CN208045933U - A kind of temperature control equipment of laser - Google Patents
A kind of temperature control equipment of laser Download PDFInfo
- Publication number
- CN208045933U CN208045933U CN201820496734.7U CN201820496734U CN208045933U CN 208045933 U CN208045933 U CN 208045933U CN 201820496734 U CN201820496734 U CN 201820496734U CN 208045933 U CN208045933 U CN 208045933U
- Authority
- CN
- China
- Prior art keywords
- laser
- heat
- semiconductor cooler
- conducting plate
- radiator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Lasers (AREA)
Abstract
This application discloses a kind of temperature control equipment of laser, the temperature control in laser high-temperature region is realized by increasing semiconductor cooler auxiliary heat dissipation channel.The application include shell, laser, the first screw connection heat-conducting plate connect the heat-conducting plate and the shell with radiator, the second screw, one end of the heat-conducting plate is between the laser and the shell, heat-conducting plate other end connection semiconductor cooler side, the semiconductor cooler other side connects the radiator.It is cold and hot switching device with semiconductor cooler in the prior art, its transfer efficiency is low under high temperature environment, semiconductor cooler damage is easily caused to compare, the application realizes on conventional heat radiating device for laser, by increasing semiconductor cooler auxiliary heat dissipation channel, laser is improved in the adaptability of high-temperature region, realizes effective control to laser temperature in high-temperature region.
Description
Technical field
This application involves field of laser device technology more particularly to a kind of temperature control equipments of laser.
Background technology
Semiconductor laser is the laser for using semi-conducting material as operation material.Common operation material has arsenic
Gallium (GaAs), cadmium sulfide (CdS), indium phosphide (InP), zinc sulphide (ZnS) etc..Semiconductor laser has the small, service life
It is long, and it is compatible with integrated circuit to pump its operating voltage and electric current to can be used the mode of simple Injection Current, and may be used also
It is exported with the laser for obtaining High Speed Modulation with directly carrying out current-modulation with the up to frequency of GHz.Therefore, semiconductor laser exists
It laser communication, optical storage, optical circulator, laser printing, ranging and radar etc. and has been widely used.
Semiconductor laser mostly uses water-cooling pattern and semiconductor cooler mode, the former is to reduce temperature, the latter
Temperature can also be increased to reduce temperature.Existing semiconductor cooler mode radiator is not connect with laser, laser
The heat of device is to be transferred to radiator by semiconductor cooler, since semiconductor cooler hot-side heat dissipation is tired at high operating temperatures
Difficult and semiconductor cooler device itself, causes the poor work stability of semiconductor cooler, semiconductor cooling device service life low.
Utility model content
This application provides a kind of temperature control equipments of laser, suitable in high-temperature region to solve laser in the prior art
Should be able to force difference the problem of.
This application provides a kind of temperature control equipments of laser, including shell, laser, the first screw to connect heat conduction
Plate connect the heat-conducting plate and the shell with radiator, the second screw, and one end of the heat-conducting plate is in the laser and institute
Between stating shell, heat-conducting plate other end connection semiconductor cooler side, the semiconductor cooler other side connects institute
State radiator.
Further, the shell is the box body or plate body of body.
Further, radiator is box body type or plate body.
It is cold and hot switching device with semiconductor cooler in the prior art, its transfer efficiency is low under high temperature environment, Yi Zao
It is compared at semiconductor cooler damage, the application realizes on conventional heat radiating device for laser, by increasing semiconductor system
Laser is improved in the adaptability of high-temperature region in cooler auxiliary heat dissipation channel, and realizing has laser temperature in high-temperature region
Effect control.
Description of the drawings
In order to illustrate more clearly of the technical solution of the application, letter will be made to attached drawing needed in the embodiment below
Singly introduce, it should be apparent that, for those of ordinary skills, without having to pay creative labor,
Other drawings may also be obtained based on these drawings.
Fig. 1 is a kind of structural schematic diagram of the temperature control equipment of laser provided by the present application.
