JP2006253524A - Transfer method for semiconductor substrate and conveyance apparatus used therefor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for transferring a substrate from the grinding stage to the cleaning stage, the method that reduces minute particles firmly adhering to a grinding mark groove of a back ground semiconductor substrate. <P>SOLUTION: The surface of the substrate with a printed wiring is coated by a protective tape. The protective tape side of the semiconductor substrate is disposed in face to face with a porous ceramic chuck 12, and the backside of the substrate is polished by grinding stones 16a, 16b. On completion of grinding, an annular suction pad open above and below on a conveyor is brought into contact with the backside of the polished substrate, while feeding washing liquid 60 onto the polished substrate on its backside. The substrate is shifted to a washing spinner 10 with the washing liquid film existent inside a recessed gap formed by the upper face of the substrate and the lower face of the annular sucking pad. As the substrate is conveyed with its polishing surface kept wet, fine particles can be prevented from getting fixed and can be removed easily during spin washing. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a method of transferring a semiconductor substrate in a wet state from a back grinding process stage of a semiconductor substrate to a cleaning stage of the semiconductor substrate, and a transfer device used for transferring the semiconductor substrate. According to the wet (wet) delivery method of the present invention, it is possible to obtain a semiconductor substrate in which the amount of extremely small foreign matter (particles) adhering to the back surface of the ground semiconductor substrate is reduced.

  In a semiconductor substrate back surface grinding apparatus, a substrate surface on which printed wiring is applied is covered with a protective tape, and the back surface of the semiconductor substrate placed with the protective tape surface facing a porous ceramic chuck The surface of the substrate that has been ground by back surface is brush-washed while spraying the cleaning liquid onto the back-ground substrate surface, the back surface of the ground substrate that has been brush-washed is adsorbed to the suction pad of the transport device, and the suction pad of the transport device is rotated. It has been practiced that the back surface of the ground substrate subjected to brush cleaning is transferred upward onto a cleaning spinner, and the front surface and the back surface of the substrate are cleaned with a cleaning spinner (see, for example, Patent Document 1 and Patent Document 2). ).

  As a specific example of such a substrate grinding apparatus, FIG. 8 shows a substrate back surface grinding apparatus. This back grinding apparatus has a chuck cleaner (a brush 14 provided with a brush cleaning mechanism 15a and a ceramic iron on a rail 14 provided on a porous ceramic chuck 12 provided on an index table 13 at a distance. This is an index-type back surface grinding apparatus having a cleaning device 15 that can travel in the lateral direction with a chuck cleaning mechanism) 15b as a pair, on a substrate that has been back-ground by a grinding wheel 16d mounted on the chuck 12. The brush cleaning mechanism 15a is run, the rotating brush is lowered while supplying the cleaning liquid to the substrate, the substrate is cleaned, then the brush is lifted, and the back surface grinding processed by the transfer pad 17a of the transfer device 17 is cleaned. After the substrate is transferred onto the cleaning spinner 10, the chuck cleaner 15b is run on the chuck 12, and the cleaning liquid is supplied to the surface of the chuck 12. Lowering the ceramic rod which is rotating are washed chuck with (e.g., see Patent Document 1.).

  In addition, a ground substrate obtained by grinding a substrate obtained by slicing an ingot with a grindstone is immersed in an alkaline cleaning solution having a pH of 12 or more, and then irradiated with ultrasonic waves to perform alkali cleaning / ultrasonic cleaning. After removing the processing scraps and residues sandwiched between the grooves and the grinding striations of the grinding substrate, solid abrasive grains having a Mohs hardness equal to or softer than the Mohs hardness of the substrate are applied to the surface of the substrate. There has also been proposed a dry chemical mechanical polishing method characterized in that a polishing tool formed by bonding with a binder is pressed, and the surface of the substrate is flattened by relatively moving the grinding substrate and the polishing tool (for example, Patent Documents). 3).

