CN206061381U - Heat abstractor - Google Patents
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- CN206061381U CN206061381U CN201521084443.XU CN201521084443U CN206061381U CN 206061381 U CN206061381 U CN 206061381U CN 201521084443 U CN201521084443 U CN 201521084443U CN 206061381 U CN206061381 U CN 206061381U
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- heat abstractor
- electronic equipment
- heat
- semiconductor chilling
- chilling plate
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- 239000004065 semiconductor Substances 0.000 claims abstract description 62
- 239000004744 fabric Substances 0.000 claims abstract description 30
- 239000002184 metal Substances 0.000 claims abstract description 28
- 239000000463 material Substances 0.000 claims description 8
- 238000001816 cooling Methods 0.000 description 11
- 238000005057 refrigeration Methods 0.000 description 10
- 230000000694 effects Effects 0.000 description 9
- 229920000915 polyvinyl chloride Polymers 0.000 description 6
- 239000004800 polyvinyl chloride Substances 0.000 description 6
- 238000012546 transfer Methods 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 238000004891 communication Methods 0.000 description 4
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- 230000008859 change Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
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- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 241000521257 Hydrops Species 0.000 description 1
- 241001123862 Mico Species 0.000 description 1
- 206010030113 Oedema Diseases 0.000 description 1
- 206010053615 Thermal burn Diseases 0.000 description 1
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- 238000012549 training Methods 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
This utility model embodiment provides a kind of heat abstractor, and the heat abstractor includes：Thermal conductive metal plate；Conductive fabric, positioned at the first side of the thermal conductive metal plate；Wherein, the first side is the one side for electronic equipment contact；Semiconductor chilling plate, positioned at the second side of the thermal conductive metal plate, can freeze for absorbing heat from the electronic equipment by the conductive fabric and the heat-conducting metal；Wherein, the second side and the first side are oppositely arranged.
Description
Technical field
This utility model is related to electronic technology field, more particularly to a kind of heat abstractor.
Background technology
With the development of electronic technology, the disposal ability of electronic equipment is stronger and stronger, and caused is the energy of electronic equipment
Consumption is also increasing, and the heat produced because working is also increasing, if not carrying out radiating in time can cause electronic equipment because overheated
And the phenomenon of the failure such as quit work.Radiating mode is carried out to electronic equipment in the prior art to generally comprise：Wind-cooling heat dissipating, for example
Radiated by accelerating the flowing of the gases such as air by way of external fan；Liquid radiating, using high specific heat capacities such as water
Liquid radiated.But it is for electronic equipments such as mobile phone, panel computer or Wearable devices, due to small volume, air-cooled
The poor effect of radiating, but the structure of existing electronic equipment must be transformed with liquid radiating, so as to cause radiating office
The sex-limited various problems such as big；Therefore a kind of heat abstractor suitable for hand-hold electronic equipments that can be new is proposed in the prior art,
It is problem demanding prompt solution.
Utility model content
In view of this, this utility model embodiment is expected to provide a kind of heat abstractor, at least can partly solve above-mentioned asking
Topic.
To reach above-mentioned purpose, what the technical solution of the utility model was realized in：
This utility model embodiment first aspect provides a kind of heat abstractor, and the heat abstractor includes：
Thermal conductive metal plate；
Conductive fabric, positioned at the first side of the thermal conductive metal plate；Wherein, the first side is for electronic equipment
The one side of contact；
Semiconductor chilling plate, positioned at the second side of the thermal conductive metal plate, can freeze for being knitted by the heat conduction
Thing and the heat-conducting metal absorb heat from the electronic equipment；Wherein, the second side and the first side are set relatively
Put.
Based on such scheme, the heat abstractor also includes：
Control module, is connected with the semiconductor chilling plate, for controlling the working condition of the semiconductor chilling plate；
Battery module, is connected with the semiconductor chilling plate and the control circuit respectively, is the semiconductor chilling plate
Electric energy is provided with the control module.
Based on such scheme, the heat abstractor also includes：
Connecting interface, one end are connected with the control module, and the other end can be connected with the electronic equipment, for receiving
The control parameter that the electronic equipment sends；
The control module, the working condition specifically for the semiconductor chilling plate is controlled according to the control parameter.
