CN203523222U

CN203523222U - Expansion radiating device of mobile electronic equipment

Info

Publication number: CN203523222U
Application number: CN201320612205.6U
Authority: CN
Inventors: 李增珍
Original assignee: Individual
Current assignee: Individual
Priority date: 2013-10-07
Filing date: 2013-10-07
Publication date: 2014-04-02
Anticipated expiration: 2023-10-07

Abstract

The utility model discloses an expansion radiating device of mobile electronic equipment. Apart from a radiating system (3) of the mobile electronic equipment, an expansion radiating port (1) is further formed, the expansion radiating port and an external radiating module are in good heat connection, so that parallel connection radiating of the external radiating module and the internal radiating system (3) is achieved, and therefore the radiating capacity of the equipment is enhanced.

Description

A kind of expansion heat abstractor of mobile electronic device

Technical field

The utility model relates to a kind of heat abstractor and method, particularly the heat abstractor of mobile electronic device and method.

Background technology

The power consumption of electronic equipment is more and more higher, and mobile electronic device particularly, for portable consideration, requires size, weight as much as possible little.This brings very large challenge to heat radiation.Current mobile electronic device, is nearly all only by built-in heat sink conception, to solve heat dissipation problem, and the defect of bringing is like this:

1, be subject to the restriction of portable devices, the heat-sinking capability of built-in heat sink conception is limited, and when ambient temperature surpasses the temperature requirements of Product Definition, the performance of equipment can reduce, or direct automatic shutdown;

2, the client who has extra high performance requirement for product, such as the pursuit of game fan to game performance originally, requires notebook to have good heat radiation, but does not reach in actual applications their expection;

3, the design producer of mobile device, needs on the one hand to consider portable, and most of client's is relatively low to product work load, also wishes to meet on the other hand the pursuit ultimate attainment to properties of product of high-end customer, and the balance before these two is difficult to hold.

For current mobile electronic product, in the defect aspect heat radiation, occurred being at present connected on the product in equipment cooling path by external fan, such as notebook air-cooled base.As everyone knows, the fan of series connection can only increase blast, but can not increase air quantity, and the flow velocity that passes through raising gas of this series products has increased heat convection effect slightly, produces little effect.There is extreme player to disassemble voluntarily notebook, revise its heat sink conception, increase external cooling facility and carry out parallel connection heat radiation, yet this causes notebook can not enjoy guarantee due to after opening voluntarily, and, because producer does not consider this application scenarios, these notebooks are easily damaged, and player can be very limited to the processing of its contact heat resistance, and its radiating effect is also not ideal enough.Above problem, tracing it to its cause is exactly that equipment vendors are not to the reserved suitable expansion heat radiation of client interface.

Summary of the invention

In order to solve above-mentioned deficiency of the prior art, the invention provides a kind of enforcement simple, the heat sink conception that terminal use just can complete voluntarily.

For achieving the above object, the present invention is by the following technical solutions:

An expansion heat abstractor for mobile electronic device, comprises:

The cooling system of mobile electronic device itself (3), expansion heat radiation interface (1), connects thermal source and the hot good conductor (2) of expanding heat radiation interface (1).Described expansion heat radiation interface can, for terminal client for doing good hot link with other heat dissipation equipment, be done auxiliary heat dissipation.The device that described expansion heat radiation interface is large with caloric value in described electronic equipment is connected by hot good conductor.Described expansion heat radiation interface can be connected by hot good conductor with a heater members or a plurality of heater members.Described hot good conductor (2) refers to metal and the alloys thereof such as copper, aluminium, or heat pipe, other heat transfer unit (HTU)s that the field of radiatings such as liquid cooling stream are used.When mobile electronic device temperature is higher; temperature on this interface is also higher, such as higher than 60 ℃, or 65 ℃ time; can use this heat radiation interface, do good hot link (conventionally can be aided with heat-conducting interface material as connecting media) with outside heat radiation module.External cooling module is heat radiation in parallel with built-in cooling system, works simultaneously, therefore can reduce significantly temperature.When the space of plane is restricted, this heat radiation interface can be made the face of 3 dimension spaces, to increase contact area.

As preferably, this expansion heat radiation interface, is directly connected with heater members by metal derby.

As preferably, this metal derby is copper billet.

As preferably, for avoiding client not to be burned when using this interface, this expansion heat radiation interface, under obsolete state, has a heat insulation cover for protecting to get up.

