CN101314214B - Method for removing rough edges of element base substrate and application thereof - Google Patents
Method for removing rough edges of element base substrate and application thereof Download PDFInfo
- Publication number
- CN101314214B CN101314214B CN200810029175XA CN200810029175A CN101314214B CN 101314214 B CN101314214 B CN 101314214B CN 200810029175X A CN200810029175X A CN 200810029175XA CN 200810029175 A CN200810029175 A CN 200810029175A CN 101314214 B CN101314214 B CN 101314214B
- Authority
- CN
- China
- Prior art keywords
- base substrate
- burr
- ceramic component
- component base
- small
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Compositions Of Oxide Ceramics (AREA)
Abstract
The invention discloses a method for removing raw edges of an element blank body and an application thereof. The method comprises the following steps that: firstly, the element blank body after dry pressing and molding is subject to preburning treatment; a preburning temperature is between 700 and 1,100 DEG C; a grinding medium, water and a preburned element blank sheet are put into a planetary grinding tank for carrying out sheet grinding treatment; and finally the element blank sheet is cleaned and dried. The product produced by removing the raw edges by the method has smooth and flat appearance, no raw edges, no collapse and other poor phenomena. The method is used for removing the raw edges of the sensing element blank body, and the qualified rate of the appearance of the ground sensing element blank body reaches 99 percent above.
Description
Technical field
The present invention relates to element base substrate processing technique field, relate in particular to a kind of method of removing sensing element base substrate burr.
Background technology
The existing method of removing the element base substrate is: the ceramic body that will sinter is put into ball grinder and is added the water wet-milling, utilize the friction between ceramic body that burr or burr are removed, owing to be to utilize the rigid collision between ceramic body to reach the purpose of removing burr in the process of mill, and ceramic body enbrittles, and causes ceramic body to collapse problems such as limit or fracture.Perhaps the surface of ceramic body that will sinter with the method for machining polishes, and this method is applicable at present in the production of the ceramic body that volume is bigger that this method also can exist ceramic body to collapse the limit bad phenomenon.Put into the vibratory sieve vibration again or with the base substrate of firm forming, utilize the friction between base substrate that burr are removed, but this method also has certain limitation, it is bigger generally to be used for size, and on the higher solid device of base substrate hardness, for the lower small-sized or hollow device of blank strength, this method also can cause to the ceramic body edge and collapse not phenomenon of limit, even mashed sheet problem appears, and this method is to the tiny burr of burr height less than 0.05mm, and removal effect is bad.
Summary of the invention
The technical issues that need to address of the present invention are to remove the burr of element base substrate, make the ceramic body surfacing smooth, do not have bad order phenomenons such as collapsing limit, mashed sheet, improve the yields of producing.
The technical problem to be solved in the present invention is achieved through the following technical solutions: a kind of method of removing rough edges of element base substrate, earlier dry-pressing formed good element base substrate being carried out pre-burning handles, calcined temperature is 700 ℃~1100 ℃, make the ceramic body after the pre-burning have certain intensity, but do not reach into the porcelain state yet.To grind Jie, water and pre-burned ceramic body again and put into the planetary mills jar and carry out abrasive disc and handle, when planetary mills jar during by certain rotation speed operation, base sheet surface is being situated between in the process of friction with mill, and the burr part of some high out-of-planes just can be worn away; Last cleaning, drying.To thoroughly grind off burr and again the protecting component base substrate be not damaged, the adding proportional quantity of control mill Jie, water, base sheet, and by the size of burr in addition parameters such as rotating speed, time control.The quality proportioning of described mill Jie, water, base sheet is 40 ± 10: 18 ± 5: 3 ± 1.Described mill be situated between be by ceramic powder particle through high temperature pre-burning, ball milling, dry, sieving forms.
Further: described planetary mills jar rotating speed is 35 ± 5 rev/mins, and the time is 5~15 minutes.The described pre-burning time is 2~5 hours.Described mill Jie high temperature calcined temperature is 1000 ℃~1300 ℃.The described sieve number of sieving is 100~120 orders.Ceramic powder particle is the dry powder before the element blank forming.
Use said method to remove the product of rough edges of element base substrate gained, product appearance is smooth smooth, and no burr, nothing collapse mashed bad phenomenon, and this method is used to remove the burr of small-sized sensing element base substrate, and mill back sensing element base substrate appearance yield reaches more than 99%.Satisfy electrode printing and client requirement to the ceramic body outward appearance.
Description of drawings
Fig. 1 is deckle-edged ring-type pressure cell base substrate schematic diagram, and Fig. 2 is deckle-edged column pressure cell base substrate schematic diagram, wherein 1 ring-type pressure cell base substrate, 2 burr, 3 column pressure cell base substrates.
The specific embodiment
Purport of the present invention is the adding proportional quantity by control mill Jie, water, base substrate, and by the size of burr in addition parameter such as rotating speed, time control, reach the purpose of removing the ceramic body burr, and product appearance is smooth smooth, no burr, product do not have and collapse mashed bad phenomenon.Below content of the present invention is described in further detail, mentioned content is not a limitation of the invention among the embodiment, and the selection of each parameter such as temperature, time can be suited measures to local conditions and the result be there is no substantial effect.
