CN105751054B - A kind of quartz wafer processing technology - Google Patents
A kind of quartz wafer processing technology Download PDFInfo
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- CN105751054B CN105751054B CN201610133039.XA CN201610133039A CN105751054B CN 105751054 B CN105751054 B CN 105751054B CN 201610133039 A CN201610133039 A CN 201610133039A CN 105751054 B CN105751054 B CN 105751054B
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- quartz wafer
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- roller
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B31/00—Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor
- B24B31/02—Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor involving rotary barrels
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- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The present invention is suitable for electronic component processing technology field, provides a kind of quartz wafer processing technology, includes the following steps：Overlay film：The intermediate region of quartz wafer is applied and is covered with protection materials；Processing：Quartz wafer, abrasive sand, steel ball and water are placed in roller, processing is completed in starting roller rotation；Demoulding：Remove the protection materials on quartz wafer.The present invention not only shortens the quartz wafer process-cycle, reduces production cost, but also does not influence the performance of quartz wafer.In addition, processing technology of the invention is easy to operate, it is convenient for industrialized production.
Description
Technical field
The invention belongs to electronic component processing technology field more particularly to a kind of quartz wafer processing technologys.
Background technique
Currently, mobile communication, IT information, electronic product etc. include that crystal proposes that smallerization is wanted to electronic component
It asks, the size of quartz crystal requires also to tend to minimize.Quartz wafer as quartz crystal core component also makes every effort to minimize,
To adapt to the vertical requirement of subsequent handling compact package group.According to the energy well theory of quartz wafer piezoelectric property, when wafer size without
When limiting big, performance is best, impedance very little.But since the size of quartz wafer is limited, it can not accomplish infinity, and wafer size is got over
Small, impedance is bigger.Present electronic product is smaller and smaller, and chip also will be smaller, and when wafer size reduces, edge effect
It answers more obvious, Chip-R is caused to increase.Thinned wafer edge can reduce the influence of edge effect, to reduce chip resistance
It is anti-.
The method that quartz wafer edge is thinned in the prior art is to place a wafer into the certain metal roller of curvature, and add
It with abrasive sand, is rotated with certain rate, the centrifugal force of quartz wafer makes it be bonded cylinder wall when rotating by metal cylinder
Rotation, rub quartz wafer, and wafer profile curvature is similar to roller curvature to reach, to reduce the resistance of chip, reduces crystalline substance
Piece impedance.But following problems exist in the prior art：Quartz wafer quality is very small, and drum rotation speed cannot be infinitely great
(because the frictional force generated by centrifugal force is necessarily less than the gravity of chip, it could occur between such chip and cylinder wall opposite
Displacement, and then play the effect at thinned wafer edge), therefore the frictional force generated is just very small, and the chip process-cycle is very long, and one
As want 200 hours or so.Process-cycle is long, and the phase mutual friction that will lead between chip to be processed increases, and will lead to crystalline substance
The electric property of piece declines.In addition, the longer process-cycle also causes abrasive sand consumption more, it is more to change sand number, and process
Range request constant temperature and humidity is crossed, unit cost is very high.
High material consumption present in quartz crystal roller processing technology, homogeneity of product are general in the prior art, process
Period is long, changes sand number is more, unit cost is high etc., is technical problem urgently to be resolved in the art.
Summary of the invention
The present invention provides a kind of quartz wafer processing technology, it is intended to overcome depositing in quartz wafer roller machining process
Process-cycle it is long, material consumption is long, unit cost is high the problems such as.
The invention is realized in this way a kind of quartz wafer processing technology, includes the following steps：
Overlay film：The intermediate region of quartz wafer is covered into upper protection materials；
Processing：The quartz wafer, abrasive sand, steel ball and water are placed in roller, starting roller rotation, processing；And
Demoulding：Remove the protection materials on quartz wafer.
Further, the intermediate region is the non-processing region of the quartz wafer, and the intermediate region is the stone
The non-processing region of English chip, the intermediate region edge is corresponding to the quartz wafer to close on outer peripheral distance for the stone
The 1/5~1/10 of English chip length.
Further, the mode of the overlay film includes silk-screen, spraying or directly pastes preshaped protective film.
Further, the protection materials include polyurethanes, ethylene esters of gallic acid, esters of acrylic acid, poly terephthalic acid
At least one of class, epoxy resin.
