CN105385883B - 一种电触头材料 - Google Patents
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Abstract
本发明涉及一种电触头材料,尤其涉及一种石墨烯增强铜基电触头复合材料,以及这种材料的制备方法。电触头材料由重量比为0.1‑3.0%镀镍石墨烯和97.0‑99.9%铜合金组成。其制备方法为:石墨烯镀镍、铜合金制粉、球磨混粉、致密化、烧结、加工成型。本发明的电触头材料,在铜合金中添加镀镍石墨烯作为骨架,使材料具有高硬度、抗机械冲击性能与抗电弧烧蚀性能的同时,避免了导电性、导热性的降低。
Description
技术领域
本发明涉及一种电触头材料及其制备方法,尤其涉及一种石墨烯增强铜基电触头复合材料及其制备方法。
背景技术
真空触头材料是影响真空开关开断性能的重要因素,要求触头材料具有高导电率、高导热系数、高的机械强度及低的接触电阻。真空开关不需检修,触头需要最少耐受8-12次,多则30-50次的开合额定短路电流对触头的烧损,因此触头材料应具有良好的耐弧性、抗熔焊性。目前常用的铜铋合金具有良好的抗熔焊性、较低的载流值,一定的开断能力,但强度较低,电弧侵蚀大,降低了触头材料的寿命。
现有(公开号105063413A),公开了“一种铜基电触头材料及其制备工艺”,铜基触头材料包含以下重量百分比成份:0.2-0.6%的镁、0.05-0.3%的锑、0.05-0.4%的铋、0.05-0.3%的锡、0.05-0.3%的铬、0.005-0.05%的硼、0.02-0.1%的镧以及0.2-0.5%的石墨和余量的铜。通过加入适量的硼、锡、锑粉末,提高电触头制成品的强度和耐磨性,但一定程度上降低了材料导电性。
现有专利文献(公开号102385938A),公开了一种金属基石墨烯复合电接触材料及其制备方法,电接触材料包含0.02-10wt.%的石墨烯,其余为金属基体材料。由于石墨烯增强相的加入,使该复合电接触材料具有比其他增强相复合电接触材料更好的导电、导热性能和更高的硬度和耐磨性。石墨烯与金属基体的润湿性不好,电触头材料性能具有进一步提升的空间。
发明内容
本发明提供了一种电触头材料,通过在铜合金材料中加入镀镍石墨烯增强体,在不降低其导电性、导热性的同时,提高铜合金的硬度。
此外本发明还提供了上述电触头材料的制备方法。
本发明为解决上述问题提出的技术方案:
一种电触头材料,其特征在于,由重量比为0.1-3.0%镀镍石墨烯和97.0-99.9%铜合金组成,铜合金的重量组成成分为0.15-0.5%的铋、0.1-3.0%的金属X、余量为铜,X选自锌、锡、铝、镍和银中一种或几种。优选地,X选自锌、铝和镍中一种或几种。石墨烯为N层,N为1-10。
上述电触头材料的制备方法,包括以下步骤:
(1)采用直流磁控溅射法将金属镍沉积在石墨烯表面,制成镀镍石墨烯。直流磁控溅射沉积设备的工艺参数为:真空度达到0.1*10-3-1.0*10-3Pa时,通入高纯氩气,真空室气压0.5-1.2Pa,溅射功率100-150W,沉积时间为5-30min,优选10-30min。
(2)将铜合金采用雾化法制成200-300目的铜合金粉末。
(3)将镀镍石墨烯和铜合金装入球磨机球磨,制成镀镍石墨烯和铜合金均匀混合的粉末。球磨机工作状态为:转速100-250r/min,球磨15-20分钟,停止5分钟,顺时针、逆时针交替运行,混粉时间为2-6小时。
(4)将步骤(3)混合后的粉末放入模具中进行致密化处理。
(5)热压烧结,塑性加工成型,制成石墨烯增强铜基的电触头复合材料。热压烧结工艺为:采用惰性气体保护,烧结温度700-900℃,烧结压力30-60MPa,时间2-4h。