A kind of method of removing pressure-sensitive thin slice burr is carried out dry-pressing formed good Φ 2.8mm x Φ 1.5mmx0.4mm ring-type pressure cell base substrate 1 pre-burning earlier and is handled, and calcined temperature is 1100 ℃; To grind Jie, water and pre-burned element base substrate again puts into the planetary mills jar and carries out abrasive disc and handle last cleaning, drying.The quality proportioning of mill Jie, water, base substrate is 40: 18: 3.Planetary mills jar rotating speed is 35 rev/mins, and the time is 5 minutes.The pre-burning time is 3 hours, mill be situated between be by ceramic powder particle through high temperature pre-burning, ball milling, dry, sieving forms.Described mill Jie high temperature calcined temperature is 1250 ℃.The described sieve number of sieving is 120 orders.Described ceramic powder particle is the dry powder before the element blank forming.
Use said method to remove the product of base substrate burr 2 gained, product appearance is smooth smooth, and no burr, product do not have and collapse mashed bad phenomenon, and this method is used to remove the burr of ring-type pressure cell base substrate, and mill afterwards Sensitive Apparatus base substrate appearance yield reaches more than 99%.
A kind of method of removing the pressure-sensitive sheet burr of ring-type is carried out dry-pressing formed good Φ 4.2mm x Φ 2.8mm x0.7mm ring-type pressure cell base substrate 1 pre-burning earlier and is handled, and calcined temperature is 1000 ℃; To grind Jie, water and pre-burned element base substrate again puts into the planetary mills jar and carries out abrasive disc and handle last cleaning, drying.The quality proportioning of described mill Jie, water, base substrate is 42: 16: 3.Described planetary mills jar rotating speed is 35 rev/mins, and the time is 8 minutes.The pre-burning time is 3.5 hours, described mill be situated between be by ceramic powder particle through high temperature pre-burning, ball milling, dry, sieving forms.Described mill Jie high temperature calcined temperature is 1250 ℃.The described sieve number of sieving is 120 orders.Described ceramic powder particle is the dry powder before the element blank forming.
Use said method to remove the product of base substrate burr gained, product appearance is smooth smooth, and no burr, product do not have and collapse mashed bad phenomenon, and this method is used to remove the burr of small, annular pressure cell base substrate, and mill afterwards Sensitive Apparatus base substrate appearance yield reaches more than 99%.
A kind of method of removing column temperature-sensitive element base substrate burr is carried out the cylindric temperature-sensitive element base substrate 3 of dry-pressing formed good Φ 3.7mm x2.6mm pre-burning earlier and is handled, and calcined temperature is 900 ℃; To grind Jie, water and pre-burned element base substrate again puts into the planetary mills jar and carries out abrasive disc and handle last cleaning, drying.The quality proportioning of described mill Jie, water, base substrate is 45: 18: 3.Planetary mills jar rotating speed is 30 rev/mins, and the time is 12 minutes.The pre-burning time is 5 hours, described mill be situated between be by ceramic powder particle through high temperature pre-burning, ball milling, dry, sieving forms.Described mill Jie high temperature calcined temperature is 1180 ℃.The described sieve number of sieving is 100 orders.Described ceramic powder particle is the dry powder before the element blank forming.
Use said method to remove the product of base substrate burr 2 gained, product appearance is smooth smooth, and no burr, product do not have and collapse mashed bad phenomenon, and this method is used to remove the burr of small-sized column temperature-sensitive element base substrate, and mill afterwards Sensitive Apparatus base substrate appearance yield reaches more than 99%.
Claims (6)
1. method of removing small-sized ceramic component base substrate burr, it is characterized in that: earlier dry-pressing formed good ceramic component base substrate is carried out the pre-burning processing, calcined temperature is 700 ℃~1100 ℃; To grind Jie, water and pre-burned ceramic component base substrate again puts into the planetary mills jar and carries out abrasive disc and handle; Last cleaning, drying; The quality proportioning of described mill Jie, water, base substrate is 40 ± 10: 18 ± 5: 3 ± 1, described mill be situated between be by ceramic powder particle through high temperature pre-burning, ball milling, dry, sieving forms.
2. the method for the small-sized ceramic component base substrate of removal according to claim 1 burr is characterized in that: to the ceramic component base substrate pre-burning time be 2~5 hours.
3. the method for the small-sized ceramic component base substrate of removal according to claim 2 burr is characterized in that: described planetary mills jar rotating speed is 35 ± 5 rev/mins, and the ceramic component base substrate carries out the abrasive disc processing in the planetary mills jar time is 5~15 minutes.
4. the method for the small-sized ceramic component base substrate of removal according to claim 3 burr is characterized in that: described mill Jie high temperature calcined temperature is 1000 ℃~1300 ℃.
5. the method for the small-sized ceramic component base substrate of removal according to claim 4 burr is characterized in that: the described sieve number of sieving is 100~120 orders.