Compared with prior art, the present invention has following technique effect:

1, implement simply.This expansion heat radiation interface is that user oriented is open, so user do not need to tear open machine, can complete the installation of outside heat sinks.

2, heat-sinking capability is strong.Because this interface is special reserved for outside outer heat dissipation equipment, this expansion heat radiation interface is very little to the thermal resistance on hot-fluid road between heater members, and the temperature difference is very little, and temperature is relatively high, and therefore outside heat abstractor can more effective performance radiating effect.

3, flexible configuration.Due to the existence of this heat radiation interface, mobile electronic device can be only for most of client in when design, and for the client of high-end demand, can sell together external radiating device as accessory, and client can buy as required.

Accompanying drawing explanation

Fig. 1 is the schematic diagram of device that has adopted the expansion heat radiation of this mobile electronic device in embodiment 1;

Fig. 2 is the schematic diagram of device that has adopted the expansion heat radiation of this mobile electronic device in embodiment 2;

Fig. 3 is the hot flow circuit diagram of mobile electronic device while having used this heat radiation interface.

Embodiment

Below in conjunction with drawings and Examples, the present invention is done to further detailed description.

Embodiment 1:

As shown in Figure 1, a kind of mobile device of device of the expansion heat radiation that has adopted this mobile electronic device, is provided with cooling system (3) for daily application in this mobile device.For the client of reply special heat-radiating demand, be provided with expansion heat radiation interface (1).In the present embodiment, expansion heat radiation corresponding two thermals source of interface (4,5) are done concentrated radiating treatment; Wherein thermal source (4) is directly connected with expansion heat radiation interface (1) by copper billet, and thermal source (5) is done and is connected with expansion heat radiation interface (1) by heat pipe.When needs are enabled expansion heat radiation interface, outside heat radiation module (6) is done good hot link with heat radiation interface (1), in this example, be that the interface Heat Conduction Material passing through connects, this class material is the conventional material in electronic radiation field, so does not provide example in figure.When user has specific (special) requirements to heat radiation, only use the built-in cooling system of equipment (3) can cause the temperature of equipment higher, such as over 55 ℃, can enable this interface is connected with outside heat radiation module, realize inside and outside two groups of heat radiation modules in parallel, thereby effectively reduce the temperature of device interior heater element.

Embodiment 2:

As shown in Figure 2, a kind of mobile device that has adopted the expansion heat abstractor of this mobile electronic device, is provided with cooling system (3) for daily application in this mobile device.For the client of reply special heat-radiating demand, be provided with expansion heat radiation interface (1).Difference from Example 1, in this example, expansion heat radiation interface correspondence a thermal source (4), and this expansion heat radiation interface is set to regular three-dimensional space face, thereby has increased the contact area of this expansion heat radiation interface and external cooling module, reduces contact heat resistance; This expansion heat radiation interface is directly connected with thermal source (4) by metal.

Above-mentioned execution mode should not be construed as limiting the scope of the invention.Key of the present invention is in the situation that mobile device itself is provided with cooling system, then sets up an expansion heat radiation interface and expand voluntarily heat dispersion for terminal client.In the situation that not departing from spirit of the present invention, within any type of change that the present invention is made all should fall into protection scope of the present invention. ?

Claims

1. the expansion heat abstractor of a mobile electronic device, it is characterized in that described mobile electronic device is except the cooling system (3) of itself, also be provided with expansion heat radiation interface (1), described expansion heat radiation interface is for the hot link good with outside heat radiation module, do auxiliary heat dissipation, the device that described expansion heat radiation interface (1) is large with caloric value in described electronic equipment is connected by hot good conductor (2), the thermal resistance value of this hot good conductor (2) is less than 1 ℃/W, described expansion heat radiation interface is open to user, do not need the machine of tearing open to use, this interface is provided with protector, avoid user to be burned when not using this interface, avoid having dust to enter this interface under off position.

2. expansion heat abstractor according to claim 1, is characterized in that: described expansion heat radiation interface (1) connects before external cooling module refuting, and its temperature can be higher than 60 ℃;

3. expansion heat abstractor according to claim 1, is characterized in that: described expansion heat radiation interface (1) is a smooth metal surface.

4. expansion heat abstractor according to claim 1, is characterized in that: described expansion heat radiation interface (1) is a 3D regular surfaces.