本发明的有益成果是:
(1)这种电触头材料,在铜合金中添加镀镍石墨烯作为骨架,使材料具有高硬度、抗机械冲击性能与抗电弧烧蚀性能的同时,避免了导电性、导热性的降低。此外,镀镍石墨烯改善了石墨烯与金属间的界面结合力,获得良好界面结合,解决了石墨烯与基体间界面润湿的问题。
(2)电触头的制备方法,采用直流磁控溅射法在石墨烯表面沉积镍,形成的结构,减少石墨烯作为纳米颗粒在混粉过程中的团聚。镍可作为铜基体的合金化元素,提高铜合金的耐腐蚀能力和抗熔焊性。
具体实施方式
实施例1
(1)采用直流磁控溅射法在石墨烯(层数为1-5)表面沉积金属镍制备成镀镍石墨烯。纯度为99.99%的镍靶安装前先用细砂纸进行打磨,去除表面氧化膜,再用丙酮清洗,烘干,直流磁控溅射沉积前进行5分钟预溅射,去除靶材表面的金属氧化物及其它杂质,保证后续石墨烯表面沉积镍膜的纯度。溅射参数如下:真空度达到0.1*10-3Pa时,通入高纯氩气,真空室气压0.5Pa,溅射功率100W,沉积时间为30min。
(2)将含有0.15%铋、1.0%锌、98.85%铜的合金粉采用气体雾化法制成200目铜合金粉末。
(3)镀镍石墨烯与铜-0.15铋-1.0%锌合金粉按0.1:99.9的重量比例装入球磨机中,球磨罐先抽真空再通入氩气保护,转速100r/min,球磨混粉过程中,顺时针球磨15分钟,停止5分钟,逆时针球磨15分钟,停止5分钟,依此交替工作,球磨时间6小时,获得镀镍石墨烯和铜合金均匀混合的粉末。
(4)将混合后粉末放入模具中进行致密化处理,压力为250MPa。
(5)制成的块坯放入热压烧结炉中进行烧结,采用氩气保护,烧结压力30MPa,烧结温度900℃,时间2h,采用挤压或者轧制等工艺加工成型,制备出石墨烯增强铜基电触头复合材料。
实施例2
(1)采用直流磁控溅射法在石墨烯(层数为1-10)表面沉积金属镍制备成镀镍石墨烯。纯度为99.99%的镍靶安装前先用细砂纸进行打磨去除表面氧化膜,再用丙酮清洗,烘干,直流磁控溅射沉积前进行5分钟预溅射,去除靶材表面的金属氧化物及其它杂质,保证后续石墨烯表面沉积镍膜的纯度。溅射参数如下:真空度达到1.0*10-3Pa时,通入高纯氩气,真空室气压1.2Pa,溅射功率150W,沉积时间为10min。
(2)将含有0.5%铋、3.0%锌、96.5%铜的合金粉采用气体雾化法制成300目铜合金粉末。
(3)镀镍石墨烯与铜-0.5%铋-3.0%锌合金粉按0.1:99.9的重量比例装入球磨机中,球磨罐先抽真空再通入氩气保护,转速250r/min,球磨混粉过程中,顺时针球磨20分钟,停止5分钟,逆时针球磨20分钟,停止5分钟,依此交替工作,球磨时间2小时,获得镀镍石墨烯和铜合金均匀混合的粉末。
(4)将混合后粉末放入模具中进行致密化处理,压力300MPa。
(5)制成的块坯放入热压烧结炉中进行烧结,采用氩气保护,烧结压力60MPa,烧结温度700℃,时间2h,采用挤压或者轧制等工艺加工成型,制备出石墨烯增强铜基电触头复合材料。
实施例3
(1)采用直流磁控溅射法在石墨烯(层数为1-10)表面沉积金属镍制备成镀镍石墨烯。靶材安装前先用细砂纸进行打磨去除表面氧化膜,再用丙酮清洗,烘干,直流磁控溅射沉积前进行5分钟预溅射,去除靶材表面的金属氧化物及其它杂质,保证后续石墨烯表面沉积镍膜的纯度。溅射参数如下:真空度达到0.5*10-3Pa时,通入高纯氩气,真空室气压1.0Pa,溅射功率140W,沉积时间为15min。
(2)将含有0.3%铋、3.0%铝、96.7%铜的合金粉采用气体雾化法制成200目铜合金粉末。