Furthermore, recently, as a cleaning spinner, in order to reduce the amount of minute foreign matter (particles) adhering to the cleaned semiconductor substrate, a liquid mixture of two types of chemicals stored in the chemical tank and pure water It has also been proposed to supply a preparation liquid onto a substrate surface on a spinner from a chemical spray nozzle while applying ultrasonic vibration to the substrate and perform spin liquid phase cleaning (see, for example, Patent Document 4 and Patent Document 5). .
Japanese Patent Laid-Open No. 11-307489 (see page 3-5 and FIGS. 1 and 3) JP 2003-282673 A (see page 3-5 and FIGS. 1 and 2) Japanese Patent Laid-Open No. 2004-235201 (see page 4-8 and FIG. 3) JP 2003-179118 A (see page 2-8 and FIG. 10) JP 2004-259742 A (see page 2-8 and FIGS. 2 and 1)

A semiconductor substrate in a back grinding stage (corresponding to the chuck 12 in the loading / unloading stage s ₁ in FIG. 8) using the transfer pad 17 described in Patent Documents 1 and 2. In the method of adsorbing the back surface and delivering the semiconductor substrate to the cleaning stage of the semiconductor substrate, the semiconductor substrate is dried and transferred to the cleaning spinner 10 (cleaning stage). Therefore, the very small foreign matter once dried and adhering to the groove of the grinding mark on the back side of the substrate cannot be easily removed by spin cleaning using a cleaning liquid to which ultrasonic waves are applied in cleaning at the cleaning stage. There are drawbacks.

  An object of the present invention is to form a suction pad structure of a transfer device in an upper and lower open type annular body, and when transferring a semiconductor substrate from a back grinding process stage to a semiconductor substrate cleaning stage, the upper surface of the substrate and the annular suction pad By transporting the semiconductor substrate in a wet state where the cleaning liquid film exists in the recess space formed between the bottom and the bottom surface, it is possible to prevent the extremely small foreign matter from drying and sticking and to keep the very small foreign matter floating in the cleaning liquid film. Accordingly, the present invention is to provide a substrate delivery method capable of removing 95% or more of ultrafine foreign substances in the cleaning stage of the next process, and to provide a transport device used therefor.

  According to the first aspect of the present invention, the back surface of the semiconductor substrate placed on the substrate surface on which the printed wiring is applied is covered with a protective tape and the protective tape surface is opposed to the porous ceramic chuck. After grinding with a grindstone, while supplying the cleaning liquid to the back-ground ground substrate surface, the upper and lower open-type annular suction pads of the transfer device are brought into contact with the back surface of the ground substrate to adsorb the substrate, and the upper surface of the substrate And a method of transferring a semiconductor substrate, wherein the substrate is transferred to a spinner as a cleaning stage in a state in which a cleaning liquid film exists in a recess space formed by the lower surface of the annular suction pad. Is.

The invention of claim 2
An annular suction pad having a piercing portion that communicates vertically and having a plurality of vacuum holes in the annular bottom surface,
A pressure reducing means provided on the annular upper surface of the annular suction pad and leading to the vacuum hole of the annular suction pad;
A pad holding fixture for fixing the annular suction pad on the upper surface of the annular suction pad;
A swivel arm that rotatably supports the pad pressing fixture;
A moving mechanism for moving the swivel arm so that the swivel arm can be moved up and down and swiveled or moved back and forth linearly;
and,
The present invention provides a substrate transport device provided with a cleaning liquid supply means for supplying a cleaning liquid from above the annular suction pad to a penetration portion of the annular suction pad.

  The substrate ground on the back surface keeps the back surface of the semiconductor substrate wet by stagnation in a recess space formed by the upper surface (grinding surface) of the substrate and the pierced portion communicating with the upper and lower sides of the annular suction pad. Therefore, it is easy to remove the very small foreign matter on the cleaning stage, and more than 95% of the very small foreign matter is removed from the back-ground substrate surface. The

Hereinafter, the present invention will be described in more detail with reference to the drawings.
1 is a perspective view of a substrate transfer device according to the present invention, FIG. 2 is a front view of the substrate transfer device according to the present invention, FIG. 3 is a bottom view of an annular suction pad of the substrate transfer device, and FIG. FIG. 5 and FIG. 5 are cross-sectional views of the annular suction pad, showing the AA cut surface in FIG. FIG. 6 is a side view of the substrate transfer apparatus, and FIG. 7 is a plan view of the back surface grinding apparatus.