Based on such scheme, the connecting interface is also connected with the battery module, be can be used in the electronic equipment
Electric energy is provided.
Based on such scheme, the control parameter includes the occupancy and specified parts according to resource in the electronic equipment
Temperature at least one instant control instruction of generation；
The instant control instruction can be used in the working condition for controlling the semiconductor chilling plate, adjusts the electronics and sets
Standby Current Temperatures.
Based on such scheme, the occupancy of the resource includes the current active thread of the electronic equipment, central processing unit
At least one of the occupancy and memory usage of CPU；
The temperature of the specified parts includes at least one of cpu temperature and battery temperature.
Based on such scheme, the control parameter also includes the advance control generated according to the electron temperature Changing Pattern
Instruction；
The advance control instruction, can be used in extracting carries out advance temperature adjustment to the electronic equipment.
Based on such scheme, the heat abstractor also includes：
Temperature sensor, for detecting the temperature data of the heat abstractor；
Wherein, the temperature data is to form one of parameter of the advance control instruction.
Based on such scheme, the battery module is charging cell module；
The semiconductor chilling plate is at least two；Described at least two, semiconductor chilling plate stacking is arranged.
Based on such scheme, the heat abstractor also includes heat-dissipating casing；
The thermal conductive metal plate, conductive fabric and the semiconductor chilling plate are respectively positioned in the heat-dissipating casing；It is described to dissipate
The outer surface of hot shell is additionally provided with holding assembly；The holding assembly is by constituting with heat-barrier material.
This utility model embodiment heat abstractor, is radiated using semiconductor chilling plate, with small volume and radiating effect
The characteristics of fruit is obvious, it is clear that easily solved the limitation of air cooling equipment and liquid cooling apparatus, while introducing in heat abstractor
Conductive fabric, conductive fabric is arranged on the one side contacted with electronic equipment, can increase contact area, heat radiation effect
Rate；While conductive fabric can have certain water sorption due to the form of its fabric, can be with easy solution humid air
It is middle to condense phenomenon because refrigeration is caused, prevent the hydrops for condensing from causing the problem of electronic failure.
Description of the drawings
The structural representation of the first side of the heat abstractor that Fig. 1 is provided for this utility model embodiment；
The structural representation of the second side of the heat abstractor that Fig. 2 is provided for this utility model embodiment；
The schematic cross-section of the heat abstractor that Fig. 3 is provided for this utility model embodiment；
Structural representations of the Fig. 4 for a kind of communication system of this utility model embodiment application.
Specific embodiment
The technical solution of the utility model is done below in conjunction with Figure of description and specific embodiment and further explain in detail
State.
As shown in Figure 1 to Figure 3, a kind of heat abstractor of the present embodiment, the heat abstractor include：
Thermal conductive metal plate 111；
Conductive fabric 112, positioned at the first side of the thermal conductive metal plate；Wherein, the first side is for electronics
The one side of equipment contact；
Semiconductor chilling plate 113, positioned at the second side of the thermal conductive metal plate, can freeze for by the heat conduction
Fabric and the heat-conducting metal absorb heat from the electronic equipment；Wherein, the second side and the first side are relative
Arrange.
Thermal conductive metal plate 111 can be that the various metal or alloy with good heat conductive ability are constituted.111 energy of thermal conductive metal plate
Enough conduction heats well, so being capable of the rapid absorption heat from electronic equipment.
The conductive fabric 112 can be that the various fibrous materials with electric action are constituted, and for example, the conductive fiber can
It is made up of carbon fiber-containing, carbon fiber-containing typically has very strong heat conductivity.In the present embodiment the conductive fabric 112 is arranged
In the one side contacted with electronic equipment, the contact area between electronic equipment and heat abstractor can be increased such that it is able to lifted
The heat abstractor absorbs the speed of heat, improving radiating effect from electronic equipment.