Drawing reference numeral explanation：
1- shells, 2- heat-conducting plates, 3- radiators, 4- heat-radiator plate lids, 5- centrifugal blowers, 6- semiconductor coolers, 7-
One screw, 8- air outlets, 9- hoses, 10- lasers, the second screws of 11-.
Specific implementation mode
Embodiment one
It is a kind of structural schematic diagram of the temperature control equipment of laser provided by the present application referring to Fig. 1.As shown in Figure 1,
Including shell 1, laser 10, the first screw 7 connects heat-conducting plate 2 and radiator 3, the second screw 11 connect the heat-conducting plate 2 with
The shell 1, between the laser 10 and the shell 1,2 other end of the heat-conducting plate connects for one end of the heat-conducting plate 2
6 side of semiconductor cooler is connect, 6 other side of the semiconductor cooler connects radiator 3.
Further, the shell 1 is the box body or plate body of body.
Further, radiator 3 is box body type or plate body.
Laser 10 is arranged in one end of heat-conducting plate 2, and the other end passes through 2 balance laser of heat-conducting plate close to semiconductor cooler 6
Temperature between device 10 and semiconductor cooler 6, to achieve the purpose that adjust the temperature of laser 10.The heat conduction speed of heat-conducting plate 2
The faster the better for degree.The other end of heat-conducting plate connects radiator 3 by the first screw 7, the setting among heat-conducting plate 2 and radiator 3
Semiconductor cooler 6.The one side of semiconductor cooler 6 is close to heat-conducting plate 2, and the another side of semiconductor cooler 6 is close to radiator
3.Radiator 3 is in order to accelerate to radiate, and the one side of radiator 3 close to semiconductor cooler 6 is plane so that with semiconductor cooler
6 contact area is maximum, and the another side of radiator 3 is arranged to several strip grooves, increases heat dissipation area, is conducive to air and flows.
It is cold and hot switching device with semiconductor cooler in the prior art, its transfer efficiency is low under high temperature environment, Yi Zao
It is compared at semiconductor cooler damage, the application realizes on conventional heat radiating device for laser, by increasing semiconductor system
Laser is improved in the adaptability of high-temperature region in cooler auxiliary heat dissipation channel, and realizing has laser temperature in high-temperature region
Effect control.
Embodiment two
It is a kind of structural schematic diagram of the temperature control equipment of laser provided by the present application referring to Fig. 1.As shown in Figure 1,
The device includes：Shell 1, laser 10, heat-conducting plate 2 and semiconductor cooler 6；
One end of the heat-conducting plate 2 is fixedly connected between the shell 1 and the laser 10；
The other end of the heat-conducting plate 2 is fixed with semiconductor cooler 6.
The radiator 3 of the other end of the heat-conducting plate 2 is connected to by the first screw 7；
The semiconductor cooler 6 is arranged between the heat-conducting plate 2 and radiator 3；
Radiator cover board 4 at the top of the radiator 3 is set；
Centrifugal blower 5 on the radiator cover board 4 is set.
Further, the homonymy in the heat-conducting plate 2 is arranged in the semiconductor cooler 6 and the laser 10.
Laser 10 is arranged in one end of heat-conducting plate 2, and the other end passes through 2 balance laser of heat-conducting plate close to semiconductor cooler 6
Temperature between device 10 and semiconductor cooler 6, to achieve the purpose that adjust the temperature of laser 10.The heat conduction speed of heat-conducting plate 2
The faster the better for degree.The material of common heat-conducting plate 2 includes copper, aluminium etc..Heat-conducting plate 2 is fixed on shell, and fixed form can be with
By bayonet, screw etc., do not limit in the embodiment of the present application.The other end of heat-conducting plate is connected by the first screw 7 to be dissipated
Semiconductor cooler 6 is arranged among heat-conducting plate 2 and radiator 3 in hot device 3.The one side of semiconductor cooler 6 close to heat-conducting plate 2,
The another side of semiconductor cooler 6 is close to radiator 3.Radiator 3 is in order to accelerate to radiate, and radiator 3 is close to semiconductor cooler 6
One side be plane so that maximum with the contact area of semiconductor cooler 6, the another side of radiator 3 is arranged to several bar shapeds
Groove increases heat dissipation area, is conducive to air and flows.Radiator 3 and radiator cover board 4 collectively form radiator, heat-dissipating cover plate 4
Middle part be provided with circular hole, be conducive to the directed flow of air in radiator by circular hole.Centrifugation is set on radiator cover board 4
Wind turbine 5 so that air being capable of directed flow in radiator.
