CN105798767B - The Ginding process and lapping device of plate body - Google Patents
The Ginding process and lapping device of plate body Download PDFInfo
- Publication number
- CN105798767B CN105798767B CN201610211050.3A CN201610211050A CN105798767B CN 105798767 B CN105798767 B CN 105798767B CN 201610211050 A CN201610211050 A CN 201610211050A CN 105798767 B CN105798767 B CN 105798767B
- Authority
- CN
- China
- Prior art keywords
- mentioned
- plate body
- grinding
- abrasion site
- milling tool
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F2201/00—Constructional arrangements not provided for in groups G02F1/00 - G02F7/00
- G02F2201/48—Flattening arrangements
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Abstract
The present invention relates to a kind of Ginding process of plate body and lapping device, make plate body holding member and milling tool relatively close, so as to the above-mentioned plate body kept by the grinding of above-mentioned milling tool by above-mentioned plate body holding member, wherein, above-mentioned plate body holding member keeps the non-abrasive side of plate body, and revolved round the sun and rotation some action, above-mentioned milling tool has multiple grooves along a direction on the face that the abradant surface to above-mentioned plate body is ground, and the milling tool is revolved round the sun and another action of rotation, in the Ginding process of the plate body, the above-mentioned revolution action and above-mentioned rotation action of the above-mentioned plate body holding member of independent control and above-mentioned milling tool, in the process of lapping of above-mentioned plate body, change the angular speed of above-mentioned rotation.
Description
The application is the " tabular submit, Application No. 201280013296.X, entitled on the 13rd of September in 2013
The divisional application of the application of the Ginding process of body ".
Technical field
The present invention relates to a kind of Ginding process of plate body and lapping device.
Background technology
Plate body, it is particularly applied in the glass plate of liquid crystal display, the small bumps on its surface, ripple are to cause
Image produces the reason for distortion, therefore removes small bumps, the ripple by lapping device.As this lapping device, under
Lapping device is stated generally to be in the public eye：Pushed against by the glass plate kept on fixture to the grinding pad set on grinding plate
While upper, grinding plate and fixture was set to rotate against and carry out abrading glass plate.
Lapping device disclosed in patent document 1 sets pliability film body in the bottom of fixture, and to film body and fixture it
Between supply gas-pressurized, by the pressure of the gas-pressurized, the glass plate pasted on film body is pressed on abrasive cloth and ground.Root
According to the lapping device, by gas-pressurized present in the space between film body and fixture, the pressure of glass plate each several part is applied to
Power turns into uniform pressure, therefore with the minute asperities that glass pane surface is can remove while flatly abrading glass plate
Advantage.
Also, the lapping device of patent document 1 supplies slurries (lapping liquid) to grinding plate, makes the slurries from grinding pad
Surface is oozed out and abrading glass plate.Patent Document 1 discloses the grinding pad of trough of belt, on the surface of the grinding pad, with 5 to 10mm
Spacing form wide 2 to 6mm along a direction, deep 1 to 5mm multiple grooves.By the grinding pad, will can be used in grinding
Slurries discharge the outside of grinding pad via above-mentioned groove, therefore with the advantages of grinding pad is not likely to produce blocking, abrasive power is stable.
Prior art literature
Patent document
Patent document 1：Japanese Laid-Open 2004-122351 publications
The content of the invention
Problems to be solved by the invention
But problems be present in the lapping device of patent document 1：The groove of grinding pad is transferred to the glass after grinding
On the abradant surface of plate, the grinding inequality of strip decorative pattern is produced, and the grinding is not local generation.
The present invention, its object is to provide a kind of Ginding process of plate body, can remove tabular body surface in view of this case
Minute asperities, the ripple in face, and can suppress because of the groove of grinding pad and caused by locality grinding it is uneven.
The means used to solve the problem
The present invention is to achieve the above object, there is provided a kind of Ginding process of plate body, makes plate body holding member and grinding
Instrument is relatively close, so as to grind the above-mentioned plate body kept by above-mentioned plate body holding member by above-mentioned milling tool,
Wherein, above-mentioned plate body holding member keeps the non-abrasive side of plate body, and is revolved round the sun and some action of rotation, on
Milling tool is stated on the face that the abradant surface to above-mentioned plate body is ground with multiple grooves along a direction, and should
Milling tool is revolved round the sun and another action of rotation, and the Ginding process of the plate body is characterised by, in independent control
The above-mentioned revolution action and above-mentioned rotation action of plate body holding member and above-mentioned milling tool are stated, in the grinding of above-mentioned plate body
During, change the angular speed of above-mentioned rotation.
According to the present invention, it is available for removing the concavo-convex main power on the surface of plate body by revolution action, because
This can remove minute asperities, the ripple on the surface of plate body.Also, the matter of the abradant surface of controllable plate body is acted by rotation
Amount.In rotation action, when persistently being ground with certain angular speed, produced on plate body caused by the groove of milling tool
Locality grinding is uneven.Therefore, the present invention changes the angular speed of rotation in the grinding of plate body.So, milling tool
Grinding pattern change, therefore it is uneven to suppress caused by the groove of milling tool locality grinding.
The Ginding process of the present invention is preferred, has following process：Adhering processes, will in the paste position of above-mentioned plate body
The non-abrasive side of above-mentioned plate body is pasted on plate body affixed component；Plate body transmits process, by maintaining part by above-mentioned plate
Shape body affixed component is sent to the abrasion site of above-mentioned plate body from above-mentioned paste position, wherein, above-mentioned maintaining part is installed into
Moved freely along guide member of the configuration between above-mentioned paste position and above-mentioned abrasion site, and in above-mentioned paste position and
Back and forth movement is carried out between above-mentioned abrasion site；Grinding step, ground above-mentioned plate body affixed component is installed in place in above-mentioned
After grinding on the above-mentioned plate body holding member of position, it is pasted onto by the grinding of above-mentioned milling tool on above-mentioned plate body affixed component
Above-mentioned plate body；Plate body unloads process, and above-mentioned plate body is unloaded from above-mentioned plate body affixed component, and from above-mentioned plate body
Holding member unloads the plate body affixed component, or, above-mentioned plate body affixed component is unloaded from above-mentioned plate body holding member,
And unload above-mentioned plate body from the plate body affixed component；And send process back to, the above-mentioned tabular of above-mentioned plate body will be unloaded
Body affixed component sends back to above-mentioned paste position, and in above-mentioned grinding step, above-mentioned plate body affixed component has been sent to
The above-mentioned maintaining part for stating abrasion site is sent back to above-mentioned paste position.
The Ginding process of the present invention is preferred, has following process：Adhering processes, will in the paste position of above-mentioned plate body
The non-abrasive side of above-mentioned plate body is pasted on plate body affixed component；Plate body transmits process, will be above-mentioned by the 1st maintaining part
Plate body affixed component is sent to the 1st abrasion site of above-mentioned plate body from above-mentioned paste position, wherein, above-mentioned 1st maintaining part
It is installed into along guide member of the configuration between above-mentioned paste position and above-mentioned 1st abrasion site and moves freely, and upper
State and carry out back and forth movement between paste position and above-mentioned 1st abrasion site；1st grinding step, by above-mentioned plate body paste section
Part is installed in place after on the above-mentioned plate body holding member of above-mentioned 1st abrasion site, is ground by the 1st in above-mentioned milling tool
Mill tool grinding is pasted onto the above-mentioned plate body on above-mentioned plate body affixed component；Plate body transmits process, passes through the 2nd maintaining part
Above-mentioned plate body affixed component is sent to the 2nd abrasion site from above-mentioned 1st abrasion site, wherein, above-mentioned 2nd maintaining part is pacified
Dress up and moved freely along guide member of the configuration between above-mentioned 1st abrasion site and above-mentioned 2nd abrasion site, and above-mentioned
Back and forth movement is carried out between 1st abrasion site and above-mentioned 2nd abrasion site；2nd grinding step, by above-mentioned plate body paste section
Part is installed in place after on the above-mentioned plate body holding member of above-mentioned 2nd abrasion site, is ground by the 2nd in above-mentioned milling tool
Mill tool grinding is pasted onto the above-mentioned plate body on above-mentioned plate body affixed component；Plate body unloads process, from above-mentioned plate body
Affixed component unloads above-mentioned plate body, and unloads the plate body affixed component from above-mentioned plate body holding member, or, from above-mentioned
Plate body holding member unloads above-mentioned plate body affixed component, and unloads above-mentioned plate body from the plate body affixed component；And
Send process back to, the above-mentioned plate body affixed component for having unloaded above-mentioned plate body is sent back into above-mentioned plate body paste position, upper
State in the 1st grinding step, above-mentioned 1st maintaining part that above-mentioned plate body affixed component has been sent to above-mentioned abrasion site is sent back to
To above-mentioned paste position, in above-mentioned 2nd grinding step, above-mentioned plate body affixed component above-mentioned 2nd grinding position has been sent to
Above-mentioned 2nd maintaining part put is sent back to above-mentioned 1st abrasion site.