(3)将镀镍石墨烯:铜-0.3%铋-3.0%铝的合金粉按按重量比0.5:99.5装入球磨机中,球磨罐先抽真空再通入氩气保护,转速150r/min,球磨混粉过程中,顺时针球磨20分钟,停止5分钟,逆时针球磨20分钟,停止5分钟,依此循环工作,总计混粉时间3h,获得镀镍石墨烯和铜合金均匀混合的粉末。
(4)将混合后粉末放入模具中进行致密化处理,压力300MPa。
(5)将处理后的块坯放入热压烧结炉中进行烧结,采用氩气保护,烧结压力40MPa,烧结温度850℃,时间2h,采用挤压或者轧制等工艺加工成型,制备出石墨烯增强铜基电触头复合材料。
实施例4
镀镍石墨烯:铜-0.3%铋-3.0%铝合金粉按重量比1.0:99.0装入球磨机,其他条件同实施例3,制成石墨烯增强铜基电触头复合材料。
实施例5
镀镍石墨烯:铜-0.3%铋-3.0%铝合金粉按重量比3.0:97.0装入球磨机中,其他参数同实施例3,制成石墨烯增强铜基电触头复合材料。
实施例6
镀镍石墨烯:铜-0.15%铋-0.1%镍合金粉按重量比0.5:99.5装入球磨机中,其他参数同实施例3,制成石墨烯增强铜基电触头复合材料。
对比例1
将铜-0.2%铋-1.0%锌装入球磨机混粉,其它参数同实施例1,制成铜基电触头材料。
对比例2
将铜-0.3%铋-3.0%铝装入球磨机混粉,其它参数同实施例3,制成铜基电触头材料。
对比例3
未镀镍石墨烯:铜-0.2%铋-1.0%锌按重量比0.2:99.8装入球磨机混粉,其它参数同实施例1,制成铜基电触头材料。
制成的复合材料各项参数如下表:
加入镀镍石墨烯制成石墨烯增强铜基电触头复合材料,与对比例1、2中未加入石墨烯的铜合金制成的电触头材料相比,电导率、硬度都明显提高,硬度可提高60%以上,电导率也显著提高。与对比例3中加入未镀镍的石墨烯的铜合金制成的电触头材料相比,电导率、硬度也都明显提高。
Claims (7)
1.一种电触头材料,其特征在于,由重量组成为0.1-3.0%镀镍石墨烯和97.0-99.9%铜合金组成,铜合金的重量组成为0.15-0.5%的铋、0.1-3.0%的金属X、余量为铜,X选自锌、锡、铝和银中一种或几种;
制备方法包括以下步骤:
(1)采用直流磁控溅射法将金属镍沉积在石墨烯表面,制成镀镍石墨烯;
(2)将铜合金采用雾化法制成200-300目的铜合金粉末;
(3)将镀镍石墨烯和铜合金装入球磨机球磨,制成镀镍石墨烯和铜合金均匀混合的粉末;
(4)将步骤(3)混合后的粉末放入模具中进行致密化处理;
(5)热压烧结,塑性加工成型,制成石墨烯增强铜基的电触头复合材料。
2.根据权利要求1所述的一种电触头材料,其特征在于,石墨烯为N层,N为1-10。
3.根据权利要求1所述的一种电触头材料,其特征在于,X选自锌和铝中一种或几种。
4.根据权利要求1所述的一种电触头材料,其特征在于,所述步骤(1)中直流磁控溅射沉积设备的工艺参数为:真空度达到0.1×10-3-1.0×10-3Pa时,通入高纯氩气,真空室气压0.5-1.2Pa,溅射功率100-150W,沉积时间为5-30min。
5.根据权利要求4所述的一种电触头材料,其特征在于,所述步骤(1)中直流磁控溅射沉积设备的工艺参数为:沉积时间为10-30min。
6.根据权利要求1所述的一种电触头材料,其特征在于,所述步骤(3)中球磨机工作状态为:转速100-250r/min,球磨15-20分钟,停止5分钟,顺时针、逆时针交替运行,混粉时间为2-6小时。
7.根据权利要求1所述的一种电触头材料,其特征在于,所述步骤(5)中热压烧结工艺为:采用惰性气体保护,烧结温度700-900℃,烧结压力30-60MPa,时间2-4h。
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