CN105892595A - Method for manufacturing notebook computer radiator - Google Patents
Method for manufacturing notebook computer radiator Download PDFInfo
- Publication number
- CN105892595A CN105892595A CN201610101782.7A CN201610101782A CN105892595A CN 105892595 A CN105892595 A CN 105892595A CN 201610101782 A CN201610101782 A CN 201610101782A CN 105892595 A CN105892595 A CN 105892595A
- Authority
- CN
- China
- Prior art keywords
- tool rest
- type semiconductor
- notebook
- blank pressing
- cut
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/38—Cooling arrangements using the Peltier effect
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Human Computer Interaction (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a notebook computer radiator. The notebook computer radiator comprises a base, a blank pressing tool rest and a cut tool rest, wherein a lower end of an upper surface of the base is provided with a strip-shaped blank pressing groove; an upper end of the upper surface of the base is provided with a rectangular cut groove; the blank pressing tool rest is hinged to one end of the base; a center line of the blank pressing tool rest and a center line of the strip-shaped blank pressing groove are positioned in a same vertical plane; the blank pressing tool rest is provided with a raised strip-shaped pressing bar; the strip-shaped pressing bar is matched with the strip-shaped blank pressing groove; the cut tool rest is hinged to one end of the base; a center line of the cutting tool rest and a center line of the rectangular cut groove are positioned in a same vertical plane; the cut tool rest is provided with a rectangular cutter; the rectangular cutter is matched with the rectangular cut groove; a cut tool rest side at a tail end of the blank pressing tool rest is provided with a pin hole; a tail end of the cut tool rest is provided with a through hole and a pin shaft; and the pin shaft passes through the through hole, and is matched with the pin hole. Through adoption of the notebook computer radiator, edge sealing and cuts of plastic bags are realized, and separate or simultaneous working of the blank pressing tool rest and the cut tool rest is realized through insertion-connection of the pin shaft. The notebook computer radiator has various functions, and is simple in device structure and convenient to use.
Description
Technical field
The present invention relates to a kind of edge sealing radiator, particularly relate to a kind of notebook PC radiator.
Background technology
Along with growth in the living standard, notebook computer has spread to huge numbers of families, small size due to notebook, its internal assembly such as mainboard, hard disk etc. all must be contained in closely, and microprocessor, hard disk and other assembly all can produce substantial amounts of heat in running, thus causing net drop, card machine in notebook running the most directly to be shut down, impact is normal to be used.
Summary of the invention
The deficiency that the present invention exists for prior art just, it is provided that a kind of notebook PC radiator.
For solving the problems referred to above, the technical solution used in the present invention is as follows:
A kind of notebook PC radiator, including copper pipe, P-type semiconductor, N-type semiconductor, Miniature inverter and accumulator, described copper pipe is arranged on notebook mainboard, its two ends seal and couple with electronic component thermal source portion in notebook, described P-type semiconductor and N-type semiconductor are arc-shaped flaky, it is respectively mounted the both sides up and down being fixed on copper pipe, Miniature inverter and accumulator are arranged on notebook mainboard, the input of Miniature inverter electrically connects with laptop outfan, the outfan of Miniature inverter couples with storage battery, the positive pole of accumulator electrically connects with P-type semiconductor, its negative pole electrically connects with N-type semiconductor, fan is arranged on the side of P-type semiconductor.
Further, described copper pipe is provided with coolant.
Further, described P-type semiconductor is identical with the diameter of copper pipe with the curved portions diameter of N-type semiconductor.
Compared with prior art, the implementation result of the present invention is as follows for the present invention:
A kind of notebook PC radiator of the present invention, when electric current flows through P-type semiconductor and N-type semiconductor, form hot junction at P-type semiconductor end, form cold end at N-type semiconductor end, by fan, the heat in hot junction is discharged, the temperature in hot junction reduces, corresponding cold junction temperature reduces, thus creates a low-temperature space, it is achieved the cooling of notebook mainboard, ensure the properly functioning of notebook, extend the service life of notebook.
Accompanying drawing explanation
Fig. 1 is a kind of notebook PC radiator rope structure schematic diagram of the present invention.
Detailed description of the invention
Present disclosure is described below in conjunction with specific embodiments.
Operation principle: when the thermocouple centering that one block of N-type semiconductor 3 material and one block of P-type semiconductor 2 material are coupled to has electric current to pass through, will produce heat transfer between two ends, heat will be transferred to the other end, thus produce the temperature difference and form cold and hot end from one end.But quasiconductor self exists resistance will produce heat through quasiconductor when electric current, thus can affect heat transfer.And the heat between two pole plates also can carry out reverse heat transfer by air and semi-conducting material self.When cold and hot end reaches a fixed difference difference, and the amount of both heat transfers is equal, will reach an equilibrium point, forward and reverse is cancelled out each other to heat transfer.The temperature of the most cold and hot end would not continue to change.In order to reach lower temperature, can realize with the temperature taking the modes such as heat radiation to reduce hot junction.The generally temperature difference of the cold and hot end of semiconductor chilling plate can reach between 40～75 degree, if reducing hot-side temperature by the way of active heat removal, that cold junction temperature also can decline accordingly, thus reaches lower temperature.