, it is necessary to keep having pasted the plate body affixed component of plate body in paste position in batch lapping device, and will
It is sent to abrasion site.In the prior art, plate body holding member is made to be moved to paste position from abrasion site, herein by plate
Shape body affixed component is installed on plate body holding member, afterwards, plate body holding member is moved to grinding from paste position
Position, so as to transmit plate body affixed component.But in the transfer approach, make the grinding of plate body terminate after plate body
Holding member reciprocates between abrasion site and paste position, therefore the transmission of plate body affixed component needs tens of seconds extremely
Several minutes of time, the time have an impact to the problem for improving the productivity ratio of plate body.Also, with the maximization of plate body
And plate body affixed component, when becoming large-scale, plate body holding member also becomes large-scale, and its weight can reach tens of tons.Move this
The plate body holding member of kind weight, it is very laborious on apparatus structure, and translational speed can not also improve, and increase operation
Cost.
Therefore, the present invention will be used to keeping and transmitting tabular to shorten the time needed for the transmission of plate body affixed component
The small, dedicated transmission equipment of body affixed component is arranged in lapping device, there is provided a kind of plate body improved in this case
Productivity ratio Ginding process.That is, the purpose of the present invention to remove the minute asperities on the surface of plate body, ripple, and suppress because
Premised on locality grinding is uneven caused by the groove of grinding pad, and improve the productivity ratio of plate body.
To achieve the above object, the present invention sets the special transmission being made up of guide member and maintaining part on lapping device
A kind of equipment, there is provided Ginding process for having used the special transmission equipment.
Also, to achieve the above object, the present invention sets on lapping device and protected by guide member, the 1st maintaining part and the 2nd
Hold the special transmission equipment of portion's composition, there is provided a kind of Ginding process for having used the special transmission equipment.
Above-mentioned maintaining part and above-mentioned 1st maintaining part produce identical function, effect, therefore in above-mentioned Ginding process, say
The Ginding process of bright the latter.
The present invention Ginding process have adhering processes, plate body transmission process, the 1st grinding step, the 2nd grinding step,
Plate body unloads process and sends process back to, the milling time of the plate body in the 1st grinding step (including by plate body paste section
Part is installed to the time of plate body holding member) in, plate body paste section has been sent to the 1st maintaining part of the 1st abrasion site
Sent back to paste position along guide member.Also, the milling time of the plate body in the 2nd grinding step is (including by plate
Shape body affixed component is installed to the time of plate body holding member) in, plate body paste section has been sent to the 2nd abrasion site
2nd maintaining part is sent back to the 1st abrasion site along guide member.
Therefore, using the milling time of the plate body in the 1st grinding step, the 1st maintaining part is sent back into paste position, from
And using above-mentioned milling time, the 1st maintaining part is kept having pasted the plate body affixed component of next plate body.Also, work as
After 1st grinding step terminates, the plate body affixed component for having pasted next plate body can be sent to by the 1st maintaining part at once
1st abrasion site.Also, using the milling time of the plate body in the 2nd grinding step, the 2nd maintaining part is sent back into the 1st grinding
Position, so as to utilize above-mentioned milling time, make the 2nd maintaining part standby in the 1st abrasion site.Also, when the 1st grinding step knot
Shu Hou, plate body affixed component can be sent to the 2nd abrasion site by the 2nd maintaining part from the 1st abrasion site at once.
Therefore, Ginding process of the invention can be implemented to send back to the 1st maintaining part from the 1st abrasion site in milling time
The process of paste position, maintaining part is set to keep having pasted the process of the plate body affixed component of next plate body and be kept the 2nd
The process that part sends back to the 1st abrasion site from the 2nd abrasion site, therefore and make plate body holding member in abrasion site and glue
The existing Ginding process reciprocated between patch position is compared, and the productivity ratio of plate body greatly improves.
The Ginding process of the plate body of the present invention is preferred, and above-mentioned plate body affixed component is configured to rectangle, above-mentioned plate body
Holding member carries out revolution action, above-mentioned milling tool by scope cycle at a predetermined angle or the cycle with along above-mentioned
The combinative movement of the swing in the direction of the abradant surface of plate body, make to produce relative fortune between above-mentioned plate body and above-mentioned milling tool
It is dynamic.
Also, the Ginding process of the plate body of the present invention is preferred, and above-mentioned plate body affixed component is configured to rectangle, above-mentioned plate
Shape body holding member carries out revolution action, above-mentioned 1st milling tool and above-mentioned 2nd milling tool and revolved by scope at a predetermined angle
Return or the combinative movement of the cycle and the swing in the direction of the abradant surface along above-mentioned plate body, make above-mentioned plate body and upper
State between the 1st milling tool and produce relative motion between above-mentioned plate body and above-mentioned 2nd milling tool.
Make the large-scale rectangular plate body while more than 1000mm using plate body holding member via plate body affixed component
When rotation and revolution, the operating range of plate body affixed component becomes big, therefore plate body affixed component is kept relative to plate body
The input of part and taking-up need the long period.Also, the length on one side of the plate body ground by the Ginding process of the present invention
For degree as described above, it is preferred to be more than 1000mm, more than more preferably 2000mm (such as 2200 × 2500mm) is further excellent
Elect as more than 2800 (such as 2800 × 3000mm).
Therefore, be make holding pasted large-scale plate body plate body affixed component plate body holding member revolution, make
The Ginding process of milling tool cycle.So, the operating range of plate body affixed component compares change with above-mentioned operating range
It is small, therefore input and taking-up of the plate body affixed component relative to plate body holding member can be implemented in a short time.Also, plate
The operating range of shape body affixed component diminishes, thus can there is provided multiple posts, the lapping device of beam narrow space in set
Put special transmission equipment.Further, by make holding pasted plate body plate body affixed component plate body holding member
Revolution, it is available for removing the power of the minute asperities on the surface of plate body.
Further, while making milling tool sidespin time, angular speed is changed in process of lapping, so as to prevent from grinding work
The surface state of tool, the groove on the surface for being for example formed at milling tool are transferred to the abradant surface of plate body.Also, it can realize
While the abrasive action of the revolution of plate body holding member and the cycle of milling tool, tabular is realized by special transmission equipment
The high efficiency of body transmission, therefore compared to the prior art can improve the productivity ratio of plate body.
The Ginding process of the plate body of the present invention is preferred, and guide sections part has a pair of guide rails of configured in parallel, passes through
Above-mentioned maintaining part transmits above-mentioned plate body affixed component between a pair of guide rails, above-mentioned plate body affixed component relative to upper
State the length (L1) for configuring the orthogonal direction in direction of guide rail and from the end of above-mentioned plate body affixed component to above-mentioned guide rail
The ratio (L2/L1, L3/L1) of distance (L2, L3) is 0.28 to 0.35.
According to the present invention, the size and rigidity of maintaining part can optimize, and high-speed cyclic action and the tabular of maintaining part can be achieved
The High Speed Transfer of body affixed component.In addition, above-mentioned optimization refers to, it can minimize the size of maintaining part, maintaining part can be suppressed
Flexure and the vibration of maintaining part.
The Ginding process of the plate body of the present invention is preferred, and guide sections part has a pair of guide rails of configured in parallel, passes through
Above-mentioned 1st maintaining part and above-mentioned 2nd maintaining part transmit above-mentioned plate body affixed component, above-mentioned plate body between a pair of guide rails
The length (L ' 1) in the orthogonal direction in configuration direction relative to above-mentioned guide rail of affixed component and from above-mentioned plate body affixed component
The ratio (L ' 2/L ' 1, L ' 3/L ' 1) of end to the distance (L ' 2) of above-mentioned guide rail be 0.28 to 0.35.