6. the method for the small-sized ceramic component base substrate of removal according to claim 5 burr is characterized in that: described ceramic powder particle is the dry powder before the ceramic component blank forming.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200810029175XA CN101314214B (en) | 2008-06-28 | 2008-06-28 | Method for removing rough edges of element base substrate and application thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200810029175XA CN101314214B (en) | 2008-06-28 | 2008-06-28 | Method for removing rough edges of element base substrate and application thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101314214A CN101314214A (en) | 2008-12-03 |
CN101314214B true CN101314214B (en) | 2010-06-16 |
Family
ID=40105441
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200810029175XA Expired - Fee Related CN101314214B (en) | 2008-06-28 | 2008-06-28 | Method for removing rough edges of element base substrate and application thereof |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN101314214B (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102079056B (en) * | 2010-12-29 | 2012-12-05 | 东莞市赛泽康纳米科技有限公司 | Method for removing lock core burrs |
CN102642170B (en) * | 2012-05-07 | 2014-06-04 | 广东风华高新科技股份有限公司 | Multilayer ceramic capacitor grinding process and application of multilayer ceramic capacitor grinding process |
CN104723191B (en) * | 2013-12-19 | 2017-09-01 | 比亚迪股份有限公司 | A kind of method for removing amorphous alloy product flash |
CN104157442A (en) * | 2014-08-15 | 2014-11-19 | 无锡斯贝尔磁性材料有限公司 | Deburring technology for magnetic core |
CN105261472A (en) * | 2015-10-12 | 2016-01-20 | 无锡斯贝尔磁性材料有限公司 | Burr-free production technology for ferrite magnetic ring |
CN106217229B (en) * | 2016-07-11 | 2019-05-03 | 深圳振华富电子有限公司 | The preparation method of low-temperature sintered ceramics part |
CN113696087A (en) * | 2021-10-07 | 2021-11-26 | 广西新未来信息产业股份有限公司 | Vibration grinding disc cleaning process for piezoresistor ceramic chip |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1225168A (en) * | 1996-07-11 | 1999-08-04 | 尼奥斯罗伯蒂克斯公司 | A deburring method |
CN1775439A (en) * | 2005-11-24 | 2006-05-24 | 江苏曙光集团有限公司 | Method for removing burr on thread starting tooth crest |
-
2008
- 2008-06-28 CN CN200810029175XA patent/CN101314214B/en not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1225168A (en) * | 1996-07-11 | 1999-08-04 | 尼奥斯罗伯蒂克斯公司 | A deburring method |
CN1775439A (en) * | 2005-11-24 | 2006-05-24 | 江苏曙光集团有限公司 | Method for removing burr on thread starting tooth crest |
Non-Patent Citations (4)
Title |
---|
JP特开2006-312203A 2006.11.16 |
JP特开2006-73085A 2006.03.16 |
徐庆仁 ,刘淑敏.国外去毛刺技术发展的现状和动向.导弹与航天运载技术.1991,第35-43页. |
徐庆仁,刘淑敏.国外去毛刺技术发展的现状和动向.导弹与航天运载技术.1991,第35-43页. * |
Also Published As
Publication number | Publication date |
---|---|
CN101314214A (en) | 2008-12-03 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN101314214B (en) | Method for removing rough edges of element base substrate and application thereof | |
CN104114322B (en) | Method for polishing both surfaces of wafer | |
TW201638287A (en) | Grinding tool | |
CN106179561A (en) | A kind of processing method of rice with remained germ | |
TWI737928B (en) | Apparatus of chemical mechanical polishing and operating method thereof | |
CN103817806A (en) | Loose wheel and method of producing quartz wafers | |
KR101677732B1 (en) | Scribing wheel and method for manufacturing the same | |
CN108161586A (en) | A kind of workpiece surface treatment process | |
CN101733697A (en) | Silicon chip polishing method | |
CN101716738A (en) | Process for grinding SMD quartz square chip by using circular holed loose pulley | |
CN107652899A (en) | A kind of ceramic sapphire polishing Liquid diamond and its manufacture method | |
CN103937451A (en) | Efficient preparation method of ultra-precision cutting abrasive sand | |
CN102336571A (en) | Manufacture method for chip ceramic element | |
CN103072983B (en) | Ceramic grinding wheel abrasive recovery method | |
JP5647475B2 (en) | Manufacturing method of glass plate | |
JP2012050378A5 (en) | ||
CN103144199A (en) | Processing process of jade | |
CN202079475U (en) | Loose pulley capable of grinding high-frequency and high-precision wafer with small tolerance | |
KR101469842B1 (en) | Recycling of Quartz | |
CN203887682U (en) | Grinding head and grinding device | |
TW202130457A (en) | Composite particle | |
CN102528645A (en) | Double-sided polishing method for large-sized ultra-thin quartz glass sheets | |
CN208020030U (en) | A kind of ceramic block and resin composite diamond flexibility mill | |
CN104761136A (en) | Glass substrate cutting method and manufacturing method for glass substrate for magnetic recording medium | |
CN104369086B (en) | Spherical sapphire finish machining equipment and method |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100616 Termination date: 20170628 |
|
CF01 | Termination of patent right due to non-payment of annual fee |