It is that the conductive fabric 112 can also have certain water suction because being made up of fabric, typically in concrete implementation
Property, like this, it becomes possible to when solving that humidity is larger in air ambient, the refrigeration of the semiconductor chilling plate 113 causes in electricity
The moisture of the condensation between sub- equipment and thermal conductive metal plate 111, it is to avoid these moisture for condensing infilter the problem of electronic equipment and send out
It is raw.
Conductive fabric 112 described in the present embodiment has certain heat conductivity, while also having certain water absorption, i.e. institute
It can be heat conduction water absorbing fabric to state conductive fabric, and the heat conduction system meeting fabric that the present embodiment is provided can be knitted for Muscovitum cool fiber fabric etc.
Thing.
The semiconductor chilling plate 113, to be also thermoelectric module, is a kind of heat pump.Semiconductor chilling plate 113 typically should
It is restricted used in some spaces, reliability requirement is high, the occasion without cold-producing medium pollution.Using the Peltier of semi-conducting material
Effect, when the galvanic couple that unidirectional current is connected into by two kinds of different semi-conducting materials, can absorb heat respectively at the two ends of galvanic couple
Amount and releasing heat, it is possible to achieve the purpose of refrigeration.It is a kind of Refrigeration Technique for producing negative thermal resistance, is characterized in without motion portion
Part, reliability are also higher.Semiconductor chilling plate generally includes N-type semiconductor material and p-type semiconductor material is collectively constituted.When
When the thermocouple centering that one piece of N-type semiconductor material and one piece of p-type semiconductor material are coupled to has electric current to pass through, between two ends just
Heat transfer can be produced, and heat will be transferred to the other end from one end, cold and hot end be formed so as to produce the temperature difference.But quasiconductor is certainly
There is resistance and heat will be produced when electric current is through quasiconductor in body, so as to affect heat transfer.And between two pole plates
Heat can also pass through air and semi-conducting material itself carries out reverse heat transfer.When cold and hot end reaches certain temperature difference, both heat
When the amount of transmission is equal, an equilibrium point will be reached, just reverse heat transfer is cancelled out each other.Now the temperature at cold and hot end would not
Continue to change.In order to reach lower temperature, the modes such as radiating can be taken to reduce the temperature in hot junction to realize.
Refrigeration radiating is carried out using the semiconductor chilling plate 113 in the present embodiment, with radiating effect it is fast the characteristics of.
During concrete implementation, in order to improve radiating effect, the semiconductor chilling plate 113 may include multi-disc.These quasiconductor systems
Cold 113 stacking is arranged；Form a semiconductor refrigerating blade unit being made up of multi-lager semiconductor cooling piece 113.
Further, as shown in Fig. 2 the heat abstractor also includes：
Battery module 114, is connected with the semiconductor chilling plate 113, is that the semiconductor chilling plate 113 provides refrigeration institute
The electric energy for needing；
Control module 115, is connected with the semiconductor chilling plate 113, for controlling the work of the semiconductor chilling plate 113
Make state.
Certainly the battery module 114 is also connected with the control module 115, is that the control module 115 provides work
Required electric energy.
The heat abstractor also includes battery module 114 in the present embodiment, and the battery module may include one or more
Battery, battery here may include the various batteries that can provide electric energy such as accumulator, photovoltaic cell.The control module 115
May include various control chips existing on the market or control integrated circuit etc..The semiconductor chilling plate 113 can be controlled
Working condition.For example, the control module is by being connected with the battery module 114 in the semiconductor chilling plate 113
One controlled switch is set on power supply circuits, by the closed and disconnected for controlling the controlled switch, the quasiconductor system is controlled
Whether cold 113 in running order.The controlled switch various can be turned on or off according to a signal of telecommunication
The structures such as components and parts, such as transistor or audion.Certainly described in the present embodiment, control module 115 controls semiconductor chilling plate
113, closely can not only include whether control semiconductor chilling plate 113 is in running order, also including control semiconductor chilling plate 113
In working time, work efficiency.For example, the semiconductor chilling plate 113 includes multiple refrigeration ranks, working condition here
May include the refrigeration rank residing for semiconductor chilling plate 113.Certainly this refrigeration rank can be led to by the control module 115 certainly
Cross control to supply operating current or running voltage of the semiconductor chilling plate 113 etc. to realize control.