According to the present invention, the size and rigidity of the 1st and the 2nd maintaining part can optimize, and the height of the 1st and the 2nd maintaining part can be achieved
Fast cycle action and the High Speed Transfer of plate body affixed component.In addition, above-mentioned optimization refers to, the big of the 1st and the 2nd maintaining part can be made
Small miniaturization, the flexure and the 1st, vibration of the 2nd maintaining part of the 1st, the 2nd maintaining part can be suppressed.
The Ginding process of the plate body of the present invention is preferred, above-mentioned to send back in process, by above-mentioned plate body affixed component in water
Square sent back to, vertical direction or relative to the inclined incline direction of horizontal direction.
According to the present invention, when plate body affixed component is sent back in the horizontal direction, it can simplify and send processing apparatus back to, shorten and send
Return the time.That is, plate body is ground with horizontal attitude, therefore plate body affixed component is also horizontal attitude.Therefore, in plate body
Grinding terminate after, such as make the plate body affixed component keep the posture (keep level) to be sent back to, then plate body affixed component
Posture vertically or will not tilt, therefore can shorten and send the time back to.Also, by plate body affixed component vertical direction or relative to
When the inclined incline direction of horizontal direction is sent back to, the cleaning for the plate body affixed component that can efficiently carry out sending back to in-process is done
It is dry.That is, after the grinding of plate body terminates, plate body affixed component is cleaned, therefore the moisture for being used to clean in its remained on surface.
By making plate body affixed component vertical or being tilted relative to horizontal direction, it can flow down the moisture, can efficiently dry tabular
Body affixed component, shorten drying time.
Invention effect
According to the present invention, can remove minute asperities, the ripple on the surface of plate body, and can suppress because of the groove of grinding pad and
The grinding of caused locality is uneven.Also, the productivity ratio of plate body can be improved.
Brief description of the drawings
Fig. 1 is the top view of the unitary construction for the lapping device for representing embodiment.
Fig. 2 is the assembling stereogram of fixture and film frame.
Fig. 3 is the side view for the embodiment for representing grinding head and grinding table.
Fig. 4 is the stereogram for including representing the portion of partly cut-away of the structure of grinding plate.
Fig. 5 is to represent enlarged view of a portion of the film frame relative to the installation constitution of fixture.
Fig. 6 (a) is to represent to expand film body and the figure of the original state of lower glass plate is unloaded from film frame.
Fig. 6 (b) is edge part and film body from blast injection nozzle by blast injection to glass plate
The figure of boundary portion.
Fig. 6 (c) is the explanation figure that glass plate is peeled off from film body.
Fig. 6 (d) is to unload glass plate completely from film body and be placed on the explanation figure on stage body.
Fig. 6 (e) is to unload lower film frame from fixture by unloading device and film frame is positioned over to the explanation figure of jack.
Fig. 7 is the stereogram for the structure for representing conveyer.
Fig. 8 is that the structure for representing conveyer wants portion's amplification stereogram.
Fig. 9 is the top view for the structure for representing conveyer.
Figure 10 is the top view of grinding pad.
Figure 11 is the enlarged view of a portion of grinding pad.
Figure 12 is the explanation figure of the shield collision of film frame and guide rail.
Figure 13 is the explanation figure for the revolution track for representing glass plate.
Figure 14 is the chart that the roughness after glass plate is ground is standardized and is compared.
Figure 15 is the top view of the relation for the size for representing film body and guide rail.
Label declaration
G glass plates
10 lapping devices
12 glass plates, which are moved into, uses conveyer belt
14 film frames
16 glass plates paste platform
18 the 1st grinding tables
20 the 2nd grinding tables
22 glass plates unload leave from office
24 glass plates, which take out of, uses conveyer belt
26 film frame rinsing tables
28 film frame drying tables
30 film frames send conveyer belt back to
32 automatic machines
33 arms
34 absorption layers
36 conveyer belts
38 film bodies
40 upper ledges
42 lower frames
43 juts
50 grinding heads
51 main body covers
52 fixtures
54 air chambers
56 main shafts
58 grinding pads
60 grinding pads
62 grinding plates
64 grinding base stations
65 bearings
66 gear parts
67 gears
68 motors
69 guide rails
70 direct acting guiding devices
72 guide rails
74 maintenance consoles
76 maintenance consoles
78 sling framework
80 through holes
82 sliding frames
84 sliding frame suspenders
86 sling and use disc spring
88 sling spring
90 through holes
92 screw jack
98 jets
100 air chambers
102 air feed paths
104 valves
106 air pumps
108 pins
110 heads
112 hooks
114 pins
138 conveyer belts
140 automatic machines
142 arms
144 adsorption heads
146th, 148 conveyer belt
150th, 152,154 conveyer
160 guide rails
162 maintaining parts
164 small-sized automatic machines
166 arms
168 guide blocks
170 guide rails
172 feed screws
174 shields
200 control units
204 stage bodies
206 air injection nozzles
208 jack
Embodiment
The preferred embodiment of the Ginding process of the plate body of the present invention is described in detail below according to accompanying drawing.
Fig. 1 is the top view of the unitary construction for the lapping device 10 for representing embodiment.Fig. 2 is fixture 52 and film frame 14
Assembling stereogram.Fig. 3 is the side view for the embodiment for representing grinding head 50 and grinding table.
Lapping device 10 is by for example while being more than 1000mm, thickness grinding for 0.2mm to 0.7mm large glass plate G's
Flour milling is ground to the lapping device of the flatness needed for glass for liquid crystal display plate.
The glass plate that the lapping device 10 mainly has the glass plate G before moving into grinding is moved into conveyer belt 12, by glass
The glass plate that plate G pastes film frame (plate body affixed component) 14 pastes platform (paste position：Adhering processes) the 16, the 1st grinding table
(the 1st abrasion site：1st grinding step) the 18, the 2nd grinding table (the 2nd abrasion site：2nd grinding step) 20, will grind complete
The glass plate that glass plate G unloads from film frame 14 unloads leave from office (plate body unloads process) 22, glass plate is taken out of with conveyer belt 24, film frame
Rinsing table 26, film frame drying table 28 and film frame send conveyer belt (sending process back to) 30 back to.
Below to simplify explanation, glass plate is pasted into platform 16, the 1st grinding table 18, the 2nd grinding table 20, glass plate and unloads leave from office
22nd, film frame rinsing table 26 and film frame drying table 28 are recited as platform 16,18,20,22,26,28.
It is provided with lapping device 10：Conveyer (special transmission equipment) 150, film frame 14 is sent to platform 18 from platform 16；
Conveyer 152, film frame 14 is sent to platform 20 from platform 18；And conveyer 154, film frame 14 is sent to platform 22 from platform 20.
These structures of conveyer 150,152,154 are identical, and the control unit 200 by being uniformly controlled lapping device 10 controls its action,
Synchronously reciprocated in left and right directions in Fig. 1.
The glass plate G moved into by glass plate before the grinding moved into conveyer belt 12 is by being arranged on the arm 33 of automatic machine 32
Absorption layer 34 absorption keep.Also, glass plate G is moved into conveyer belt 12 by the spinning movement of arm 33 from glass plate
Conveyer belt 36 is displaced to, platform 16 is sent to by conveyer belt 36.
On platform 16, the glass plate G before grinding is pasted on film frame 14.Illustrate the method for attaching, film frame 14 is in platform 16
On kept by lowering or hoisting gear (not shown), when glass plate G is located at the lower section of film frame 14, film frame 14 pass through lowering or hoisting gear decline move
It is dynamic, the film body 38 with pliability and self adsorptivity set up on the film frame 14 shown in Fig. 2 is pressed to the non-of glass plate G and ground
Flour milling.Glass plate G non-abrasive side is set to paste on film body 38 by the pushing force.Afterwards, film frame 14 by Fig. 1 conveyer
150 keep, and are sent to Fig. 3 platform 18, are installed to herein on the fixture (plate body holding member) 52 of grinding head 50.This
Outside, following film frames 14 refer to set up the entirety for having film body 38.Also, conveyer 150 is described in detail later.
As shown in Fig. 2 film frame 14 is formed as follows：The film body 38 of Pasting glass plate G rectangle is being similarly rectangle
After being set up between upper ledge 40 and lower frame 42, upper ledge 40 and lower frame 42 are tightened by bolt (not shown).