  In the substrate transfer device 30 shown in FIGS. 1 to 6, 17′a is an annular suction pad of the head portion, which has a piercing portion 30a having a diameter of 36 mm that communicates with the top and bottom, and four pieces having a diameter of 2 to 6 mm on the upper surface. An adsorption communication hole 30b is formed, an arc-shaped groove 30d having a width of 1 mm and a depth of 1 mm is provided on the bottom surface, and a plurality of vacuum holes 30e having a diameter of 0.5 to 1.5 mm are provided in the arc-shaped groove. An annular suction pad having a diameter of about 165 mm and a height of 15 mm. The suction communication hole 30b is provided on the annular upper surface of the annular suction pad 17'a and communicates with a vacuum hole 30e provided on the bottom surface of the annular suction pad. The other end of the suction communication hole 30 b is connected to the hose 32 of the decompression means 31. The bottom central portion 30f of the annular suction pad 17'a is 0.5 to 1 mm lower than the outer peripheral portion 30c. The material of this annular suction pad 17'a is poly (tetrafluoroethylene), poly (difluoro-dichloroethylene), nylon 6, nylon 6,10, polyacetal, glass fiber reinforced epoxy resin, glass fiber reinforced polybutylene terephthalate. -It is preferable that the Rockwell hardness is D50 or higher, such as G, ceramic, aluminum, and stainless steel.

  As shown in FIGS. 1 and 2, the decompression means 31 for decompressing the vacuum hole 30e provided in the arc-shaped groove 30d of the annular suction pad includes a polyurethane coil 32, a binding material (union) 33, a fluid passage connecting pipe 34, It consists of a hose fixture 35, a vacuum pump (not shown), and a coupling 36 connected to this vacuum pump. When the vacuum pump is driven to depressurize, the depressurization depressurizes the vacuum hole 30e on the bottom surface of the annular suction pad 17′a via the joint 36, the polyurethane coil 32, the binding material 33, the fluid passage connecting pipe 34, and the suction communication hole 30b. The back surface of the semiconductor substrate is sucked by the annular suction pad.

  Reference numeral 37 denotes a pad pressing fixture, which fixes the annular suction pad with bolts 39 on the upper surface of the annular suction pad 17 ′ a. Reference numeral 38 denotes a swing arm which rotatably supports a pad pressing fixture 37 for fixing the annular suction pad 17'a. The arm 38 that supports the annular suction pad 17'a can be advanced and retracted in the left-right direction shown in FIG. The upper part of the square F cylinder 22 is fixed to an arm holder 25 provided at the lower part of the stepping motor 40.

  An arm shaft is provided in the center of the arm holder 25. The arm shaft is composed of a small arm shaft 28a and a large arm shaft 28b. The upper portion of the small arm shaft 28a is supported by a bearing 43 below the bearing case 42 of the stepping motor 40. A large arm shaft 28b is connected to the upper portion of the small arm shaft 28a, and is rotatably supported by the lower bearing 43 and the upper bearing 45. The upper part of the large arm shaft 28b is connected to the rotating shaft 46 of the stepping motor 40. By driving the stepping motor 40, the arm shafts 28a, 28b are rotated, and the arm holder 25 is rotated around the small arm shaft 28a. By rotation of the arm holder 25, the square F cylinder 22 fixed to the holder also rotates around the small arm shaft 28a. Therefore, the arm 38 supported by the square F cylinder 22 also rotates around the small arm shaft 28 a, and the annular suction fixed to the fixture 37 on the extension of the arm 38. The pad 17'a rotates around the small arm shaft 28a.

  The arm 38 of the annular suction pad 17'a is moved up and down by moving the arm 47 up and down with a cylinder 48 on a slider 47 that fixes the stepping motor 40.