The heat abstractor also includes in the present embodiment：
Connecting interface 116, one end are connected with the control module, and the other end can be connected with the electronic equipment, be used for
Receive the control parameter that the electronic equipment sends；
The control module 115, the work shape specifically for the semiconductor chilling plate is controlled according to the control parameter
State.
Heat abstractor described in the present embodiment also introduces connecting interface 116, and the connecting interface can be USB interface.The USB connects
Mouth typically can either transmitting telecommunication number be used to carry out the interaction of data, while can be additionally used in the transfer of electric energy.
The control module 115 will be connected with electronic equipment by the connecting interface 116 in the present embodiment, such
The control parameter of electronic equipment transmission can be received by the connection unit 116 just.Here control parameter can be directly
Control instruction, control unit 115 directly according to the control instruction can control the working condition of the semiconductor chilling plate 113, example
Such as switch order of semiconductor chilling plate 113 etc..Certainly the control parameter described in the present embodiment may also include various can be used in
The control module 115 voluntarily generates the parameter of control instruction, the Current Temperatures of such as electronic equipment.The control module 115
Can be used to be compared the Current Temperatures of electronic equipment and preset temperature, if finding, Current Temperatures are higher than preset temperature, can
Voluntarily to generate the control instruction or control signal that control semiconductor chilling plate 113 opens work.
In the present embodiment, the connecting interface 116 is also connected with the battery module 114, be can be used in the electricity
Sub- equipment provides electric energy.The connecting interface 116 is also connected with battery module 114 in the present embodiment, and for example, USB interface is not
Only it is connected with control module 115, while be also connected with the battery in battery module 114, can be by the USB interface to electronics
Equipment provides electric energy.For example, the electronic equipment is the mobile terminal such as mobile phone or panel computer, if mobile terminal electric energy occurs not
Foot, can from the heat abstractor described in the present embodiment by the connecting interface to mobile terminal electric energy supplement, improve and move
The endurance of terminal.
Further, the control parameter includes the temperature according to the occupancy and specified parts of resource in the electronic equipment
At least one instant control instruction of generation of degree；
The instant control instruction can be used in the working condition for controlling the semiconductor chilling plate, adjusts the electronics and sets
Standby Current Temperatures.
The occupancy of the resource described in the present embodiment in electronic equipment, such as electronic equipment central processing unit CUP are accounted for
With rate, the occupancy of Micro-processor MCV, the occupancy of application processor AP, occupancy of internal memory etc..The occupancy of these resources
The current load of electronic equipment is indicated, generally the load of electronic equipment is higher, the heat of generation is also more.Institute
Specified parts are stated, specified parts here may include the battery of electronic equipment, the CUP of electronic equipment or graphic process unit GPU etc.
The temperature of part.If these part temperatures are too high, electronic equipment slow, the hand-held discomfort of user that response speed occurs is may result in
The problems such as.This when, the electronic equipment will likely will generate instant control instruction.The instant control instruction, directly controls
Described in the present embodiment in heat abstractor semiconductor chilling plate 113 working condition, to reduce the electronic equipment as soon as possible
Current temperature.
In a word, in the present embodiment, the occupancy of the resource includes the current active thread of the electronic equipment, centre
At least one of the occupancy and memory usage of reason device CPU；The temperature of the specified parts includes cpu temperature and battery
At least one of temperature.
Certainly, the control parameter also includes the advance control instruction generated according to the electron temperature Changing Pattern；Institute
Advance control instruction is stated, can be used in extracting carries out advance temperature adjustment to the electronic equipment.
