: Wu Xiangwei Inventor before: Xiao Zhen Inventor before: Dai Wenyan |
|
GR01 | Patent grant | ||
GR01 | Patent grant |