  A cleaning liquid supply means 60 supplies the cleaning liquid from above the annular suction pad 17'a to the piercing portion 30a of the annular suction pad. The cleaning liquid stays in the recess space formed by the substrate and the through-hole 30a of the annular suction pad, and stretches the film.

  The back grinding apparatus 1 shown in FIG. 7 includes a base 2, a shaft 3 that can be moved up and down, and a shaft 4. A robot arm is attached to the shaft 3 so as to be horizontally extendable and rotatable. The substrates are transported or carried in from a plurality of substrates (wafers) vertical storage cassettes 5 and 5 'provided at the front side of the shaft 3 and provided at an annular position having the same circle center point as the axis of the shaft 3. . The arm back surface of the robot arm 4 has many holes with a diameter of 0.5 to 1 mm, and adsorbs the substrate A by depressurizing the chamber. The robot arm 4 includes two arms which are provided on the shaft 3 and are rotatable, and an arm which is designed to be able to extend and retract by an air cylinder and to be rotated.

  The storage cassettes 5 and 5 ′ are installed on the same circumference at a distance of 60 degrees from the axis 3 of the robot arm 4. The storage cassette 5 can store 25 substrates before being ground, and the storage cassette 5 'can store 25 substrates A that have been ground.

6 is a temporary placement table for a substrate on which the back surface of the substrate to be placed can be washed with water, 7 is a vertically movable shaft, 8 is a suction chuck mechanism supported by the shaft 7, and 9 is provided around the chuck mechanism 8. An adsorption table capable of supplying water, 10 is a cleaning spinner, 11 is a rotatable rotary shaft, 12, 12 and 12 are horizontal chucks rotatably supported by a hollow spindle (not shown). (Disk-shaped porous ceramic chuck) 13 is an index table supported by the rotary shaft 11, and includes a loading / unloading zone s ₁ , a rough grinding zone s ₂ , and a finish grinding zone. It is divided into s _3. Reference numeral 14 denotes a rail, and 15 denotes a chuck cleaning and cleaning device which is provided on the upper surface of the index table 13 so as to clean the disc-shaped porous ceramic chuck 12.

  The cleaning device 15 includes a pair of a brush cleaning device 15a and a chuck cleaning device 15b having a ceramic bowl, and is attached to the rail 14 so as to be movable in the lateral direction. Reference numeral 60 denotes a pure water supply nozzle. Pure water is supplied from the pure water supply nozzle 60 to the piercing portion 30a that communicates with the upper and lower sides of the annular suction pad 17'a.

  Reference numeral 16 denotes a grinding device supported on a shaft that can move up and down, and includes a rough grinding device 16b supported on a rotating shaft 16a and a finish grinding device 16d supported on a rotating shaft 16c. These grinding machines 16 b and 16 d are installed on the frame 21.

The substrate transfer device 17 provided with a suction pad is a substrate transfer mechanism that can rotate around a shaft 17b provided with a suction pad 17a. Left substrate transfer mechanism 17 b of the substrate on the provisional table 6 - loading / unload - Dinguzo - disc-shaped port lies down s ₁ position - is used to transport on Las ceramic chuck 12. The robot arm 4 may perform the function of the left substrate transfer mechanism 17. Right board conveying device 17 ', Russia - loading / unload - Dinguzo - disc-shaped port lies down s ₁ position - Las ceramic chuck 12 on the semiconductor substrate adsorption Te washing spinner 10 - transferred onto table 9 Used to do. Above the cleaning spinner 10 is provided a nozzle 61 for supplying a cleaning liquid to which ultrasonic vibration is applied. The ultrasonic vibration transmitter includes a first ultrasonic transmission element of 0.5 to 2 MHz and a second ultrasonic transmission element of 20 to 200 kHz, and the frequency width can be changed. Since the frequency of the ultrasonic wave depends on the particle to be removed, it is preferable to irradiate the cleaning liquid repeatedly at a cycle of 50 kHz for 30 seconds, 100 kHz for 30 seconds, and 1 MHz for 30 seconds.