Further, the specification of the quartz wafer is：0.04~0.20mm of thickness, long 0.8~3.6mm, it is wide by 0.6~
2.0mm。
Further, the quartz wafer quantity:Abrasive sand:Steel ball:Water is：3000~10000pcs:10~50g:100
~500g:200~500ml.
Further, the revolving speed of the roller is 120~240rpm, and process time is 3~20h；The diameter of the roller
For 50~120mm.
Further, the material of the abrasive sand is SiC or Ai2O3。
Further, the demoulding mode includes that heat removes, light irradiates or is removed using chemical remover.
Further, the chemical remover includes alcohols, ketone or organic acid cleaning agent.
Further, the hot removal process is：Quartz wafer is heated to 240~400 DEG C.
The present invention also provides a kind of for processing the roller system of quartz wafer, including roller, abrasive sand, steel ball and
Water.
Compared with prior art, the present invention beneficial effect is：When roller rotates, the quality of steel ball generates biggish centrifugation
Power increases the frictional force of quartz wafer and inner wall of rotary drum；The damping action of water can reduce damage when steel ball falls to chip.
It is applied in quartz wafer intermediate region and is covered with protection materials, this non-processing region that can protect on chip is affected.This hair
It is bright not only to shorten the quartz wafer process-cycle, reduce production cost, but also the performance of quartz wafer is not influenced.In addition, this
The processing technology of invention is easy to operate, is convenient for industrialized production.Stablized by the performance of the quartz wafer after processing technology processing,
And homogeneity of product is high.
Detailed description of the invention
Fig. 1 is the schematic diagram for the quartz wafer roller processing technology that the embodiment of the present invention 1 provides.
Fig. 2 a is the distribution of impedance figure of the 322525MHz of the quartz wafer of roll processes processing in the prior art, and Fig. 2 b is
The distribution of impedance figure of the 322525MHz of the quartz wafer of processing in the embodiment of the present invention 1.
Specific embodiment
In order to make the objectives, technical solutions, and advantages of the present invention clearer, with reference to the accompanying drawings and embodiments, right
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.
Technical solution according to the invention processes quartz wafer, and process is as follows：
Overlay film：The intermediate region of quartz wafer is pasted using silk-screen or directly and is covered by the way of preshaped protective film
Upper protection materials, wherein intermediate region edge is corresponding to quartz wafer closes on outer peripheral distance for the 1/5 of quartz wafer length
~1/10；Protection materials select polyurethanes, hexenoic acid lipid, acrylics, poly terephthalic acid class, rubber, epoxy
At least one of resinae；The specification of quartz wafer is：0.04~0.20mm of thickness, long 0.8~3.6mm, it is wide by 0.6~
2.0mm；
Processing：Quartz wafer, abrasive sand, steel ball and water are placed in roller, processing is completed in starting roller rotation；Wherein,
Chip:Abrasive sand:Steel ball:Water is：3000~10000pcs:10~50g:100~500g:200~500ml；The revolving speed of roller
For 120~240rpm, the diameter of roller is 50~120mm；
Demoulding：The protection materials on quartz wafer are removed by the way of heat removal or using chemical remover；Chemistry is de-
Film includes alcohols, ketone or organic acid cleaning agent；Hot removal process is：Quartz wafer is heated to 240~400 DEG C.
It as shown in fig. 1, is the schematic diagram of quartz wafer roller processing technology, wherein 1 is steel ball, 2 be quartz wafer, 3
It is roller for water, 4.This technique is that chip 2, abrasive sand (not shown), steel ball 1, water 3 are put into roller 4, works as roller machine
When work, the high-speed rotation in roller machine of circular drum 4, chip 2, steel ball 1 and abrasive sand can under the influence of centrifugal force with cylinder
Inner wall rub；The quality of steel ball 1 can generate biggish centrifugal force simultaneously, increase the friction of chip 2 and 4 inner wall of roller
Power.By rubbing to quartz wafer 2, keep the design curvature of its shape curvature roller identical.In process, steel ball 1
With abrasive sand again can non-edge (intermediate region) to quartz wafer 2 carry out certain friction, lead to the electrical resistance of chip 2
It can decline.The intermediate region of quartz wafer 2 is applied and is covered with protection materials, it can be to avoid this influence.Meanwhile it applying and being covered with protected material
The quality of the quartz wafer of material further increases, and can further increase the frictional force of chip and inner wall of rotary drum, further shortens
Process-cycle.