Then the grinding head 50 shown in Fig. 3 is illustrated.Also, the grinding head 50 of platform 18 and the structure phase of grinding head 50 of platform 20
Together, therefore mark identical label illustrates.
Grinding head 50 has main body cover 51, and revolution drive mechanism portion (not shown) is built-in with main body cover 51.Should
Revolution drive mechanism portion is made up of planetary gears portion and motor, by the output shaft in the motor-driven planetary gears portion
It is connected to the main shaft 56 to be hung down to vertical direction.Also, the jockey 52 on the main shaft 56.Therefore, when above-mentioned planetary gear
When mechanism part is driven, fixture 52 and film frame 14 revolve round the sun (reference picture 13) centered on predetermined revolution center P.
Further, the main body cover 51 shown in Fig. 3 is connected to elevating mechanism 156 via sliding block 158.Pass through the elevating mechanism
156 make main body cover 51 be lifted relative to sliding block 158, so that circular grinding pad (1st grinding of the fixture 52 relative to platform 18
Instrument) 58 and the circular grinding pad (the 2nd milling tool) 60 of platform 20 move forward and backward, also, with predetermined grinding pressure by film
The glass plate G pasted on frame 14 abradant surface is pressed to grinding pad 58,60.
In addition it is also possible to unload sliding block 158 from lapping device 10, main body cover 51 and elevating mechanism 156 are directly connected to.
Fig. 4 is the stereogram for including representing the portion of partly cut-away of the structure of grinding plate 62.Grinding pad 58 as shown in figure 4,
It is pasted onto the upper surface of grinding plate 62.The grinding plate 62 is ground base station 64 and supported into be rotated freely by bearing 65, its
The central shaft of pivot and grinding pad 58 is set on coaxial.Also, in the side of grinding plate 62, gear part 66 is set, should
Gear part 66 engages with the gear 67 rotated by motor 68.Further, gear part 66 is configured to the central shaft of grinding pad 58
Centered on arc-shaped.Therefore, by motor 68, grinding pad 58 is made to rotate (rotation) centered on central shaft.
Also, the support of a pair of guide rails 69,69 that grinding base station 64 is arranged in parallel is into moving freely.By with making
The drive division (not shown) that base station 64 comes and goes action along guide rail 69,69 is ground, makes grinding pad 58 when necessary in the horizontal direction
Swing.The swaying direction of grinding pad 58 can be mutually the direction orthogonal with the direction of transfer of Fig. 1 conveyer 150 or
The direction parallel with the direction of transfer.That is, as long as the direction for making grinding pad 58 swing in the horizontal direction.
In addition, multiple flexible pipes (not shown) are connected on Fig. 4 grinding plate 62, for supplying slurry to the dorsal part of grinding pad 58
Liquid.To make these flexible pipes not be intertwined, the rotation of grinding pad 58 is limited so that its since predetermined reference position with
Predetermined angular range cycle.The slurries of the dorsal part of grinding pad 58 are supplied to from above-mentioned flexible pipe by penetrating the inside of grinding pad 58
Slurries supply hole and be fed into the front of grinding pad 58.
Also, the cycles such as the scope of the cycle angle of grinding pad 58, turning speed action, revolution rotating speed of unit interval etc.
Revolution acts the independent control of control unit 200 by Fig. 1.
The Each part of grinding pad 60 is identical with the structure of above-mentioned grinding pad 58, and the description thereof will be omitted herein.
On the other hand, as shown in figure 3, installing direct acting guiding device 70,70 on the sliding block 158 of platform 18.Direct acting guiding device 70,
70 is chimeric with guide rail 72,72.The guide rail 72,72 as indicated by the dashed line in figure 1, is tieed up towards main shaft 56, fixture 52 to platform 18
The maintenance console 74 of shield configures.
Also, as shown in figure 3, direct acting guiding device 70,70 is similarly installed on the sliding block 158 of platform 20.Direct acting guiding device
70th, 70 is chimeric with guide rail 160,160.The guide rail 160,160 as indicated by the dashed line in figure 1, towards main shaft 56, fixture 52 to platform 20
The maintenance console 76 safeguarded configures.
Also, also sliding block 158 can be unloaded from lapping device 10, direct acting guiding device 70,70 be to be mounted directly into elevating mechanism
On 156.
Then the fixture 52 shown in Fig. 2 and Fig. 5 is illustrated.Fig. 5 is to represent installation constitution of the film frame 14 relative to fixture 52
Enlarged view of a portion.
In the upper periphery portion of fixture 52, fixed by bolt (not shown) and sling framework 78.Slinging framework 78
Through hole 80,80 ... is offered with predetermined at equal intervals on flange part, projection is arranged on the (slide- of sliding frame 82
Contact frame) upper surface sliding frame suspender 84 as shown in figure 5, penetrate from below these through holes 80,
80…….Also, sliding frame suspender 84 is as shown in figure 5, insertion is being sling framework 78 and sling with configuring between disc spring 86
Spring 88 is sling, and penetrates the through hole 90 sling with disc spring 86, is connected to screw jack 92.
Therefore, act screw jack 92, resistance slings the force of spring 88 and pulls up sliding frame suspender 84
Rise, so as to which sliding frame 82 be pulled up relative to fixture 52.So, detachably on sliding frame 82
Film frame 14 is pulled up, and applies predetermined tension force to film body 38.
The jet 98,98 ... that oriented air chamber 54 sprays compressed air is opened up on fixture 52.These jets 98,
98 ... via the air chamber 100 set in the upper surface of fixture 52, with the air feed path 102 shown in the dotted line on Fig. 3
Connection.Air feed path 102 extends via the swivel joint (not shown) installed on grinding head 50 to the outside of grinding head 50
Set, air pump 106 is connected to through valve 104.Therefore, when opening valve 104, the compressed air from air pump 106 is via sky
Gas feed path 102, Fig. 5 air chamber 100 and jet 98 are fed into air chamber 54.So, the pressure of compressed air
Power is delivered to glass plate G via film body 38, and by the pressure, glass plate G abradant surface is pushed to Fig. 3 grinding pad 58,60
It is ground.
Next, illustrate the construction of the handling unit relative to sliding frame 82 of the film frame 14 shown in Fig. 2 and Fig. 5.
On the upper ledge 40 of film frame 14, equally spaced projection is set multiple pins 108,108 ..., the upper end of these pins 108
The big footpath head 110 that portion has engages with the hook 112 fixed in the bottom of sliding frame 82, so as to which film frame 14 is installed into slip
Framework 82.The reaction force of film body 38 when the clamping force of head 110 and hook 112 is because jacking up film body 38 by screw jack 92
And becoming strong, under the grinding resistance being subject in grinding from film body 38, head 110 will not come off from hook 112.
Glass plate G grinding is as shown in figure 3, passed the film frame 14 for having pasted glass plate G from platform 16 by conveyer 150
Platform 18 is sent to, after the abradant surface that glass plate G has been ground on platform 18, glass plate G film frame will have been pasted by conveyer 152
14 are sequentially transmitted to platform 20 from platform 18, the abrading glass plate G abradant surface on platform 20, are so implemented with 2 stages.Further,
After the grinding for terminating glass plate G on platform 20, film frame 14 is unloaded from fixture 52 herein, and platform 22 is sent to by conveyer 154.
In addition, grinding table can be one or more than two according to purposes difference.In view of efficiency, cost, preferably there is corase grind
Two platforms of platform and finish grinding, but it is according to circumstances different, it has been alternatively raising quality and has been further added by finish grinding.
The method of lower film frame 14 is unloaded from fixture 52 is, the screw jack 92 shown in Fig. 5 is acted to relaxation direction first,
Eliminate the tension force of film body 38.Then, film frame 14 is slided relative to fixture 52, head portion 110 is unloaded from hook 112.So, will
Film frame 14 unloads from fixture 52.
On the other hand, on the platform 22 shown in Fig. 1, from by conveyer 154 transmit Lai film frame 14 unload end grinding
Glass plate G afterwards.The glass plate G unloaded is transmitted by conveyer belt 138, and the absorption installed on the arm 142 of automatic machine 140
First 144 absorption, glass plate is moved to by the action of automatic machine 140 and taken out of with conveyer belt 24, takes out of the outside of lapping device 10.
Fig. 6 (a) represents process implementing on platform 22, unloading the glass plate G for grinding completion from film frame 14 to 6 (d).