  18 is a double door safety door, which is provided with handles 18a, 18a on the front surface, and can be opened and closed in a circular arc shape around the axis 18b on the rail 2a on the upper surface of the semicircular base on the front surface of the base 2. . Reference numeral 19 is a control monitor, and 20 is a housing.

  This index table type substrate back surface grinding apparatus 1 is provided with the axis of the robot arm 4, the axis of the temporary table 6, and the axis of the chuck mechanism 8 of the cleaning spinner 10 on the same straight line. A straight line connecting the horizontal movement trajectory of the brush cleaner 15a for chuck cleaning and the ceramic scissor cleaning device 15b, and the axis of the rotating shaft 16a of the rough grinding device 16b and the axis of the rotating shaft 16c of the finish grinding device 16d. Is compactly designed by being provided so as to be parallel to each other. Reference numeral 70 denotes a substrate cleaning brush.

Next, a method for grinding a substrate and a method for cleaning the substrate using the index table type substrate back surface grinding apparatus 1 shown in FIG. 7 will be described. In order to grind the substrate A, the rotary shaft 3 of the robot arm 4 is moved up and down to adjust the height of the substrate in the storage cassette 5, and then the air cylinder is operated to extend the robot arm 4 so that a suction hole exists. The robot arm is inserted under the cassette to be suctioned with the surface to be suctioned as the upper surface, and the substrate is attracted to the robot arm by suction. Next, the air cylinder is operated to retract the robot arm 4 while contracting, and the robot arm is rotated to position the sucked substrate under the robot arm. On the other hand, the disc-shaped porous ceramic chuck 12 in the loading / unloading zone s ₁ on the index table 13 is rotated in the horizontal direction, and pure water is added to the upper surface of the disc-shaped porous ceramic chuck 12 with pure water. Supplied from the supply nozzle 60 and chuck-cleaned by the ceramic bowl 32 of the cleaning device 15b.

  The rotation axis 3 of the robot arm 4 is rotated, the robot arm 4 is extended, and when the adsorbed substrate is transferred onto the temporary table 6, the decompression is stopped and the substrate is placed on the porous ceramic plate on the temporary table 6. The cleaning water is introduced into the chamber, and the cleaning water is blotted from the porous ceramic plate to clean the back surface of the substrate. The robot arm 4 is extended from the upper side of the cleaned substrate, and the shaft 3 is lowered to attract the substrate to the robot arm.

  The robot arm 4 is contracted and retracted, the shaft 3 is rotated, the robot arm is advanced and extended again, and the substrate is depressurized on the porous ceramic chuck 12 washed with the ceramic iron on the index table 13. The substrate is mounted on the chuck 12 by reducing the pressure of the hollow spindle on the lower surface of the porous ceramic chuck 12. On the other hand, the arm is folded while the robot arm 4 is retracted.

Rough grinding equipment located down s ₂ - to rotate the rotary shaft 11 of the index table 13 by 120 degrees rotation in-deck table 13 in the right direction, placing the substrate, the porous ceramic chuck 12 which has adsorbed the rough grinding zone 16b. The rotating shaft 16a of the rough grinding machine 16b is lowered, the provided grindstone is pressed against the substrate, the rotation of the porous ceramic chuck (grinding table) 12 and the rotation of the rough grinding equipment 16b are rotated, and the grindstone is placed on the substrate surface. Rub and rough grind.

The rotational speed of the grindstone shaft 16a during the rough grinding may be 10 to 200 rpm, and the rotational direction of both shafts may be either forward or reverse, but the reverse direction is preferred. When the rotation of the porous ceramic chuck 12 and the rotary shaft 16a of the rough grinding device 16b is stopped and this rough grinding (primary grinding) is finished, the rough grinding device 16b is raised, and then the index table 13 is rotated 120 degrees to the right. is moving, the porous ceramic chuck 12 carrying the crude grinded substrate fine grinding zone - move beneath the finish located down s ₃ grinding device 16d.