For example, the electronic equipment has counted the moving law of own thread, the resource consumption of all parts is worried and each
The temperature changing regularity of individual part, in order to avoid having increased to a height in electronic equipment temperature, then carries out radiating and causes
Electronic equipment overheated situation still occurs for some time, the control parameter is also possible in advance control in the present embodiment
System instruction.The advance control instruction may include that the various parameters such as control time, controlled state are constituted.For example, electronic equipment itself
Or the server that is connected with electronic equipment finds electronic equipment at 8 points of every afternoon to 9：30 load is heavier, temperature also compared with
It is high.When the height of needs cooling is risen in order to avoid electronic equipment temperature in the present embodiment, just control semiconductor chilling plate
113 radiated caused by radiate delay, an advance control instruction will be formed in the present embodiment.The control module
115 will be used for according to the control instruction, start to make the semiconductor chilling plate 113 in advance before 8 points start or 8 points are arrived
It is in running order, radiated in advance.Certainly it is full of an example more than, the composition of the specific advance control instruction is also
There are a many kinds, here just differs and one schematically illustrates.
Additionally, the heat abstractor also includes：
Temperature sensor, for detecting the temperature data of the heat abstractor；
Wherein, the temperature data is to form one of parameter of the advance control instruction.
The temperature sensor in the present embodiment, can be used for detecting the temperature data of the heat abstractor, here
Temperature sensor may include the various electronic devices and components for being capable of detection temperature.The temperature sensor can be directly or by described
The temperature data is transferred to electronic equipment by connecting interface 116, the clothes for facilitating electronic equipment itself or being connected with electronic equipment
The third party devices such as business device are used as to form one of parameter of the advance control instruction.
Certainly, battery module 114 described in the present embodiment is charging cell module；The heat abstractor also includes：Power supply
Interface 117, for the charging battery module.Power supply interface described in the present embodiment can be micro USB interface.The mico
USB interface can be the interface of less type in USB interface, can be used in providing electric energy for the charging cell module.
Additionally, the heat abstractor also includes heat-dissipating casing；The thermal conductive metal plate 111, conductive fabric 112 and described half
Conductor cooling piece 113 is respectively positioned in the heat-dissipating casing；The outer surface of the heat-dissipating casing is additionally provided with holding assembly；It is described to hold
Part is held by constituting with heat-barrier material.
Heat-dissipating casing described in the present embodiment can be heat dissipation metal shell, be the thermal conductive metal plate 111, conductive fabric
112 and the semiconductor chilling plate 113 provide and control be installed, i.e., described thermal conductive metal plate 111, conductive fabric 112 and described half
Conductor cooling piece 113 is installed in the thermal conductive shell.
The outer surface of the heat-dissipating casing is additionally provided with holding assembly in the present embodiment.Here holding assembly can be tool
There is polrvinyl chloride (Polyvinyl chloride, the PVC) part of heat-blocking action.The PVC parts are by gathering for main material
What vinyl chloride was constituted.Like this, user, can be by gripping the holding assembly when by the heat abstractor, it is to avoid with
Heat-dissipating casing directly contact, caused scald or feels the too high discomfort of temperature.The generally holding assembly can be described
The thermal insulation layer of latticed or many strips is formed at the grip position of the whole outer surface or outer surface of radiating shell, thus can be with
The skin of user is avoided directly to contact with the heat-dissipating casing.
Heat abstractor described in the present embodiment may make up the shell on the back of electronic equipment.For example, the electronic equipment be mobile phone or
Panel computer.A shell on the back can be covered in the mobile phone or panel computer generally, to prevent the scuffing of mobile phone or panel computer and knock
Touch, the heat abstractor reusable is shell on the back in the present embodiment.The heat-dissipating casing of so described heat abstractor will act as handss
The back cover of machine or panel computer, while can also be radiated for electronic equipment.So the conductive fabric 112 will with mobile phone or
The back contacts such as panel computer, absorb the heat that the electronic equipment such as mobile phone or panel computer is produced, electronic equipment are radiated.
Below in conjunction with any one technical scheme in above-described embodiment, there is provided a specific example：
Fig. 4 provides a kind of communication system, includes that mobile phone, this utility model embodiment are provided in the communication system scattered
Thermal and server.
The heat abstractor shell integrally uses heat-conducting metal, surrounding bound edge to install PVC bound edges additional for the ease of gripping.Here
PVC bound edges can be the holding assembly in above-described embodiment.