In addition, in Fig. 6 (a) into 6 (d), illustrate after film frame 14 unloads lower glass plate G, the example of lower film frame 14 is unloaded from fixture 52, but
As described above, lower glass plate G also can be unloaded from film frame 14 after lower film frame 14 is unloaded from fixture 52.
As shown in Fig. 6 (a), when fixture 52 is located at the top of the stage body 204 set on platform 22, via air feed path
102 supply air to air chamber 54, expand film body 38.The state is the original state that glass plate G is unloaded.In this state
Under, glass plate G and film body 38 produce relative offset, and want to recover flat elastic force by glass plate G, easily by glass
Glass plate G unloads from film body 38.That is, in the prior art because it is mandatory unload lower glass plate G make equipment produce burden unload process,
Become prone to carry out by expanding film body 38.
To shorten the activity duration for unloading process, other embodiment is enumerated.As shown in Fig. 6 (b), in Fig. 6 (a) process
Afterwards, from multiple blast injection nozzles 206,206 with glass plate G edge part relative configuration by blast injection to glass
Boundary portion between glass plate G edge part and film body 38.So, as shown in Fig. 6 (c), glass plate G is peeled off from film body 38.
The absorption affinity of film body 38 declines because of compressed air, therefore glass plate G is easy to unload from film body 38.In addition, also alternative compression
Air and injection water, while can also obtain same effect when injection water and compressed air.In addition, omitted in Fig. 6 (c)
Nozzle 206.
Fig. 6 (d) represents the state that glass plate G is unloaded and is placed on stage body 204 from film body 38 completely.Afterwards, glass plate G
Transmitted by the conveyer belt 138 shown in Fig. 1, also, glass plate is moved to by automatic machine 140 and taken out of with conveyer belt 24, taken out of
The outside of lapping device 10.
On the other hand, as shown in Fig. 6 (d), glass plate G then as shown in Fig. 6 (e), passes through after film body 38 unloads completely
Unload device to unload film frame 14 from fixture 52, film frame 14 is placed on jack 208,208.The film frame 14 passes through Fig. 1 institutes
The conveyer belt 146 shown is sent to film frame rinsing table 26.
The film frame 14 for being sent to platform 26 is washed with water herein.The film frame 14 that cleaning terminates is sent to platform 28 by conveyer belt 148,
It is heated and dries herein.Also, the film frame 14 for drying end sends conveyer belt 30 back to by film frame and is sent to platform 16, is re-used for
Glass plate G stickup.
Then, reference picture 7, Fig. 8 and Fig. 9 illustrate conveyer 150 (152,154).Fig. 7,8 and 9 are to represent to transmit respectively
The stereogram of the structure of device 150 (152,154), want portion's amplification stereogram, top view.
Conveyer 150 has 4 maintaining parts of the jut 43 in four corners for remaining set at film frame 14 from below
162、162…….The transmitting path for the film frame 14 that the configuration of these maintaining parts 162,162 ... is formed between platform 16 and platform 18
Both sides, it is connected to the axle 166 of small-sized automatic machine 164.The axle is driven to vertical direction and horizontal direction by small-sized automatic machine 164
166, so as to drive maintaining part 162 to vertical direction and horizontal direction.In addition, the maintaining part of film frame 14 is transmitted from platform 16 to platform 18
162 be the 1st maintaining part, and the maintaining part 162 that film frame 14 is transmitted from platform 18 to platform 20 is the 2nd maintaining part.
Also, as shown in figure 8, in the bottom fixed guide blocks 168 of small-sized automatic machine 164, the guide block 168 is with configuration in film frame
The guide rail (guide member) 170,170 of 14 transmitting path both sides is chimeric.Also, guide block 168 enters with what is configured along guide rail 170
Feed screw 172 to screw device screws togather.So, pasted glass plate G film frame 14 by conveyer 150 (152,
154) maintaining part 162,162 ... is kept, and platform 18 is sent to from platform 16.Also, pass through the decline of maintaining part 162,162 ...
Shift action, the film frame 14 that can will be delivered to platform 18 are placed on the grinding pad 58 of platform 18, afterwards, by maintaining part 162,
The rotational action of 162 ... horizontal direction, maintaining part 162,162 ... can be made to keep out of the way movement from film frame 14.Also, from film frame
14 keep out of the way mobile maintaining part 162,162 ... sends back in glass plate G process of lapping to platform 16.Wherein, placed on platform 16
The film frame 14 for having pasted next glass plate G by maintaining part 162,162 ... keep, it is standby to next time transmit untill.Keep
Movement of the portion 162 between platform, relative to film frame 14 vertical direction and horizontal direction action control unit as shown in Figure 1
200 controls.
In embodiments, guide rail 170 is configured in the both sides of the transmitting path of film frame 14, but the number of guide rail 170 is unlimited
In a pair (2).Also can only configure in the side of the transmitting path of film frame 14.But when guide rail 170 is configured the two of transmitting path
During side, glass plate G can be kept from the both sides relative with guide rail 170, therefore can stably keep glass plate G.
Then, the effect of lapping device 10 as constructed as above is illustrated.
(embodiment)
The specification of platform 18,20 is as follows.
Grinding pressure：2kPa to 25kPa
Grinding milk：Supply grinding milk cerium oxide being distributed in water from the slurries supply hole of grinding plate
Grinding pad 58：For polyurethane foam system, front have flow slurries groove (separation 4.5mm, groove width 1.5mm,
Groove depth 1 is to 5mm)
Grinding pad 60：For flexibel polyurethane system, suede shape, front have flow slurries groove (separation 4.5mm,
Groove width 1.5mm, groove depth 1 to 5mm)
Glass plate G thickness：0.2mm to 0.7mm
Glass plate G shape：While the rectangular glass more than 3000mm
Glass plate G non-abrasive side：The closely sealed holding of absorption layer of polyurethane by forming film body 38
As shown in Figure 10, in the front of grinding pad 58 (60), there are multiple grooves 59,59 ... in same direction.Each groove
59 as shown in figure 11, separation a=4.5mm, groove width b=1.5mm, groove depth c=1 to 5mm.
(the 1st grinding step of platform 18)
Milling time：Flatness as requested and allowance is needed to determine (being, for example, 2 minutes)
The revolution diameter of fixture 52：150mm
The revolution rotating speed of fixture 52：110rpm
Grind the swing speed of base station 64：180mm/min
Grind the swing stroke of base station 64：±100mm
The cycle scope of grinding plate 62：±80°
The turning speed of grinding plate 62：7.4°/sec
(the 2nd grinding step of platform 20)
Milling time：Last 30sec
The revolution diameter of fixture 52：150mm
The revolution rotating speed of fixture 52：110rpm
Grind the swing speed of base station 64：180mm/min
Grind the swing stroke of base station 64：±100mm
The cycle scope of grinding plate 62：±80°
The turning speed of grinding plate 62：0.1°/sec
Above is the specification of each 18,20, by these 18,20 abrading glass plate G, so as to can remove glass plate G
Minute asperities, the ripple on surface.
Also, so revolution action of independent control fixture 52 and the cycle of grinding plate 62 action, in grinding for glass plate G
In time consuming, the turning speed (angular speed) of grinding plate 62 is changed to low speed, so as to suppress because of the groove of grinding pad 58,60
Locality grinding is uneven caused by 59.Wherein, power caused by above-mentioned revolution action turns into the minute asperities for removing glass plate G surfaces
Power, power caused by above-mentioned cycle action turns into the power of the quality of control abradant surface.
Figure 14 is by the coarse metric of the glass plate ground by the Ginding process of existing Ginding process and embodiment
The chart formatted and be compared.The thick line A of the chart is normalized roughness under the Ginding process of embodiment, fine rule
B is normalized roughness under existing Ginding process.Also, the longitudinal axis of the chart will be coarse under existing Ginding process
The maximum of degree is standardized as 1.0, and transverse axis is standardized using maximum as 10.0.The roughness measure of glass plate uses
Contact pin type shapometer (the ProductName of Tokyo Seimitsu Co., Ltd's manufacture：サーフコム).
As indicates, according to the Ginding process of embodiment, compared with existing Ginding process, improve glass plate
Roughness.
In addition, turning speed is preferably 30 °/below sec in corase grind, more preferably 10 °/below sec.During fine grinding
Preferably 10 °/below sec, more preferably 3 °/below sec.