  The finish grinding device 16d is lowered, the finish grinding wheel is pressed against the substrate, and the hollow spindle that supports the porous ceramic chuck 12 and the rotary shaft 16c that supports the finish grinding device 16d are rotated to finish the substrate (2). Next grinding). The rotational speed is 10 to 200 rpm, and the rotational direction of both axes may be either forward or reverse, but the reverse direction is preferred.

Finishing grinding is terminated by stopping the rotation of the hollow spindle for bearing the porous ceramic chuck 12 and the rotary shaft 16c for bearing the grinding wheel 16d for the finishing grinding machine, the finishing grinding machine 16d is raised, and the index table 13 is moved 120 to the right. Then, the ground substrate is returned to the loading / unloading zone s ₁ position on the first index table 13.

Loading / unloading zone s on the index table 13 The pure water is supplied from the pure water supply nozzle 60 to the upper surface of the back-grinding substrate on the chuck while rotating the chuck 12 located at the position ₁ on the substrate. Clean the (back) side.

  After the rotation of the chuck 12 is stopped and the pressure reduction of the chuck 12 is stopped, the annular conveyance pad 17′a of the conveyance device 30 is moved onto the chuck 12, and then the annular conveyance pad 17′a is lowered to the upper surface of the back grinding substrate. When the contact is made, the pressure is reduced to firmly fix the back grinding substrate to the lower surface of the annular transfer pad 17'a, and then the pressurized water containing pressurized air is instantaneously blown from the lower surface of the chuck 12 to easily separate the substrate from the chuck. At the same time, the annular conveyance pad 17'a is rotated around the arm axis, and the back ground substrate is transferred onto the suction chuck mechanism 8 of the cleaning spinner 10 (unloading). The semiconductor substrate that has been ground and cleaned by stopping the decompression of 'a is placed on the porous ceramic plate 9 of the suction chuck mechanism 8, and the chuck mechanism 8 is decompressed. After firmly adsorbing the substrate, the shaft 7 is lowered to position the porous ceramic plate of the chuck mechanism 8 and the height position of the adsorption table (made of porous ceramics) 9 arranged around the porous ceramic plate. Are approximately the same height.

  Next, the annular transport pad 17′a is rotated to return to the standby position, and while the cleaning spinner 10 is rotated, pure water is blotted from the lower surface of the suction table 9, and the ground substrate is immersed in water to perform back surface grinding. The substrate protective film side is washed, and pure water to which ultrasonic vibration is applied is supplied from the upper side of the back grinding substrate from the nozzle 61, and the particles on the back side of the substrate are removed and washed. After this water washing, the shaft 7 is raised to bring the grinding substrate on the chuck mechanism 8 to a position higher than the water surface, and the robot arm 4 is rotated, moved forward, stretched, and the washed grinding substrate upper surface is adsorbed by the arm. Then, the depressurization of the chuck mechanism 8 is stopped, and then the back surface of the substrate is dried by blowing dry air from the hollow shaft 7.

The robot arm 4 adsorbing the dried ground substrate is retracted, the arm is reversed, the brush 70 is wiped with the protective tape surface of the ground substrate to wipe off moisture, and then the arm is folded. Rotate, advance and extend the arm again to store the ground substrate in the storage cassette 5 ', retract, fold the arm, rotate, and reverse the arm to load / unload the next new substrate -Ding zone s Prepare for transfer onto chuck 12 in position ₁ .

While the ground substrate is being cleaned and dried on the cleaning spinner 10, the cleaning device 15 runs on the rail 14 to the left and rotates horizontally on the disc-shaped porous ceramic chuck 12. the moved, then the b on the index table 13 - the emission s ₁ chuck 12 is lowered brush cleaner 15a while rotating the brush of the brush washer 15a on with a brush located in a position - loading / unload - Dinguzo Loading / Unloading Zone s Abuts on the porous ceramic chuck 12 at position ₁ to clean the chuck. At this time, pure water is also supplied from the pure water supply nozzle 60 to the chuck surface. When the chuck cleaning is completed, the cleaning device 15 is further moved to the left on the rail 14 and returned to the standby position.