The making material of heat-conducting plate 2 is copper.Compare thermal conductivity and price, compared with aluminium, silver, the heat-transfer rate of copper is opposite to teach
Soon, moderate, it is the best making material of heat-conducting plate 2.Shell 1 is the good conductor of heat.The good conductor of heat can be selected in shell 1,
Increase heat conduction rate.
Further, in the corresponding shell 1 in the underface of the laser 10, the side to where the laser 10
To, formed protrusion platform.
There are spaces between one end being connect with radiator 3 and shell 1 of heat-conducting plate 2, are convenient for the installation of radiator 3.
And by the way that raised platforms are arranged, the height of laser 10 can be adjusted.
Further, the heat-conducting plate 2 is connect with the platform by the second screw 11.
Second screw 11, the plate face that can preserve heat-conducting plate are smooth, it is ensured that the contact between laser 10 and heat-conducting plate 2
Area.
Further, the middle part of the radiator cover board 4 is provided with circular hole.
Further, the air inlet of the centrifugal blower 5 is connect with the radiator cover board 4.
By the connection of air inlet and radiator cover board 4, air inlet can be divulged information by the circular hole of radiator cover board 4.
Further, it is connected to the hose 9 of the air outlet 8 of the centrifugal blower 5.
Centrifugal blower 5, air inlet and outlet 8 and hose 9, collectively form the circulation passage of air, take away 3 table of radiator
The air in face realizes the cooling to radiator 3 and heat-conducting plate 2, and then realizes the cooling to laser 10.
Further, described device further includes：
The DC output unit being connect with the semiconductor cooler 6.
Semiconductor cooler 6, by the different electric current of output size, to realize the control to temperature.Implement in the application
DC output unit in example is the unit for referring to control output different size direct current, and there are many real for specific control program
Existing method, does not elaborate in the present embodiment.
Further, described device further includes：The power supply unit being connect with the DC output unit；Said supply unit
Also it is connect with the centrifugal blower 5.
DC output unit and centrifugal blower 5 are required for using electric energy, electric energy are provided by power supply unit.Power supply unit
The voltage described in DC output unit and centrifugal blower 5 can be exported, the electric energy of power supply unit can be originated from 220V alternating currents,
The battery of the fixed DC voltage of output can be originated from.
It is cold and hot switching device with semiconductor cooler 6 in the prior art, its transfer efficiency is low under high temperature environment, Yi Zao
It is compared at the damage of semiconductor cooler 6, the application realizes on conventional heat radiating device for laser, by increasing semiconductor system
6 auxiliary heat dissipation channel of cooler is improved laser 10 in the adaptability of high-temperature region, is realized in high-temperature region to 10 temperature of laser
Effective control.
The same or similar parts between the embodiments can be referred to each other in this specification.Above-described practicality is new
Type embodiment does not constitute the restriction to scope of protection of the utility model.
Claims (3)
1. a kind of temperature control equipment of laser, including shell (1), laser (10), the first screw (7) connect heat-conducting plate
(2) heat-conducting plate (2) and the shell (1) are connect with radiator (3), the second screw (11), it is characterised in that：The heat conduction
Between the laser (10) and the shell (1), heat-conducting plate (2) other end connects semiconductor system for one end of plate (2)
Cooler (6) side, semiconductor cooler (6) other side connect the radiator (3).