Also, fixture 52 is carried out cycle action, when grinding plate 62 carries out revolution action, can also obtain same effect
Fruit.Also, cycle is not limited to, in spinning movement, in the angular speed of grinding midway change rotation, can also obtain same effect
Fruit.Further, the change of above-mentioned angular speed is not limited to from high speed to low speed, can be also changed to from low speed at a high speed.
On the other hand,, will be by maintaining part to improve glass plate G productivity ratio in the lapping device 10 of embodiment
162nd, 162 ... and a pair of guide rails 170,170 form conveyer 150 be arranged on lapping device 10.Also, in grinding work
In the milling time (including film frame 14 is installed to the time of fixture 52) of glass plate G in sequence, film frame 14 platform has been sent to
18 maintaining part 162 is sent back to platform 16 along a pair of guide rails 170,170.
Maintaining part 162 is sent back to by platform 16 from platform 18 by the milling time like this using glass plate G, using grinding
Time makes maintaining part 162 keep having pasted next glass plate G film frame 14.Also, after previous glass plate G grinding terminates,
The film frame 14 for having pasted next glass plate G can be sent to platform 18 by maintaining part 162 at once.
Also, the milling time of the glass plate G using platform 20, film frame 14 has been sent to from platform 18 maintaining part of platform 20
162 are sent back to platform 18 from platform 20.So, using above-mentioned milling time, above-mentioned maintaining part 162 is made to be treated on platform 18
Machine.Also, after platform 18 terminates grinding step, film frame 14 can be sent to platform 20 by above-mentioned maintaining part 162 from platform 18 at once.
In addition, before platform 20 sends back to platform 18, maintaining part 162 is set to be moved to shown in Fig. 8 double dot dash line above-mentioned maintaining part 162
Retreating position.So, maintaining part 162 is not sent back to intrusively with grinding pad 60.
That is, according to the Ginding process for having used conveyer 150, can implement maintaining part 162 in milling time from platform
18 send back to the process of platform 16, make maintaining part 162 keep having pasted the process of next glass plate G film frame 14 and by maintaining part
162 send back to the process of platform 18, therefore the existing grinding side with making fixture be reciprocated between platform 18 and platform 16 from platform 20
Method is compared, and can greatly improve glass plate G productivity ratio.
On the other hand, in embodiments, film frame 14 is formed as rectangle corresponding to glass plate G shape.Also, fixture
52 carry out revolution action, and grinding pad 58 (60) passes through with predetermined angular range cycle or the cycle and along glass
The combinative movement of the swing in the direction of plate G abradant surface, make to produce relative motion between glass plate G and grinding pad 58 (60), from
And abrading glass plate G.
Made via film frame 14 using fixture 52 while during large-scale rectangular glass G rotations and revolution more than 1000mm,
The operating range of film frame 14 becomes big, therefore film frame 14 needs the long period relative to the input and taking-up of fixture 52.Also, such as
Shown in Figure 12, the shield 174 of film frame 14 and guide rail 170 collides.
Therefore, Ginding process is as follows in embodiments：Make as illustrated in fig. 13 large-scale film frame 14 (glass plate G) side with
Revolved round the sun centered on revolution center P, as illustrated in fig. 4 return grinding pad 58 (60) sidespin.
So, the operating range of film frame 14 is compared with above-mentioned operating range and diminished, therefore can be implemented in a short time
The input relative to fixture 52 of film frame 14 and taking-up, and can prevent the shield 174 of film frame 14 and guide rail 170 from colliding.Also,
The operating range of film frame 14 diminishes, thus can there is provided multiple posts, the lapping device 10 of beam narrow space in set
Conveyer 150.Further, by making the side of film frame 14 revolve round the sun, the power needed for grinding can be obtained, by making grinding pad 58 (60) side
Cycle, can control the quality of abradant surface, therefore the groove of grinding pad 58 (60) can be prevented to be transferred on glass plate G.Further, can be
While realizing abrasive action as revolution and cycle, the high efficiency of glass plate G delivery time is realized, therefore glass can be improved
Glass plate G productivity ratio.
Also, in embodiments, as shown in figure 15, the preferred configuration direction relative to guide rail 170,170 of film frame 14
The length L1 in orthogonal direction and ratio (L2/L1, L3/L1) from the end of film frame 14 to distance L2, L3 of guide rail 170,170 are
0.28 to 0.35.
So, the size of maintaining part 162 (reference picture 9) and rigidity can optimize, and the high speed rotation of maintaining part 162 can be achieved
Reverse work and film frame 14 High Speed Transfer.In addition, above-mentioned optimization refers to, it can minimize the size of maintaining part 162, can suppress to protect
Hold the flexure in portion 162 and the vibration of maintaining part 162.Also, distance L2 and L3 can be identical value or different value.
Also, in the process for sending film frame 14 back to, preferably film frame 14 in the horizontal direction, vertical direction or relative to level
Sent back on the inclined incline direction in direction.
That is, when film frame 14 is sent back in the horizontal direction, it can simplify and send processing apparatus back to, shorten and send the time back to.That is, glass plate
G is ground with horizontal attitude, therefore film frame 14 and horizontal attitude.Therefore, after glass plate G grinding terminates, film frame is such as made
The 14 holding postures (keep level) are sent back to, then the posture of film frame 14 vertically or inclination therefore will not can shorten and send the time back to.
Also, film frame 14 can efficiently be sent back in vertical direction or when being sent back to relative to the inclined incline direction of horizontal direction
The cleaning-drying of the film frame 14 of in-process.That is, after the grinding of glass plate G terminates, film frame 14 is cleaned on platform 26, therefore at it
Remained on surface is used for the moisture cleaned.By making film frame 14 vertical or being tilted relative to horizontal direction, the moisture can be made from film frame
14 flow down, and so as to efficiently desciccator diaphragm frame 14, shorten drying time.
The present invention is described in detail with reference to specific embodiment, but it is aobvious and easy for a person skilled in the art
See, do not depart from scope and spirit of the present invention such as, various amendments, change can be carried out.
The application is used as reference to help based on Japanese patent application 2011-056732 filed in 15 days March in 2011, its content
Draw in this.
Claims (9)
1. a kind of Ginding process of plate body, there is following process：
Adhering processes, in the paste position of plate body, the non-abrasive side of above-mentioned plate body is pasted on plate body affixed component；
Plate body transmits process, by the maintaining part towards abrasion site by above-mentioned plate body affixed component from above-mentioned paste position
Above-mentioned abrasion site is sent to, wherein, the above-mentioned maintaining part towards abrasion site is installed into along configuration in above-mentioned sticky position
The guide member put between above-mentioned abrasion site moves freely, and is carried out between above-mentioned paste position and above-mentioned abrasion site
Back and forth movement, there is the milling tool for the abradant surface for grinding above-mentioned plate body in above-mentioned abrasion site；
Grinding step, on the plate body holding member that above-mentioned plate body affixed component is installed to located at above-mentioned abrasion site
Afterwards, the above-mentioned plate body being pasted onto by the grinding of above-mentioned milling tool on above-mentioned plate body affixed component；
Plate body unloads process, and above-mentioned plate body is unloaded from above-mentioned plate body affixed component, and from above-mentioned plate body holding member
The plate body affixed component is unloaded, or, unload above-mentioned plate body affixed component from above-mentioned plate body holding member, and from the plate
Shape body affixed component unloads above-mentioned plate body；And
Send process back to, the above-mentioned plate body affixed component for having unloaded above-mentioned plate body sent back into above-mentioned paste position,
The Ginding process of above-mentioned plate body is characterised by,
In above-mentioned grinding step, the action of the above-mentioned plate body holding member of independent control and above-mentioned milling tool so that above-mentioned plate
Shape body holding member carries out revolution action, and above-mentioned milling tool carries out the rotation action of scope cycle at a predetermined angle or carried out
The combinative movement of the cycle of predetermined angular range and the swing in the direction of the abradant surface along above-mentioned plate body, passes through above-mentioned tabular
Body holding member and above-mentioned milling tool make to produce relative motion between above-mentioned plate body and above-mentioned milling tool.
2. the Ginding process of plate body according to claim 1, wherein,
In above-mentioned grinding step, above-mentioned plate body affixed component the above-mentioned towards grinding position of above-mentioned abrasion site has been sent to
The maintaining part put is sent back to above-mentioned paste position.