One layer of conductive fabric that the front that heat abstractor is contacted with mobile phone is covered by thermal conductive metal plate and thereon is constituted.Heat conduction
The use of fabric can increase the contact area at the mobile phone back side and heat abstractor, strengthen radiating effect, additionally, due to quasiconductor system
Cold refrigerating capacity is very strong, when used in the excessive environment of summer or humidity can due to air in be condensate in chill surface adhere to very
Moisture absorption can be avoided mobile phone from intaking and then generation problem in fabric by juicy, using for conductive fabric.
Heat sink interior is by multi-lager semiconductor cooling piece, temperature sensor, control circuit, battery, USB interface, micro
USB charging inlets are constituted, and are easy to gripping radiator back to be wrapped up by grid PVC plastic again for the ease of radiating.Here control
Circuit processed may make up control module in previous embodiment.
As the power characteristic of size limitation and semiconductor chilling plate is limited, in order to strengthen refrigeration heat-conducting effect, this example
Described in semiconductor chilling plate have multiple, be divided into multiple-level stack arrangement.
Control circuit mainly realizes the data communication with USB interface, digital independent to temperature sensor and to quasiconductor
The on-off control of cooling piece.USB interface also provides to mobile phone the function of charging simultaneously.
The mobile phone may include the processing unit formed by processor or process circuit；The processing unit can be used to read handss
The current active thread of machine, CPU and memory usage, mobile phone CPU and battery temperature, are carried out to heat abstractor by USB interface
On-off control, and heatsink temperature sensor temperature data is read at certain intervals.
Mobile phone is connected with server, and server can receive the resources occupation rate of mobile phone of mobile phone transmission, specified parts
The information such as the temperature data of temperature and heat abstractor, and these information are analyzed with process, obtain temperature liter in mobile phone use
High factor and cooling system start or out-of-work temporal regularity, it is to avoid occur not up to dissipate due to cooling system in use
Thermal effect and make mobile phone temp drastically elevated situation.
The temperature of cell phone battery information that can be measured with Real-time Collection mobile phone inner sensor in mobile phone, cpu temperature information etc., together
Each program threads of Shi Jilu mobile phones currently operation are to CPU and the occupancy situation of memory source, and record is reported service end.
When mobile phone temp is overheated, mobile phone is opened by USB interface output control parameter, control heat abstractor.Accumulate through certain data
Tired and training, after server summarizes the rule that cpu resource takes and mobile phone temp rises in some cell phone types, can generate control
The generation strategy that control parameter is generated in mobile phone processed, such mobile phone will generate the control parameter, control according to the generation strategy
The working condition of heat abstractor, to realize that opening heat sink and intelligence in advance closes the function of heat sink.
The above, specific embodiment only of the present utility model, but protection domain of the present utility model do not limit to
In this, any those familiar with the art can readily occur in change in the technical scope that this utility model is disclosed
Or replace, should all cover within protection domain of the present utility model.Therefore, protection domain of the present utility model should be with the power
The protection domain that profit is required is defined.
Claims (10)
1. a kind of heat abstractor, it is characterised in that the heat abstractor includes：
Thermal conductive metal plate；
Conductive fabric, positioned at the first side of the thermal conductive metal plate；Wherein, the first side is to contact for electronic equipment
One side；
Semiconductor chilling plate, positioned at the second side of the thermal conductive metal plate, can freeze for by the conductive fabric and
The heat-conducting metal absorbs heat from the electronic equipment；Wherein, the second side and the first side are oppositely arranged.
2. heat abstractor according to claim 1, it is characterised in that
The heat abstractor also includes：
Control module, is connected with the semiconductor chilling plate, for controlling the working condition of the semiconductor chilling plate；
Battery module, is connected with the semiconductor chilling plate and the control circuit respectively, is the semiconductor chilling plate and institute
State control module and electric energy is provided.
3. heat abstractor according to claim 2, it is characterised in that
The heat abstractor also includes：
Connecting interface, one end are connected with the control module, and the other end can be connected with the electronic equipment, described for receiving
The control parameter that electronic equipment sends；
The control module, the working condition specifically for the semiconductor chilling plate is controlled according to the control parameter.