Phenomena such as steel ball is heavier, will cause wafer breakage, chipping, unfilled corner when rotating to high-order fall, causes part brilliant
Piece is scrapped.It is the damping action using water that water is added in roller, reduces damage when steel ball falls to chip；Protection materials are deposited
It more can further weaken this damage effect.Simultaneously because abrasive sand be it is water-soluble, the presence of water keeps abrasive sand equal
Even uniformly mixes with chip steel ball, improves the consistency and lot stability of converted products.
The protection materials include polyurethanes, hexenoic acid lipid, acrylics, poly terephthalic acid class, rubber,
At least one of epoxy resin, these protection materials are organic-based material, dissolve in chemical remover, such as alcohols, ketone
Class or organic acid cleaning agent specifically can be K191 reagent or acetone reagent；It can be removed using these cleaning agents dry
Only；In addition, the heat resistance of these protection materials at 300 DEG C hereinafter, and quartz wafer at 520 DEG C or less when can long-time work
Make, therefore the performance of quartz wafer is not produced when protection materials can be removed to quartz wafer when being heated to 300~400 DEG C
It is raw to influence.
Embodiment 1
Roller processing technology according to the invention processes quartz wafer, and steps are as follows：
Overlay film：The intermediate region of quartz wafer is covered into upper protection materials using silk-screen mode, wherein intermediate region edge
It is corresponding to quartz wafer to close on outer peripheral distance for the 1/10 of quartz wafer length；Protection materials select epoxy resin；Quartz
The specification of chip is：Thickness 0.07mm, long 2.0mm, width 1.34mm；
Processing：Quartz wafer, abrasive sand, steel ball and water are placed in roller, processing is completed in starting roller rotation；Wherein,
Chip:Abrasive sand:Steel ball:Water is：5000pcs:30g:100g:500ml；The revolving speed of roller is 150rpm, and the diameter of roller is
60mm；
Demoulding：It adopts using the epoxy resin on chemical remover hydroxyacetic acid removal quartz wafer.
Processing technology of the invention and existing roller processing technology are compared, as a result as shown in table 1.It can from table 1
To find out, the present invention is low to environmental requirement, and material consumption is few, and the process-cycle is short, does not have to change sand in process；In summary,
Unit cost reduces very much, can promote 5~10 times of processing efficiency.
In addition, it is good always by the product of the quartz wafer of processing technology processing of the invention, it specifically combines shown in Fig. 2.
Fig. 2 a is the distribution of impedance figure of the 322525MHz of the quartz wafer of roll processes processing in the prior art, and Fig. 2 b is of the invention real
The distribution of impedance figure of the 322525MHz of the quartz wafer of the processing in example 1 is applied, we improve the consistency of product from figure.
Table 1
| Project | Conventional tumble | Improve roller | Wet process roller |
| Environmental requirement | Constant temperature and humidity | Constant temperature and humidity | Room temperature (no temperature and humidity requirement) |
| Equipment | Roller machine | Roller machine | Roller machine |
| Consumptive material | Abrasive sand | Abrasive sand, steel ball | Abrasive sand, steel ball, water |
| Material consumption | It is more | It is more | Seldom |
| Homogeneity of product | Generally | It is poor | It is good |
| Process-cycle (hour) | 200 | 120 | <20 |
| Change sand number | 20 | 12 | 0 |
| Unit cost | It is high | It is higher | It is very low |
Embodiment 2
Roller processing technology according to the invention processes quartz wafer, and steps are as follows：
Overlay film：The mode that the intermediate region of quartz wafer is directly pasted to preshaped protective film covers upper protected material
Material, wherein intermediate region edge is corresponding to quartz wafer closes on outer peripheral distance for the 1/5 of quartz wafer length；Protection materials
Select polyurethane；The specification of quartz wafer is：Thickness 0.07mm, long 3.6mm, width 1.8mm；
Processing：Quartz wafer, abrasive sand, steel ball and water are placed in roller, processing is completed in starting roller rotation；Wherein,
Chip:Abrasive sand:Steel ball:Water is：10000pcs:40g:500g:500ml；The revolving speed of roller is 200rpm, and the diameter of roller is
120mm；
Demoulding：Quartz wafer is heated to 240~400 DEG C, removes the protection materials on quartz wafer.