3. the Ginding process of plate body according to claim 1, wherein,
Above-mentioned plate body, which unloads process, includes following process：
The process that above-mentioned plate body affixed component is unloaded from above-mentioned plate body holding member；
Plate body transmits process, by unloading the maintaining part of leave from office towards plate body by above-mentioned plate body affixed component from above-mentioned grinding
Position is sent to above-mentioned plate body and unloads leave from office, and the above-mentioned maintaining part that leave from office is unloaded towards plate body is installed into along configuration above-mentioned
The guide member that abrasion site and above-mentioned plate body are unloaded between leaving office moves freely, and in above-mentioned abrasion site and above-mentioned plate body
Unload and carry out back and forth movement between leaving office；And
The process for unloading above-mentioned plate body from above-mentioned plate body affixed component.
4. a kind of Ginding process of plate body, there is following process：
Adhering processes, in the paste position of plate body, the non-abrasive side of above-mentioned plate body is pasted on plate body affixed component；
Plate body transmits process, by the maintaining part towards the 1st abrasion site by above-mentioned plate body affixed component from above-mentioned stickup
Position is sent to above-mentioned 1st abrasion site, wherein, the maintaining part of the above-mentioned abrasion site of direction the 1st, which is installed into along configuration, to exist
Guide member between above-mentioned paste position and above-mentioned 1st abrasion site moves freely, and in above-mentioned paste position and the above-mentioned 1st
Back and forth movement is carried out between abrasion site, there is the 1st grinding of the abradant surface for grinding above-mentioned plate body in above-mentioned 1st abrasion site
Instrument；
1st grinding step, above-mentioned plate body affixed component is being installed to the plate body maintaining part located at above-mentioned 1st abrasion site
After on part, the above-mentioned plate body being pasted onto on above-mentioned plate body affixed component is ground by above-mentioned 1st milling tool；
2nd plate body transmits process, by the maintaining part towards the 2nd abrasion site by above-mentioned plate body affixed component from above-mentioned the
1 abrasion site is sent to above-mentioned 2nd abrasion site, wherein, the maintaining part of the above-mentioned abrasion site of direction the 2nd be installed into along with
The guide member put between above-mentioned 1st abrasion site and above-mentioned 2nd abrasion site moves freely, and grinds position the above-mentioned 1st
Put and carry out back and forth movement between above-mentioned 2nd abrasion site, there is the grinding for grinding above-mentioned plate body in above-mentioned 2nd abrasion site
2nd milling tool in face；
2nd grinding step, above-mentioned plate body affixed component is being installed to the plate body maintaining part located at above-mentioned 2nd abrasion site
After on part, the above-mentioned plate body being pasted onto on above-mentioned plate body affixed component is ground by above-mentioned 2nd milling tool；
Plate body unloads process, and above-mentioned plate body is unloaded from above-mentioned plate body affixed component, and from above-mentioned plate body holding member
The plate body affixed component is unloaded, or, unload above-mentioned plate body affixed component from above-mentioned plate body holding member, and from the plate
Shape body affixed component unloads above-mentioned plate body；And
Send process back to, the above-mentioned plate body affixed component for having unloaded above-mentioned plate body sent back into above-mentioned paste position,
The Ginding process of above-mentioned plate body is characterised by,
In above-mentioned 1st grinding step and above-mentioned 2nd grinding step, the above-mentioned plate body holding member of independent control and above-mentioned
The action of 1 milling tool and above-mentioned 2nd milling tool so that above-mentioned plate body holding member carries out revolution action, and the above-mentioned 1st grinds
Grinder has and above-mentioned 2nd milling tool carries out the rotation action of scope cycle at a predetermined angle or carries out predetermined angular range
The combinative movement of cycle and the swing in the direction of the abradant surface along above-mentioned plate body, by above-mentioned plate body holding member and upper
Stating the 1st milling tool and above-mentioned 2nd milling tool makes above-mentioned plate body and above-mentioned 1st milling tool and above-mentioned 2nd milling tool
Between produce relative motion.
5. the Ginding process of plate body according to claim 4, wherein,
In above-mentioned 1st grinding step and above-mentioned 2nd grinding step, above-mentioned plate body affixed component has been sent to the above-mentioned 1st
The maintaining part of the abrasion site of above-mentioned direction the 1st of abrasion site is sent back to above-mentioned paste position, by above-mentioned plate body paste section
The maintaining part that part has been sent to the abrasion site of above-mentioned direction the 2nd of above-mentioned 2nd abrasion site is sent back to above-mentioned 1st grinding position
Put.
6. the Ginding process of plate body according to claim 4, wherein,
Above-mentioned plate body, which unloads process, includes following process：
The process that above-mentioned plate body affixed component is unloaded from above-mentioned plate body holding member；
Plate body transmits process, by unloading the maintaining part of leave from office towards plate body by above-mentioned plate body affixed component from the above-mentioned 2nd
Abrasion site is sent to above-mentioned plate body and unloads leave from office, and the above-mentioned maintaining part that leave from office is unloaded towards plate body is installed into along configuration and existed
Above-mentioned 2nd abrasion site and above-mentioned plate body unload guide member movement between leaving office freely, and in above-mentioned 2nd abrasion site and
Above-mentioned plate body carries out back and forth movement between unloading leave from office；And
The process for unloading above-mentioned plate body from above-mentioned plate body affixed component.
7. a kind of lapping device, has：
Glass plate is moved into conveyer belt, the glass plate moved into before grinding；
Glass plate pastes platform, and above-mentioned glass plate is pasted on film frame；
1st grinding table, there is the 1st milling tool of the abradant surface for grinding above-mentioned glass plate；
2nd grinding table, there is the 2nd milling tool of the abradant surface for grinding above-mentioned glass plate；
Glass plate unloads leave from office, and the glass plate for grinding completion is unloaded from above-mentioned film frame；
Glass plate, which takes out of, uses conveyer belt；
Film frame sends conveyer belt back to, and the above-mentioned film frame for having unloaded above-mentioned glass plate is sent back into above-mentioned glass plate pastes platform；
1st maintaining part, it is installed into along configuration and pastes the guide member between platform and above-mentioned 1st grinding table in above-mentioned glass plate
Movement freely, and is pasted in above-mentioned glass plate and carries out back and forth movement between platform and above-mentioned 1st grinding table；
Plate body holding member, located at above-mentioned 1st grinding table, the above-mentioned film frame of above-mentioned glass plate has been pasted in installation, and by above-mentioned
1st milling tool grinds above-mentioned glass plate；
2nd maintaining part, it is installed into along guide member of the configuration between above-mentioned 1st grinding table and above-mentioned 2nd grinding table and moves
Move freely, and back and forth movement is carried out between above-mentioned 1st grinding table and above-mentioned 2nd grinding table；And
Plate body holding member, located at above-mentioned 2nd grinding table, the above-mentioned film frame of above-mentioned glass plate has been pasted in installation, and by above-mentioned
2nd milling tool grinds above-mentioned glass plate,
Above-mentioned lapping device is characterised by,
With control unit, the above-mentioned above-mentioned plate body holding member of control unit independent control and above-mentioned 1st milling tool and above-mentioned
The action of 2nd milling tool so that above-mentioned plate body holding member carries out revolution action, above-mentioned 1st milling tool and the above-mentioned 2nd
Milling tool carry out the rotation action of scope cycle at a predetermined angle or carry out the cycle of predetermined angular range with along above-mentioned
The combinative movement of the swing in the direction of the abradant surface of plate body.
8. lapping device according to claim 7, wherein,
Above-mentioned control unit is controlled as follows：When grinding above-mentioned glass plate in above-mentioned 1st grinding table, by above-mentioned film frame
Above-mentioned 1st maintaining part for being sent to above-mentioned 1st grinding table is sent back to above-mentioned glass plate stickup platform, in above-mentioned 2nd grinding table
It is middle grinding above-mentioned glass plate when, by above-mentioned film frame be sent to above-mentioned 2nd grinding table above-mentioned 2nd maintaining part be sent back to it is above-mentioned
1st grinding table.