4. heat abstractor according to claim 3, it is characterised in that
The connecting interface is also connected with the battery module, can be used in providing electric energy to the electronic equipment.
5. heat abstractor according to claim 3, it is characterised in that
The control parameter is included according to the temperature of the occupancy and specified parts of resource in the electronic equipment at least within
One of generate instant control instruction；
The instant control instruction can be used in the working condition for controlling the semiconductor chilling plate, adjust the electronic equipment
Current Temperatures.
6. heat abstractor according to claim 5, it is characterised in that
The occupancy of the resource includes the current active thread of the electronic equipment, the occupancy of central processor CPU and internal memory
At least one of occupancy；
The temperature of the specified parts includes at least one of cpu temperature and battery temperature.
7. heat abstractor according to claim 3, it is characterised in that
The control parameter also includes the advance control instruction generated according to the electron temperature Changing Pattern；
The advance control instruction, can be used in extracting carries out advance temperature adjustment to the electronic equipment.
8. heat abstractor according to claim 7, it is characterised in that
The heat abstractor also includes：
Temperature sensor, for detecting the temperature data of the heat abstractor；
Wherein, the temperature data is to form one of parameter of the advance control instruction.
9. heat abstractor according to claim 2, it is characterised in that
The battery module is charging cell module；
The semiconductor chilling plate is at least two；Described at least two, semiconductor chilling plate stacking is arranged.
10. heat abstractor according to claim 1, it is characterised in that
The heat abstractor also includes heat-dissipating casing；
The thermal conductive metal plate, conductive fabric and the semiconductor chilling plate are respectively positioned in the heat-dissipating casing；Outside the radiating
The outer surface of shell is additionally provided with holding assembly；The holding assembly is by constituting with heat-barrier material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521084443.XU CN206061381U (en) | 2015-12-23 | 2015-12-23 | Heat abstractor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521084443.XU CN206061381U (en) | 2015-12-23 | 2015-12-23 | Heat abstractor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206061381U true CN206061381U (en) | 2017-03-29 |
Family
ID=58371510
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201521084443.XU Expired - Fee Related CN206061381U (en) | 2015-12-23 | 2015-12-23 | Heat abstractor |
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| Country | Link |
|---|---|
| CN (1) | CN206061381U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108006445A (en) * | 2017-12-28 | 2018-05-08 | 江苏君厚科技有限公司 | A kind of LED light easy to fix and radiate |
| CN108224375A (en) * | 2017-11-22 | 2018-06-29 | 佛山市南海区联合广东新光源产业创新中心 | A kind of LED light modulating devices |
| CN109683690A (en) * | 2018-12-29 | 2019-04-26 | 努比亚技术有限公司 | Cooling control method, mobile terminal and computer readable storage medium |
| WO2020113383A1 (en) * | 2018-12-03 | 2020-06-11 | Oppo广东移动通信有限公司 | Heat dissipation device, charging apparatus, electronic apparatus, charging system and method therefor |
-
2015
- 2015-12-23 CN CN201521084443.XU patent/CN206061381U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108224375A (en) * | 2017-11-22 | 2018-06-29 | 佛山市南海区联合广东新光源产业创新中心 | A kind of LED light modulating devices |
| CN108006445A (en) * | 2017-12-28 | 2018-05-08 | 江苏君厚科技有限公司 | A kind of LED light easy to fix and radiate |
| WO2020113383A1 (en) * | 2018-12-03 | 2020-06-11 | Oppo广东移动通信有限公司 | Heat dissipation device, charging apparatus, electronic apparatus, charging system and method therefor |
| CN113039873A (en) * | 2018-12-03 | 2021-06-25 | Oppo广东移动通信有限公司 | Heat dissipation device, charging equipment, electronic equipment, charging system and method thereof |
| CN113039873B (en) * | 2018-12-03 | 2023-08-11 | Oppo广东移动通信有限公司 | Heat dissipation device, charging equipment, electronic equipment, charging system and method thereof |
| CN109683690A (en) * | 2018-12-29 | 2019-04-26 | 努比亚技术有限公司 | Cooling control method, mobile terminal and computer readable storage medium |
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