The loading / unloading zone is performed while the substrate is coarsely ground in the other work zone, ie, the coarse grinding zone s ₂ and the substrate is ground in the fine grinding zone s _3. -A new substrate is unloaded from the storage cassette 5 on the disc-shaped porous ceramic chuck 12 at the position ₁ where brush cleaning has been completed, and is placed on the chuck pad via the temporary placement table (Ro -Ding)

When the loading / unloading zone s ₁ loads a new substrate, the rough grinding zone s ₂ finishes the rough grinding of the substrate, and the fine grinding zone s ₃ finishes the finish grinding of the substrate. The table 13 repeats the movement in the 120 ° clockwise direction, 120 ° clockwise direction, and 120 ° clockwise direction or 240 ° counterclockwise direction again, and the new substrate is subjected to rough grinding, finish grinding, and ground substrate. Cleaning, substrate unloading, chuck cleaning, and substrate loading are performed by the disk-shaped porous ceramic chuck 12 in each work zone (s ₁ , s ₂ and s ₃ ). In order to prevent the chuck 12 from being worn, the cleaning of the chuck is preferably performed alternately with brush cleaning and ceramic soot cleaning as described.

  In the method of delivering a back-grinded substrate from the grinding stage chuck to the cleaning stage chuck according to the present invention, the ground surface of the substrate is in a wet state. Dry adhesion to the ground surface of the substrate is prevented, and the particle removal rate is improved by 95% or more in the spin cleaning stage as compared with the conventional delivery method in the dry state.

It is a perspective view of the board | substrate conveyance apparatus of this invention. It is a front view of the conveyance apparatus for substrates of this invention. It is a bottom view of the cyclic | annular suction pad of the conveyance apparatus for substrates. It is a top view of an annular suction pad. It is sectional drawing of a cyclic | annular suction pad, and shows the AA cut surface in FIG. It is a side view of a board | substrate conveyance apparatus. It is a top view of a back grinding apparatus. It is a top view of a back grinding apparatus. (Known)

Explanation of symbols

1 Index Table Type Substrate Back Grinding Device A Semiconductor Substrate 10 Cleaning Spinner
12 Porous ceramic chuck 13 Index table 17'a Annular suction pad 22 Square F cylinder 25 Arm holder
DESCRIPTION OF SYMBOLS 30 Substrate conveyance apparatus 30a Penetration part 30b Adsorption hole 30c Bottom outer peripheral part 30d Arc-shaped groove 30e Vacuum hole 30f Bottom center part 31 Pressure reducing means 32 Polyurethane coil 33 Binding material 34 Fluid passage connecting pipe 38 Swing arm 40 Stepping motor 60 Pure water supply nozzle 61 Cleaning liquid supply nozzle

Claims (2)

  The surface of the printed circuit board is covered with a protective tape, and the back surface of the semiconductor substrate placed with the surface of the protective tape facing the porous ceramic chuck is ground with a grinding stone. Then, while supplying the cleaning liquid to the back-ground substrate surface, the upper and lower open-type annular suction pads of the transport device are brought into contact with the rear surface of the ground substrate to suck the substrate, and the upper surface of the substrate, the lower surface of the annular suction pad, A method of transferring a semiconductor substrate, wherein the substrate is transferred to a spinner as a cleaning stage in a state where a cleaning liquid film is present in a recess space formed in step (b). An annular suction pad having a piercing portion that communicates vertically and having a plurality of vacuum holes in the annular bottom surface,
A pressure reducing means provided on the annular upper surface of the annular suction pad and leading to the vacuum hole of the annular suction pad;
A pad holding fixture for fixing the annular suction pad on the upper surface of the annular suction pad;
A swivel arm that rotatably supports the pad pressing fixture;
A moving mechanism for moving the swivel arm so that the swivel arm can be moved up and down and swiveled or moved back and forth linearly;
and,
A substrate transport apparatus, comprising cleaning liquid supply means for supplying a cleaning liquid from above the annular suction pad to a penetration portion of the annular suction pad.

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