9. lapping device according to claim 7, wherein,
Guide sections part has a pair of guide rails of configured in parallel, by above-mentioned 1st maintaining part and above-mentioned 2nd maintaining part this one
To transmitting above-mentioned film frame between guide rail,
Distance from the end of above-mentioned film frame to above-mentioned guide rail relative to above-mentioned film frame the configuration direction relative to above-mentioned guide rail
The ratio of the length in orthogonal direction is 0.28 to 0.35.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011056732 | 2011-03-15 | ||
| JP2011-056732 | 2011-03-15 | ||
| CN201280013296.XA CN103429383B (en) | 2011-03-15 | 2012-03-12 | The Ginding process of plate body |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201280013296.XA Division CN103429383B (en) | 2011-03-15 | 2012-03-12 | The Ginding process of plate body |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105798767A CN105798767A (en) | 2016-07-27 |
| CN105798767B true CN105798767B (en) | 2018-01-30 |
Family
ID=46830732
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201280013296.XA Active CN103429383B (en) | 2011-03-15 | 2012-03-12 | The Ginding process of plate body |
| CN201610211042.9A Active CN105856061B (en) | 2011-03-15 | 2012-03-12 | The grinding method and grinding device of plate body |
| CN201610211050.3A Active CN105798767B (en) | 2011-03-15 | 2012-03-12 | The Ginding process and lapping device of plate body |
Family Applications Before (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201280013296.XA Active CN103429383B (en) | 2011-03-15 | 2012-03-12 | The Ginding process of plate body |
| CN201610211042.9A Active CN105856061B (en) | 2011-03-15 | 2012-03-12 | The grinding method and grinding device of plate body |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2012124663A1 (en) |
| KR (2) | KR20140010073A (en) |
| CN (3) | CN103429383B (en) |
| TW (1) | TW201247362A (en) |
| WO (1) | WO2012124663A1 (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101612928B1 (en) * | 2013-01-04 | 2016-04-15 | 주식회사 엘지화학 | Apparatus and method for mounting glass plate on back pad for polishing |
| JP6357260B2 (en) * | 2016-09-30 | 2018-07-11 | 株式会社荏原製作所 | Polishing apparatus and polishing method |
| IT201600130117A1 (en) | 2016-12-22 | 2018-06-22 | Breton Spa | Machine and method for grinding and / or polishing stone slabs, such as natural or agglomerated stone, ceramic and glass |
| KR102027814B1 (en) * | 2018-05-23 | 2019-10-02 | 주식회사 앤아이윈 | Upper platen of chemical mechanical polishing Equipment of large area glass for display device |
| JP7217202B2 (en) * | 2019-05-31 | 2023-02-02 | 株式会社荏原製作所 | Temperature controller and polisher |
| CN110707670B (en) * | 2019-10-24 | 2020-12-01 | 南方电网科学研究院有限责任公司 | Control method of small-resistance grounding device of transformer substation |
| CN111300240B (en) * | 2020-02-22 | 2021-02-19 | 深圳市盛鸿运科技有限公司 | Steel plate surface treatment equipment and steel plate surface treatment process |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10291147A (en) * | 1997-04-21 | 1998-11-04 | Nippon Electric Glass Co Ltd | Method and device for polishing plate glass |
| JP2004122351A (en) * | 2002-07-31 | 2004-04-22 | Asahi Glass Co Ltd | Method and device for polishing substrate |
| CN101823223A (en) * | 2009-03-06 | 2010-09-08 | 株式会社Lg化学 | Glass polishing system |
| JP4654275B2 (en) * | 2008-07-31 | 2011-03-16 | 信越半導体株式会社 | Double-side polishing equipment |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5094037A (en) * | 1989-10-03 | 1992-03-10 | Speedfam Company, Ltd. | Edge polisher |
| WO2001083285A1 (en) * | 2000-05-01 | 2001-11-08 | Honda Giken Kogyo Kabushiki Kaisha | Side panel assembly line |
| JP2004034216A (en) * | 2002-07-02 | 2004-02-05 | Tamagawa Machinery Co Ltd | Polishing machine and polishing method |
| DE60230819D1 (en) * | 2002-10-11 | 2009-02-26 | Bando Kiko Co | DEVICE FOR MACHINING WINDOW DISCS |
| JP5009101B2 (en) * | 2006-10-06 | 2012-08-22 | 株式会社荏原製作所 | Substrate polishing equipment |
| JP5028354B2 (en) * | 2008-07-31 | 2012-09-19 | 信越半導体株式会社 | Wafer polishing method |
| JP5408788B2 (en) * | 2009-03-06 | 2014-02-05 | エルジー・ケム・リミテッド | Float glass polishing system |
-
2012
- 2012-03-12 CN CN201280013296.XA patent/CN103429383B/en active Active
- 2012-03-12 JP JP2013504723A patent/JPWO2012124663A1/en not_active Withdrawn
- 2012-03-12 CN CN201610211042.9A patent/CN105856061B/en active Active
- 2012-03-12 WO PCT/JP2012/056308 patent/WO2012124663A1/en active Application Filing
- 2012-03-12 KR KR1020137024240A patent/KR20140010073A/en not_active Application Discontinuation
- 2012-03-12 CN CN201610211050.3A patent/CN105798767B/en active Active
- 2012-03-12 KR KR1020187016539A patent/KR20180069925A/en active Search and Examination
- 2012-03-15 TW TW101108932A patent/TW201247362A/en unknown
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10291147A (en) * | 1997-04-21 | 1998-11-04 | Nippon Electric Glass Co Ltd | Method and device for polishing plate glass |
| JP2004122351A (en) * | 2002-07-31 | 2004-04-22 | Asahi Glass Co Ltd | Method and device for polishing substrate |
| JP4654275B2 (en) * | 2008-07-31 | 2011-03-16 | 信越半導体株式会社 | Double-side polishing equipment |
| CN101823223A (en) * | 2009-03-06 | 2010-09-08 | 株式会社Lg化学 | Glass polishing system |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103429383B (en) | 2016-05-11 |
| CN105856061A (en) | 2016-08-17 |
| WO2012124663A1 (en) | 2012-09-20 |
| KR20140010073A (en) | 2014-01-23 |
| CN105856061B (en) | 2019-06-11 |
| CN105798767A (en) | 2016-07-27 |
| TW201247362A (en) | 2012-12-01 |
| JPWO2012124663A1 (en) | 2014-07-24 |
| KR20180069925A (en) | 2018-06-25 |
| CN103429383A (en) | 2013-12-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105798767B (en) | The Ginding process and lapping device of plate body | |
| US8808061B2 (en) | Method and apparatus for dressing polishing pad | |
| JP2001018169A (en) | Polishing device | |
| JP2010064196A (en) | Substrate polishing device and substrate polishing method | |
| CN106206374A (en) | For keeping the workbench of object to be processed and there is the processing means of this workbench | |
| TW201402273A (en) | Methods and apparatus for pre-chemical mechanical planarization buffing module | |
| JP2010069601A (en) | Method for dressing polishing pad and polishing device | |
| CN109623629A (en) | One kind automating polishing production line for hard material | |
| TWI362698B (en) | Wafer polishing apparatus, wafer polishing system and wafer polishing method | |
| JPWO2012077427A1 (en) | Polishing tool | |
| JP2004356336A (en) | Double-sided polishing method of semiconductor wafer | |
| JP2539753B2 (en) | Mirror polishing machine for semiconductor substrates | |
| KR20070031220A (en) | Double face plane polishing machine and method for polishing rectangular workpiece | |
| JPH07299738A (en) | Wafer polishing device | |
| TW201302381A (en) | Polishing device for plate-like object | |
| JP2000326207A (en) | Double-side grinding device | |
| JP4058904B2 (en) | Polishing cloth dressing method, semiconductor wafer polishing method and polishing apparatus | |
| WO2013118578A1 (en) | Polishing pad and polishing apparatus | |
| KR20010029637A (en) | Exchange device of polishing pad and exchange method of the same | |
| JP2002355759A (en) | Wafer polishing device | |
| JPH08267358A (en) | Simultaneous mirror surface abrasive device of semiconductor substrate | |
| JP2006253524A (en) | Transfer method for semiconductor substrate and conveyance apparatus used therefor | |
| JP3596253B2 (en) | Double-side polishing machine for semiconductor wafer | |
| KR20100053242A (en) | Apparatus for grinding the substrate | |
| JP2000326213A (en) | Double-side grinding method and device thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: Tokyo, Japan Patentee after: AGC Corporation Address before: Tokyo, Japan Patentee before: Asahi Glass Co., Ltd. |
|
| CP01 | Change in the name or title of a patent holder |