2. the temperature control equipment of laser as described in claim 1, it is characterised in that：The shell (1) is the box of body
Body or plate body.
3. the temperature control equipment of laser as described in claim 1, it is characterised in that：Radiator (3) is box body type or plate
Shape body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820496734.7U CN208045933U (en) | 2018-04-03 | 2018-04-03 | A kind of temperature control equipment of laser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820496734.7U CN208045933U (en) | 2018-04-03 | 2018-04-03 | A kind of temperature control equipment of laser |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208045933U true CN208045933U (en) | 2018-11-02 |
Family
ID=63943260
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820496734.7U Active CN208045933U (en) | 2018-04-03 | 2018-04-03 | A kind of temperature control equipment of laser |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208045933U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109343605A (en) * | 2018-11-07 | 2019-02-15 | 南京牧镭激光科技有限公司 | A kind of temperature control equipment and control method |
-
2018
- 2018-04-03 CN CN201820496734.7U patent/CN208045933U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109343605A (en) * | 2018-11-07 | 2019-02-15 | 南京牧镭激光科技有限公司 | A kind of temperature control equipment and control method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104035459B (en) | The control method of the temperature of frequency converter and described frequency converter | |
| CN105720319A (en) | PTC heater and power battery heating and cooling device | |
| CN102299614A (en) | Semiconductor-refrigeration-based inverter radiating system | |
| CN109638379A (en) | The reverse-flow double air duct cooling systems of energy storage mould group | |
| CN212629011U (en) | Heat radiation assembly based on semiconductor power generation | |
| CN208045933U (en) | A kind of temperature control equipment of laser | |
| CN105759923A (en) | Separating type radiating device and method for closed industrial computer | |
| CN214675510U (en) | Switch device based on network operation and maintenance detection | |
| CN206893674U (en) | A kind of heat dissipation battery case | |
| CN208208744U (en) | Integrated radiator with temperature gradient | |
| CN202261069U (en) | Inverter cooling system based on semiconductor refrigeration | |
| CN206640600U (en) | A kind of router with self-regulation refrigerating function | |
| CN213125826U (en) | High-efficient heat dissipation type converter | |
| CN207800596U (en) | A kind of combined heat radiating system | |
| CN209449127U (en) | A kind of high frequency electric source radiator | |
| CN209626372U (en) | The reverse-flow double air duct cooling systems of energy storage mould group | |
| CN110920911A (en) | High-efficient heat dissipation aircraft motor cabinet with self-loopa liquid cooling structure | |
| CN206471449U (en) | A kind of novel power battery heat management system | |
| CN113055757A (en) | Switch system based on intelligent network operation and maintenance detection | |
| CN202026555U (en) | Heat radiation device | |
| CN206411589U (en) | A kind of electronic cooling cooling pad of notebook computer | |
| CN212463083U (en) | Prevent overheated power adapter | |
| CN210444722U (en) | Frequency converter cooling fin | |
| CN201210780Y (en) | Recirculated water-cooling and air-cooling heat radiating device | |
| CN210275007U (en) | Water-cooling controller for remote control mower |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 100094 701, 7 floor, 7 building, 13 Cui Hunan Ring Road, Haidian District, Beijing. Patentee after: Lingyunguang Technology Co.,Ltd. Address before: 100094 701, 7 floor, 7 building, 13 Cui Hunan Ring Road, Haidian District, Beijing. Patentee before: Beijing lingyunguang Technology Group Co.,Ltd. Address after: 100094 701, 7 floor, 7 building, 13 Cui Hunan Ring Road, Haidian District, Beijing. Patentee after: Beijing lingyunguang Technology Group Co.,Ltd. Address before: 100094 701, 7 floor, 7 building, 13 Cui Hunan Ring Road, Haidian District, Beijing. Patentee before: LUSTER LIGHTTECH GROUP Co.,Ltd. |