The quartz wafer of quartz wafer and prior art processing after processing is carried out result in the same manner as in Example 1 to unite
Meter and test, it is as a result essentially identical with the result in embodiment 1.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Made any modifications, equivalent replacements, and improvements etc., should all be included in the protection scope of the present invention within mind and principle.
Claims (8)
1. a kind of quartz wafer processing technology, which is characterized in that include the following steps:
Overlay film：The intermediate region of quartz wafer is covered into upper protection materials；
Processing：The quartz wafer, abrasive sand, steel ball and water are placed in roller, starting roller rotation, processing；And
Demoulding：Remove the protection materials on quartz wafer；
The protection materials include polyurethane or epoxy resin.
2. processing technology as described in claim 1, which is characterized in that the intermediate region is the non-processing of the quartz wafer
Region, the intermediate region edge is corresponding to the quartz wafer to close on outer peripheral distance for the 1/ of the quartz wafer length
5~1/10.
3. processing technology as described in claim 1, which is characterized in that the mode of the overlay film includes silk-screen, spraying or direct
Paste preshaped protective film.
4. processing technology as described in claim 1, which is characterized in that the specification of the quartz wafer is：Thickness 0.04~
0.20mm, long 0.8~3.6mm, wide 0.6~2.0mm.
5. processing technology as described in claim 1, which is characterized in that the quartz wafer quantity:Abrasive sand:Steel ball:Water is：
3000~10000pcs:10~50g:100~500g:200~500ml.
6. processing technology as described in claim 1, which is characterized in that the revolving speed of the roller is 120~240rpm, when processing
Between be 3~20h；The diameter of the roller is 50~120mm.
7. processing technology as described in claim 1, which is characterized in that the demoulding mode includes that heat removes light irradiation or makes
It is removed with chemical remover.
8. processing technology as claimed in claim 7, which is characterized in that the chemistry remover includes alcohols, ketone or organic
Acids cleaning agent.
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| CN201610133039.XA CN105751054B (en) | 2016-03-09 | 2016-03-09 | A kind of quartz wafer processing technology |
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| CN201610133039.XA CN105751054B (en) | 2016-03-09 | 2016-03-09 | A kind of quartz wafer processing technology |
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| CN105751054B true CN105751054B (en) | 2018-11-27 |
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| CN107398782A (en) * | 2017-09-06 | 2017-11-28 | 云南围棋厂 | A kind of stone engraving process |
| CN108177080A (en) * | 2017-12-28 | 2018-06-19 | 应达利电子股份有限公司 | A kind of bevelling method of chip |
| CN110561200A (en) * | 2019-08-02 | 2019-12-13 | 菲特晶(南京)电子有限公司 | quartz wafer processing technology |
| CN111687742A (en) * | 2020-07-06 | 2020-09-22 | 深圳市深汕特别合作区应达利电子科技有限公司 | Processing method of quartz wafer |
| CN113478331A (en) * | 2021-05-10 | 2021-10-08 | 中山市海晶电子有限公司 | Quartz wafer trimming barrel diameter capable of reducing resonator resistance and trimming method thereof |
| CN114029812B (en) * | 2021-11-19 | 2022-11-01 | 杭州中欣晶圆半导体股份有限公司 | Structure for removing silicon wafer edge oxidation film and operation method |
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| JPS60259374A (en) * | 1984-06-01 | 1985-12-21 | Osaka Kiko Co Ltd | Low pressure polishing device |
| CN201493744U (en) * | 2009-09-11 | 2010-06-02 | 镇江市港南电子有限公司 | Straight drum roller |
| CN101716738A (en) * | 2009-12-11 | 2010-06-02 | 廊坊中电大成电子有限公司 | Process for grinding SMD quartz square chip by using circular holed loose pulley |
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Effective date of registration: 20200928 Address after: 518000 south side of innovation Avenue and east side of Bianxi River, EBU Town, Shenzhen Special Cooperation Zone, Shenzhen City, Guangdong Province Patentee after: Shenzhen Shenshan special cooperation zone Yingdali Electronic Technology Co.,Ltd. Address before: 518103, building 3-4, building C, 4 / F, Tai Po Industrial Park, Fenghuang second industrial zone, Fenghuang Industrial Zone, Baoan District, Shenzhen, Guangdong, Fuyong, China Patentee before: INTERQUIP ELECTRONICS (SHENZHEN) Co.,Ltd. |