As shown in Figure 1, described a kind of notebook PC radiator, including copper pipe 1, P-type semiconductor 2, N-type semiconductor 3, Miniature inverter 4 and accumulator 5, described copper pipe 1 is arranged on notebook mainboard, its two ends seal and couple with electronic component thermal source portion in notebook, described P-type semiconductor 2 and N-type semiconductor 3 are arc-shaped flaky, it is respectively mounted the both sides up and down being fixed on copper pipe 1, Miniature inverter 4 and accumulator 5 are arranged on notebook mainboard, the input of Miniature inverter 4 electrically connects with laptop outfan, the outfan of Miniature inverter 4 electrically connects with accumulator 5, the positive pole of accumulator 5 electrically connects with P-type semiconductor 2, its negative pole electrically connects with N-type semiconductor 3, fan 6 is arranged on the side of P-type semiconductor 2.
When electric current flows through P-type semiconductor 2 and N-type semiconductor 3, hot junction is formed at P-type semiconductor 2 end, cold end is formed at N-type semiconductor 3 end, by fan 6, the heat in hot junction is discharged, the temperature in hot junction reduces, and corresponding cold junction temperature reduces, thus creates a low-temperature space, realize the cooling of notebook mainboard, extend the service life of notebook.
Described copper pipe 1 is provided with coolant 7, absorbs heat further, reduce main board for notebook computer temperature.
Described P-type semiconductor 2 is identical with the diameter of copper pipe 1 with the curved portions diameter of N-type semiconductor 3 so that between three, set is closely.
The foregoing is only presently preferred embodiments of the present invention, not in order to limit the present invention, all any amendment, equivalent and improvement etc. made within the spirit and principles in the present invention, should be included within the scope of the present invention.
Claims (3)
- null1. a notebook PC radiator，It is characterized in that，Including copper pipe (1)、P-type semiconductor (2)、N-type semiconductor (3)、Miniature inverter (4)、Accumulator (5) and fan (6)，Described copper pipe (1) is arranged on notebook mainboard，Its two ends seal and couple with electronic component thermal source portion in notebook，Described P-type semiconductor (2) and N-type semiconductor (3) are arc-shaped flaky，It is respectively mounted the both sides up and down being fixed on copper pipe (1)，Miniature inverter (4) and accumulator (5) are arranged on notebook mainboard，The input of Miniature inverter (4) electrically connects with laptop outfan，The outfan of Miniature inverter (4) electrically connects with accumulator (5)，The positive pole of accumulator (5) electrically connects with P-type semiconductor (2)，Its negative pole electrically connects with N-type semiconductor (3)，Fan (6) is arranged on the side of P-type semiconductor (2).
- A kind of notebook PC radiator the most according to claim 1, is characterized in that, be provided with coolant (7) in described copper pipe (1).
- A kind of notebook PC radiator the most according to claim 1, is characterized in that, described P-type semiconductor (2) is identical with the diameter of copper pipe (1) with the curved portions diameter of N-type semiconductor (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610101782.7A CN105892595A (en) | 2016-02-25 | 2016-02-25 | Method for manufacturing notebook computer radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610101782.7A CN105892595A (en) | 2016-02-25 | 2016-02-25 | Method for manufacturing notebook computer radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105892595A true CN105892595A (en) | 2016-08-24 |
Family
ID=57014761
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610101782.7A Pending CN105892595A (en) | 2016-02-25 | 2016-02-25 | Method for manufacturing notebook computer radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105892595A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20140268579A1 (en) * | 2013-03-16 | 2014-09-18 | Henkel Corporation | Electronic devices assembled with heat absorbing and/or thermally insulating composition |
| CN204759329U (en) * | 2015-06-26 | 2015-11-11 | 杭雨潇 | Radiator for laptop |
| CN205405396U (en) * | 2016-02-23 | 2016-07-27 | 天津市福厚盈科技有限公司 | Notebook computer radiator |
-
2016
- 2016-02-25 CN CN201610101782.7A patent/CN105892595A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20140268579A1 (en) * | 2013-03-16 | 2014-09-18 | Henkel Corporation | Electronic devices assembled with heat absorbing and/or thermally insulating composition |
| CN204759329U (en) * | 2015-06-26 | 2015-11-11 | 杭雨潇 | Radiator for laptop |
| CN205405396U (en) * | 2016-02-23 | 2016-07-27 | 天津市福厚盈科技有限公司 | Notebook computer radiator |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20160824 |